company space products interfaces - 3d plus · 2018. 9. 26. · pleïades, ariane 5, hii-a, iss,...

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3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and Die and Wafer Level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. We offer standard products and custom System-in-Package (SiP) solutions based on our Space qualified and patented technology portfolio. The company is ISO 9001:2008 certified and its stacking technologies are qualified by European Space Agency for Space applications. With more than 125,000 modules in orbit today and a failure-free flight heritage of more than 17 years, 3D PLUS is the largest Space Qualified MCM manufacturer in Europe. 3D PLUS products are used by all the major space agencies and customers worldwide. They fly in numerous missions : Envisat, Galileo, AlphaSat, Rosetta, Worldstar 3C, Corot, SaRLupe, Bepi-Colombo, Pleïades, Ariane 5, HII-A, ISS, Goce, Kepler, Dawn, RadarSat, New Horizons, W3B, Goes-R, Sentinel, MSL, Juno, Gaia, X-SAT, Grail, SMOS, MMS, Planck, ReStore, Grace, Insight, Iridium Next, Osiris-Rex, Solar Orbiter, RASAT, SAGE III, DubaiSAT-2... COPYRIGHT 3D PLUS - DECEMBER 2017 PHOTO CREDIT: ISS, NASA Recognized for their electrical performance, miniaturization, quality, reliability and radiation assurance level, 3D PLUS Space qualified products bring key advantages to all Space Application fields : Consumer Applications: telecommunication, navigation, internet... Durable Development: environment and climate monitoring Defense & Security: earth observation Space transportation: launchers and manned space vehicles Science: astronomy, space exploration and interplanetary missions HIGH DENSITY HIGH SPEED PERFORMANCE SMALL FORM FACTOR 75 % space and weight savings in the design HIGH RELIABILITY 20 years lifetime SPACE QUALIFIED TECHNOLOGY FLIGHT PROVEN PRODUCTS RADIATION HARDENED (TID, SEE) LONG TERM SUPPLY AND UPGRADES PATHS GUARANTY KEY BENEFITS AN INNOVATIVE COMPANY FLIGHT PROVEN PRODUCTS SPACE APPLICATIONS EXPERTISE RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS www.3d-plus.com RELIABLE MINIATURIZATION TECHNOLOGIES FOR ELECTRONICS SPACE PRODUCTS INTERFACES

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  • 3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and Die and Wafer Level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. We offer standard products and custom System-in-Package (SiP) solutions based on our Space qualified and patented technology portfolio. The company is ISO 9001:2008 certified and its stacking technologies are qualified by European Space Agency for Space applications.

    With more than 125,000 modules in orbit today and a failure-free flight heritage of more than 17 years, 3D PLUS is the largest Space Qualified MCM manufacturer in Europe. 3D PLUS products are used by all the major space agencies and customers worldwide. They fly in numerous missions : Envisat, Galileo, AlphaSat, Rosetta, Worldstar 3C, Corot, SaRLupe, Bepi-Colombo, Pleïades, Ariane 5, HII-A, ISS, Goce, Kepler, Dawn, RadarSat, New Horizons, W3B, Goes-R, Sentinel, MSL, Juno, Gaia, X-SAT, Grail, SMOS, MMS, Planck, ReStore, Grace, Insight, Iridium Next, Osiris-Rex, Solar Orbiter, RASAT, SAGE III, DubaiSAT-2...

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    Recognized for their electrical performance, miniaturization, quality, reliability and radiation assurance level, 3D PLUS Space qualified products bring key advantages to all Space Application fields :

    ▪ ConsumerApplications: telecommunication, navigation, internet...

