tokyo electron corporate update · · 2018-05-142018-05-14 · processes: front-end (wafer...
TRANSCRIPT
CORP IR / 2018.05.14 1
May 14, 2018
Tokyo Electron
Corporate Update
CORP IR / 2018.05.14 2
3
9
16
25
30
35
42
1. TEL Overview
2. Medium-term Management Plan TEL Initiatives and Progress
3. FY2019 Business Environment and Financial Estimates
Appendix 1: Etching System
Appendix 2: Effects of EUV Lithography Adoption
Appendix 3: FPD Production Equipment
Appendix 4: Financial Data
Contents
CORP IR / 2018.05.14 3
TEL Overview
CORP IR / 2018.05.14 4
Distributor of other suppliers’ productsEstablished development/
manufacturing functionsGlobalization Production reform
TEL is Innovative and Flexible to Market Change
0
300
600
900
1,200
1,500
65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19(E)
(Billion Yen)
(FY)
TEL consolidated net sales
Listed on TSE #2 in1980 and #1 in 1984 Strengthened corporate governanceEstablished first
manufacturing JV
(TEL-Thermco)Discontinued export business of
consumer productsBegan overseas direct operations
Semiconductor applications
Mainframe computer
Mobile phonePC
Consumer electronics, etc.
Striving for
new growth
CORP IR / 2018.05.14 5
Financial Performance: Sales and Operating Margin
(Billion Yen)
4M DRAM oversupply • IT bubble crash
• Excessive logic foundry investment
• Financial crisis in Asia
• 64M DRAM oversupply
• World financial crisis
• Memory oversupply
(FY)
• Effects of European debt crisis,
slowdown in emerging markets
• Weak demand for PC, mobile
723.8
906.0
668.7
497.2612.1613.1
663.9
799.7
1,130.7
1,400.0
16.7%
-4.4%
18.6%
-0.5%
14.6%
2.5%5.3%
14.4%17.6%
19.5%
24.9%26.1%
-10%
0%
10%
20%
30%
40%
50%
-300
0
300
600
900
1,200
1,500
90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19(E)
TEL Net sales
Operating income
Operating margin
CORP IR / 2018.05.14 6
US$ 1,742B
US$ 343B
US$ 37B
The Market TEL Participates in
¥1,055.2B, 93%
¥75.0B, 7%
¥0.4B, 0%
¥1,130.7B
CY2016 World Market
Electronic System
Semiconductor
WFE* CAPEX
*The semiconductor production process can be divided into two sequential sub-
processes: front-end (wafer fabrication) and back-end (assembly and test)
production. WFE is used in the front-end production process. Front-end production
equipment includes equipment for wafer level packaging.
Source: Gartner, “Forecast: Semiconductor Wafer Fab Manufacturing Equipment,
Worldwide, 1Q17 Update” 13 April 2017
Charts/graphics created by Tokyo Electron based on Gartner research.
FY2018 TEL Sales(April 2017-March 2018)
FPD Production
Equipment
(FPD)
Semiconductor
Production
Equipment
(SPE)
Others
CORP IR / 2018.05.14 7
Oxidation/Diffusion
FPD Coater/Developer FPD Etcher/Asher
Deposition System Cleaning SystemCoater/Developer Dry Etch System
87%
26%36%
31%
25%
19%
71%
TEL Main Products World Market Share (CY2017)
ALD
38%
CVD
42%
Semiconductor Production Equipment
FPD Production Equipment (FY2018)
Source (SPE): Gartner, “Market Share: Semiconductor Wafer Fab Equipment, Worldwide, 2017”, 18 April 2018,
Charts/graphics created by Tokyo Electron based on Gartner research.
Coater/Developer: Photoresist processing (Track), Dry Etch System: Dry etch, Deposition System: Tube CVD + Atomic layer
deposition tools + Oxidation/diffusion furnaces + Nontube LPCVD, ALD: Atomic layer deposition tools, CVD: Tube CVD + Nontube
LPCVD, Oxidation/Diffusion: Oxidation/diffusion, Cleaning System: Wet stations + Spray processors + Other clean process
Source (FPD): TEL survey
CORP IR / 2018.05.14 8
World Top 10 SPE Makers
9.87
7.33
6.37
6.06
3.19
1.78
1.41
1.36
1.12
0.93
Applied Materials
ASML
Lam Research
Tokyo Electron
KLA-Tencor
SCREEN
Advantest
Teradyne
HitachiHigh-Technologies
ASM Pacific Technology
CY2016 Revenue Ranking(Billions of US$)
Source; The Chip Insider Equipment & Emerging Markets (VLSI Research, May 2017)
Exchange Rates: 1US$=¥108.80
CORP IR / 2018.05.14 9
Medium-term Management Plan
TEL Initiatives and Progress
CORP IR / 2018.05.14 10
Wafer Fab Equipment (WFE) Market Outlook
WFE market growth accelerating.
Investment expanding to
$50B+
Future growth drivers
Equipment market is moving to the next phase amid expanding
applications for semiconductorsEquipment for wafer-level packaging is not included in the market size here.
