www.intercon.org.pe /Intercon2020

XXVII INTERNATIONAL CONFERENCE ON ELECTRONICS,ELECTRICAL ENGINEERING AND COMPUTING

The 2020 IEEE XXVII International Conference onElectronics, Electrical Engineering and Computing -INTERCON aims to bring together researchers,professionals, students and entrepreneurs to facilitatethe approach, identification and commitment to joinchallenges that allow the development of technologiesfor the benefit of humanity.

2020 INTERCON will be held in Lima, Peru, theGastronomic Capital of Latin America and WorldHeritage Site by UNESCO. Museums with greatworks of art, archaeological sites, beaches, theboardwalk, valleys, natural reserves, the nightlife, thethrill of adventure sports and the exquisite cuisine givesPeru’s capital an authentic personality and makestourism in Lima a unique experience in the country.

2020 INTERCON will be hosted at TECSUP in SantaAnita, which is located on the eastern part of Lima’sCity Center. Between the streets Los Nogales andAlcanfores you find the Huaca Perales, built by tothe Huancho Culture.

CALL FOR PAPERSAugust 03 - 05Lima, Peru

Communication systemsSemiconductors and devicesComputers and information technologySignal processingSystems and controlEmerging technologiesCircuits and systemsPower generation, transmission and distributionRenewable energy sources, Smartgrid technologiesand applicationsPower electronics, systems and applicationsElectrical machines and adjustable speed drivesHigh voltage engineering and insulation technologyAlgorithms and complexityArchitecture and organizationGraphics and visualizationInformation management, assurance and securityIntelligent systemsParallel and distributed ComputingSoftware engineeringSocial issues and professional practice

Topics of interest include but are not limited to:Topics of interest include but are not limited to:

SubmissionThe official language of INTERCON is ENGLISH. The maximunnumber of authors per paper is four (4). Papers must be submmitedin PDF and no longer than four (4) pages, according to the IEEE.

RegistrationEvery accepted paper will need one associated full registration forbeing included in the conference technical program and proceedings.

PublicationAs it is mandatory for any IEEE conferece, we willimplement a strict “No show No Publication” policy,meaning that accepted papers that are not presentedat the conference will not be submitted for publicationin IEEE Xplore. Such presentations must be done on-site,so participants and authors can talk and exchange theirexperiences and points of view. Face-to-face technicaldiscussions are a valuable quality element of ourconference.

All the papers submitted through EasyChair will be previouslyreviewed and all the accepted papers, if presentedat 2020 INTERCON, will be submitted for publicationin IEEE Xplore.

Important Dates

Full paper submission deadline:

May 15

Notification of acceptance:

Final paper submission deadline:

Conference dates:

June 15

June 30

August 03 - 05

Important Dates

Conference Template available at: https://www.ieee.org/conferences/publishing/templates.html

We will use EasyChair system for submissions here: https://easychair.org/conferences/?conf=2020ieeeintercon.

Organizing Committee Conference Chair:

Technical Program Chair:

Publication Chair:

Conference Treasurer:

Information Contacts:

Sponsored by:

César Gallegoscgallegos@ieee.org

Carlos Silvacsilva@pucp.edu.pe

José Duránjoseduran@ieee.org

Carlos Chancafecchancafe@ieee.org

Eyner Mesonesemesones@ieee.org

IEEE Peru Section (www.ieee.org.pe)

TECSUP - Sede LimaIEEE Student Branch

Ingrid Ccoylloiccoyllo@tecsup.edu.pe

www.intercon.org.pe /Intercon2020

Organizing Committee Conference Chair:

Technical Program Chair:

Publication Chair:

Conference Treasurer:

Information Contacts:

Sponsored by: