sip and 3d tsv integrated products perspectives for...
TRANSCRIPT
SIP and 3D TSV
Integrated Products
Perspectives for Russian
Electronics Market Semicon Russia 2013
OSTEC Enterprise Ltd.
Scope of competence
Electronic Components
Integrated Circuits
(IC)
LED
MEMS
Packages
Photovoltaic
RFID
OLED &
TFT displays
Hybrids
Smart Cards
Military Electronics
25%
SMART card
6%
Digital TV
15%
Industrial,
consumer
electronics and
communications
30%
Electronic
documents
3%
Auto Electronics
15%
GLONASS
(Russian GPS
analogue)
6%
Russian Electronics Market Segments
Russian microelectronic market Increased consumption of
electronics (per year)
0%
5%
10%
15%
20%
25%
Russia World
The total market
for 2011 year (billion)
€ 3,10
€ 1,80
€ 0,00
€ 0,50
€ 1,00
€ 1,50
€ 2,00
€ 2,50
€ 3,00
€ 3,50
Total electronic
market
The microelectronics
Russian microelectronics market
• Volume of production is << of 1%
world volume
• No modern level of Si producers, only
“a few” of fabs
• Big demand for “more than Moore”
products
• Compaund semiconductors priority
• SIP and 3D TSV
3D Life
Multifunctional
Source : IMEC
Source : Amkor
Multifunctional
Special application electronics
Require special packaging solutions
High relyability and heavy environments applications
require special packaging solutions
Trends in miniaturization
• SOC
• SIP
• Multichip and Multilevel Modules
• Flip Chips (FC, WSFC)
• Pitch and Size shrinkage
• New interconnects and substrate
materials
• 3D Integration
МИС СВЧ
повышенного
уровня
выходной
мощности
Расположени
е GaAs СВЧ
транзисторов
и МИС в
«ряд»
Typical product
multichip microwave module
Typical product
SOC and SIP
System
on Chip
SiP and 3D PackagingMEMS
Bio-InterfacePower Supply
System Complexity
Cost
/ F
unct
ion
Tim
e to M
ark
et
Source : ITRS
www.ostec-micro.ru
3D products classification Плотность
Функциональность
3D IC 3D
SiP
Low Medium High
3D IC
TSV
memories
3D
stacking WB
memories
Lo
w
Med
ium
H
igh
TSV
memories
+logic
3D stacking
WB
memories+logic
SoC
TSV (concept
today)
e.g. ZyCube
2D
SiP
2D
2 chips solution
W
B 1 chip
3D
SiP WB
3D TSV- integration
Vias example
Projects demanded by Russian market -Multichip modules and 3D integrated
structures production
-RFID production including printed
electronics
-AMOLED displays production
-LED development and production
-MEMS production
-Multilayer LTCC and HTCC substrates and
packages
-Microwave chips and modules production
-Cluster minifab with nanoimprint
lithography creation project
OSTEC
has…
…Strategic
Development Plan …working
logistic and service
…perspective
English speaking
sales and service Team
…250 m2 showroom
…active promotion
program …22 years of business
experience
…active stock of
spare parts
…open and reliable
for Partners
…well known name
on the Market
…active Partner
in realization of
Government projects
OSTEC opportunity
Complex approach -
the only possible way for success
Оборудование
Технологии
Материалы Обучение Комплексное
решение
Conclusion • Complex of services for “turn key”
microelectronics production: – Equipment choosing and supply
– Project development
– Consulting
– Installation, start up and ramp up
– Personal staff training
– Process development and tuning
– Warranty and after warranty maintenance support
– Spare parts, consumables and materials supply
Thank You!
Questions?