PC, internet, mobile+
VR/AR/MR*, IoT, AI, RPA**,
machine learning, big data,
autonomous driving, blockchain
* VR/AR/MR: Virtual reality/Augmented reality/Mixed reality ** RPA: Robotic process automation
Source: VLSI “Wafer Fab Equipment (WFE) Market History and Forecast” April 2018. Graph created by TEL using above data
0
10
20
30
40
50
60
CY'13 CY'14 CY'15 CY'16 CY'17 CY'18
($ Billion)
CORP IR / 2018.05.14 11
SPE Business Strategy: Etching System
Achieving success in DRAM as planned. Continue to Focus on 3D NAND and Logic
Word line
isolation (Slit)
Multi-level
contact
3D NAND HARC* processesDRAM
Lower customer patterning costs through
combining multiple steps into one
Improve our position in 9X/12X through
our clear lead in productivity and etch
profileCY’17 CY’18 CY’19
6X 6X/9X 9X
Simplify processes
Logic
Maintain high interconnecting
dielectric process market share
Enhance our position in 7nm and finer
advanced patterning
Capacitor processes (HARC)
Interconnects
Capacitor
Interconnects
FinFET
Market share CY’15 (Actual) CY’16 (Actual) CY’17 (Actual) ・・・ CY’19 (Target)
Etching System 21% 23% 26% >30%
Channel
(Memory hole)
* HARC (High aspect ratio contact) process: a process for forming holes that requires advanced processing technology
Interconnects
CORP IR / 2018.05.14 12
SPE Business Strategy: Deposition System
CVD systemALD system
Achieve both high quality film formation and high
productivity needed for miniaturization and for 3D
structure with semi-batch system
Differentiate in memory through our clear lead in
batch system productivity
Achieve high quality metallization to enable further
miniaturization
2014 2015 2016 2017 2018 2019
ALD system market
CAGR >10%
¥90.0B
¥150.0B
Metallization system
Triase+™
Market share CY’15 (Actual) CY’16 (Actual) CY’17 (Actual) ・・・ CY’19 (Target)
Deposition system 38% 37% 36% >47%
Semi-batch ALD system
NT333™Source: TEL estimate
Batch system
TELINDY PLUS™
Aim to expand earnings based on new technologies for further
miniaturization and next-generation semiconductors
Source: Gartner, “Market Share: Semiconductor Wafer Fab Equipment, Worldwide, 2016”, 30 March 2017, Charts/graphics created by Tokyo Electron based on Gartner research.
Deposition System: Tube CVD + Atomic layer deposition tools + Oxidation/diffusion furnaces + Nontube LPCVD
CORP IR / 2018.05.14 13
SPE Business Strategy: Cleaning Systems
Single wafer cleaning system
CELLESTA™
Batch cleaning system
EXPEDIUSTM
* Bevel cleaning: process for removing film from the outer part of the wafer
Market share CY’15 (Actual) CY’16 (Actual) CY’17 (Actual) ・・・ CY’19 (Target)
Cleaning system 18% 20% 25% >24%
Expand sales of CELLESTA™ single wafer cleaning system
– Expand applications based on backside and bevel cleaning* and drying technology
that prevents pattern collapse during the post-etch cleaning processes
Secure key 3D NAND processes through batch cleaning
– Provide high quality and productivity in the metal etching, polysilicon etching, and
nitride film removal processes required for precise controllability
Apply best known coater/developers methods to cleaning system
business
– Share leading-edge technology and expertise by unifying R&D
CORP IR / 2018.05.14 14
Field Solutions (FS) Business: Medium-term Plan
Increase earnings in both the used equipment/modification and parts/service
segments through a business model that utilizes makers’ strengths
Respond to new customer needs
driven by IoT
– Provide upgrades and
remanufactured equipment that
handle new applications
Contribute to improving customer
productivity
– Provide added-value services using
remote connections
(Installed base of 62,000 units)
FS business strategy
93.0105.0 115.0
150.0180.077.0
80.093.0
101.0
140.0
0
50
100
150
200
250
300
350
400
FY'15 FY'16 FY'17 FY'18
Field Solutions sales
¥320.0B
170.0185.0
208.0
251.0
WFE$45B
Used equipment
and modification
Parts and services
FY’20
(Medium-term plan)
CORP IR / 2018.05.14 15
Financial Model (toward FY2020)FY2018
(Actual)
FY2019
(Estimate)
FY2020
(Medium-term plan)
WFE $51B WFE $58B WFE $42B WFE $45B
Net sales 1,130.7 1,400.0 1,050.0 1,200.0
SPE 1,055.2 1,288.0 970.0 1,120.0
FPD 75.0 112.0 80.0 80.0
Gross profitGross profit margin
475.042.0%
598.042.7%
452.043.0%
522.043.5%
SG&A expensesSG&A expense ratio
193.817.1%
232.016.6%
200.019.0%
210.017.5%
Operating incomeOperating margin
281.124.9%
366.026.1%
252.024.0%
312.026.0%
Net income attributable
to owners of parent204.3 270.0 180.0 220.0
(Billion Yen)
CORP IR / 2018.05.14 16
FY2019 Business Environment and Financial Estimates(FY2019: April 1, 2018-March 31, 2019)
CORP IR / 2018.05.14 17
► WFE* capex
CY2018 investment driven by buoyant demand for memory,
expect YoY growth of approx. 15%
►FPD production equipment capex for TFT array process**
We expect CY2018 investment in production equipment to increase
approx. 10% YoY despite adjustments to investment in small/medium
panels for mobile devices, with demand driven by significantly expanded
investment in G10.5 on demand for large panels
Accelerating growth in the equipment market on
active investment in IoT and next generation technologies
Business Environment (Outlook as of April 2018)
* WFE (Wafer fab equipment): The semiconductor production process is divided into front-end production, in which circuits are formed on wafers and inspected, and back-end production, in
which wafers are cut into chips, assembled and inspected again. Wafer fab equipment refers to the production equipment used in front-end production and in wafer-level packaging production.
** TFT array process: The processes of manufacturing the substrates with the electric circuit functions that drive displays
CORP IR / 2018.05.14 18
DRAM: Market growth of 60% YoY forecast
– Capex: 70% of investment amount to be for new factories, and 1X/1Ynm generation to comprise 80%
– Driving force: Average server capacity up 35%
– Opportunities: Differentiation through combined patterning and our strength in interconnects
Non-volatile memory: Same level forecast
– Capex: 9X generations to comprise 50%
– Driving force: Growth in SSD demand for data centers and PCs
– Opportunities: Differentiation through high value-added etch and clean
Logic/Foundry: Same level forecast
– Capex: 10nm and beyond generation to comprise 50%
– Driving force: Demand for higher performance, lower power consumption
– Opportunities: Business expansion in more complex patterning processes
CY’18 WFE Market Growth and Business Opportunities by Application
CY'17 CY'18
WLP
DRAM
Non-volatile memory
Logic foundry
Logic & others
* TEL estimate
WFE market by application*
$51B
$58B
CORP IR / 2018.05.14 19
Drivers of Investment in NAND Flash
29% 38% 35%30%
30%40%40%
43%
49%
51%
CY'17(E) CY'18(E) CY'19(E) CY'20(E) CY'21(E)
SSD bit growth
CAGR 50.9%
Breakdown of NAND bit demand by application*Ratios on graph are in comparison with total bit demand, which is 100
Investment driven by rapid increase in storage capacity demand through
IoT and increase in SSD usage
SSD
Others
Mobile
NAND bit growth driven by SSD
–SSD CAGR 50.9%(CY’17-21)
–Mobile CAGR 32.0%(CY’17-21)
Rapid increase in demand for server capacity*Capacity is aggregate of SSD and HDD
–CY’17 300EB⇒ CY’21 1ZB
Big potential for growth in SSD usage
–Only used in 9% of servers in CY’17
–Usage in PCs also low at 39% in CY’17Source: Gartner, “Forecast: NAND Flash Supply and Demand, Worldwide, 1Q16-4Q18, 4Q17 Update”, 02 January 2018.
