300mm wafer manufacturing in china: challenges and
TRANSCRIPT
Zing Semiconductor Corporation Confidential
300mm Wafer Manufacturing in China:Challenges and Opportunities
May 2017
Zing Semiconductor Corporation Confidential
Agenda
Advantages when working in China -Market-Policy
Challenges when working in China- Partners- Localization
A brief introduction to Zing SemiconductorChallenges for next-generation wafers
Zing Semiconductor Corporation Confidential
Advantages when working in China -Market-Policy
Challenges when working in China- Partners- Localization
A brief introduction to Zing SemiconductorChallenges for next-generation wafers
Zing Semiconductor Corporation Confidential 4
SOURCE:IBS
15.7%
15.0%
14.2%
42.5%
12.6%
15.3%
13.7%
14.5%
44.4%
12.1%
16.4%
12.3%
13.9%
46.7%
10.7%
15.6%
12.7%
20.7%
41.4%
9.6%
15.8%
10.5%
11.3%
51.9%
10.5%
15.6%
10.6%
11.3%
52.5%
10.0%
54.7%
9.3%
10.0%
15.3%
10.7%
56.2%
9.4%
15.0%
10.0%
9.4%
55.8%
9.2%
15.4%
9.8%
9.8%
57.5%
9.2%
14.9%
9.2%
9.2%
59.4%
8.0%
14.9%
8.6%
9.1%
Semiconductor Market Forecast through 2020
Zing Semiconductor Corporation Confidential
SOURCE:IBS
China Semiconductor Consumption vs. Supply from Domestic Suppliers
Zing Semiconductor Corporation Confidential
62 new fabs have been announced as starting operation between 2017 and 2020.
26 of the new fabs are located in China, or 42% of the total.
2017~2020 New Fab Construction
Zing Semiconductor Corporation Confidential
By product type, the forecast for new facilities and lines include:
① 20 foundries (32 percent), ② 13 memory fabs (21 percent), ③ Seven LED (11 percent), ④ Six Power (10 percent) ⑤ Five MEMS (8 percent).
New Facility: Types
Zing Semiconductor Corporation ConfidentialZing Semiconductor Corporation Confidential 8
Chinese 300mm wafer capacity, 2017-2020
Current 300mm demand is from 8 manufacturers, with a combined 460kwpm production. Including test and monitor wafers, total wafer demand is between 500-550Kwpm.
2017
Many fabs are scheduled to come online by 2020, including expansion of existing fabs as well as new players in the industry, including fabs in Hefei, Jinjiang, and Xiamen, among others. Demand for production wafers is expected to increase by 640K wpm, and including test and monitor wafers, demand is expected to increase by over 700K.
By 2020 total wafer demand will be around 1.2M wpm.
2017-2020
Red text above denotes fabs under construction
Zing Semiconductor Corporation Confidential
Advantages: Policy“Made in China 2025”
Elements of Germany’s “Industry 4.0” policy
Increased emphasis on supply chain efficiencies, supply chain communication, smart factories
Collaboration with MNCs; move away from “indigenous innovation” for domestic market only
Zing Semiconductor Corporation Confidential
Made in China 2025
- Financial / Facility support from central, provincial, and local governments
- Focus on high-tech jobs creation, particularly in interior
- Value-added raw materials highly desirable
Zing Semiconductor Corporation Confidential
Advantages when working in China -Market-Policy
Challenges when working in China- Partners- Localization
A brief introduction to Zing SemiconductorChallenges for next-generation wafers
Zing Semiconductor Corporation Confidential
Challenges: Finding the Right Partners
- Picking the right location
- Subcontractor quality
- When and what to outsource
Zing Semiconductor Corporation Confidential
- China GAAP vs. U.S. GAAP
- Quality bilingual employees
- Language of daily business?
Challenges: Localization
Zing Semiconductor Corporation Confidential
Advantages when working in China -Market-Policy
Challenges when working in China- Partners- Localization
A brief introduction to Zing SemiconductorChallenges for next-generation wafers
Zing Semiconductor Corporation Confidential
Zing Semiconductor is located in Lingang, a district of Shanghai, with a total area of 100,062㎡. The total built-up area will be 128394.90㎡. As of June 2018, investment will be $325M, with total investment estimated to be $1B at full capacity.
