EE503 – IC FABRICATION AND PACKAGING TECHNOLOGY

INTRODUCTION TO IC

Integrated circuit

a complex set of tiny components and their interconnections that are imprinted onto a tiny slice of semiconductor material (e.g silicon). Integrated circuits are usually called ICs or chips.

Definition of integrated circuit:

History of Semiconductor IndustryHistory of Semiconductor Industry

History of Semiconductor IndustryHistory of Semiconductor Industry

History of Semiconductor IndustryHistory of Semiconductor Industry

Functions of IC

Most electronic equipment today use integrated circuit, for example: Computer / Server / workstation TV / Radio / Video Cell Phones Digital Clock Robotic Systems Telecommunication System Automotive Medical Equipment Aerospace Children's Toys Military Field Missile System etc.

Advantages of IC

i. Small ii. Low Cost

iii. Very Low Weight

iv. Low power consumption v. High reliability

vi. Easy replacement

Microelectronics EvolutionMicroelectronics Evolution

Year Technology No. of transistors

Example

1947-1950 Transistor 1 -

1951 -1960 Discrete Component 1 FET, Diode

1961 -1966 SSI

- Small scale integration

10 Logic Gates, Flip-flop

1967-1971 MSI

- Medium scale integration

100 – 1000 Counter, Multiplexer

1972-1980 LSI

- Large scale integration

1000 – 20,000 RAM, Microprocessor

1981 -1990 VLSI

- Very large scale integration

20,000 – 1,000,000 16 bits and 32 bits Microprocessor

1990-2000 ULSI

- Ultra large scale integration

1,000,000 – 10,000,000

Graphic microprocessor

2000 - nowadays

GSI

- Giga scale integration

> 10,000,000 -

IC Integration ScalesIC Integration Scales

In 1975, he updated his prediction to once every 18-24 months.

18

IC Integration ScalesIC Integration Scales

Miniaturization size of transistor from 10µm (micron) to submicron. Nowadays, the smallest transistor is 45nm (0.045µm).

The law is still disputed because the linear growth starts to decline; the number of transistors should increase linearly, but it starts to decrease after 1970.

Factors that contribute to the Factors that contribute to the accuracy of Moore’s Lawaccuracy of Moore’s Law

Classification of Integrated CircuitClassification of Integrated Circuit

In general, IC can be classified into FOUR (4) categories :

Classification based on the fabrication method

Classification based on transistor type

Classification based on circuits function

Classification based on design methodology

IC Classification based on fabrication method:

a. Monolithic

b. Film

c. Hybrid

Classification Based on Fabrication MethodClassification Based on Fabrication Method

Classification Based on Fabrication MethodClassification Based on Fabrication Method

a. Monolithica. Monolithic

The word ‘monolithic’ is derived from the Greek word monos, meaning ’single’ and lithos, meaning ‘stone’.

A monolithic IC is a miniaturized electronic circuit including both active and passive components and their interconnections are being manufactured in the surface of a thin substrate of semiconductor material.

Monolithic ICMonolithic IC

Monolithic ICMonolithic IC

-Advantages of monolithic IC:-- most popular because of low cost.- high reliability.

Disadvantages of monolithic IC:- isolation weakness - limited range of passive components.- circuit design is not flexible.

Classification Based on Fabrication MethodClassification Based on Fabrication Method

b. Filmb. FilmFilm components are made of either conductive or nonconductive material that is deposited in desired patterns on a ceramic or glass substrate.

Film can only be used as passive circuit components, such as resistors and capacitors. Transistors and/or diodes are added to the substrate to complete the circuit.

Film ICFilm IC

Classification Based on Fabrication MethodClassification Based on Fabrication Method

c. Hybrid ICc. Hybrid IC

Hybrid integrated circuit technology is the Hybrid integrated circuit technology is the combination of monolithic circuits combination of monolithic circuits and and film film technology.technology.

The active components are monolithic transistors or diodes. The passive components may be group of monolithic resistors or capacitors on a single chip, or they may be thin-film components. Wiring or a metallized pattern provides connections between chips.

Hybrid ICHybrid IC

Hybrids ICs are widely used for high power audio amplifier applications from 5 W to more than 50 W.

