3800 die-bonder overview

Palomar Technologies

3800 Die BonderUltra-Flexible Component

Placement System

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3800 Die BonderAt a Glance• Fully automatic, precision

microelectronics assembly• Highly-flexible, computer-controlled

work cell• Up to three channels of adhesive

dispense, component placement, eutectic die attach and flip chip operations

• New, studier designed mechanical structure

• Process camera• Quiet linear motors• 0.1 micron linear XY encoders

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LARGE WORK AREA

710 square inch work envelope which can handle flip chip, multiple dispense

tools and a variety of work holders alongside a pulsed heat stage for eutectic

attach and an epoxy daub pot

3800 Die BonderCycle Time

Up to 2600 UPH; Axis Speeds near 40-ips with resolutions of 0.1 micron over work area. Linear Encoders are used for absolute positioningRepeatability

3.5 micron at 3 sigma placement repeatabilityPlacement Accuracy +/- 0.00028” (7 micron)True Radical Position depending on application

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Multiple Options• Pulsed heat stage/steady state• Flip chip• Three channels of fluid dispense• Tape feeders• Magazine handlers• Hot rail handler• ID tracking software• Look-up camera software• In-line assembly lines• Fully automatic substrate part

loading• Motorized expanded wafer die

ejectors• Automatic dispense in series with

pick-and-placewww.palomartechnologies.com 5© 2012 Palomar Technologies, Inc.

Versatile Programming and Operation Tools• Process camera• Object-based

programming• Fast program creation

tools• Diagnostic and calibration

routes• Off-line programming

vacuum sense thresholds• Bond Data Analysis™

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Pattern Recognition

• Advanced Cognex gray-scale pattern recognition system locates randomly oriented device features under a wide variety of background conditions and lighting

• PR Systems Includes:– Auto focus– Contrast enhancement– Averaging– Synthetic modeling/masking– Capacitor find– Centroid modeling– Programmable magnification and light intensity

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Ergonomics

1. New, user-friendly ergonomic user interface

2. Changeable control systems for differences in operator height

3. Gas spring-assisted cover for ease of opening, closing and everything in between

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Dispensing Options

• Dot Dispensing– For high-accuracy dispense of

dots as small as 15mm on small devices

• Line Dispensing– For larger devices where

pattern dispense is needed– Can be conductive or

nonconductive– This type of dispenser (auger)

requires a specific minimum epoxy viscosity

• Time and Pressure Dispensing– Used to dispense lines over a

wide area with low-viscosity epoxy

• Daubing– Can accommodate multiple

individually controlled daubing stations

– Daub tool is dipped into the daub pot, containing epoxy, then touches the die surface, resulting in transferred dots between 5-8mm

– Used for low volume requirements and small dot size

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Eutectic Die Attach

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Tape Feeder Option

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The 8mm feeder requires two slots, and the 12mm requires three slots. In the picture shown below, the farthest to the right is an 8mm and the one next to it is a 12mm.

Displayed above is an accurate representation also showing two 8mm and one 12mm feeders on the 3800 work envelope. A 16mm is also available.

Automated In-Line Assembly –Hot Rail Eutectic Die Attach

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Automated In-Line Assembly –Epoxy and Eutectic Die Attach

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Common Applications

• Flip Chip• Chip-On-Board• HB/HP LED Assembly• Microwave Modules• RF Packages• Hybrid Microcircuits• Fine Pitch SMT• MEMS• Laser Diodes• LED Print Head Attachment

• Solar Concentrator Packaging• MOEMS• AuSi Eutectic Scrub• AuSn Eutectic Solder Attach• PbSn Solder Perform• Anisotropic Conductive Paste

for Flip Chip Attachment• High Accuracy Placement of

Optical Components*partial lists

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3800 Die Bonder Resources

• 3800 Die Bonder Data Sheet• AuSi / AuSn Eutectic Die Attach Case Studies• Micron-Level Placement Accuracy for High Aspect Ratio Die i

n Printing Products• Micron-Level Placement Accuracy for Optoelectronic Compon

ents 

• Process and Reliability Advantages of AuSn Eutectic Die Attach

• Automated Eutectic Die Attach• Improved Eutectic Die Attach with Pulsed Heat System

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Corporate Headquarters: +1-760-931-3600

APAC: +65-6686-3096

EMEA: +49-9131-48009-30

Palomar TechnologiesFor more information visit www.palomartechnologies.com

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