Zing Semiconductor
Zing Semiconductor Corporation Confidential
2017-2022 Roadmap
Phase 1Technology Node:28nmCapacity:150K 300mm wafers per month
Phase 2Technology Node:20nm~14nmCapacity:300K 300mm wafers per month
Phase 3Technology Node:10nm and underCapacity: 600K 300mm wafers per month
2017-2018
2019-2020
2021-2022
Zing Semiconductor Corporation Confidential
To 150K wpm mass production
0102
0304
05
Construction
2015.10~2016.08
R&D Phase
2016.09~2016.12
Certification
2017.1~2017.9
Phase 1 End
2017.10~2018.6
*Complete Engineering Design
*Receive Production and Business Licenses
*Approval of construction permits
*Apply for 20 core patents
* R&D equipment tender* R&D equipment procurement* Complete factory construction
* Complete R & D equipment installation* Complete product technology research and development* Start customer sample manufacturing* Capacity to 10k wafers per month
* Pass 4 to 5 customers product certification* Passed ISO9001 certification* Production capacity of 80k/month* Began wafer foundry services in January 2017
* Production capacity of 150k/month* 6 months of sales of 100K wpm, monthly sales of 70 million RMB* Complete 510 patent applications
02:Construction
01:Planning
03: R&D Phase 04: Certification 05: Phase 1 End
Planning
2014.06~2015.09
Zing Semiconductor Corporation Confidential
Crystal Growing Performance1.8M Single Crystal
Whole Single Crystal
Shoulder100mm
Body1800mm
Tail300mm
Pulling Speed
Ingot Axial Length [mm
]70m
m1800m
m
70mm
~ 1800mm
: Target ±8%
200mm
~ 1800mm
: Target ±4%
1.6M Single Crystal
Shoulder100mm
Body1600mm
Tail300mm
Date : 2016.12.28 Date : 2017.01.16
Whole Single Crystal
Date : 2017.02.13
2.0M Single Crystal
Shoulder100mm
Body2000mm
Tail300mm
Whole Single Crystal
Zing Semiconductor Corporation Confidential
Crystal Growing Performance
Low COP Quality Summary
☞ Production Date of Test-3 Ingot : 2017.4.01200nm120nm90nm65nm37nm
30
20
10
0
12.6957
2.260870.608696 0.521739 0.478261
Test-3Test-2Test-1
3000
2500
2000
1500
1000
500
0 2.26087
313.889
2707.58
90nm LPDN Trend LPDN Result of Test-3
BOTTOMMIDDLETOP
40
30
20
10
0
13.375 12.7 11.6
37nm LPDN Result per Ingot Position
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Patent Applications
Zing Semiconductor has applied for 304 patents, for crystal growth, silicon wafer substrate technology, epitaxial material growth, silicon III-V semiconductor material epitaxial growth, SOI wafer substrate preparation and advanced CMOS devices and processes, amongst others. It has received 36 patents, with the remaining patent applications still pending.
Zing Semiconductor Corporation Confidential
Quality Certification Plans
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Certification\ Time2015 2016 2017
11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12
ISO 9001:2015
ISO 14001:2004
OHSAS 18001:2007
ISO/TS16949:2009
2017/5
2017/9
Zing Semiconductor Corporation Confidential
Advantages when working in China -Market-Policy
Challenges when working in China- Partners- Localization
A brief introduction to Zing SemiconductorChallenges for next-generation wafers
Zing Semiconductor Corporation Confidential
Challenges for the industry at 14nm and beyond
23
- Growing demand for COP-free, starting withnear-perfect crystal
- Smaller edge exclusions
Zing Semiconductor Corporation Confidential
Challenges for the industry at 14nm and beyond
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-Thick epi and FD-SOI
SOURCE:Applied Materials
SOURCE:Soitec
Zing Semiconductor Corporation Confidential
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Zing Semiconductor – Your source for300mm wafers in China
Richard Chang