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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
SEAKR Engineering Inc. SEAKR Engineering Inc.
On-Board ProcessingOn-Board Processing
SEAKR Engineering Inc. SEAKR Engineering Inc.
On-Board ProcessingOn-Board Processing
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
ReConfigurable Computing, SEAKR’s Core Business
RCC technology is a core technology for SEAKR engineering
• We are dedicated to developing state of the art RCC and other processing systems.
• Leverage large diverse customer base– Radiation testing of components– Prevent obsolescence– Fastest development times– Lowest cost systems– High level of integration
– Reduced SWaP• Creates a sustainable system
– Eliminate Stove pipes
Developing industry partners for using our RCC technology across subsystems.
• Flexible platforms that enable reuse among subsystems.
• Routers, COMSEC, Telecom, SDR, OBP
Payload Data
Processor
COMSEC
Routers
Telecom
Accelerators
Software
Defined Radio
Mass Data
Storage
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
SEAKR Processing Concept
Objectives• Provide sustainable processing
platforms for users.– SEAKR algorithms
– Users algorithms
– SEAKR platforms
– Users platforms
• Provide SEE mitigation technologies for users of SEAKR platforms.
– IP cores
– System design techniques
– Radiation characterization of components
• Provide technical customer support that specializes in the specific needs of the space community
Hardware Architecture
Radiation
Testing
SEE
MitigationCores
Platform
(SEAKR, Customer)
Algorithms
System
Application
Reliability
Testing
Board level
Or Integrated
System
SEAKR,
Customer, or
Combination
Thermal
Management
Structural
Design
Software
API
SEAKR
Core
Technology
POL
Converters
Integrated and cost effective solutions
Provide a competitive advantage to users
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
4 Generations of RCC Platforms
Four Generations of RCC Platforms
V1, V2, V2P/-X, V4
V1-RCC
V2-RCC
NT-RCC-R
NT-RCC
COP A
Xilinx V4
DDRII
FlashFlashFlash
Power
Switch
PCI-PCI
Bridge /
Config
COP
SelectMap
COP B
Xilinx V4
(NIC)DDR II
SDRAM
512 Mbyte
Serial RIO 4X3.125 Gbps
NIC SelectMap
DDR II
SDRAM
512 Mbyte
High Speed MezzHigh Speed Mezz
V4-RCC
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
SEAKR RCC Development
Virtex-I RCC product• Four Xilinx XQVR1000 FPGA CO-Processors• 256 Mbytes of EDAC R-S Protected SDRAM for each COP• Configuration RAM SEU detection and correction• Non-Volatile memory for 32 different configurations
– Symmetrical FPGA designs
• Internal PCI bus with PMC slot• Cop Interconnect Bus• Read and write COP configurations via cPCI• cPCI 32/64 33 Mhz, 6U form factor• LVDS I/O (Discrete, Serializer/De-serializer)
– SERDES capable of 8 Gbps
Adopted by GSFC for their laser altimeter program
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
Virtex I RCC Block Diagram
COP D
Xilinx V1000
COP C
Xilinx V1000
COP B
Xilinx V1000
SD
RA
M
256M
byt
es
COP A
Xilinx V1000
SD
RA
M
256M
byt
es
SD
RA
M
256M
byt
es
SD
RA
M
256M
byt
es
Config
Control
SRAM
FlashFlashFlash
Power
Switch PCI-PCI
Bridge
LV
DS
SE
RD
ES
LV
DS
SE
RD
ES
LV
DS
SE
RD
ES
LV
DS
SE
RD
ES
cPCI
PCI
SelectMap
Common Bus
Port A Port B Port C Port D
PMC
J1 J2 J3
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
Virtex II RCC Block Diagram
SRAM
FlashFlashFlash
Power
Switch
PCI-PCI
Bridge /
Config
J1 J2
cPCI
Internal PCISelectMap
COP A
Xilinx V2
Ports A1&A2
SERDES A1
SERDES A2
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
COP B
Xilinx V2
Ports B1&B2
SERDES B1
SERDES B2
COP C
Xilinx V2
Ports C1&C2
SERDES C1
SERDES C2
COP D
Xilinx V2
Ports D1&D2
SERDES D1
SERDES D2
LVDS Ring Bus
J3
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
SD
RA
M
32M
x 8
0
mezz
Common Interconnect Bus
J8
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
V2-RCC Four CoProcessors (COPS)
• Xilinx XC2V6000 CO-Processors (24M Programmable gates) – 1144 CGA Package
• 6 Gb SDRAM per COP (on board and mezzanine).
