Company presentation2017

Sung Wei Electronics – Professional PCB Maker

• Established in 1979 in Taoyuan, Taiwan; since 1996 located in Baoan, Shenzhen, China

• Focused in copper/silver paste through hole (CPTH/STH) and LED application (CEM-1, CEM-3, IMS) printed circuit boards (PCB)• SS since 1979• STH since 1996• CPTH since 2005• IMS (SS) since 2009• PTH (DS) since 2014

• Fully compliant with all the relevant labour laws and regulations; OHSAS 18001 certified since 2006

20172

Sung Wei in Numbers

• Net sales (2016) USD 43.2 million

• Employees (avg. 2016) 742

• Plant area 32,000 m2

• CPTH & STH PCBs capacity 140,000 m2/month • Current CPTH capacity allocation: 70,000 m2/month

• Current STH capacity allocation: 70,000 m2/month

• PTH (DS) capacity 50,000 m2/month

• LED/IMS capacity (SS) capacity: 100,000 m2/month

20173

Net Sales

20174

Change y-o-y

-50 %

-40 %

-30 %

-20 %

-10 %

0 %

10 %

20 %

30 %

40 %

50 %

$-

$10 000 000

$20 000 000

$30 000 000

$40 000 000

$50 000 000

$60 000 000

$70 000 000

$80 000 000

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017E

Net sales Change y-o-y

Investments

20175

Percentage of net sales

0 %

1 %

2 %

3 %

4 %

5 %

6 %

7 %

8 %

9 %

0

500 000

1 000 000

1 500 000

2 000 000

2 500 000

3 000 000

3 500 000

4 000 000

2009 2010 2011 2012 2013 2014 2015 2016 2017E

Recent investments (1/2)

20176

Robot arms for AOI scan loading/unloading

Improved capability, automation

AOI scanner line

Recent investments (2/2)

20177

Automatic Visual Inspection (AVI) to complement final inspection done by operators.

Main Application Areas

• Video game controller, computer peripherals, touch pad (CPTH, SS)

• LED lighting & back lighting (SS, SS IMS)

• Automotive LED lighting (SS IMS, DS PTH)

• Automotive instrumentation (STH, CPTH ramping-up)

• Household appliances (STH, CPTH ramping up)

20178

Quality Management

• Based on certified ISO/TS 16949

• Quality policy• Optimize manufacturing methods

• Build excellent quality

• Continue improving and innovating

• Exceed customers’ requirements

• Targets 2017• Yield: 98% (2016: 97%)

• Automotive DPPM: 18 (29)

20179

Certificates

• UL (E74739) since 1996

• ISO 9002 since 1997

• ISO14001 since 2002

• OHSAS since 2006

• QC08000 since 2008

• ISO/TS16949 since 2005

201710

Organization

201711

Mr. Roy HsiehSales

Mr. Tony WeiCEO

Mr. M.H. GuoManufacturing

Mr. D.H. PongEngineering

Mr. W.J. RenGeneral admin & Materials mgmt

Ms. G.L. ShiFinance

Ms. Dew Zhang (China)

Customer service China & Asia

Mr. Sami Holopainen

(Europe)Customer service

Europe

Ms. Z. L. WanProduction

control

Ms. M. WuEquipment

maintenance

Mr. D.H PongManufacturing

Mr. H.U. WangEnvironmental management

Mr. Z.J.LiFront-end

engineering

Mr. C.W. ChangProcess

engineering

Ms. Sunny Wu Quality

Mr. Bin FuQuality

assurance

Mr. ChrisQuality control

Ms. L.G. ZhuMaterial

management

Mr. C.X. ChangCustoms

Ms. H.F. LiLogistics

Ms. Y.C. WangHuman resources

Ms. Z. ZhuAccounting

Mr. C.M. ZhenAdministration

Ms. Nora Chan (China)

Ms. Emily Hsu (China)

Ms. Cloud Liu (China)

Why Sung Wei?

• Long and proven experience in the focused PCB technologies

• Continuously improving and investing – both in technology and productivity

• Balanced customer base with leading consumer and automotive electronics brands

• Competitive pricing

• Committed owners

20171212

Thank you!

Capability & productsAppendix to company presentation

201714

Capability (1/2)

201715

Note: This is general SW capability. Single parameters may be dependent on each other.

Your approved specifications may differ from enclosed table.

Item CPTH STH IMS (SS) PTH (DS)

Laminates CEM-1, CEM-3, FR4 FR1, CEM-1, CEM-3 Al (1060, 5052, 6061), Cu (C1100) FR4, CEM-3

Final thickness 0.5-1.6 mm 0.8-1.6 mm 0.5-3.0 mm 0.4-1.6 mm

Cu thickness 17 or 35 µm 35 µm 17 - 105 µm 17 - 70 µm

Maximum PCB dimensions 600 x 400 mm 600 x 400 mm 1200 x 500 mm 600 x 400 mm

Through holes

Drilled hole size 0.35-0.5 mm 0.45-0.7 mm 0.8-5.7 mm 0.25 mm

Min. finished hole size NA NA NA 0.2

Aspect ratio NA NA NA 10:1

Drill ing tolerance ± 50 µm ± 50 µm ± 100 µm / ± 150 µm if dia > 4.0 mm NPTH: ± 50 µm, PTH: ± 100 µm

