vacuum engineering intro
TRANSCRIPT
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What is Vacuum?
Any space at sub-atmospheric pressure
Vacuum is actually the absence of gas
Vacuum is not absolute, but a continuous range of conditions covering magnitude in common usage (103 to 10-12 Torr)
Vacuum technology involves moving and removing gases
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Why do We Use Vacuum?
Dr. Fred Strnisa
Produce a cleaner environment Remove contaminants that can cause unwanted reactions
Increase mean free path (MFP) Allow sputtering, evaporation and ion implantation
Control number of surface collisions Sputtering of metal layers Control rate of film growth in CVD
Lower molecular density Reduce unwanted contaminants Allow plasma Increase evaporation rate without increasing temperature
(freeze drying) Reduce heat conduction (thermal insulation)
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Why do We Use Vacuum?
Dr. Fred Strnisa
Create a force Move solids or liquids through pipes
Reduce heat flow Reduced pressure reduces collisions between molecules and
hence heat transfer decreases
Increase vaporization Fewer molecules impacting surface or knocking vaporized
molecules back to surface
Protect materials from reactive molecules Pump out reactive molecules and backfill with inert gas
Units of Pressure
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Pressure Force per Unit Area
lb/in2 PSI
N/m2 Pa
Atmospheric Pressure
760 Torr
1.01325x105 Pascal
1.10325 bar
14.7 PSI
Non-Si Units: (common units) Torr, mTorr Bar, mbar 1 Pascal = 10-5 atms
1.0 Bar = 105 Pascals = 750 Torr=0.987 atm
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Classification of Vacuum
760
10-3
1
10-8
750
25
7.5 x 10-4
7.5 x 10-7
7.5 x 10-10
7.5 x 10-13
105
3.3 x 103
10-1
10-4
10-7
10-10
Low
Medium
High
Very High
Ultra High
Extreme
Ultra High
Rough
Medium
High
Ultra High
25
Torr PascalTorr "Traditional"
AVS
Vacuum Ranges
Interstellar Space ~10-20 Torr
Pumping Variables:
Conductance
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The molecular flow of gas through an orifice of area A, separating two large chambers maintained at low pressures, P1 and P2.
Gas flow is driven by the pressure difference,
“Q” is defined as the gas throughput with units of pressure x volume/s (e.g., torr-liters/s).
“C” is the conductance and has units of liters/s.
For air at 298K, conductance of an orifice is 11.7 A (lit/sec)
)(
)(
21
21
PPCQ
PPQ
P1
A P2
A
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Pumping Variables:
Conductance
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For air at 298K (molecular flow), what will be the
conductance of an aperture of 5 cm dia?
What will be the conductance of pipe 3 cm long
under similar conditions?
What will be the conductance under viscous flow
conditions?
What is the difference between two flow regimes?
Pumping Speed
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The pumping speed, S, is defined as the volume of
gas passing the plane of the inlet port per unit time
when the pressure at the pump inlet is P.
P
QS
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Conductance Vs Pumping Speed
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Conductance implies a component of a given
geometry across which a pressure differential exists.
Pumping speed refers to a given plane that may be
considered a pump
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Vacuum Systems
Vacuum systems variety of vacuum pumps, tubing, valves and gauges to establish and measure the reduced pressures.
Each pump may be used as a singly or in combination in a variety of pumping-system configurations
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Vacuum pumps Vacuum pumps
Gas transfer pumps
Gas transfer pumps
Entrapment pumps
Entrapment pumps
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a) Gas Transfer Pumps
Remove gas molecules from the pumped volume and
convey them to the ambient in one or more stages of
compression
Subdivided into positive displacement and kinetic
vacuum pumps.
Rotary mechanical and Roots pumps the positive
displacement variety.
Diffusion and turbomolecular pumps examples of
the kinetic vacuum pumps.
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1) Positive Displacement Pumps:
i) Rotary Mechanical Pumps
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Frequently used to produce the minimum vacuum level
required to operate oil diffusion and TMPs’ to
attain far lower pressures.
The rotary pumps divided into two types by design
Rotary Vane-Type
Rotary Piston-Type Inject/suck
confine
Compress
gas ballast
Discharge
+displ. pump
cycle
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i) Rotary Mechanical Pumps
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The rotary-piston type: the gas is drawn into pumping
space by moving piston,
Gas isolated from the inlet after one revolution, then
compressed and exhausted during the next cycle.
