tystar silicon oxidation furnace operating manual oxidation... · document: tystar oxidation...

DOCUMENT: TYSTAR OXIDATION FURNACE STANDARD OPERATING PROCEDURE Version: 1.0

TYSTAR SILICON OXIDATION FURNACE OPERATING MANUAL

Version: 1.0 MAR 2011

UNIVERSITY OF TEXAS AT ARLINGTON

Nanofabrication Research and Teaching


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Facility

TABLE OF CONTENTS 1. Introduction………………………………………………………..3

1.1 Scope………...………………………………………......3 1.2 Description………………………………………….……3 1.3 Safety……………………………………………....……..3

2. Hardware ..............................…………………………………....4 3. Requirements……………………………………..….….………..4

3.1 Training…………………………………….……..…..….4 3.2 Restrictions…………………………………………,…...4 3.3 System Checks…………………………….……....……5

4 Operating Procedure ………………………..…..……..…….....9 4.1 Load Recipe………….………………….…....…..….….9 4.2 Load Wafer………………….………………….…..…....11 4.3 Unload Wafer….……………………………….……..….12

5 RECIPE ……………….…….………………………..…..……….12


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1 INTRODUCTION

1.1 Scope These procedures apply to the Tystar Oxidation Furnace system. All maintenance should follow the procedures set forth in the manufacturer’s maintenance and operations manuals. This document is for reference only. Personnel should be trained by authorized staff before operating this equipment.

1.2 Description Tystar oxidation furnace is configured with one tube for wet or dry oxidation process. It operates as a stand-alone unit that comprises of three modules: wafers load/unload module, furnace/process tube module, and gas control module. The system has its own computer, FCS10, whose display panel and keypad are located on the left side of the wafer load/unload module. Vented Gas/Source Cabinet includes 2 gas manifolds for N2 & O2 including a D.I. water bubbler with N2 purge. The furnace operation is controlled by using the special function buttons and a series of menu commands.

1.3 Safety 1.3.1 This furnace uses N2 and O2 gas. Make sure the quartz tube end cap is vented

to exhaust properly, if not notify NanoFab staff immediately.

1.3.2 The Oxygen bottle delivery pressure is set to 20-30psi. Do not adjust the gas bottle regulator. Call NanoFab staff for gas bottle changes or gas regulator pressure adjustments.

1.3.3 The furnace is connected to high voltage. Be very careful and aware of electrical hazards when turning on and off system power. If you encounter any electrical malfunctions contact NanoFab staff immediately.

1.3.4 The furnace will heat to high temperatures (11500 C). Make sure all high temperature heat shields and thermal insulators are in place around both ends of the tube and always use high temperature gloves when touching the quartz cap, boat loaders and push rod.

1.3.5 Clean your substrates, making sure there are no organics or metal on the wafer.

1.3.6 This machine has an EMO (Emergency Off) switch/button mounted on the top panel. The EMO switch should be pressed only in an emergency. An emergency would be fire, smoke, electrocution hazards, and an injury to anyone using this particular piece of equipment. If the EMO is pressed notify NanoFAB staff immediately.

1.3.7 Read any posted NanoFAB Engineering Change Notices (ECN) (Fig 1.3.7) for any hardware, process or safety changes before running the tool (Till now there is no ECN posted for Tystar Oxidation Furnace System).


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2 HARDWARE

2.1. Process Gases: O2, N2 2.2. Wafers Load/Unload Module 2.3. Furnace/Process Tube Module 2.4. Gas Control Module

3 REQUIREMENTS

3.1 Training You must be a qualified user on Tystar Oxidation Furnace System. The furnace system can be used for dry and wet oxidation of 3”- 4” diameter wafers.

3.2 Restrictions 3.2.1 The furnace is for small samples i.e. 3” or 4” diameter clean Silicon wafers

3.2.2 No wafers/samples are to be processed that EVER had metal on them or had been previously processed in RTA, PECVD, Sputtering and e-beam systems.

