sip and 3d tsv integrated products perspectives for...

SIP and 3D TSV

Integrated Products

Perspectives for Russian

Electronics Market Semicon Russia 2013

OSTEC Enterprise Ltd.

Scope of competence

Electronic Components

Integrated Circuits

(IC)

LED

MEMS

Packages

Photovoltaic

RFID

OLED &

TFT displays

Hybrids

Smart Cards

Military Electronics

25%

SMART card

6%

Digital TV

15%

Industrial,

consumer

electronics and

communications

30%

Electronic

documents

3%

Auto Electronics

15%

GLONASS

(Russian GPS

analogue)

6%

Russian Electronics Market Segments

Russian microelectronic market Increased consumption of

electronics (per year)

0%

5%

10%

15%

20%

25%

Russia World

The total market

for 2011 year (billion)

€ 3,10

€ 1,80

€ 0,00

€ 0,50

€ 1,00

€ 1,50

€ 2,00

€ 2,50

€ 3,00

€ 3,50

Total electronic

market

The microelectronics

Russian microelectronics market

• Volume of production is << of 1%

world volume

• No modern level of Si producers, only

“a few” of fabs

• Big demand for “more than Moore”

products

• Compaund semiconductors priority

• SIP and 3D TSV

3D Life

Multifunctional

Source : IMEC

Source : Amkor

Multifunctional

Special application electronics

Require special packaging solutions

High relyability and heavy environments applications

require special packaging solutions

Trends in miniaturization

• SOC

• SIP

• Multichip and Multilevel Modules

• Flip Chips (FC, WSFC)

• Pitch and Size shrinkage

• New interconnects and substrate

materials

• 3D Integration

МИС СВЧ

повышенного

уровня

выходной

мощности

Расположени

е GaAs СВЧ

транзисторов

и МИС в

«ряд»

Typical product

multichip microwave module

Typical product

SOC and SIP

System

on Chip

SiP and 3D PackagingMEMS

Bio-InterfacePower Supply

System Complexity

Cost

/ F

unct

ion

Tim

e to M

ark

et

Source : ITRS

www.ostec-micro.ru

3D products classification Плотность

Функциональность

3D IC 3D

SiP

Low Medium High

3D IC

TSV

memories

3D

stacking WB

memories

Lo

w

Med

ium

H

igh

TSV

memories

+logic

3D stacking

WB

memories+logic

SoC

TSV (concept

today)

e.g. ZyCube

2D

SiP

2D

2 chips solution

W

B 1 chip

3D

SiP WB

3D TSV- integration

Vias example

Projects demanded by Russian market -Multichip modules and 3D integrated

structures production

-RFID production including printed

electronics

-AMOLED displays production

-LED development and production

-MEMS production

-Multilayer LTCC and HTCC substrates and

packages

-Microwave chips and modules production

-Cluster minifab with nanoimprint

lithography creation project

OSTEC

has…

…Strategic

Development Plan …working

logistic and service

…perspective

English speaking

sales and service Team

…250 m2 showroom

…active promotion

program …22 years of business

experience

…active stock of

spare parts

…open and reliable

for Partners

…well known name

on the Market

…active Partner

in realization of

Government projects

OSTEC opportunity

Complex approach -

the only possible way for success

Оборудование

Технологии

Материалы Обучение Комплексное

решение

Conclusion • Complex of services for “turn key”

microelectronics production: – Equipment choosing and supply

– Project development

– Consulting

– Installation, start up and ramp up

– Personal staff training

– Process development and tuning

– Warranty and after warranty maintenance support

– Spare parts, consumables and materials supply

Thank You!

Questions?