Charts created by Tokyo Electron based on Gartner research.
Mobile: Ultramobile + Phone, Basic, Smart OS + Phone, Premium, Smart OS + Phone, Utility, Smart OS, CAGR: CY’17-CY’21Source: Gartner, “Forecast: Hard-Disk Drives, Worldwide, 2014-2021, 3Q17 Update”, 13 November 2017.
Server: Total Enterprise HDD/SSD PB, PC: Total Notebook/Ultramobile Premium and Desk-Based/Workstation PCs
EB: 1018 byte, ZB: 1021 byte
CORP IR / 2018.05.14 20
FY2018 (April 2017-March 2018) Highlights
Net sales +41% YoY driven by increase in SPE* demand and expansion of market share in focus areas
Operating income and net income attributable to owners of parent reached new record highs
Net Sales and Gross Profit Margin
612.1 613.1 663.9
799.7
33.0%
39.6% 40.2% 40.3%42.0%
0
400
800
1,200
FY'14 FY'15 FY'16 FY'17 FY'18
Net sales (¥B)
Gross profit margin
32.2
88.1116.7
155.6
281.1
5.3%
14.4%
17.6%19.5%
24.9%
0.0%
5.0%
10.0%
15.0%
20.0%
25.0%
30.0%
0
100
200
300
FY'14 FY'15 FY'16 FY'17 FY'18
Operating income (¥B)
Operating margin
Operating Income and Operating Margin
Net Income Attributable to
Owners of Parent and ROE
1,130.7
-19.4
71.8 77.8
115.2
204.3
-3.3%
11.8%13.0%
19.1%
29.0%
-20
80
180
FY'14 FY'15 FY'16 FY'17 FY'18
Net income attributable toowners of parent (¥B)
ROE
* SPE: Semiconductor production equipment
CORP IR / 2018.05.14 21
(Billion yen)
FY2018
(Actual)
FY2019 (Estimates)
H1 H2 Full yearFull year
YoY change
Net sales 1,130.7 690.0 710.0 1,400.0 +23.8%
SPE 1,055.2 634.0 654.0 1,288.0 +22.1%
FPD 75.0 56.0 56.0 112.0 +49.2%
Gross profitGross profit margin
475.042.0%
288.041.7%
310.043.7%
598.042.7%
+122.9+0.7pts
SG&A expenses 193.8 115.0 117.0 232.0 +38.1
Operating incomeOperating margin
281.124.9%
173.025.1%
193.027.2%
366.026.1%
+84.8+1.2pts
Income before income taxes 275.2 173.0 193.0 366.0 +90.7
Net income attributable to
owners of parent204.3 128.0 142.0 270.0 +65.6
Net income per share (Yen) 1,245.48 779.95 - 1,645.20 +399.72
FY2019 Financial Estimates
Expect sales growth to exceed market growth, generating record
high profits for third consecutive yearSPE: Semiconductor production equipment, FPD: Flat panel display production equipment
CORP IR / 2018.05.14 22
374.0
440.5
504.0 514.0
0
100
200
300
400
500
FY'18 H1(Actual)
FY'18 H2(Actual)
FY'19 H1(Estimates)
FY'19 H2(Estimates)
22%
37%
11%
30%
25%
43%
10%
22%
FY2019 SPE Division New Equipment Sales Forecast
Sales by application
35%
39%
10%
16%
32%
32%
12%
24%
DRAM
– investment growth driven by tight supply
3D NAND
– Continued strong investment on
sustained SSD demand for data centers
and PCs
Logic/Foundry
– Continued investment in 10/7nm
generations
– Also firm investment in 28nm and prior
generations
Logic foundry
Logic & others
DRAM
Non-volatile memory
(Billion yen)
Percentages on the graph show the composition ratio of new equipment sales. Field solutions sales are not included.