ONLY.

3.2.3 All wafers must not have any edge chips, nicks, or cracks. The wafer front and backside must be clean and free of resist or any residues from photolithography, wet or dry etching processes.

3.2.4 All wafers/samples must have pre-oxidation cleaning process done before oxidation such as RCA1, RCA2, 2-3 min in HF dip 1:10 remove any organic contamination and other residues.

3.2.5 Use dedicated quartz boat for the furnace (Fig 3.2.5).

Fig. 3.2.5


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3.3 System checks 3.3.1 Touch the screen anywhere to exit the screen saver mode (Fig 3.3.1.a). The Main

Menu screen will appear (Fig 3.3.1.b).

Fig 3.3.1.a


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Fig 3.3.1.b

3.3.2 Press DISPLAY STATUS (Fig 3.3.2.a) and verify that the FCS-10 (Furnace Control System-10) is in IDLE condition with about 550 ºC actual temperature (Fig 3.3.2.b) .Check to ensure the Main Chamber Lid is closed and locked, and Load Lock lid is set in Load Lock chamber.


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Fig 3.3.2.a

Fig 3.3.2.b


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3.3.3 Go to the chase. Verify that water and house nitrogen valves are open. Open UHP oxygen valves. The pressure for both nitrogen and oxygen should be 25 PSI. The O2 tank pressure should not less than 500 PSI (Fig 3.3.3).

Water Valve Fig 3.3.3 House N2 Valve

UHP O2 Valve 3.3.4 Go to the gas control section (MFSATM-015) and ensure that MANUAL and

ALARM ACK indicators are off.


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Fig 3.3.4

4 OPERATING PROCEDURE

4.1. Load Recipe 4.1.1. Press MAIN MENU. This key takes you to the main menu (Fig 4.1.1).

Fig 4.1.1

4.1.2. Press RECIPE LOAD (Fig 4.1.2)


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Fig 4.1.2

4.1.3. Use arrow keys to select your recipe file (Fig 4.1.3). Press ENTER twice to load it. There is a limited disk space in the DCS-10 computer and not all the recipes can be stored at the same time. If your recipe is not listed, contact Eduardo ([email protected]) or call X 2-5177 to down load it from the host computer.

Fig 4.1.3

mailto:[email protected]�


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4.2. Load Wafer

4.2.1. Press MAIN MENU then press RUN. Press DISPLAY STATUS (Fig 3) to see current activity. The boat holder is going to come out automatically; it will take 5 minutes. Press ALARM ACK to stop alarm sound. Remove the wafer boat with the special tool and load you sample(s) placing them with the shinny side facing the tube opening. Align the wafer boat in such way that you can see the arrow through the right hole of the boat (Fig 4.2.1).

Fig 4.2.1

4.2.2. If you press EVENT (see fig 4.1.1) the program will resume and close the tube otherwise you will have up to 20 min to load you samples and then the tube will close automatically.

4.2.3. Add FRESH D.I. water to the bubbler. Open the Swagelock fitting carefully with the designated tools, install the funnel and fill it up to the edge of the heater maximum. Close the fitting with the correct torque otherwise you could break the glass.


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Fig 4.2.3

4.3 Unload Wafer

4.3.1. The computer will run the program automatically and once the oxidation is

finished, the alarm will go off indicating that the boat is ready to come out. Press ALARM ACK to stop the alarm sound (Fig 4.3.1) and then press EVENT. The boat will come out. The alarm will go off again, press ALARM ACK. Remove your samples. Return the boat to the tube then press EVENT to put the program in IDLE mode.

Fig 4.3.1


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4.3.2. Before you leave, verify that the FCS-10 (Furnace Control System-10) is in IDLE

condition. Leave the furnace as clean as you found it. Press MAIN MEMU. Close oxygen valves in the chase.

