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www.penchem.com
AGENDA1) Company Profile 2) Product Portfolio 3) Product Development & Technology Roadmap4) Organization Chart 5) Factory Overview 6) Why Penchem Products7) ISO Certification8) Penchem Analytical Capability & Services9) Applications Lab10) Customers Footprint11) IMDF Registered for Automotive Industries12)Penchem Products Overview
COMPANY PROFILE
• Founded in 1999
• Started as a formulator and manufacturer of high performance adhesives in Permatang Tinggi
• Focused mainly in General Electronic applications
1999 - 2003 2004 - 2007
• Expanded R&D and started the development of LED epoxy for Displays
• Initiated the research on silicone for LED
• Developed a wider range of products for General Electronic applications (>100 products)
• Appointed distributors in Malaysia, Thailand and Singapore
2008 -present
• Moved to a new factory in Bkt Minyak with total build-up area of 25k sqft
• Further expanded on R&D, Quality and Production capability and capacity
• Developed LED epoxy and silicone products for PLCC and high brightness lamps
• Setting up equipment & facilities to synthesize specialties silicone
• Appointed distributors in China and Taiwan
PRODUCT PORTFOLIO – PRESENT & FUTURE
LED Silicone, TIM (Thermal Interface Material), Fiber Optic Adhesives
• Manufacturing facilities to synthesize specialties compounds
• Specialty Fiber Optic Adhesive• Specialty Thermally or
Electrically Conductive Material
LED Epoxy, UV Epoxy, Silver Epoxy, SMT, COB, Potting & Sealant)
2007 - 20112000-2006 2012 - Present
Marine & Composites
2017
MedicalAdhesives
2015
Silicone LED
& Adhesives
2013
Fiber Optics & TIM
2009
Custom Formulations
1999
Silver DA & SMT Epoxies
银胶和SMT环
2001
COB & Relay Sealant
2003
LED Epoxies &
UV adhesives
2007
EMI GasketConductive Ink
2018
Markets
Electronics
Semiconductor
Automotive
Aerospace
LEDs
Fiber Optics
Marine
PRODUCT DEVELOPMENT & TECHNOLOGY ROADMAP
ORGANIZATION CHART
SALES & MARKETG
S & M Dept Mgr
-M.Sc. Chemistry
Sales & Mktg Mgr
-B.Eng. (Hons)
Mechanical
-B.Sc. (Hons)
Biotechnology
Sales & Mktg Eng.
-B.Eng. (Hons)
Chemical
Sales Support Exec.
MANAGING DIRECTOR
Ng Chee Mang
R&D
R&D Mgr
-M. Sc. Applied
Science
R&D Sec. Mgr
-M.Sc. Materials
Eng.
R&D Engineers
-PhD. Materials Eng.
-M. Sc Eng. Science
-B. Eng. (Hons)
Polymer
-B. Sc (Hons)
Chemistry, Materials
Science, Biology
Lab Assistants
FINANCE
Finance Mgr
-B. Accounting
Finance Exec
GENERAL MANAGER
BUSINESS
DEVELOP.