CORP IR / 2018.05.14 23
Oshu City, Iwate Prefecture:
approx. ¥13.0B construction cost
(Begin construction in October 2018,
completion scheduled for September 2019)
FY2019 R&D Expenses, Capex Plan
R&D Expenses ¥120.0B– Continue investing based on focus areas and
sustainable growth
Capex ¥51.0B– Actively invest in advanced technologies R&D
and to meet increasing production
Depreciation ¥26.0B
Maximize business opportunities while equipment market is
in a growth phase
71.3 76.283.8
97.1
120.0
0
50
100
150
FY'15 FY'16 FY'17 FY'18 FY'19 (E)
13.1 13.320.6
45.651.0
20.8 19.2 17.8 20.626.0
0
20
40
60
FY'15 FY'16 FY'17 FY'18 FY'19 (E)
New production buildings
(deposition systems, gas chemical etch systems, test systems)
Nirasaki City, Yamanashi Prefecture:
approx. ¥13.0B construction cost
(Begin construction in January 2019,
completion scheduled for April 2020)
R&D expenses
(Billion Yen)
(Billion Yen)
Capex Depreciation
CORP IR / 2018.05.14 24
FY2019 Dividend Forecast
0
300
600
900
FY'15 FY'16 FY'17 FY'18 FY'19 (E)
143 yen
237 yen Interim
390
yen
Year-end
433
yen
624 yen
Expect to raise DPS 32% YoY
352 yen
823 yen(Yen)
Dividend per share
Dividend payout ratio: 50%
Annual DPS of not less than 150 yen
We will flexibly consider share buybacks
TEL shareholder return policy
We will review our dividend policy if the company does not generate
net income for two consecutive fiscal years
CORP IR / 2018.05.14 25
Appendix 1: Etching System
CORP IR / 2018.05.14 26
CY’12-’14 CY’19
3D NAND Business Opportunities
TEL estimates
Investment per 10k/wspm** ($M) 6X 9X 12X
HARC processes(multi-level contact/word line isolation/channel)
30 40 50
Other etching processes 80 80 80
Etching process total 110 120 130
Increase in 3D NAND HARC* processes
Expand HARC processes by increasing number of stacked layers
3D NAND 6X
9X
Word line
isolation (Slit)
Channel
(Memory hole)
Multi-level
contact
3D NAND HARC* processes
* HARC (High aspect ratio contact) process: a process for forming holes that requires advanced processing technology
Etching systems
50%
Etching systems
15%
Ratio of etching systems in NAND
Other systems
85%
Other systems
50%
CY’17 CY’18 CY’19
6X 6X/9X 9X
(Greenfield, TEL estimates)
** wspm: wafer starts per month
CORP IR / 2018.05.14 27
3D NAND: Approach and Results
Maintained a 100% share of the multi-level contact processes. Plan to further
increase revenues by integrating mask process to improve productivity
Captured new customer PORs with 9X generation word line isolation.
Aim to increase our position by integrating mask process
Realize the capture of channel processes through new technology
Expand our position by dramatically improving profile and productivity
A single system that combines
mask and main processes
normally processed by different
systems
Improved productivity
Mask process
Main process
Improve productivity by
integrating processes
CORP IR / 2018.05.14 28
Logic: Approach and Results
Maintained high interconnecting dielectric etching
process market share
Aim to expanded advanced patterning applications
Achieve high-level of control over
dimension variationRealize high selectivity
through low electron
temperature plasma
RLSA™ plasma source ALE concept process
Plasma etch systems
Tactras™ RLSA™
Aim to increase sales by differentiating our technology in
7nm and finer advanced patterning
Interconnects
Advanced patterning
CORP IR / 2018.05.14 29
DRAM: Approach and Results
Capacitor
(HARC)
Interconnects
Currently achieving success in all DRAM focus processes
in line with plan
Captured BEOL processes by leveraging expertise in logic through our strength in damascene
processes
Captured development PORs with all customers using 1Y generation capacitor process (HARC)
Realized reduced patterning costs for customers by combining etching steps.
Currently using successes with strategic customers to expand market share in other customers
Simplify process and raise productivity by
combining multiple etching steps
CORP IR / 2018.05.14 30
Appendix 2: Effects of EUV Lithography Adoption
CORP IR / 2018.05.14 31
EUV adoption will solve sophisticated technological hurdles our customers
face (i.e. placement errors), bringing about quite positive effects on
semiconductor and SPE industries
– Advance miniaturization
– Accelerate customers’ investment in next generation technologies by enhancing the yield
Further miniaturization led by EUV will create more differentiation of our
products and business opportunities
– Increase our coater/developer market share even further
– Expand demand for etch, deposition and cleaning equipment
– Differentiate our product through advancing self-aligned patterning technology
– Expand business with process integration, leveraging our robust product lineup
Effects of EUV Lithography Adoption
CORP IR / 2018.05.14 32
Edge Placement Error Improvement by EUV
1
12
33 masks
Too close
Closer
Too far
1 mask
Cut
3 masks : (Litho + Etch) x 3 Yield degradation
Yield improvement
Minimum fluctions
Schematic of logic device
EUV
introduction
(Litho-Etch)3 with 193i
11
11
Line
Space
Self-aligned multiple patterning (SAMP)
requires a lot of etch and dep equipment
LELELE = (Litho-Etch)3 requires
many lithography tools but does not
require many etch and dep equipment
Step1: Line/Space
Step2: Cut
1 mask : (Litho + Etch) x 1
Fluctuation can be cumulated
after each litho-etch step
Edge placement error
Single exposure by EUV
CORP IR / 2018.05.14 33
(Litho-etch)n Patterning for Logic MOL Contact/Cut Module
• PMD dep
• Hard mask1 dep
• Hard mask2 dep
• Lithography1
• Contact HM2 etch1 short etch time
• Lithography2
• Contact HM2 etch2 short etch time
• Lithography3
• Contact HM2 etch3 short etch time