5 RECIPES For details of the standard recipes available, contact Nanofab Engineering staff. Two of currently available recipes are detailed below.

DRY OXIDATION RECIPE : DRYOX.001

Value Unit Instructions Idle Condition STEP : IDLE IDLE STATE

N2 1000.0 SCCM TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC BOATSPD 5.0 IPM BOATIN ON

Process Run Sequence STEP : STRT OPEN DOOR TIME: 00.15.00

N2 5000.0 SCCM If OUTLMT = ON Then goto LDWF

TEMPL 450.0 DEGC TEMPC 500.0 DEGC TEMPS 500.0 DEGC BOATSPD 5.0 IPM BOATOUT ON

STEP : LDWF LOAD WAFERS TIME: 00.20.00

N2 5000.0 SCCM If EVENT = ON Then goto BTIN

TEMPL 450.0 DEGC TEMPC 500.0 DEGC TEMPS 500.0 DEGC BOATSPD 5.0 IPM BOATOUT ON SONIC ON


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STEP : BTIN BOAT IN TIME: 00.15.00

N2 5000.0 SCCM If DNTLK = OFF Then goto STB1

TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC BOATSPD 5.0 IPM BOATIN ON

STEP : STB1 TEMP STABILIZE TIME: 00.20.00

N2 3000.0 SCCM If TEMPC = 700 DEGC Then goto CHK1

TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC

STEP : CHK1 TEMP CHECK TIME: 00.30.00

N2 3000.0 SCCM IF DNTLK = ON goto ABRT IF TUBEOT = ON goto ABRT IF SCROT = ON goto ABRT IF CABOT = ON goto ABRT

TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC

STEP : RMP1 RAMP 1000 TIME: 01.00.00

N2 3000.0 SCCM If TEMPC = 1000 DEGC Then goto STB2

TEMPL 1000.0 DEGC TEMPC 1000.0 DEGC TEMPS 1000.0 DEGC O2 120.0 SCCM HTTAPE ON O2DRY ON

STEP : STB2 TEMP STABILIZE

N2 3000.0 SCCM If TEMPL or TEMPC or TEMPS is out-of-tolerance goto STB2 IF DNTLK = ON goto ABRT IF TUBEOT = ON goto ABRT IF SCROT = ON goto ABRT IF CABOT = ON goto ABRT

TEMPL N/C DEGC TEMPC N/C DEGC TEMPS N/C DEGC O2 120.0 SCCM


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TIME: 00.02.00

HTTAPE ON O2DRY ON

STEP : DRY1 DRYOX 1 TIME: 03.00.00

TEMPL N/C DEGC If DNTLK = ON then goto ABRT

TEMPC N/C DEGC TEMPS N/C DEGC O2 3000.0 SCCM O2DRY ON

STEP : ANL1 20 MIN ANNEAL TIME: 00.20.00

TEMPL N/C DEGC TEMPC N/C DEGC TEMPS N/C DEGC N2 3000 SCCM

STEP : RMP2 RAMP DOWN TIME: 02.00.00

TEMPL 700.0 DEGC If TEMPC = 700 DEGC Then goto HLD1

TEMPC 700.0 DEGC TEMPS 700.0 DEGC N2 3000 SCCM

STEP : HLD1 HOLD TIME: 00.00.00

TEMPL 700.0 DEGC If EVENT = ON Then goto BTOT

TEMPC 700.0 DEGC TEMPS 700.0 DEGC N2 3000.0 SCCM

SONIC ON

STEP : BTOT BOAT OUT TIME: 00.15.00

N2 5000.0 SCCM If OUTLMT = ON Then goto UNLD

TEMPL 450.0 DEGC TEMPC 500.0 DEGC TEMPS 500.0 DEGC BOATSPD 5.0 IPM BOATOUT ON


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STEP : UNLD UNLOAD WAFERS TIME: 00.30.00