MD
Director
Director
R&D Mgr
GM
ADMIN & HR
HR Manager
-B.A. (Hons)
Management
HR Exec
-B.A. (Hons) English
QUALITY
Quality Manager
-B.Eng. (Hons)
Chemical
Quality Engineers
B.Sc. (Hons)
-Chemistry
-Pure Chemistry
-Applied Science
Doc Control
Lab Assistants
SUPPLY CHAIN
Supply Chain Mgr
Procure, Warehse, Production Mfg Process Eng Customer Service
Pack’g-Del’ry Mgr Mgr Execs
-B.Eng. (Hons) -B.Eng. (Hons) -B. Computer
Chemical Chemical Science
-B. Logistics &
Transportation
Procurement Exec. Prod. Eng Process Eng
-B. Food Sc -B.Eng. Mfg. -PhD. Polymer Composites
Store Exec Prod. Supervisor Maintenance
Technician Sup
Technician Specialist
Store Assistant Line Leader Technician
Prod. Clerk
Operators
FACTORY OVERVIEW
R&D and Quality Laboratories
WarehouseProduction
Administration Office
Silicone Synthesis Plant
WHY PENCHEM PRODUCTS
Main key reasons:
✓Wide range of high quality and performance products ✓Custom formulations and solutions✓Cost effective alternatives
• Industry leading price and performance• Small Minimum Order Quantity, MOQ• Design and Synthesis of key raw materials / specialties materials
✓Strong and comprehensive technical support • Provide competitors evaluations, incorporate with professional system/equipment
manufacturer to provide total solutions, materials failure analysis and process trouble shooting
✓RoHS compliant (test report issue by SGS and accredited test labs)
ISO CERTIFICATION
ANALYTICAL CAPABILITY & SERVICESElectrical, Reliability & Curing
Analysis
Resistivity Meter
Hot Plate
Humidity Chamber
Digital Programmable Oven
Digital Oven
Solder reflow chamber
Light integrating sphere
UV Spot, UV LED, UV Conveyer
Thermal, Optical and Physical Analysis
TGA
TMA
DMA
DSC/UV-DSC
Tensile Tester
Hardness Tester
Viscometer
Refractor Meter
Colour Assessment Chamber
Digital Balance
Flow Tester
Density Meter
LP and HP Microscopes
Thermal Conductivity meter
Chemical and Molecular Analysis
Pyr-GC-MS
GPC
MICRO-FTIR
NMR
APPLICATIONS LAB
• Simulate customers process conditions• Help customers resolve material & process issues
CUSTOMER’S FOOTPRINT
United States of America
Malaysia, Singapore, Thailand, Indonesia, India and Australia
Europe
China (HK & Taiwan), Japan,
Philippines
IMDF FOR AUTOMOTIVE INDUSTRIESPenchem is a registered manufacturer and automotive materials supplier in
the International Material Data System (IMDS) since 2012
PENCHEM PRODUCTS OVERVIEW
产品概述
GENERAL ELECTRONICFinished Products Product Category Product Code Applications Special Features
Chip On Board Epoxy (COB)
➢ EN453➢ EN485 series➢ EN525➢ EN641➢ EN690➢ EN943-19
• Chip-On-Board• Dam & Fill• Encapsulation and protect
components and bonded wires
• Good mechanical and adhesion strength• Low stress• Good thermal-mechanical properties• Good whether ability
Die Attach / SMTEpoxy / Silver Epoxy / Under Fill
➢ CB643➢ CB644➢ CB651➢ DA669-series➢ UF256-series➢ AG828
➢ AG803➢ AG806 ➢ AG830-12➢ AG819 – series➢CB603 Series
• Bonding chip and component on PCB• Die attach (Electrically & non-
electrically conductive)• Under-fill
• Good mechanical and adhesion strength• High thixotropic, no bleeding and tailing• High electrical conductivity (silver epoxy)
Epoxy Sealant ➢ GL158➢ GL168➢ GL172➢ GL174➢ GL440➢ GL506
➢ GL616➢ GL902-4
• Relays & Contactors• Fiber optic• Lens
• Low thermal-mechanical stress• High thermal and moisture resistance• Good chemicals resistance
Epoxy Potting / Silicone Potting
➢ PT300➢ PT365➢ PT366 ➢ PT369➢ PT380-1➢ PT497
➢ PT542➢ PT605➢ PT610➢ PT910-4➢ PT912-1