• Contact HM1 etch short etch time
• Contact PMD etch long etch time
• Post etch clean
• Barrier metal Ti/TiN dep
• Contact plug W dep
• Contact plug W CMP
Lithography1 Lithography2 Lithgraphy3
Contact PMD etch
Contact HM2
etch1
Contact HM2
etch2
Contact HM2
etch3
Contact HM1 etch Contact plug W CMP
Thicker layer
Higher etch selectivity
(Litho-etch)3 patterning EUV lithography
Contact HM2
etch
(Litho-etch)n patterning
or
CORP IR / 2018.05.14 34
Self-aligned Multiple Patterning for Line/Space
Mandrel2 etch Sidewall1 dep Sidewall etch back1
Hard mask3 etch Mandrel1 etch Sidewall2 dep Sidewall etch back2
Hard mask1Hard mask2
Mandrel1Hard mask3Hard mask4Mandrel2Hard mask5
𝑝
• Had mask1 dep
• Hard mask2 dep
• Mandrel1 dep
• Hard mask3 dep
• Hard mask4 dep
• Mandrel2 dep
• Hard mask5 dep
• Lithography
• Hard mask5 etch
• Mandrel2 etch
• Sidewall1 dep
• Sidewall1 etch back
• Mandrel2 pull
• Hard mask4 etch
• Hard mask3 etch
• Mandrel1 etch
• Sidewall2 dep
• Sidewall2 etch back
1
2𝑝
SADP
SADP: Self-aligned double patterning
SAQP: Self-aligned quadruple patterning
1
4𝑝
SAQP
Lithography
Deposition
Etch
CORP IR / 2018.05.14 35
Appendix 3: FPD Production Equipment
CORP IR / 2018.05.14 36
Display Trends
Increasing screen size
Increasing resolution
FHD 4K 8K
OLED
Design flexibility
LCD OLED
TFT
Color filter
Backlight
LCD
TFT
Emissive
layer
TV
Smartphones 300 ppi 700 ppi
Technology inflection creates greater business opportunities
Flexible, edge bent, free format
CORP IR / 2018.05.14 37
Increase share and profitability in market that has begun to grow again
FY2020 target: sales ¥80.0B, operating margin over 20%
-10%
0%
10%
20%
30%
40%
0
20
40
60
80
100
FY2015 FY2016 FY2017 FY2018 FY2020
Sales
Operating margin
FPD Business Medium-term Plan
(Billion Yen)
(Medium-term plan)
CORP IR / 2018.05.14 38
TEL’s product strategy for a new PICP™* etching system is progressing
according to plan
Expanding the G10.5 equipment business
Medium-term Plan Progress: Highlights
2015 2016 2017 2018 2019
G10.5
G8.5
G6
PICP etching system for small- and medium-sized panels
PICP etching system forlarge-sized panels
Coater/developers and etching system
Higher profitability for all panel generations
New Betelex™ platform
OLED process (G6H)
* PICP: Plasma source for producing extremely uniform high density plasma on substrate
CORP IR / 2018.05.14 39
Opportunity – G10.5 Equipment Market
Eight 65 inch TV panel substrate possible
“65
3,3
70
mm
2,940 mm
G10.5 TFT array equipment market
($M)
0
500
1,000
1,500
2,000
2,500
3,000
3,500
2017 2018 2019
Greater than expected investment and market expansion
Maintain high market share through technological differentiation (large area plasma suppression, air floating coater)
Results based on IHS Markit, Technology Group “Display Supply Demand & Equipment Tracker, Q1 2017”. Results are not an
endorsement of Tokyo Electron. Any reliance on these results is at the third party's own risk. Visit technology.ihs.com for more details.
CORP IR / 2018.05.14 40
TFT a-Si Metal oxide LTPS
Representation
of structure
ApplicationLCD TV
Monitor
OLED TV
Tablet
Smartphone
(LCD/OLED)
Number of
masks5 6 - 8 9 - 13
Dry etch
processes
3
a-Si, SiNx
3
SiO, SiNx
-11
SiO, Metal
Flexible displays
+2 processes
OLED process
(G6 half size)+3-4 processes
Further new
needs
Higher sophistication of etching technology and increased number of processes
Opportunity – Metal Oxide/LTPS
CORP IR / 2018.05.14 41
New manufacturers in Japan
Toshiba
REGZA X910 series
Launched March 2017
SonyBRAVIA A1
To be launched June 2017
PanasonicVIERA TH-65EZ1000/EZ950 series
To be launched June 2017
Opportunity – Growth of OLED TV Market
Introduced inkjet printing system to meet production demand from 2018
Material utilization significantly more efficient than current evaporation method
Increase in OLED TV manufacturers
0
1
2
3
4
5
6
7
8
2016 2017 2018 2019 2020 2021
Mm
2/Y
R
OLED TV area demand
Results based on IHS Markit, Technology Group “Display Supply Demand & Equipment
Tracker, Q1 2017”. Results are not an endorsement of Tokyo Electron. Any reliance on these
results is at the third party's own risk. Visit technology.ihs.com for more details.
CORP IR / 2018.05.14 42
Appendix 4: Financial Data
CORP IR / 2018.05.14 43
Financial Summary
FY2017 FY2018YoY
Change
(Reference)
FY2018 estimates
announced on Oct.
31, 2017
Net sales 799.7 1,130.7 +41.4% 1,130.0SPE 749.8 1,055.2 +40.7% 1,054.7
FPD 49.3 75.0 +52.0% 75.0
Gross profitGross profit margin
322.240.3%
475.042.0%
+47.4%+1.7pts
467.041.3%
SG&A expenses 166.5 193.8 +16.4% 196.0Operating incomeOperating margin
155.619.5%
281.124.9%
+80.6%+5.4pts
271.024.0%
Income before income taxes 149.1 275.2 +84.6% 267.0Net income attributable to
owners of parent115.2 204.3 +77.4% 198.0
EPS (Yen) 702.26 1,245.48 +77.4% 1,206.66
R&D expenses 83.8 97.1 +15.9% 100.0
Capital expenditures 20.6 45.6 +120.3% 50.0
Depreciation and amortization 17.8 20.6 +15.4% 23.0
(Billion yen)
1. In principle, export sales of Tokyo Electron’s mainstay semiconductor and FPD production equipment are denominated in yen. While some settlements are denominated
in dollars, exchange risk is hedged as forward exchange contracts are made individually at the time of booking.
2. Profit ratios are calculated using full amounts, before rounding.
CORP IR / 2018.05.14 44
94 93
6 7
0%
50%
100%
FY'17 FY'18
749.8
1,055.2
182.7
314.624.4%
29.8%
0%
10%
20%
30%
40%
50%
60%
0
300
600
900
1,200
FY'17 FY'18
Segment Information
49.3
75.0
4.6
13.29.4%
17.7%
0%
10%
20%
30%
40%
50%
60%
0
25
50
75
100
FY'17 FY'18
Significantly raised profitability in both SPE and FPD
SPE
FPD
SPE(Semiconductor Production Equipment)
FPD(Flat Panel Display Production Equipment)
(Billion Yen) (Billion Yen)
