wafer inspection system he-wi-06s - meyer burger online · the reference inspection system in the...
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The reference inspection system in the market
Leading wafer producers rely on qualified solar wafers from Hennecke More than 80% of all solar wafers in the world are inspected by Hennecke WIS Highly accurate measurement and control systems lead to highest level of process controlling
The crucial measurement technology that adds real value to a Manufacturing Execution System (MES)
Enhancement of proven technology ensures best wafer inspection
Highest accuracy
Highest throughput with highest measurement accuracy 0.6 sec/wafer cycle time Certified and highly qualified solar wafers secure net earnings Lowest breakage rate minimizes operating costs Accurate measurement process maximizes the benefit of automated wafer inspection
Customization and available upgrades turn the modular HE-WI-06s into a long lasting investment
Highest precision and best uptime – made by Hennecke
Fast and fully automated change of all sizes and formats including diamond wire and slurry
Maximized uptime due to highly reliable, qualified and industry proven modularized technologies
The HE-WI-06s is fully dwc compatible (automatic adjustment to “changing shiny wafer” surfaces)
Optional advanced dwc Saw Mark 2 measurement Optional transflection technology (TFC) reliably detects µ-cracks
Wafer Inspection System HE-WI-06sWafer quality control – Best technology for most reliable inspection results
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Wafer Inspection ModulesHE-WI-06s
The following parameters are measured with highest accuracy:
Thickness / TTV Saw Mark / Roughness
Edge defect Chip Resistivity*
*optional
Photoluminescence module HE-PL-02
Applications Analysis of ingot casting Incoming QC in cell fab Prediction of wafer efficiency
Strengths Segregation of multicrystalline wafers Unmatched picture quality at full throughput 14 bit color depth
Key features Machine: integrated into Hennecke wafer inspection and sorting system or stand-alone solution
Wafer type: mono, mono-like and multi wafers
Grinding ScanningMeasuring Cropping Slicing /
CleaningQuality control
Cell productionGluing
Stain µ-cracks / Inclusions Geometry Sori, Bow Lifetime* P/N type* TFC*
Perpendicular Edge Detection module HE-PED-03
High accuracy analysis of wafer edges Hennecke unique feature: inspection of chamfers
No manual inspection of wafers needed any more
Camera
Laser
Wafer
Filter
Wafer
Edge defect
Detection of chipping
Detection of breakage
Loading devices
Double indexer HE-DI-03
Fewer operators needed Semi-automatic module Magazine suitable for three carriers with 25 wafers each or two carriers with 50 wafers each
Optional: adaptable for the use of carriers with up to 120 wafers
Alternating unloading process Easy upgrade for existing systems
Double indexer HE-DI-04
Like HE-DI-03, including automated carrier flipping device
Loading & Sorting
Grinding ScanningMeasuring Cropping Slicing /
CleaningQuality control
Cell productionGluing
Sorting devices
Sorting module HE-WS-04
Fewer operators needed Wafer sorting according to measured quality Polysterene boxes for all relevant wafer sizes 6 single boxes are mounted on two sides One additional output for breakage is available at the end of the last module
Operators have to replace full box(es) with empty one(s)
Easy upgrade for existing systems Up to 3 modules can be added to a WIS
Sorting module HE-WS-05
Like HE-WS-04, but up to 3 single boxes are replaced by quad boxes (stack of 4 regular boxes) to increase sorter capacity
2820 1200 350
5485
1115
100
0 ±
20
OptionsSaw Mark measurement
Saw Mark 2 including roughness (up to 3 lines on each wafer side)
Optional Saw Mark 1 with up to 10 lines on each wafer side (Matrix Saw Mark)
High speed automation and measurement
Increase of effective throughput Reduction of CAPEX and expenses for large factories
MES
Connection to various Manufacturing Execution Systems (MES) possible
Transflection technology
New transflection technology based on NVCD detects µ-cracks on all wafers
InGaAs camera ensures higher sensitivity Set-up utilizes the characteristics of wave guides Installable inside the WIS or as additional module Reduced number of Saw Mark patterns Cracks are visible over the full length Best performance on dwc and multi-wafers
Grinding ScanningMeasuring Cropping Slicing /
CleaningQuality control
Cell productionGluing
We
rese
rve
the
right
to m
ake
chan
ges
refle
ctin
g te
chni
cal p
rogr
ess
(02
/201
7)
Meyer Burger (Switzerland) AG, [email protected], www.meyerburger.comDesigned and manufactured by Hennecke Systems GmbH
Standard technology
Transflection technology