Hybrid ICHybrid IC

Hybrid ICs usually have better performance than monolithic ICs.

However, the process is too expensive for mass production. Thus, multi-chip techniques are quite economical for small quantity production and are more often used as prototypes for monolithic ICs.

Fabrication Method ComparisonFabrication Method Comparison

Characteristics Monolithic Technology Film Technology Hybrid Technology

Type of components Active and passive Passive (Resistor & Capacitor)

Active and passive

Substrate material Silicon (Si)Germanium(Ge)Gallium Arsenide (GaAs)

Conduction layer on insulator (glass, ceramic)

Silicon and insulator

Interconnection method

On substrate surface Metal (Al or gold) Interconnection of two or more chips

Technology method BJT, MOS,GaAs Thin film = 0.5mThick film = 25m

Combination of monolithic and film

Size Medium Small Large

Classification of IC based on transistor typeClassification of IC based on transistor type

Types of transistor

MOS

PMOSNMOS CMOSVMOS

BiCMOS BIPOLAR JUNCTION

TRANSISTOR(BJT)

NPNPNP

Bipolar Junction Transistor (BJT)

NPN

Cross section and Symbol

PNP

Cross section and Symbol

Bipolar Junction Transistor (BJT)

Advantages Of BJT:i. High switching speedii. High durabilityiii. High power handling capability

Disadvantages Of BJT:i. High power dissipationii. Large chip size

iii. Temperature sensitive

MOS ICMOS IC

MOS transistor is known as MOSFET (metal oxide semiconductor field-effect transistor).

MOSFET is widely used nowadays in electronic equipment, e.g. mobile phone, computer, medical electronic equipment, etc.

Examples of MOS technology are:

i. PMOS

ii. NMOS

iii. CMOS

iv. VMOS

PMOS & NMOSPMOS & NMOS

PMOS Cross Section

NMOS Cross Section

PMOS Symbol

NMOS Symbol

CMOSCMOS

CMOS Cross Section :

Schematic diagram of 2-input NAND gate using CMOS

2-input NAND gate symbol

VMOSVMOS

One of the disadvantages of CMOS technology is the disability of handling high power.

VMOS is invented to overcome the problem. VMOS has the capability to operate in high current and voltage.

VMOSVMOS

VMOS is the acronym of Vertical Metal Oxide Semiconductor.

VMOS has the V shape gate to conduct more carriers vertically from SOURCE to DRAIN.

P P

+

+

+

GS S

D

BiCMOSBiCMOS

BiCMOS is the acronym of bipolar complementary metal oxide semiconductor , the technology that combines BJT and CMOS on the same chip to generate high speed and high concentration circuit.

Advantages & Disadvantages of MOS technologyAdvantages & Disadvantages of MOS technology

MOS Transistor

Types

Advantage Disadvantage

PMOSi. Low fabrication cost.ii. Simple fabrication method.

i. Low circuit performance (slow). This is because the hole current

mobility is two times slower than electron.

NMOSi. Smaller size compared to PMOS.ii. High circuit performance.

i. Fabrication process is more difficult compare to PMOS.

CMOSi. Low power dissipation. i. Larger size compared to PMOS and

NMOS.

BiCMOSi. High circuit performance (high speed).ii. Low power dissipation.

i. Larger chip size.ii. Complex fabrication process.iii. High fabrication cost.

VMOSi. Capable of operating in high

current and voltage.ii. High circuit performance (high

speed).

i. Complex fabrication process.ii. High fabrication cost.

Classification Based on Circuits FunctionClassification Based on Circuits Function

Integrated Circuit

Linear / AnalogIntegrated circuits that operate with analogue signal at the input and output -continuous sine wave signal .Examples:i. Op-Ampii. Power Amplifieriii. Multiplieriv. Comparatorv. Voltage Regulator

DigitalIntegrated circuits that operate with digital signal at the input and output – Discrete square wave signal Examples:i. Logic gatesii. Flip-flopiii. Counteriv. Calculator chipsv. Memoryvi. Microprocessor

Analog and Digital ICAnalog and Digital IC