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Slide - 1 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Slide - 1
Chip Packaging for WearablesChoosing the Lowest Cost Package
Alan PaleskoSavanSys Solutions LLCalanp@savansys.com
(512) 402-9943www.savansys.com
Slide - 2 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Agenda
Introduction
Wearable Requirements
Packaging Technologies and Cost Drivers
Technology Cost Comparisons
Summary
Slide - 3 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
About SavanSys Solutions LLC
Timeline• 1995: Founded as a spin-off of Microelectronics and Computer Consortium
(MCC) in Austin, TX.
Began with cost modeling for PCB and MCM fabrication and assembly.
• 2005: Partnered with TechSearch International to expand line-up of cost models to include electronics packaging.
Wire bond, flip chip, fan-in WLP, fan-out WLP, embedded die, etc.
• 2012: Initiated development of TSV, 2.5D and 3D fabrication and assembly modeling.
Customers• We have modeled suppliers in: Japan, Malaysia, Taiwan, China, Korea,
Finland, and the US.
• Customers include: semiconductor giants, fabless semiconductor companies, OEMS, system design houses, and more.
• Our customer base is worldwide, with customers in Asia, Europe and the US.
Slide - 4 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Cost Modeling For. . .
Cost Reduction/Optimization• Size, Yield, and Cost Design Planning
• New Technology Adoption Cost Analysis
• Technology Platform and Process Comparison
Supply Chain Collaboration• Characterize Supplier Capabilities
• Consistent and Predictable Behavior
Slide - 5 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
In Search of the Optimal Packaging Choice
Cost
Technology options
OPTIMALPRODUCT
Optimal Product The lowest cost technology choice that meets product requirements
Slide - 6 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Components of Total Cost / Price
Labor Cost
Capital/Depreciation Cost
Material Cost (Consumables and Permanent)
Tooling/NRE Cost
Scrap / Rework Cost
Indirect Labor Cost
Factory Overhead Cost
Corporate Overhead Cost
Profit Margin
Risk Factor
DirectCost
IndirectCost
Margin
UsuallyApplied
as aPercentageOn Direct
Cost
Slide - 7 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Example Wearables
SMS Audio BioSport In-Ear Headphones
* Teardown photos by Chipworks
Huawei Talkband B2
Slide - 8 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Market Requirements for Wearables
Data Collection – Sensors• Low Cost
• Small
• Flexible / Washable / Invisible
• Water proof / Sweat proof
Data Processing and Communication• Bluetooth, WIFI, Cellular?
• Small, but may be rigid
• Water proof / Sweat proof
• Shock Resistant
• Low power
• Light
• Bio compatible
Slide - 9 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Wearables are not Smart Phones
Size constraints in all dimensions• Not just thin
Less data processing requirements• Minimal local data processing. Collect data and send off to smart phone, fog,
or cloud
No access to a battery as large as a cell phone
Much tougher physical requirements• Flexible, washable, sweat-proof, drop-proof, etc
Slide - 10 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Total Cost Relationship to Test/Scrap Opportunities
Traditional Packaging• Three opportunities to scrap at three different factories
Advanced Packaging• Possibly less than three opportunities to scrap
Scrap Die & Package
DiceTest
Wafer Probe
Fabricate
Package
Scrap Bad Substrates
Package
AssemblyTest
Test Complete Product
Fabricate
Semiconduc
tor Wafer
Scrap Bad Die
Scrap
Test
Slide - 11 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Yield Loss Example
TechnologyTest/scrapdie before assembly?
Test/scrapsubstrate
before assembly?
Test/scrap after
assembly ?
