04 arcamone-mems devices and applications

MEMS devices and applications

Dr Julien ArcamoneBusiness development, Silicon Components [email protected]

©© CEA. All rights reservedCEA. All rights reserved

Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 2| 2

Outline |

I. Introduction: LETI, a major player in MEMS R&D

II. Activities on MEMS actuators

III. Activities on RF MEMS

IV. Activities on MEMS sensors

V. Key accomplishments and vision for the future








MEMS activities at LETI: missions & scope|

Market areas

Missions

R&D

domainsMEMSat LETI

Designing new MEMS components and/or developing fabrication processes of MEMS devices with Si‐based technologies

In strong partnership with international industrial companies

Focusing on single process steps or full development cycle including device concept and prototyping

MEMS actuators

MEMS (NEMS) sensors

RF MEMS & passives

+ packaging and associated design kits

Very broad range

Consumer applications, mobile phones

Automotive & Space

Health

Defense



MEMS activities at LETI: main figures|

Some statistics: the largest R&D MEMS lab in EuropeMore than 150 persons including research engineers and technicians, PhD students and Post‐docs∼30 patents and more than 150 publications every year5 common labs with industrial companies

Covering the whole chain: from MEMS design to system integration

MEMS design (modeling and simulation) and prototyping

Fabrication and packaging

Electrical and functional characterization

Integration with analog and digital electronics

Main industrial partners



Outline |








MEMS actuators|

Research FocusMaterials and process development (PZT,…)Piezoelectric and Electrostatic actuators

Applications Inkjet technology Imaging: adaptive focus lensAcoustic: MEMS loudspeakers Medical: energy harvesting, micro‐pump



MEMS actuators realizations 1/3

Material development and 200mm integrationSpecific deposition techniques (Sol‐Gel, epitaxial) for

gradient‐free layers

In‐depth characterization → extracted parameters: e31,eff ∼ ‐16 C/m², d31 ∼ 155pm/V, ε∼1500

Implementation as piezoelectric actuatorApplied voltage on PZT → in‐plane stress → membrane deflection

Application: inkjet and switch

Development of PZT asMEMS material|



MEMS actuators realizations 2/3

Acoustic digital MEMS for portable electronic devicesSound Level Pressure at 1m: 50 dB/cm2

Actuation voltage < 30 V

Thickness < 1mm , size 1 x 1cm2

Acoustic applicationMEMS digital loudspeaker|



MEMS actuators realizations 3/3Optical applicationMEMS varifocal lens|

Electrostatic or piezoelectric actuator for portable electronic devicesFocal distance: ∞ → 10 cm

Actuation voltage < 10 V

Thickness < 500 µm

Start‐up creation: Wavelens



Outline |








RF MEMS|

Research FocusMaterials and process development (AlN,…)High‐Performance RF Passive ComponentsHigh‐Q and Tunable Magnetic InductorsAcoustic Resonators and FiltersRF MEMS Switches

Applications Impedance Matching NetworksTunable AntennasFiltering, Time Reference, RF Circuits

Market areas Space & Defense, Telecom, Low‐Power Radio, Medical, Entertainment



RF MEMS switch| RF MEMS realizations 1/2

Electrostatic switchSPST dc‐contact series switch

Ultra‐compact design → 800x800µm2

High maturity 200mm process

Highly reliable Ruthenium metal contact

Dielectric free electrostatic actuation →no charging effects

DC to 40 GHz operation band

Insertion Loss < 0.6 dB, Isolation > 20dB

Low actuation voltage (35 V)



RF filters| RF MEMS realizations 2/2

Lamb waves filtersBasis: strong know‐how on BAW devices

Use of laterally‐propagating waves

Frequency and other resonator properties fixed by layout (and not only by layer thicknesses)

Frequencies ranging from 100 MHz to 2.5 GHz depending on the exploited acoustic mode