Composition of Net Sales
Sales
Segment income
Segment profit margin
Sales
Segment income
Segment profit margin
1. Segment income is based on income before income taxes.
2. R&D expenses such as fundamental research and element research are not included in above reportable segments.
3. Composition of net sales figures is based on the sales to customers.
CORP IR / 2018.05.14 45
(Billion Yen)
FY2018 results
Sales of DRAM and non-volatile memory
more than doubled YoY driven by increase
in demand for servers and proactive
investment in next-generation technology
In foundry/logic, investment in cutting-edge
generations and 28nm and above continued
SPE Division: New Equipment Sales by Application
25% 24%25%
25%
31%11%20%
28%
40%
30%
17%
24%
437.4
550.3
814.6
0
300
600
900
FY'16 FY'17 FY'18
DRAM
Non-volatile memory
Logic foundry
Logic & others (MPU, AP, Others)
CORP IR / 2018.05.14 46
FY2018 results
Sales expanded in focus areas (etch,
deposition, cleaning) driven by investment
in non-volatile memory and miniaturization
enabled by multiple patterning
SPE Division: New Equipment Sales by Product
3% 2% 1%4% 6% 6%10%
11%10%
26%22%
23%29%
34%
40%
28%
25%
20%
437.4
550.3
814.6
0
300
600
900
FY'16 FY'17 FY'18
Coater/Developer
Etch system
Deposition system
Cleaning system
Wafer prober
Others
(Billion Yen)
CORP IR / 2018.05.14 47
105.0 115.0
150.0
80.0
93.0
101.0185.0
208.0
251.0
0
100
200
300
FY'16 FY'17 FY'18
FY2018 results
Sales growth of +21% YoY,
full-year sales reached ¥251.0B
Parts sales increased strongly, especially
in South Korea, due to rise in customers’
equipment utilization
Field Solutions Sales
Used equipment and modification
Parts and services
(Billion Yen)
* FY2016 and FY2017 sales figures have been rounded.
CORP IR / 2018.05.14 48
SPE Sales by Region
91.2
145.5
0
200
400
FY'17 FY'18
101.5119.2
0
200
400
FY'17 FY'18
59.996.9
0
200
400
FY'17 FY'18
137.7
371.9
0
200
400
FY'17 FY'18
225.9
169.0
0
200
400
FY'17 FY'18
90.6 104.3
0
200
400
FY'17 FY'18
42.8 48.2
0
200
400
FY'17 FY'18
12 14
14 11
8 9
18 35
30
16
12 10 6 5
0%
50%
100%
FY'17 FY'18
(Billion Yen)
Japan North America Europe Korea(Billion Yen)(Billion Yen) (Billion Yen)
Taiwan China S.E. Asia, Others Region Composition(Billion Yen) (Billion Yen) (Billion Yen)
S.E. Asia,
OthersChina
Taiwan
Korea
Europe
North America
Japan
CORP IR / 2018.05.14 49
Turnover days = inventory or accounts receivable at the end of each quarter / last 12 months sales x 365
Inventory Turnover and Accounts Receivable Turnover (Quarterly)
355.9
64 57
81
65 61
57 54 54 52
107 113 111
120
108 110 107
117 111
0
40
80
120
160
0
100
200
300
400
Q4FY'16
Q1FY'17
Q2 Q3 Q4 Q1FY'18
Q2 Q3 Q4
(Billion Yen)
Net sales
Accounts receivable turnover
Inventory turnover
(Days)
CORP IR / 2018.05.14 50
Financial Summary (Quarterly)
FY2017 FY2018
Q4 Q1 Q2 Q3 Q4vs. Q3
FY2018
Net sales 260.6 236.3 280.5 257.7 355.9 +38.1%
SPE 243.5 221.9 265.7 241.4 326.0 +35.1%
FPD 17.0 14.3 14.7 16.2 29.7 +83.1%
Gross profitGross profit margin
110.642.5%
97.141.1%
118.242.1%
106.041.1%
153.543.1%
+44.8%+2.0pts
SG&A expenses 49.1 42.3 49.7 47.9 53.7 +12.1%
Operating incomeOperating margin
61.523.6%
54.723.2%
68.524.4%
58.022.5%
99.728.0%
+71.7%+5.5pts
Income before income taxes 61.4 55.1 67.1 57.3 95.6 +66.8%
Net income attributable to
owners of parent47.2 41.2 49.4 40.7 72.9 +79.3%
R&D expenses 24.8 21.1 24.8 23.9 27.0 +13.1%
Capital expenditures 7.1 8.1 11.7 13.7 12.0 -12.7%
Depreciation and amortization 5.0 4.2 4.7 5.5 6.0 +10.6%
1. In principle, export sales of Tokyo Electron’s mainstay semiconductor and FPD production equipment are denominated in yen. While some settlements are denominated
in dollars, exchange risk is hedged as forward exchange contracts are made individually at the time of booking.
2. Profit ratios are calculated using full amounts, before rounding.
(Billion yen)
SPE: Semiconductor production equipment, FPD: Flat panel display production equipment
CORP IR / 2018.05.14 51
Q4
FY’17
Q1
FY’18
Q2 Q3 Q4
Net sales 260.6 236.3 280.5 257.7 355.9
Operating income 61.5 54.7 68.5 58.0 99.7
Net income attributable
to owners of parent47.2 41.2 49.4 40.7 72.9
Gross profit margin 42.5% 41.1% 42.1% 41.1% 43.1%
Operating margin 23.6% 23.2% 24.4% 22.5% 28.0%
355.9
99.772.9
43.1%
28.0%
0%
10%
20%
30%
40%
50%
0
100
200
300
400
500
Financial Performance (Quarterly)(Billion Yen)
CORP IR / 2018.05.14 52
243.5
221.9
265.7241.4
326.0
67.6 66.1 78.6 69.0
100.7
27.8%29.8% 29.6% 28.6%
30.9%
0%
10%
20%
30%
40%
50%
60%
0
70
140
210
280
350
Q4FY'17
Q1FY'18
Q2 Q3 Q4
Segment Information (Quarterly)
17.0
14.3 14.7 16.2
29.7
2.3
0.4 2.2
3.0
7.4 14.1%
3.2%
15.4%
19.0%
25.1%
0%
10%
20%
30%
40%
50%
60%
0.0
7.0
14.0
21.0
28.0
35.0
Q4FY'17
Q1FY'18
Q2 Q3 Q4
93 94 95 94 92
7 6 5 6 8
0%
50%
100%
Q4FY'17
Q1FY'18
Q2 Q3 Q4
SPE(Semiconductor production equipment)
FPD(Flat panel display production equipment)
Composition of Net Sales
(Billion Yen) (Billion Yen)