Often employed to evacuate large systems and to
back roots blower pumps.
https://www.youtube.com/watch?v=fEO8LEGfdgc
i) Rotary Piston Pump
Created by web
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i) Rotary Mechanical Pumps:
Types
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Rotary vane type : Consists of vanes mounted to a
rotor that rotates inside of a cavity.
https://www.youtube.com/watch?v=AFHogF-9eGA
i) Rotary Mechanical Pumps:
Comparison
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Piston pumps have
higher pumping speed
than vane type.
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i) Rotary Mechanical Pumps
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Oil is employed as a sealant as well as lubricant between
components moving within narrow clearances
Single-stage vane pumps have an ultimate pressure of
10-2 torr, while two-stage pumps can reach 10-4 torr.
Both usually have a gas ballast to inject air into the
compressed gas a little before discharge.
The injected ballast prevents condensation, allowing
vapors to escape with the exhaust, reducing corrosion
Gas ballasts raise the ultimate pressure and thus reduce
the pump capacity.
ii) Root Pumps
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This pump also called a blower mainly used as a booster or enhancer for positive displacement pumps.
Two figure-eight-shaped lobes rotate in opposite directions relative to each
The clearance between the rotors, and the rotors and housing is 75-300 microns rotation without contact and friction (eliminate oil lubrication)
Very high pumping speeds can attain ultimate pressures ~10-5 torr, however, a fore pump, e.g., rotary mechanical, is required
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ii) Root Pumps
Taken from vacuum engineering, © 2005 by Taylor & Francis Group, LLC
ii) Root Pumps
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Pushes a high volume of gas at low pressure not
useful at high pressures
Roots pumps are popular in sputtering as well as low-
pressure CVD (LPCVD) systems where large gas
volumes continuously pass through reactors (~1 torr)
The pumping speed depends on the RPM
For heat generation water cooling is encased
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2) Kinetic Vacuum Pumps: i) Diffusion
Pumps
From www.furende-ltd.com
The gas molecules from the vessel are trapped by a
stream of vapors and carried towards the exit.
Ultimate pressure
10-9 torr
i) Oil Diffusion Pump: Design
From text book
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i) Diffusion Pumps
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Has no moving parts, unlike positive displacement
Designed to operate in the molecular flow regime
The pumping medium, i.e., the vapor is produced at
the base of the pump by boiling synthetic oil.
As the vapor carrying the gas descends, it condenses
on the cold walls of the pump casing.
i) Diffusion Pumps
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The pump inlet is essentially like the orifice, a pumping speed _________ is theoretically expected for air at room temperature.
The trapped gas molecules released near the lower end and discharge through the foreline.
Desirable properties of the pumping oils Low vapor pressure, High molecular weight, Low latent heat of evaporation and Noncorrosive and nontoxic.
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i) Diffusion Pumps
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Achieving ultimate pressure (Po) depends on the back-
streaming of oil from the pump to the vacuum vessel.
It is controlled by using a cold trap or baffle at the
inlet to condense the oil vapor.
Can pump only from about 10−3 torr needs a
backing pump
Diffusion pumps with diameters of 25–1200 mm, air
pumping speeds from 10–20,000 (lit./sec) are
available.
ii) Turbomolecular pump (TMP): design
From text book
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ii) Turbomolecular pump (TMP)
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Oil-free pumping has spurred the development and
use of TMPs’ (especially in electronics industry)
Gas molecules impact with a rapidly whirling turbine
rotor (20,000 to 30,000 RPM)
A vertical axial-flow compressor consisting of many
rotor/stator pairs or stages mounted in series.
Gas captured by the upper stages is transferred to
the lower stages where it is successively compressed
to the level of the fore-vacuum pressure.
ii) TMP
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No traps or baffles are required and TMPs can be backed by rotary pumps and effectively achieve oilless pumping.
Expensive, but are increasingly employed in all sorts of thin-film deposition and characterization equipment
Pumping speeds of 103 liters/sec and ultimate pressures (Po) <10-10 torr.
Starts pumping from about 10−2 to10-3 torr down to 10−9 torr. A backing pump is required.
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b) Entrapment Pumps
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Condense or chemically bind molecules to surfaces
situated within the pumping chamber.
They work in a different manner to the gas transfer
pumps, which remove gas permanently.
Reversible entrapment pumps release trapped or
condensed gas back into the system upon warmup.
Entrapment
Pumps Entrapment
Pumps
Adsorption Adsorption Cryogenic Cryogenic Sputter ion Sputter ion
i) Cryogenic pumps
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Generate a clean ultrahigh vacuum in the pressure
range of 10-3 to 10-10 torr.
Based on the condensation of vapor molecules on
surfaces cooled below 120K (-153°C).