Suitable for narrow‐band filtering

Resonant cavity

Air gap

Waveguide fo = 280 MHz

kt2 =1 %Qshunt = 400



Outline |








MEMS sensors|

Research FocusProcess integrationInertial sensors (accelerometer, gyroscope, magnetometer)Pressure and force sensorsNEMS‐based chemical and biosensorsMagnetic sensors

Applications Motion capture (11 axis platform)HapticsGas analysis and point‐of‐care

Market areas Space & Defense, Automotive, Entertainment, Industrial Safety, Health monitoring

SEM view

CMOS

NEMS



Multi‐axis M&NEMS platform| MEMS sensors realizations 1/3

3D accelerometer 3D magnetometer3D gyroscope Microphone & Pressure sens.

MEMS‐size inertial mass+ Nano‐size piezoresistive gauge

M&NEMS: a multi‐sensor, multi‐axis generic platformSensors fusion with one common electronics, protected by more than 20 patents

Not sensitive to parasitic, x3 area gain, low‐power

To be published



NEMS‐based sensors| MEMS sensors realizations 2/3

NEMS‐based resonant sensors address other domains than MEMS:eg, chemical and bio‐sensingHigh‐efficiency generic (patented) design of NEMS

resonator based on electrostatic actuation and piezoresistive detection (high SNR, high frequency)

Unique and robust NEMS technology

Multi‐gas sensor coupling gas chromatography and NEMS detectors Start‐up creation 2012 APIX tech.

NEMS‐based mass spectrometry for biodetection (proteins, viruses and bacteria)



Magnetic sensors| MEMS sensors realizations 3/3

Above‐IC GMR current sensors

Thickness of Thickness of free layer tfree layer t

Pinned Pinned layerlayer

Free layerFree layer Yoke Yoke width wwidth w

contactcontact

HHxxyyzz

CurrentCurrent lineline Ta (5 nm)CoFeBCoFeCu (2.5nm)CoFePtMn (20nm)

TaCoFeB (4nm)CoFe (1nm)CuCoFe (4nm)

Ta (5 nm)CoFeBCoFeCu (2.5nm)CoFePtMn (20nm)

TaCoFeB (4nm)CoFe (1nm)CuCoFe (4nm)

Magnetic Tunnel Junction (TMR, MRAM)

110nm110nm



Outline |








Key accomplishments|Examples of technological transfers to industrial companies

Recent start‐ups

APIX Multi‐gas analyzers couplinggas chromatography and NEMS

Wavelens MEMS‐actuator –based varifocallens (autofocus) for mobile phone camera

MEMS accelerometersand gyroscopes

High‐value capacitors



Future perspectives|

MEMS actuatorsMEMS using low‐cost piezoelectric polymer as structural layerEnergy harvesters

RF MEMS Tunable, reconfigurable and low‐power componentsUltra‐high frequency (60‐100GHz) filters and switchesComplex SoC (DC‐DC converters, decoupling capacitors)

MEMS sensorsExtension of M&NEMS platform to other kinds of sensorsMEMS / NEMS for biosensingCurrent sensors based on magnetic components



Support to industry either on technological steps (new materials, technology consulting) or full development cycle (new device concept demonstrator including design and process of prototypes)

LETI’s MEMS activities in summary|

Investigating new materials for improved performance, reliability, lower production cost, and new applications

Investigating breakthrough devices architectures

Keep industrialization in mind at all times, ensure quick demonstration for design feedback

Deliver



Annex |



Original approach on energy harvesting|

Multi‐ferroic Composites coupled to shape‐memory/PiezoE CompositesMagnetization changes with stress

PZT actuator to obtain a voltage controlled of the uniaxial anisotropy

New concept for thermal harvesting based on combination of shape memory effect and direct piezoelectric effect (ΔT≈ 2 – 20°C)

Net uniaxial anisotropy field of the composite vs applied stress

Voltage response of the piezo/magnetic compositevs time with natural T variations in a room (open window)

04 arcamone-mems devices and applications

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