Sales
Segment income
Segment profit margin
Sales
Segment income
Segment profit margin
SPE
FPD
1. Segment income is based on income before income taxes.
2. R&D expenses such as fundamental research and element research are not included in above reportable segments.
3. Composition of net sales figures is based on the sales to customers.
CORP IR / 2018.05.14 53
SPE Division: New Equipment Sales by Application (Quarterly)
29%
20%
30%
21%
25%
23%
27%
25%
38%
17%
22%
23%
18%
31%
32%
19%
12%
31%
32%
25%
16%
24%
34%
26%
22%
27%
27%
24%
17%
40%
16%
27%
DRAM
Non-volatile memory
Logic foundry
Logic & others
(MPU, AP, Others)
(Billion Yen)
Percentages on the graph show the composition ratio of new equipment sales. Field solutions sales are not included.
25%
23%
27%
25%
38%
17%
22%
23%
18%
31%
32%
19%
12%
31%
32%
25%
16%
24%
34%
26%
22%
27%
27%
24%
17%
40%
16%
27%
25%
35%
8%
32%
23% 19%25% 26% 24% 27%
32%26% 19%
22% 32%
32% 34%27%
16%8%
12% 10%17% 31%
31%24%
27%40%
35%41%
43%
38% 18%
12%16%
22%17%
25%21%
28%
103.1
88.3
146.1
130.4
185.3
169.7
204.3
181.7
258.8
0
50
100
150
200
250
300
Q4FY'16
Q1FY'17
Q2 Q3 Q4 Q1FY'18
Q2 Q3 Q4
CORP IR / 2018.05.14 54
Field Solutions Sales (Quarterly)
48.944.4
52.4 50.9
60.4
54.4
64.462.1
70.0
0
20
40
60
80
Q4
FY’16
Q1
FY’17
Q2 Q3 Q4 Q1
FY’18
Q2 Q3 Q4
SPE Sales 46.4 42.4 50.0 48.8 58.1 52.2 61.4 59.7 67.2
FPD Sales 2.4 2.0 2.4 2.0 2.2 2.2 2.9 2.4 2.8
(Billion Yen)
CORP IR / 2018.05.14 55
Q4
FY’16
Q1
FY’17
Q2 Q3 Q4 Q1
FY’18
Q2 Q3 Q4
Japan 26.4 17.8 26.4 20.3 26.6 26.7 38.4 35.1 45.1
North America 19.7 17.0 34.4 24.6 25.4 24.0 32.0 29.1 33.9
Europe 9.5 5.2 6.6 15.0 32.9 25.3 26.9 19.6 25.0
South Korea 30.9 19.8 29.0 33.3 55.5 68.3 101.7 79.4 122.3
Taiwan 42.5 30.5 58.2 62.3 74.7 45.8 36.6 42.1 44.3
China 15.2 30.0 24.0 13.7 22.7 26.7 23.0 22.6 31.8
S. E. Asia, Others 5.0 10.3 17.3 9.8 5.3 4.6 6.7 13.2 23.4
SPE Division: Sales by Region (Quarterly)
149.5130.7
196.2179.3
243.5221.9
265.7241.4
326.0
0
100
200
300
400
(Billion Yen)
CORP IR / 2018.05.14 56
Balance Sheet (Quarterly)
65.6 68.2 70.0 72.0 69.715.4 16.2 16.4 16.5 15.8
100.4 104.2 111.4 120.8 125.9
90.4 65.2 77.0 95.6 119.5
236.2 266.6 283.4332.8
344.0133.8 139.7
142.8
152.3159.5
315.3 294.6329.9
301.2
373.8957.4 954.9
1,031.11,091.5
1,208.7
Q4FY'17
Q1FY'18
Q2 Q3 Q4
645.9 655.1 707.9 709.5771.5
311.4 299.8323.1
381.9
437.1957.4 954.9
1,031.11,091.5
1,208.7
Q4FY'17
Q1FY'18
Q2 Q3 Q4
Assets Liabilities & Net Assets
(Billion Yen) (Billion Yen)
* Cash and cash equivalents: Cash and deposits + Short-term investments, etc. (Securities in B/S).
Liabilities
Net assets
Other current assets
Tangible assets
Intangible assets
Cash & cash
equivalents*
Inventories
Trade notes, accounts
receivables
Investment & other assets
CORP IR / 2018.05.14 57
Cash Flow (Quarterly)
88.1
-12.8
75.3
-100
-80
-60
-40
-20
0
20
40
60
80
100
Q4
FY’16
Q1
FY’17
Q2 Q3 Q4 Q1
FY’18
Q2 Q3 Q4
Cash flow from operating activities 7.9 22.1 29.8 41.3 43.6 24.4 43.4 30.4 88.1
Cash flow from investing activities* -2.9 -4.9 -4.9 -4.1 -4.9 -9.3 -9.4 -15.2 -12.8
Cash flow from financing activities 0.0 -18.3 0.0 -21.0 -0.0 -36.8 -0.0 -45.7 -0.0
Free cash flow** 5.0 17.2 24.8 37.1 38.7 15.1 34.0 15.1 75.3
Cash on hand*** 236.6 230.9 255.6 277.2 315.3 294.6 329.9 301.2 373.8
* Cash flow from investing activities excludes changes in deposits with periods to maturity of over 3 months.
** Free cash flow = cash flow from operating activities + cash flow from investing activities excluding changes in deposits with periods to maturity of over 3 months.
