advantages of nanotechnology
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Advantages of Nanotechnology Nanotechnology revolutionize a lot of electronic products,
procedures, and applications.
Nanotechnology cause more effective energy-producing,energy-absorbing, and energy storage products in smallerand more efficient devices are possible. More efficient andsmaller batteries, fuel cells, and solar cells can be builtwith this technology.
Manufacturing sector that will need materials likenanotubes, aero gels, nano particles, and other similaritems to produce their products using nanotechnology.These materials are often stronger, more durable, and
lighter than those that are not produced with the help ofnanotechnology.
In the medical world, nanotechnology is also seen as abonus since these can help with creating what is calledsmart drugs. These help cure people faster and without
the side effects that other traditional drugs have.
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Disadvantages of Nanotechnology Possible loss of jobs in the traditional farming and
manufacturing industry.
The development of nanotechnology can also bring aboutthe crash of certain markets due to the lowering of thevalue of oil and diamonds due to the possibility ofdeveloping alternative sources of energy that are moreefficient and wont require the use of fossil fuels.
Atomic weapons can now be more accessible and made tobe more powerful and more destructive. These can alsobecome more accessible with nanotechnology.
Since these particles are very small, problems arise from theinhalation of these minute particles, much like the problems
a person gets from inhaling minute asbestos particles. Presently, nanotechnology is very expensive and developing
it can cost you a lot of money. It is also pretty difficult tomanufacture, which is probably why products made withnanotechnology are more expensive.
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W at is nanoe ectronics? Modern electronics technology is characterized by its
emphasis on miniaturization. Where remarkabletechnological progress has come from reductions in thesize of transistors, thereby increasing the number oftransistors possible per chip.
With more transistors per chip, designers are able to createmore sophisticated integrated circuits (ICs)
Using nanotechnology in electronics resultsnanoelectronics; which deals with the electronic devicesthat has length scales of approximately 1 to 100nanometers
In the age of microelectronics, the devices active zone,e.g., the channel length of a field effect transistor or thethickness of a gate dielectric is derived from the size ofseveral m. Using nanotechnology typical geometricaldimension of an electronic device is the nm.
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Moores Law:
The industrys history of steady increases in
complexity was noted by Gordon Moore, a co-founder of Intel. He made an observation in
1965, later it is called Moores law and states
that: the complexity of an integrated circuit,
with respect to minimum component cost,
will double in about 18 months.
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A typical electronic device of the fifties was a
single device with a dimension of 1 cm, while
the age of microelectronics began in theeighties. Based on Moores law, in the year
2030 in which the nanometer era is to be
expected.
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Roadmap milestones
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Impacts, Limitations of conventional
microelectronics: Microelectronics is one of the most important
technological advancement of our times, onethat has drastically changed the way we workand live
The success of the microelectronics industry isattributed in large parts due to reducedtransistor size in complementary metal-oxide
semiconductor (CMOS) integrated circuitsover 60nm
This increasing miniaturization has allowed an
exponential growth in computing power
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But the size of the transistor approaches the
nanoscale; it is difficult to sustain the Moore
law. Thus new methods for computation arerequired and one of the most promising
method is Molecular Electronics (by
nanoelectronics), where active electronicsdevices are made up of a single molecule or a
molecular monolayer
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Social positive impact of microelectronics
1. Mass production of products
2. Production of less complex (user friendly)
products
3. Enhanced devices for information technology
Some negative impacts are:
1. Misuse of technology
2. Destroy of human lives3. Ignorance of fundamental parts of life
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Some limitations of microelectronics:
1. The physical limit: At thickness less than
1nm, SiO2 will no longer be a good insulatorand leak current will occur, generating too
much heat. In addition, quantum effects
become significant at lower dimensions,interfering with the operation of the
transistor. Moreover, as the device becomes
smaller, the number of doping atoms usedalso decreases, leading to greater fluctuation
of the number of dopant atoms and thus
greater variation among the transistors.
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2. The lithographic limit: The current technology
can only produce a minimum feature size of
130 nm. Other techniques such as extremeultraviolet, x-ray or electron beam lithography
are required to produce features of smaller
dimensions.
3. Limit of manufacturing time: Minimum time is
required for maintaining high temperature, low
pressure etc. during fabrication of
microelectronics devices
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4. The economic limit: Chip fabrication facilities,
also known as fabs, are becoming increasingly
expensive. The state-of-the-art fabs now costabout 10B$. Further reduction in transistor
size will require more expensive equipment
that will not make economic sense.
d h d f f b
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Introduction to methods of fabrication
of nanomaterials: Two types of approach for fabrication of nanomaterials:
1. Bottom-up
2. Top-down
In bottom-up approach, arranging smaller components into
more complex assemblies. It is similar to molecular self-assembly. In this method one collects, consolidates, andfashion individual atoms and molecules into structure. Thisis carried out by a sequence of chemical reactions controlledby catalysts. It is a process which is widespread in biology
where, for example, catalysts called enzymes assembleamino acids to living tissue that forms and supports theorgans of the body. The problem with this approach is long-range order difficult to achieve.
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In top-down approach, creating smaller
devices by using larger ones to direct their
assembly. In this approach one starts with alarge-scale object or pattern and gradually
reduces its dimension or dimensions. This can
be accomplished by a technique calledlithography. Some problem with this approach
with the precision and cost.
In practice the combination of both approach
is using
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Fabrication of nano-layers:Physical Vapor Deposition (PVD):
In general, physical vapor deposition (PVD)
from the gas phase is subdivided into four
groups, namely (i) evaporation, (ii) sputtering,
(iii) ion plating, and (iv) laser ablation
The first three methods occur at low pressures
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An overview of PVD:
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Evaporation:
This procedure is carried out in a bell jar as
shown below
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A crucible is heated up by a resistance or anelectron gun until a sufficient vapor pressuredevelops. As a result, material is deposited on thesubstrate. Technically, the resistance is wrappedaround the crucible, or a metal wire is heated upby a current and vaporized. The electron gun (e-
gun) produces an electron beam of, e.g., 10keV.This beam is directed at the material intended forthe deposition on the substrate. The gunsadvantage is its unlimited supply of evaporating
material and applicability of non-conductive orhigh-melting materials. Its shortcomings lie in theproduction of radiation defects, for instance inthe underlying oxide coating.
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