Cumulative Yield
Wire Bond Yes Yes Yes 90%
Flip Chip Yes Yes Yes 90%
Fan-out WLP Yes No Yes 81%
Embedded Die Yes No Yes 81%
Fan-in WLP No No Yes 73%
Assume following yields for all packages:90% Die Yield90% Fabrication Yield90% Assembly Yield
Slide - 12 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Wire Bond Technology
Process Flow1. Fabricate substrate or leadframe
2. Die bond chip to package (pads face up)
3. Wire bond die pads to substrate/leadframe pads
4. Mold
Cost Drivers• Wire cost (if gold)
• Number of wire bonds
• Package size
Summary• Almost always the lowest cost option if product requirements (size,
performance, etc.) can be met
Slide - 13 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Flip Chip Technology
Process Flow1. Fabricate substrate
2. Wafer bump die
3. Die bond chip to package (pads face down)
4. Underfill
5. Mold / Lid
Cost Drivers• Wafer bumping cost
• Underfill process
• Substrate cost
Summary• Good choice for high IO count dies with challenging size requirements
Slide - 14 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
WLP, FOWLP, Embedded Die Technology
Process Flow1. Start with either wafer (fan-in WLP) or die (fan-out WLP, embedded)
2. Place die on tape or partially completed organic substrate
3. Add RDL for interconnect to die
Cost Drivers• Compound yield loss
• RDL process
Summary• Best option to meet difficult miniaturization requirements
• Suitable for small die
Slide - 15 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Activity Based Cost Modeling
Cost Components of each Activity• The time required to complete the activity
• The amount of labor dedicated to the activity
• The cost of material required to perform that activity – both consumable and permanent material
• Any tooling cost
• The depreciation cost of the equipment required to perform the activity
• The yield loss associated with the activity
Sample Output
Substrate Labor Material Capital Tooling Yield Macro Running Total
2-[IL-Core] $0.0007 $0.2000 $0.0007 $0.0000 $0.0000 $0.0000 $0.2014
3-[IL-Photoresist] $0.0007 $0.0120 $0.0011 $0.0000 $0.0000 $0.0000 $0.2152
4-[IL - Image] $0.0007 $0.0144 $0.0045 $0.0000 $0.0000 $0.0000 $0.2349
5-[IL-DES] $0.0009 $0.0072 $0.0088 $0.0000 $0.0000 $0.0000 $0.2517
6-[IL - Oxide] $0.0010 $0.0001 $0.0026 $0.0000 $0.0000 $0.0000 $0.2554
7-[IL-AOI]-[Setup] $0.0001 $0.0000 $0.0006 $0.0000 $0.0000 $0.0000 $0.2561
7-[IL-AOI]-[Test] $0.0025 $0.0000 $0.0099 $0.0000 $0.0000 $0.0000 $0.2686
Slide - 16 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Trade Off Scenario 1 – Packaging Technology vs. Package Size
3.5mmx3.5mmPackage - WLP
4mmx4mm Package- FOWLP, FC
5mmx5mm Package- WB
100 IO
5.5mmx5.5mmPackage - WLP
6mmx6mm Package- FOWLP, FC
7mmx7mm Package- WB
225 IO
7.5mmx7.5mmPackage - WLP
8mmx8mm Package- FOWLP, FC
9mmx9mm Package- WB
400 IO
9.5mmx9.5mmPackage - WLP10mmx10mm
Package - FOWLP, FC11mmx11mmPackage - WB
625 IO
11.5mmx11.5mmPackage - WLP12mmx12mm
Package - FOWLP, FC13mmx13mmPackage - WB
900 IO
13.5mmx13.5mmPackage - WLP14mmx14mm
Package - FOWLP, FC15mmx15mmPackage - WB
1225 IO
WLP $0.09 $0.23 $0.46
FOWLP $0.12 $0.25 $0.44 $0.69 $1.02 $1.44
FC PBGA $0.22 $0.40 $0.68 $1.06 $1.48 $2.08
WB PBGA $0.17 $0.29 $0.44 $0.65 $0.94 $1.24
$0.00
$0.50
$1.00
$1.50
$2.00
$2.50
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Cost Comparison.2 defects/sq.cm DD
Key Takeaways• WLP has largest slope due to increasing yield fallout• FC high because wafer bumping is required
Slide - 17 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Trade Off Scenario 2 – Effect of Die Size on Package Cost
Key Takeaways• WB relatively flat since package size and number of WBs drives cost• FC very dependent due to wafer bumping costs• FOWLP decreases due to less mold (larger die displaces more mold).
Also assumes only 1 RDL required.