N2 5000.0 SCCM If EVENT = ON Then goto LDIN

TEMPL 450.0 DEGC TEMPC 500.0 DEGC TEMPS 500.0 DEGC SONIC ON BOATOUT ON

STEP : LDIN CLOSE DOOR TIME: 00.15.00

N2 5000.0 SCCM If DNTLK = OFF Or EVENT = ON Then goto ENDP

TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC BOATSPD 5.0 IPM BOATIN ON

STEP : ENDP END PROCESS TIME: 00.00.01

N2 5000.0 SCCM TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC BOATSPD 5.0 IPM BOATIN ON

SPECIAL HOLD STEP

STEP : SHLD SPECIAL HOLD

N2 3000.0 SCCM TEMPL N/C DEGC TEMPC N/C DEGC TEMPS N/C DEGC BOATSPD 5.0 IPM SONIC ON BOATIN ON

ABORT SEQUENCE


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STEP : ABRT ABRT: 1st STEP TIME: 00.15.00

N2 5000.0 SCCM TEMPL 550.0 DEGC TEMPC 550.0 DEGC IF EVENT=ON goto ABT1 TEMPS 550.0 DEGC BOATSPD 25.0 IPM SONIC ON BOATOUT ON

STEP : ABT1 END ABRT TIME: 00.00.01

N2 5000.0 SCCM TEMPL 550.0 DEGC TEMPC 550.0 DEGC TEMPS 550.0 DEGC BOATSPD 25.0 IPM SONIC ON BOATOUT ON


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WET OXIDATION RECIPE : WETOX.001

Value Unit Instructions IDLE CONDITION STEP : IDLE IDLE STATE

N2 1000.0 SCCM TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC BOATSPD 5.0 IPM BOATIN

ON

PROCESS RUN SEQUENCE STEP : STRT OPEN DOOR TIME: 00.15.00

N2 5000.0 SCCM If OUTLMT = ON Then goto LDWF

TEMPL 450.0 DEGC TEMPC 500.0 DEGC TEMPS 500.0 DEGC BOATSPD 5.0 IPM BOATOUT

ON

STEP : LDWF LOAD WAFERS TIME: 00.30.00

N2 5000.0 SCCM If EVENT = ON Then goto BTIN


ON

SONIC ON

STEP : BTIN BOAT IN TIME: 00.15.00

N2 5000.0 SCCM If DNTLK = OFF Then goto STB1

TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC BOATSPD 5.0 IPM BOATIN

ON


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N2 3000.0 SCCM If TEMPC = 700 DEGC Then goto RMP1


ON

STEP : RMP1 RAMP 1100 TIME: 01.00.00

N2 3000.0 SCCM If TEMPC = 1100 DEGC Then goto STB2

TEMPL 1100.0 DEGC TEMPC 1100.0 DEGC TEMPS 1100.0 DEGC O2 120.0 SCCM HTTAPE

ON

O2DRY ON


N2 3000.0 SCCM If TAPERDY = OFF goto STB2 If TEMPL or TEMPC or TEMPS is out-of-tolerance goto STB2 IF DNTLK = ON goto SHLD IF TUBEOT = ON goto SHLD IF SCROT = ON goto SHLD IF CABOT = ON goto SHLD IF N2PRSAL = ON goto SHLD

TEMPL 1100.0 DEGC TEMPC 1100.0 DEGC TEMPS 1100.0 DEGC H2OHTR OFF O2 120.0 SCCM HTTAPE

ON

O2DRY ON

STEP : DRY1 DRYOX 1 TIME: 00.15.00

TEMPL 1100.0 DEGC TEMPC 1100.0 DEGC TEMPS 1100.0 DEGC H2OHTR

ON

O2 3000.0 SCCM HTTAPE


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ON O2DRY

ON

STEP : RDYC CHECK H2O TAPE TIME: 00.01.00

TEMPL 1100.0 DEGC IF H2ORDY = OFF goto RDYC IF TAPERDY = OFF goto RDYC

TEMPC 1100.0 DEGC TEMPS 1100.0 DEGC H2OHTR

ON

HTTAPE ON

STEP : WET1 WETOX TIME: 01.00.00

If TAPERDY = OFF goto ABRT If H2ORDY = OFF goto ABRT IF DNTLK = ON goto ABRT IF TUBEOT = ON goto ABRT IF SCROT = ON goto ABRT IF CABOT = ON goto ABRT IF N2PRSAL = ON goto ABRT