Temperature-dependent van der Waals forces are
responsible for physically binding gas molecules
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i) Cryogenic pumps
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Surfaces that condense gas molecules are;
Untreated bare metal surfaces
A precooled surface (20K) containing a layer of
precondensed gas e.g., Ar for H2 and CO2 for He
adsorption
A microporous surface of very large area within
molecular sieve materials such as activated charcoal
or zeolite
i) Cryogenic pumps: Design
Taken from web.
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i) Cryogenic pumps: Design
Taken from text book
i) Cryogenic pumps
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Require an initial forepressure of about 10-3 torr in
order to prevent a large thermal load on the
refrigerant and the accumulation of a thick ice
condensate on the cryopanels.
Cryopumps have the highest pumping speeds. For air
at 20 K is equal to 3 liters/s for each square
centimeter of cooled surface.
Expensive, more frequently used with other
conventional pumps (e.g., turbopumps).
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ii) Sputter-ion pumps
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Relies on sorption processes initiated by ionized gas to
achieve pumping.
An electrical discharge between stainless-steel anode
and titanium cathode arrays maintained (few kVs’)
Electrons emitted from the cathode are trapped in the
applied magnetic field (few thousand gauss) high
electron density cloud
After impact ionization of residual gas molecules, the
gas ions travel to the cathode and sputter atoms of Ti.
ii) Sputter-ion pumps: Design
Taken from web and text book
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ii) Sputter-ion pumps
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Ti atoms deposit within the pump to form films that
combine with reactive gases such as nitrogen, oxygen,
and hydrogen
These gases and corresponding Ti-compounds are
then buried by fresh layers of sputtered metal
A wide variation in pumping speeds for different
gases. Hydrogen pumped more effectively than
oxygen, water, or nitrogen
Gases are permanently removed (unlike cryo pump)
ii) Sputter-ion pumps
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Quite expensive and have a finite lifetime that varies
inversely with the operating pressure.
Commonly employed in oilless ultrahigh (10-10 torr)
vacuum deposition and surface analytical equipment.
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iii) Ti-Sublimation pump
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Ti metal is thermally evaporated (sublimed) onto
cryogenically cooled surfaces.
Vacuum Systems Design:
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How to select the pump or pumps required to achieve
the given vacuum pressure in the given time ?
and to sustain it during the given process time?
The various available pumps have their characteristic
pressure range and pumping speed optimum
performance
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Vacuum Systems Design:
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No one pump can produce higher vacuum.
Only mechanical, i.e., positive displacement pumps,
can pump out at atmospheric pressure
In virtually all the pump combinations, the mechanical
pump will be the output or the last pump and will
have to be used as the backing pump.
Vacuum Systems Design:
Created by Dr Yasir F Joya
Pumps applicable for low pressures have high pumping speeds.
Because at low pressures the volume of gas to be pumped out is large (PV = Constant).
At pressure of about 10−3 torr outgassing from the vessel, and components. The pumps should be capable of taking up this load and maintaining the vacuum.
The leaks and permeation will also pose an additional load
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Vacuum Systems Design:
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The length of piping (conductance) will depend on the
system layout but should be the shortest possible.
Conductance will lower the actual speed available at
the input and, hence, will influence the pump selection.
Issues with Vacuum
Taken from web.
Enemies of Vacuum & Cleanliness
Backstreaming
Virtual Leaks
Permeation
Real Leaks
Particulates
Elastomer Seal on
Baseplate
Metal
Vacuum
Wall
Diffusion
Permeation
Vaporization
Desorption
Vacuum
EnvironmentAmbientCondensates
Grime
Rough
Medium
High
Ultra
High
Condensation
Particulate Generation
Large Leaks
Gross Contamination
Volume & Loosely
Bound Water
Elastomer Outgassing and
Permeation
Surface Desorption
Diffusion Through Metal
Permeation Through Metal
Vaporization
Admittance of
Room Air
Backstreaming
Enemies of Vacuum & Cleanliness
Backstreaming
Virtual Leaks
Permeation
Real Leaks
Particulates
Elastomer Seal on
Baseplate
Metal
Vacuum
Wall
Diffusion
Permeation
Vaporization
Desorption
Vacuum
EnvironmentAmbientCondensates
Grime
Rough
Medium
High
Ultra
High
Condensation
Particulate Generation
Large Leaks
Gross Contamination
Volume & Loosely
Bound Water
Elastomer Outgassing and
Permeation
Surface Desorption
Diffusion Through Metal
Permeation Through Metal
Vaporization
Admittance of
Room Air
Backstreaming
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Rate limiting pumping processes
From text book
Most of the time involved in pumping systems to high
vacuum is spent in removing gas from surfaces.
Outgassing
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All materials, when exposed to low pressure, release gases, called “outgassing”.