    ▪ DurableDevelopment: environment and climate monitoring

    ▪ Defense&Security: earth observation

    ▪ Spacetransportation: launchers and manned space vehicles

    ▪ Science: astronomy, space exploration and interplanetary missions

    ▪ HIGH DENSITY

    ▪ HIGH SPEED PERFORMANCE

    ▪ SMALL FORM FACTOR 75 % space and weight savings in the design

    ▪ HIGH RELIABILITY 20 years lifetime

    ▪ SPACE QUALIFIED TECHNOLOGY

    ▪ FLIGHT PROVEN PRODUCTS

    ▪ RADIATION HARDENED (TID, SEE)

    ▪ LONG TERM SUPPLY AND UPGRADES PATHS GUARANTY

    KEY BENEF I TS

    AN INNOVATIVE COMPANY

    FL IGHT PROVEN PRODUCTS

    SPACE APPL ICAT IONS EXPERT ISE

    RELIABLE MINIATURIZ ATION TECHNOLOGIES FOR ELEC TRONICSwww.3d-plus.com

    RELIABLE MINIATURIZ ATION TECHNOLOGIES FOR ELEC TRONICS

    SPACE PRODUCTSINTERFACES

  • ²

    LVT TYPE SUPPLYVOLTAGE(V)PROPAGATIONDELAY(ns)

    RADIATIONTOLERANCEPACKAGE TEMPERATURE SCD#

    TID(1) SEL(2) SEU(3)

    3DLT162245VS1639 Dual 16-bit buffer Transceiver 1.8 - 3.6 3.2 100 >110 >110 SOP82 C, I, M 3DPA-5580

    3DLT164245VS1645 Dual 16-bit bidirectional Level Shifter 3.3V to 5V 2.7 - 5.5 8 100 >111 >64 SOP82 C, I, M 3DPA-6390

    3DLT163245US1696 Dual 16-bit bidirectional Level Shifter 1.8V to 3.3V 1.8 - 3.6 5.5 100 >110 >60 SOP82 C, I, M 3DPA-6700

    LVDS TYPE I/Os SUPPLYVOLTAGE(V)PROPAGATIONDELAY(ns)

    RADIATIONTOLERANCEPACKAGE TEMPERATURE SCD#

    TID(1) SEL(2) SET(4)

    3DLV3108VS1372 Octal Driver LVTTL / LVCMOS 3.3 >400 100 >80 - SOP34 C, I, M 3DPA-3740

    3DLV3208VS1373 Octal Receiver LVTTL / LVCMOS 3.3 >400 100 >80 - SOP34 C, I, M 3DPA-3750

    3DLV3304VS1374 Quad Driver & Receiver LVTTL / LVCMOS 3.3 >400 100 >80 - SOP34 C, I, M 3DPA-3820

    3DLV3104VS1617 Quad Driver LVTTL / LVCMOS 3.3 >400 100 >80 - SOP16 C, I, M 3DPA-5230

    3DLV3204VS1618 Quad Receiver LVTTL / LVCMOS 3.3 >400 100 >80 - SOP16 C, I, M 3DPA-5240

    3DLV3302VS1619 Dual Driver & Receiver LVTTL / LVCMOS 3.3 >400 100 >80 - SOP18 C, I, M 3DPA-5250

    3DLV3408VS1715 Octal Repeater LVTTL / LVCMOS 3.3 >400 100 >80 - SOP48 C, I, M 3DPA-7020

    LV T PRODUCT L INE LVDS PRODUCT L INE

    SERDES PRODUCT L INE

    K E Y F E AT U R E S

    K E Y F E AT U R E S

    K E Y F E AT U R E S

    Radiation hardened LVT line dual 16-bit transceiver and level shifters in a highly miniaturized package, bring the maximum area and weight savings for the space applications board’s designs. Conceived for low power and very high speed applications.

    Performs cold sparing and bus hold function enabling a two-way asynchronous communication between buses (address, data). The direction of data transmission is determined by a digital input. The two enable inputs can be used to disable the device, cold sparing the component to the bus. Enable inputs can be shorted together to provide 32-bit operation.

    The LVDS technology provides the benefits of high-speed, low-power consumption, low-EMI, simple termination and standardization for the high-speed data transmission solutions.

    3D PLUS Radiation Tolerant and Space Qualified LVDS line drivers and receivers embed 8 or 4 LVDS channels in a single highly miniaturized package, enabling the maximum area and weight savings for the space applications board’s designs. They are available in a variety of temperature ranges and with a single power supply of 3.3V.