TEMPL 1100.0 DEGC TEMPC 1100.0 DEGC TEMPS 1100.0 DEGC H2OHTR OFF HTTAPE

ON

STEP : DRY2 POST DRY TIME: 00.15.00

TEMPL 1100.0 DEGC TEMPC 1100.0 DEGC TEMPS 1100.0 DEGC O2 3000.0 SCCM HTTAPE

ON

O2DRY ON

STEP : ANNL ANNEAL TIME: 00.20.00

TEMPL 1100.0 DEGC TEMPC 1100.0 DEGC TEMPS 1100.0 DEGC N2 3000.0 SCCM HTTAPE

ON

STEP : RMPD

TEMPL 700.0 DEGC If TEMPC = 700 DEGC

TEMPC 700.0 DEGC


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RAMP DOWN TIME: 02.00.00

TEMPS 700.0 DEGC Then goto HLD1 N2 3000.0 SCCM

HTTAPE ON

STEP : HLD1 HOLD TIME: 00.00.00

TEMPL 700.0 DEGC If EVENT = ON Then goto BTOT

TEMPC 700.0 DEGC TEMPS 700.0 DEGC N2 3000.0 SCCM

SONIC ON

STEP : BTOT BOAT OUT TIME: 00.15.00

N2 5000.0 SCCM If OUTLMT = ON Then goto UNLD


ON

STEP : UNLD UNLOAD WAFERS TIME: 00.30.00

N2 5000.0 SCCM If EVENT = ON Then goto LDIN

TEMPL 450.0 DEGC TEMPC 500.0 DEGC TEMPS 500.0 DEGC BOATSPD 5.0 IPM SONIC ON BOATOUT

ON

STEP : LDIN CLOSE DOOR TIME:

N2 5000.0 SCCM If DNTLK = OFF Then goto END1



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00.15.00

ON

STEP : END1 END PROCESS TIME: 00.00.01

N2 5000.0 SCCM TEMPL 700.0 DEGC TEMPC 700.0 DEGC TEMPS 700.0 DEGC BOATSPD 5.0 IPM BOATIN

ON

SPECIAL HOLD STEP

STEP : SHLD SPECIAL HOLD

N2 5000.0 SCCM BOATSPD 5.0 IPM SONIC ON BOATIN ON

ABORT SEQUENCE STEP : ABRT ABRT: 1st STEP TIME: 00.15.00

N2 5000.0 SCCM TEMPL 550.0 DEGC TEMPC 550.0 DEGC TEMPS 550.0 DEGC BOATSPD 5.0 IPM SONIC ON BOATOUT ON

STEP :

N2 5000.0 SCCM TEMPL 550.0 DEGC


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TEMPS : Temperature of source zone (From where the steam enters) TEMPL : Temperature of load zone (At the opposite end of source zone) TEMPC : Temperature of center zone BOATSPD : Boat speed SCROT : Silicon Controlled Rectifier Over Temperature sensor TUBEOT :Tube Over Temperature sensor CABOT : Cabinet Over Temperature sensor DNTLK : Door Interlock

ABT1 END ABRT TIME: 00.00.01

TEMPC 550.0 DEGC TEMPS 550.0 DEGC BOATSPD 5.0 IPM SONIC ON BOATOUT ON

tystar silicon oxidation furnace operating manual oxidation... · document: tystar oxidation...

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