Punched holes ≥ 0.70 mm ≥ 0.70 mm ≥ 1.0 mm ≥ 0.70 mm

Punching tolerance ± 100 µm ± 100 µm ± 100 µm ± 100 µm

Imaging

Line/space ≥ 0.127 mm ≥ 0.150 mm ≥ 0.127 mm ≥ 0.1 mm

Clearance between annular ring and trace ≥ 0.30 mm ≥ 0.30 mm ≥ 0.30 mm ≥ 0.30 mm

Annular ring diameter, dril led hole size + 0.6 mm hole size + 0.6 mm hole size + 0.6 mm hole size + 0.4 mm

Annular ring diameter, punched hole size + 0.8 mm hole size + 0.8 mm hole size + 0.8 mm NA

UV cured soldermask

Opening & clearance ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm

Dam ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm ≥ 0.15 mm

LPI soldermask

Opening & clearance ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm

Dam ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm ≥ 0.10 mm

Vias Paste through hole Paste through hole Printed through hole

Printing side paste thickness (baked) 10-50 µm 10-50 µm NA NA

Botton side paste thickness (baked) 10-70 µm 10-70 µm NA NA

Hole wall paste thickness (baked) ≥ 20 µm ≥ 20 µm NA NA

Overcoat diameter on printing side CPTH + 0.70 mm STH + 0.70 mm NA NA

Overcoat diameter on bottom side CPTH + 0.90 mm STH + 0.90 mm NA NA

Overcoat distance from pad ≥ 0.30 mm ≥ 0.30 mm NA NA

Item CPTH STH IMS (SS) PTH (DS)

Surface finishing & outline

Available surface finishes (in-house) OSP OSP OSP OSP

Lead-free HASL Lead-free HASL Lead-free HASL Lead-free HASL

Available surface finishes Immersion tin HASL Immersion tin Immersion tin

HASL ENIG HASL HASL

ENIG ENIG ENIG

Punching, dimension toleranses

< 100 mm ± 0.10 mm ± 0.10 mm ± 0.10 mm ± 0.10 mm

> 100 mm ± 0.15 mm ± 0.15 mm ± 0.10 mm ± 0.15 mm

> 200 mm ± 0.20 mm ± 0.20 mm ± 0.15 mm ± 0.20 mm

> 300 mm ± 0.25 mm ± 0.25 mm ± 0.15 mm ± 0.25 mm

> 400 mm NA NA ± 0.20 mm NA

> 500 mm NA NA ± 0.25 mm NA

> 600 mm NA NA ± 0.30 mm NA

> 900 mm NA NA ± 0.40 mm NA

Routing, dimension toleranses

< 100 mm ± 0.15 mm ± 0.15 mm ± 0.15 mm ± 0.15 mm

> 100 mm ± 0.20 mm ± 0.20 mm ± 0.15 mm ± 0.20 mm

> 200 mm ± 0.25 mm ± 0.25 mm ± 0.20 mm ± 0.25 mm

> 300 mm ± 0.30 mm ± 0.30 mm ± 0.20 mm ± 0.30 mm

> 400 mm NA NA ± 0.25 mm NA

> 500 mm NA NA ± 0.30 mm NA

> 600 mm NA NA ± 0.35 mm NA

> 900 mm NA NA ± 0.40 mm NA

Distance between V-cut and hole pad/trace ≥ 0.40 mm ≥ 0.40 mm ≥ 0.40 mm ≥ 0.40 mm

Distance between 2 V-cut l ines ≥ 4.0 mm ≥ 4.0 mm ≥ 4.0 mm ≥ 4.0 mm

Electrical

Voltage / via ≤ 100 V (DC) ≤ 50 V (DC) NA

Instant current load / via ≤ 1 A ≤ 1 A NA

Constant current load / via ≤ 600 mA ≤ 300 mA NA

Resistance / via ≤ 100 mΩ ≤ 100 mΩ NA

Capability (2/2)

201716

Note: This is general SW capability. Single parameters may be dependent on each other.

Your approved specifications may differ from enclosed table.

Products: Automotive instrumentation, household appliances

Laminates: FR1, CEM-1, CEM-3

STH/SCO Applications

201717

Dashboard Control board for washing machine

Products: Video game controller, mouse, keyboard, home audio, household appliances

Laminates: CEM-1, CEM-3, FR4

CPTH Applications (1/2)

201718

Product: Laptop touch panel

Laminate: FR4

CPTH Applications (2/2)

201719

Laminates: IMS, CEM-1, CEM-3

LED Applications

201720

Maximum length of the PCB: 1.2 meters

Contact informationAppendix to company presentation

201721

Contact Information

Europe• Sami Holopainen• Phone (Finland): +358 400 487 180• Phone (China): +86 138 2889 4761• Email: sami@sungwei.com

Shenzhen, China• Roy Hsieh• Phone: +86 139 2377 5765• Email: roy@sungwei.com

201722

mailto:sami@sungwei.commailto:roy@sungwei.com

To Get to Sung Wei

Name: Shenzhen Sung Wei Electronics Co., Ltd.

Address: No. 43 Shatou Shangye Road, Shajing, BaoanDist., Shenzhen, Guangdong, China

Name: 深圳松維電子股份有限公司

Address: 深圳市寶安區沙井街道辦沙頭商業路43號

• By car from• Shenzhen airport: 30 min• HK airport 120 min• Guangzhou Baiyun airport 120 min

• By ferry from HK airport• To Fuyong 45 min + car 30 min• To Shekou 30 min + car 60 min

201723

Thank you!