    The devices are offered with standard SOP footprint for high resistance SMT assembly and for withstanding harsh thermal and mechanical environments. 3D PLUS LVDS products are used for high speed point-to-point interface in a variety of high performance digital electronics in all the space applications fields: science and deep space missions, Earth observation, navigation, launchers and manned space vehicles.

    Note1: Total Ionizing Dose Tolerance is given in krad(Si)Note2: Latch-up LET Threshold is given in MeV.cm²/mgNote3: SEU LET Threshold is given in MeV.cm²/mgNote4: SET detailed reports can be requested

    The 21:3 radiation tolerant Serializer/Deserializer interface modules meet the demands for high-speed and reliable data communications preserving signal integrity.

    Our SERDES modules convert 21-bit LVTTL parallel clock and data to 3-LVDS high-speed serial data channels in a highly miniaturized package. Nominal and Redundant designs have been conceived in one single module. The module also includes a Power Down control for both Nominal and Redundant devices.

    ▪ Extended Voltage Range

    ▪ High Current Driving Capability (up to 24 mA)

    ▪ Ultra Low Power Consumption

    ▪ High Speed Outputs

    ▪ Bus Hold Provided on Both Sides

    ▪ Cold Spare Function

    ▪ Space Quality Grade

    ▪ Radiation Hardened Die

    ▪ Compact Size and Low Weight

    ▪ Worldwide Delivery Guaranty

    ▪ Very High Density – small footprint

    ▪ High Speed Performance: > 400 Mbps (200 MHz) switching rates

    ▪ 3.3V Power Supply

    ▪ Cold Sparing Capability

    ▪ Ultra Low Power Dissipation

    ▪ Excellent Differential Skew and Propagation Delay

    ▪ Compatible with IEEE 1596.3 SCI and ANSI/TIA/EIA-644 LVDS standards

    ▪ Suitable for SpaceWire data links

    ▪ Radiation Tolerance (TID, SEE)

    ▪ Space Quality Level - ESA Qualified Technology

    ▪ Very Long Life Time Electronics (Technology proven for 15 to 18 years missions in Space)

    ▪ Long Term Supply

    ▪ Worldwide Delivery Guaranty

    ▪ Up to 1.428 Gb/s Data Rate ▪ PLL Frequency Range 20 to 68 MHz

    ▪ Low Power Consumption

    ▪ Power-down Mode

    ▪ Requires no External Components

    ▪ Rising Clock Edge Trigger

    ▪ Space Qualified Technology

    ▪ Radiation Tolerant (TID,SEE)

    ▪ Compact Size and Low Weight

    ▪ Worldwide Delivery Guaranty

    VCCASystem

    VCCBSystem

    DATASERIALIZER

    DATASERIALIZER

    DATASERIALIZER

    DATASERIALIZER

    DATASERIALIZER

    DATASERIALIZER

    PLL PLLCLK CLK

    POWDN POWDN

    TEMPERATURERANGES

    QUALITYGRADES

    ORDERINGINFORMATION

    C : Commercial (0°C to +70°C)

    I : Industrial (-40°C to +85°C)

    M : Military (-55°C to +125°C)

    S : Specific Temperature Range

    N : Commercial

    B : Industrial

    S : Space

    PartNumber–XX–XXX

    Quality Grade

    Temperature Range

    Options

    http://www.3d-plus.com/how-to-buy.php

    SERDES TYPE SUPPLYVOLTAGE(V)DATA

    THROUGHPUT(Gbps)

    RADIATIONTOLERANCEPACKAGE TEMPERATURE SCD#

    TID(1) SEL(2) SET(4)

    3DLV21721VS2622 21:3 Serializer 3.3 1.428 100 >67 - SOP56 C, I, M 3DPA-5210

    3DLV21821VS2623 3:21 Deserializer 3.3 1.428 100 >67 - SOP56 C, I, M 3DPA-5220