Slide - 18 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Summary
Wire bond technology is almost always lowest cost
WLP and Embedded die are smallest package but limited to small die
Package Technology Sensitivity• Wire Bond Not particularly sensitive to die or package size
• FOWLP Sensitive to package size but not die size
• Flip Chip Sensitive to both die size (wafer bumping) and package size
(expensive substrate)
Slide - 19 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
BACKUP
Slide - 20 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Trade Off Scenario 3 – Packaging Technology vs. Package Size
3.5mmx3.5mm Package- WLP
4mmx4mm Package -FOWLP, FC
5mmx5mm Package -WB
100 IO
5.5mmx5.5mm Package- WLP
6mmx6mm Package -FOWLP, FC
7mmx7mm Package -WB
225 IO
7.5mmx7.5mm Package- WLP
8mmx8mm Package -FOWLP, FC
9mmx9mm Package -WB
400 IO
9.5mmx9.5mm Package- WLP
10mmx10mm Package -FOWLP, FC
11mmx11mm Package -WB
625 IO
11.5mmx11.5mmPackage - WLP
12mmx12mm Package -FOWLP, FC
13mmx13mm Package -WB
900 IO
13.5mmx13.5mmPackage - WLP
14mmx14mm Package -FOWLP, FC
15mmx15mm Package -WB
1225 IO
WLP $0.10 $0.25 $0.55
FOWLP $0.13 $0.25 $0.44 $0.69 $1.02 $1.44
FC PBGA $0.22 $0.41 $0.70 $1.10 $1.57 $2.25
WB PBGA $0.17 $0.29 $0.44 $0.65 $0.96 $1.27
$0.00
$0.50
$1.00
$1.50
$2.00
$2.50
Tota
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Cost Comparison.5 defects/sq.cm DD
Slide - 21 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Trade Off Scenario 4 – Packaging Technology vs. Package Size
3.5mmx3.5mm Package- WLP
4mmx4mm Package -FOWLP, FC
5mmx5mm Package -WB
100 IO
5.5mmx5.5mm Package- WLP
6mmx6mm Package -FOWLP, FC
7mmx7mm Package -WB
225 IO
7.5mmx7.5mm Package- WLP
8mmx8mm Package -FOWLP, FC
9mmx9mm Package -WB
400 IO
9.5mmx9.5mm Package- WLP
10mmx10mm Package -FOWLP, FC
11mmx11mm Package -WB
625 IO
11.5mmx11.5mmPackage - WLP
12mmx12mm Package -FOWLP, FC
13mmx13mm Package -WB
900 IO
13.5mmx13.5mmPackage - WLP
14mmx14mm Package -FOWLP, FC
15mmx15mm Package -WB
1225 IO
WLP $0.09 $0.21 $0.41
FOWLP $0.12 $0.25 $0.44 0.6902 1.0162 1.4316
FC PBGA $0.21 $0.40 $0.67 $1.03 $1.41 $1.95
WB PBGA $0.17 $0.29 $0.44 $0.64 $0.93 $1.21
$0.00
$0.50
$1.00
$1.50
$2.00
$2.50
Tota
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Cost Comparison.01 defects/sq.cm DD
Slide - 22 Electronic Packaging for Wearable ElectronicsSavanSys Solutions LLC
Trade Off Scenario 5 – Packaging Technology vs. Package Size
3.5mmx3.5mm Package -WLP
4mmx4mm Package -FOWLP, FC
5mmx5mm Package - WB100 IO
5.5mmx5.5mm Package -WLP
6mmx6mm Package -FOWLP, FC
7mmx7mm Package - WB225 IO
7.5mmx7.5mm Package -WLP
8mmx8mm Package -FOWLP, FC
9mmx9mm Package - WB400 IO
9.5mmx9.5mm Package -WLP
10mmx10mm Package -FOWLP, FC
11mmx11mm Package -WB
625 IO
11.5mmx11.5mm Package- WLP
12mmx12mm Package -FOWLP, FC
13mmx13mm Package -WB
900 IO
13.5mmx13.5mm Package- WLP
14mmx14mm Package -FOWLP, FC
15mmx15mm Package -WB
1225 IO
WLP $0.09 $0.22 $0.42
FOWLP $0.12 $0.25 $0.44 $0.69 $1.02 $1.43
FC PBGA $0.22 $0.40 $0.67 $1.03 $1.43 $1.98
WB PBGA $0.17 $0.29 $0.44 $0.64 $0.93 $1.22
$0.00
$0.50
$1.00
$1.50
$2.00
$2.50
Tota
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Co
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Cost Comparison.05 defects/sq.cm DD
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