• 25 GFLOPs Radiation Tolerant System by Design (RTSD)
• FPGA mitigation techniques
• SEU and TID radiation techniques for memories
• Radiation Tolerant power conversion Non-Volatile memory for 32 different configurations Data Buses
• Internal PCI bus (~1Gbps)
• Shared COP Interconnect Bus (~4.224 Gbps)
• Pipelined COP bus (~10.0 Gbps) – LVDS
• cPCI 32/64 33/66 Mhz LVDS SERDES (24 Gbps aggregate bandwidth)
• TX 12 Gbps. RX 12 Gbps Mezzanine Card
• 12 Gbps data rates
• 4 Gb SDRAM card with aggregate bandwidth of 19.2 Gbps.
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
Network Based RCC
SEAKR has performed a trade study on network based RCC processing architectures.
Our Network based design leverages much of our existing architecture and interface.
• Builds on our existing V2 RCC architecture but changes some of the physical partitioning due to greater Actel AX device capability and adds an 6 to 8 port network switch
• PCI interface and functionality remains intact.• Configuration scrubbing and SEE mitigation is identical• Uses existing interface GUI and drivers for configuration control and
FPGA communication.
High Speed Serial I/O Network protocol
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
NT-RCC-R Block Diagram
COP A
Xilinx V2Pro
DDRII
FlashFlashFlash
Power
Switch
PCI-PCI
Bridge /
Config
J1 J2 J3
cPCI
PCI
COP
SelectMap
RIO A
6 Port
Switch
Xilinx V2Pro
(NIC)
DDR II
SDRAM
512 Mbyte
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
Serial RIO 4X3.125 Gbps
Parallel
RIO
Serial RIO 4X3.125 Gbps
NIC SelectMap
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
SEAKR NT-RCC-R
NT RCC-R
Network IF Chip (NIC)Parallel Rapid IO Port(4) 3.125Gbps serial links off board(4) 3.125Gbps serial links to COP
Parallel RIO Port
Configuration Controller/PCI-PCI Bridge
Up to 1Gbit NV memory
512MBytes
DDRII SDRAM
Quad Data Rate SRAMs
CO-Processor (COP)2VP70~8Mbits embedded RAMHSIO to NIC2 PPC 405 processors
HSIO
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
NT-RCC Block Diagram
COP D
XilinxV2Pro
COP C
Xilinx V2Pro
COP B
Xilinx V2Pro
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
COP A
Xilinx V2Pro
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
DDRII
FlashFlashFlash
Power
Switch
PCI-PCI
Bridge /
Config
J1 J2 J3
cPCI
PCI
COP
SelectMap
Common Bus
RIO A RIO B
6 Port
Switch
Xilinx V2Pro
(NIC)
DDR II
SDRAM
512 Mbyte
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
QD
R S
RA
M
1M x
36
Serial RIO 4X3.125 Gbps
4X3.125 Gbps
Parallel
RIO Parallel
RIO
Serial RIO 4X3.125 Gbps
NIC SelectMap
4X3.125 Gbps4X3.125 Gbps
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
NT-RCC Layout
SEAKR NT-RCC
24 Layer board MicroVias, blind vias, via-in-padHigh speed 3.125 Gbps Serial links82 pages of schematic capture10 weeks of PCB layout time
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
CGA Qualification Developments
Virtex II CGA Qual CF1144• GSFC Program• 52 boards each with four Xilinx
Virtex2 CF1144 BGA packages• 283 thermal cycles from 0 to 100 C• Vibration and shock testing • 35mm x 35mm, 1144 pin CGA,
1mm pitch.
MPC7457 CGQ Qual• 18 boards with 6 CGA
packages/board. • 456 thermal cycles -40C to 95C • 29mm x 29mm, 483 pin, 1.27mm
BGA pitch
Plastic BGA
ceramic CGA
micro BGA
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Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
Thermal Management
Design supports 8 watts per FPGA without heat pipes or other active cooling
Enclosure Fitting
Thermal Plate (Integral part of Fitting)
CGA
Thermal Plug
Copper Shims
Plug Height
CGA Depth
T-Putty 504
CGA
.007” Thick Etched Shim
Stack
Thermal “Plug”
Enclosure Fitting
PBA
Thermal Plate Feature
16
Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
Low Voltage High Current DC/DC Converters
SEAKR has also developed a Point of Load power supply for low voltage, high current systems.
• Programmable voltage down to 1.0V at 12A
• 85% efficiency• Mezzanine card for design reuse and
flexibility• Originally developed for G4 SBC
VPC Back ViewPOL
Power Supply
17
Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
PCI Chassis Application
Client application to interface with SBC Determines PCI chassis configuration Sends RCC commands to the SBC Used for hardware debug and FPGA configuration
18
Aerospace Data Storage and Processing Systems
SEAKR Engineering, Inc.
SEAKR Engineering Proprietary Information
RCC Built-in Self Test Application
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