• Transformer• Sensor
• Low stress, Good thermal-mechanical properties and whether ability
• Good flow ability & self-levelling
UV Epoxy / Silicone ➢ UV200 ➢ UV255➢ UV367➢ UV379-1➢ UV421-2 ➢ UV705 Series➢ UV706 Series➢ UV566-series
➢UV760-series➢ UV766-series➢ UV768➢ UV788➢ UV900➢ UV923➢UV773 Series
• Bonding Fiber optic• Bonding Lens• Tacking Coils• Coating
• High Refractive index (RI=1.4 to 1.5)• Good mechanical and adhesion strength• Fast curing
PHOTONICFinished Products Product Category Product Code Applications Special Features
Casting Epoxy ➢ PT1002➢ PT542➢ OP695-7➢ OP692 Series
• Automobile lighting• Turn signal bulbs• Electronic signs• Signboards• Backlighting• Traffic signal lights
Package Type:❑ Through hole LED (3mm, 5mm, Oval, Flat-
top)❑ Super Flux❑ Snap LED
• Outstanding performance for outdoor applications• Pass 1000TMCL -55°C to 100°C and -45°C to
+120°C• Meet MSL2 specifications• Low Iv degradation (<10%) at 1000hours HTOL• Comply to REACH & RoHS requirements
High Brightness LEDEpoxy/Silicone
➢ OP954 Series➢ OP959 Series ➢ OP966➢ OP955 Series➢OP995 series
• Commercial lighting• Architectural lighting• Outdoor lighting
Package Type:❑ High power LED
• High transmission > 92%• High thermal & radiation resistance, Low stress• Low gas permeability• Wide range of refractive index (RI from 1.4 to 1.58)
SMD/PLCCEpoxy / Silicone ➢ OP685 series
➢ OP955 Series➢ OP959 Series
• Backlighting for signage, LCD panel (TV, hand phone, tablets, etc
• Architectural Lighting• Automotive Accent Lighting
Package Type:❑ PLCC/SMD LED
• Good heat & UV resistance• Meet MSL2 specification
Potting Epoxy ➢ OP281-1 • S4 (seven Segment Display) for counters and digital instruments
• Low thermo-mechanical stress • Meet MSL2 specification
THERMAL MANAGEMENTFinished Products Product Category Product Code Applications Special Features
Silicone or Non Silicone Pad
➢ TH935-2➢ TH979➢ TH996➢ TH211 Series➢TH212 Series➢ TH832➢ TH997➢ TH994➢ TH838
• Heat sink for Power driver, IC for PC, Set
box, Notebook, & Server• Heat sink for high power LED and controller• Heat sink for automobile and heat
exchangers
• Very good thermal conductivity up to 8.0W/mK• 2 types of Pad: (a)Non-sticky and (b)Two-side
sticky• Can die cut to specific size and dimensions• Wide range of thickness (0.3mm up to 7mm)
Silicone or non Silicone Putty / Grease
➢ TH930➢ TH931-2➢ TH932-3➢ TH936-1➢ TH937➢ TH975➢ TH976-1
➢ TH235 Series➢ TH837 • Excellent outdoor performance with good stability
& reliability • Ease of use by dispensing or screen printing
Potting Silicone /Epoxy
➢ TH912-1 ➢ TH934-4➢ TH934-6➢ PT604➢ PT605
• 2-Part RTV potting compound• Good adhesion and weather ability • Good flow ability and self-leveling
Thermally ConductiveSilicone / Epoxy
➢ TH732-1➢ TH670➢ TH974
• 1-Part heat curable epoxy• Excellent adhesion and good mechanical strength • Good thermal conductivity
• Solid at room temperature but changes phase to a viscous liquid at 55°C• For an ultra thin bond linePhase Change
Thermal Stick➢ TH711 (B)➢ TH711-1 (P)
COMPOSITEFinished Products Product Category Product Code Applications Special Features
Structural Epoxy ➢ GL 301➢ GL 302➢ GL 304➢ GL 305➢ GL 306➢ GL 307➢ GL 310➢ GL 311 Series➢ GL 312
• Lamination and vacuum infusion for quality boat• Repair of boat blister and parts• Tank and other composite structures
• Good water resistance• Low viscosity for good wetting on different substrates. E.g: Closed cell foams (PVC and SAN foams) and various types of fiberglass mat.