During manufacturing, processing and handling, materials absorb gases water vapor, hydrogen, and oxygen.
Bonded with the surface layers said to be “absorbed.”
May be dissolved within the material and evenly distributed
Clean surfaces would also have absorbed gases
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Outgassing: Sources
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Construction of vacuum vessels, accessories metals,
polymers and rubbers (gaskets), glasses (view ports),
ceramics, etc.,
These materials have absorbed gases mainly on their
surfaces.
The pressure at which a material outgasses, and the
rate of evolution varies for each material type
Outgassing: Measurement
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Outgassing rates throughput per unit area, i.e.,
torr × liters/sec × cm2 and are published.
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Outgassing: Remedy
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The outgassing problem can be reduced by heating the vessel during the roughening stage. This is called “bake out.”
A temperature of 200–400°C is used. Due to the combination of heating and vacuum, the exposed surfaces outgas quickly
At elevated temperature the material outgasses at a higher pressure and at a faster rate.
It is limited to surface outgassing (desorption) only. Surfaces will reabsorb gases if exposed to the environment.
Outgassing and Leaks:
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What is vacuum leakage?
For outgassing, its rate first increases and then
diminishes with time.
Gas leakage causes a linear rise in pressure with time
Most materials outgas in 10−2–10−4 torr pressure
range.
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Monitoring of Vacuum
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Vacuum Gauges, ordinary Bourdon tube gauges
can be used from 760 to 0.5 torr,
Every gauge has its applicable pressure range.
Vacuum Gauges
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Vacuum Gauges
Rough
Medium
High
Ultra
High
Thermal
Conductivity
of Residual Gas
Ionization of Residual Gas Drag Induced by
Residual Gas on
Moving Object
Force Applied
to Surface
Hot &
Cold Cathode
Ion Gauges
Residual
Gas
Analyzer
Gas
Composition
Analysis
System
Total
Pressure
Measurement
Spinning
Rotor
Gauge
Capacitance
Manometer
Ranges of Vacuum Gauges
Thermo-
couple &
Pirani
Gauges
Convection
Pirani
Atm
100
10-3
10-8
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Monitoring of Vacuum:
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Direct Pressure Gauges
Capacitance manomater consists of a flexible
circular metal diaphragm that is welded in place
symmetrically between two fixed electrode plates
Vacuum Gauges Vacuum Gauges
Direct Gauges Direct
Gauges Indirect Gauges Indirect Gauges
1) Direct Vacuum Gauges:
Capacitance Manometer
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There are two chambers
One chamber permanently sealed and evacuated to
a pressure of ~10-7 torr, while the other opens to the
vacuum chamber
The capacitance change is a direct measure of the
vacuum chamber pressure.
Operate in the range from atmospheric pressure to
about 10-5 torr
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2) Indirect Vacuum Gauges
Relatively high-pressure regime (~10-4 to 760 torr),
Thermocouple gauges and Pirani gauges mostly used
For Knudsen numbers, 10 > Kn > 0.01, the rate of
heat transfer through gases is linearly proportional to
pressure.
Sense the rate of heat transfer between a heated
wire and a nearby wall
i) Pirani Gauge
The filament resistance varies linearly with
temperature proportional to the gas pressure.
As the pressure decreases the number of impacts
decreases resistance increases
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ii) Thermocouple Gauge
http://www.rdmag.com/images/0410/FEVac_a.jpg
In thermocouple gauge, a thermocouple placed in
close thermal but not electrical contact with the
heated filament.
iii) Ionization Vacuum Gauges
From the vacuum engg. ref book
In the high and ultrahigh vacuum regimes, gas
molecules are ionized and the ion current is used
measure of the system pressure.
Hot-cathode gauges Baird-Alpert
ionization tube universally employed
Monitor pressure in the ~10-5 to 10-13
torr
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iii) Ionization Vacuum Gauges
Adopted from vacuum engg book
Vacuum port
Anode Electron source
Cathode
Glass envelope
iii) Ionization Vacuum Gauges
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Thermionic emission of electrons from a heated
filament
Attracted to a positively biased grid design to
increase the collisional impact with gas molecules.
Positive gas ions generated and drawn to a fine wire
collector positioned coaxially within the grid.
The resulting ion current is proportional to the number
of gas ions proportional to the gas pressure
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iii) Ionization Vacuum Gauges
Ionization gauges also available as Cold cathode or Penning Gauges
Tube is like a diode. A permanent magnet is placed outside the tube.
The combined electric and magnetic fields increase ionization and the resulting current.
Penning gauges are cheaper but bulky
Good for general vacuum duty