*** Cash on hand includes the total of cash + deposits with periods to maturity of over 3 months.
(Billion Yen)
-0.0
CORP IR / 2018.05.14 58
(Million Yen) FY2009 FY2010 FY2011 FY2012 FY2013 FY2014 FY2015 FY2016 FY2017 FY2018
Net Sales 508,082 418,636 668,722 633,091 497,299 612,170 613,124 663,948 799,719 1,130,728
Semiconductor production equipment 325,383 262,391 511,331 477,873 392,026 478,841 576,242 613,032 749,893 1,055,234
FPD production equipment 88,107 71,361 66,721 69,888 20,160 28,317 32,709 44,687 49,387 75,068
PV production equipment 3,805 3,617
Computer network 94,207 84,473 90,216 84,867 84,664 100,726
Electronic components
Other 384 410 453 461 448 479 555 6,228 438 425
Gross profit 137,408 108,316 234,758 211,444 158,754 201,892 242,773 267,209 322,291 475,032
Gross profit margin 27.0% 25.9% 35.1% 33.4% 31.9% 33.0% 39.6% 40.2% 40.3% 42.0%
SG&A expenses 122,697 110,496 136,887 151,001 146,206 169,687 154,660 150,420 166,594 193,860
Operating income 14,710 -2,180 97,870 60,443 12,548 32,204 88,113 116,788 155,697 281,172
Operating margin 2.9% -0.5% 14.6% 9.5% 2.5% 5.3% 14.4% 17.6% 19.5% 24.9%
Ordinary income 20,555 2,558 101,919 64,046 16,696 35,487 92,949 119,399 157,549 280,737
9,636 -7,767 99,579 60,602 17,766 -11,756 86,827 106,466 149,116 275,242
7,543 -9,033 71,924 36,725 6,076 -19,408 71,888 77,891 115,208 204,371
Depreciation and amortization 23,068 20,001 17,707 24,197 26,630 24,888 20,878 19,257 17,872 20,619
Capital expenditures 18,107 14,918 39,140 39,541 21,773 12,799 13,183 13,341 20,697 45,603
R&D expenses 60,987 54,074 70,568 81,506 73,248 78,663 71,349 76,286 83,800 97,103
Interest-bearing debt 3,806 5,105 7,996 4,402 3,756 13,531 ― ― ― ―
Equity 518,387 511,818 572,741 586,789 593,032 578,091 639,483 562,369 643,094 767,146
Total assets 668,998 696,351 809,205 783,610 775,527 828,591 876,153 793,367 957,447 1,208,705
Debt-to-equity ratio 0.7% 1.0% 1.4% 0.8% 0.6% 2.3% ― ― ― ―
Equity ratio 77.5% 73.5% 70.8% 74.9% 76.5% 69.8% 73.0% 70.9% 67.2% 63.5%
ROE 1.4% -1.8% 13.3% 6.3% 1.0% -3.3% 11.8% 13.0% 19.1% 29.0%
81,030 48,284 83,238 29,712 84,266 44,449 71,806 69,398 136,948 186,582
-160,621 9,613 -35,881 -8,352 -141,769 -19,599 155,737 -150,013 -28,893 -11,833
-46,015 -287 -5,236 -27,334 -10,625 -186 -18,213 -138,600 -39,380 -82,549
42.2 -50.5 401.7 205.0 33.9 -108.3 401.1 461.1 702.3 1,245.5
24 12 114 80 51 50 143 237 352 624
10,391 10,068 10,343 10,684 12,201 12,304 10,844 10,629 11,241 11,946
Net income per share
Cash dividends per share
Number of employees
Income before income taxes
Net income attributable to owners of parent
Cash flow from operating activities
Cash flow from investing activities
Cash flow from financing activities
Consolidated 10-year Financial Summary
CORP IR / 2018.05.14 59
Disclaimer regarding forward-looking statement
Forecast of TEL’s performance and future prospects and other sort of information published are made based on information available
at the time of publication. Actual performance and results may differ significantly from the forecast described here due to changes in
various external and internal factors, including the economic situation, semiconductor/FPD market conditions, intensification of sales
competition, safety and product quality management, and intellectual property-related risks.
Processing of numbers
For the amount listed, because fractions are rounded down, there may be the cases where the total for certain account titles does not
correspond to the sum of the respective figures for account titles. Percentages are calculated using full amounts, before rounding.
Exchange risk
In principle, export sales of Tokyo Electron’s mainstay semiconductor and FPD panel production equipment are denominated in yen.
While some settlements are denominated in dollars, exchange risk is hedged as forward exchange contracts are made individually at
the time of booking. Accordingly, the effect of exchange rates on profits is negligible.
Disclaimer regarding IHS Markit data (Page 39, 41)
The IHS Markit reports and information referenced herein (the "IHS Markit Materials") are the copyrighted property of IHS Markit Ltd. (“IHS Markit”) and represent data, research,
opinions or viewpoints published by IHS Markit, and are not representations of fact. The IHS Markit Materials speak as of the original publication date thereof (and not as of the
date of this offering document). The information and opinions expressed in the IHS Markit Materials are subject to change without notice and IHS Markit has no duty or
responsibility to update the IHS Markit Materials. Moreover, while the IHS Markit Materials reproduced herein are from sources considered reliable, the accuracy and
completeness thereof are not warranted, nor are the opinions and analyses which are based upon it. To the extent permitted by law, IHS Markit shall not be liable for any errors
or omissions or any loss, damage or expense incurred by reliance on the IHS Markit Materials or any statement contained herein, or resulting from any omission. No portion of
the IHS Markit Materials may be reproduced, reused, or otherwise distributed in any form without the prior written consent of IHS Markit. Content reproduced or redistributed with
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trademarks appearing in the IHS Markit Materials are the property of IHS Markit or their respective owners.
Disclaimer regarding Gartner data (Page 6, 7, 12, 19)
All statements in this presentation attributable to Gartner represent Tokyo Electron’s interpretation of data, research opinion or viewpoints published as part of a syndicated
subscription service by Gartner, Inc., and have not been reviewed by Gartner. Each Gartner publication speaks as of its original publication date (and not as of the date of this
presentation). The opinions expressed in Gartner publications are not representations of fact, and are subject to change without notice.
FPD: Flat panel display
CORP IR / 2018.05.14 60