THANK YOU!
PENCHEM ANALYTICAL CAPABILITY & SERVICES
TGA Thermal Gravimetric Analysis
TMA Thermo MechanicalAnalysis
DMA Dynamic Mechanical Analysis
DSC Differential Scanning Calorimetry
It is a thermal analysis in which changes in physical and chemical properties of materials are measured as a function of increasing temperature or time. Determination of 1. Trace of inorganic filler
content 2. Thermal stability of materials3. Oxidation stability of
materials
It measures the dimensional and mechanical changes of materials at elevated temperature. Determination of 1. CTE2. Tg3. Changes of mechanical properties subjected to temperature change 4. Cure shrinkage
It measures the change in modulus or stiffness of material at elevated temperature.Determination of 1. Complex modulus, M*2. Storage modulus, M'3. Loss modulus, M"4. Glass transition, Tg
It measures the change of thermal dynamic performance Determination of 1. Oxidative Induction time (OIT)2. Glass transition, Tg3. Melting point, Tm4. Crystallization Temp, Tc5. Heat capacity changes6. Estimation of curing % or curing duration 7. Thermal kinetics study
GPC / SEC GC-MS + Pyrolyzer Micro-FTIR (ATR / KBr method)
Ultraviolet-Visible Spectrometer (UV/Vis)
• GPC is often used to determine the relative molecular weight of polymer samples as well as the distribution of molecular weights.
• The primary goal of instrument analysis is to quantify an amount of substance by comparing the relative concentrations among the atomic masses in the generated spectrum
• Material purity• Trace contaminants analysis
• Determination of functional group and structure of materials. Quantitative analysis and qualitative characterization.
• Determination of 1. % T or absorbance2. PtCo color3. Haze4. Whiteness index5. Hunter Lab6. Gardner Color
PENCHEM ANALYTICAL CAPABILITY & SERVICES
NMR Nuclear Magnetic Resonance Spectroscopy
Tensile Machine Refractometer Viscometer
It determines the physical and chemical properties of atoms or the molecules in the sample base on the nuclear magnetic resonance phenomenon and can provide detailed information about the structure, dynamics, reaction state, and chemical environment of molecules
Determination of 1. Tensile strength2. Elongation % 3. Push Strength 4. Strength(Compression) 5. Lap shear strength 6. Tear strength
Measure the Refractive Index (RI) ofthe sample
1. Viscosity and viscoelasticproperties
2. Pot Life determination3. Gel time determination
PENCHEM ANALYTICAL CAPABILITY & SERVICES
PENCHEM ANALYTICAL CAPABILITY & SERVICES
Thermal Conductivity Meter Resistivity Meter Hardness Tester (Shore A/ D/ 00)
Density Meter
Determination of the thermal conductivity of material.
Measure the electrical resistivity of the sample using 4-point probes technique
Determination of Hardness Specific gravity/ Density of solid sample
PENCHEM ANALYTICAL CAPABILITY & SERVICES
Low/High Resolution Optical Microscope
Light Integrating Sphere Micro-Reflow Simulation Oven Humidity Chamber
1. Sample appearance2. Contaminant including shape, size,
texture and uniformity. characterization.
3. Stress characterization
Measure the Light output and the performance and stability of light emitting and optical products
Simulate real reflow ovenstemperature profiles and conditions. The real-time video camera records the changes (eg. color change, crack, delamination) of the samples under the testing conditions.
Humidity and temperature simulation test to accelerate the effects of exposure to the various environmental conditions.
PENCHEM ANALYTICAL CAPABILITY & SERVICES
UV Chamber Molding machine R&D Chemical Reactors R&D Fume Hood
Developing UV curable compoundsand UV aging test
Developing of Silicone Molding Compound
Synthesis of chemical compounds Materials preparation