Three Dimensional System Integration

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Antonis Papanikolaou ● Dimitrios SoudrisRiko RadojcicEditors

Three Dimensional System Integration

IC Stacking Process and Design

EditorsAntonis PapanikolaouDepartment of Electrical and Computer EngineeringNational Technical University of Athens157 80 Athens Zographou CampusGreeceantonis.papanikolaou@gmail.com

Riko RadojcicQualcomm Inc.San Diego, CAUSArradojcic@yahoo.com

Dimitrios SoudrisDepartment of Electrical and Computer EngineeringNational Technical University of Athens157 80 Athens Zographou CampusGreecedsoudris@microlab.ntua.gr

ISBN 978-1-4419-0961-9 e-ISBN 978-1-4419-0962-6DOI 10.1007/978-1-4419-0962-6Springer New York Dordrecht Heidelberg London

© Springer Science+Business Media, LLC 2011All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden.The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights.

Printed on acid-free paper

Springer is part of Springer Science+Business Media (www.springer.com)

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Contents

1 Introduction to Three-Dimensional Integration .................................. 1Antonis Papanikolaou, Dimitrios Soudris, and Riko Radojcic

2 TSV-Based 3D Integration ..................................................................... 13James Burns

3 TSV Characterization and Modeling .................................................... 33Michele Stucchi, Guruprasad Katti, and Dimitrios Velenis

4 Homogeneous 3D Integration ................................................................ 51Robert Patti

5 3D Physical Design .................................................................................. 73Jason Cong and Guojie Luo

6 Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs .......................................................................... 103Young-Joon Lee, Michael Healy, and Sung Kyu Lim

7 PathFinding and TechTuning ................................................................. 137Dragomir Milojevic, Ravi Varadarajan, Dirk Seynhaeve, and Pol Marchal

8 3D Stacking of DRAM on Logic ............................................................ 187Trevor Carlson and Marco Facchini

9 Microprocessor Design Using 3D Integration Technology .................. 211Yuan Xie

10 3D Through-Silicon Via Technology Markets and Applications ........ 237E. Jan Vardaman

Index ................................................................................................................. 243

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Contributors

James BurnsLincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA

Trevor CarlsonGhent University, Ghent, Belgium

Jason CongUniversity of California, Los Angeles, CA, USA

Marco FacchiniIMEC vzw & Katholieke Universiteit Leuven, Leuven, Belgium

Michael HealyGeorgia Institute of Technology, Atlanta, Georgia, USA

Guruprasad KattiIMEC vzw & Katholieke Universiteit Leuven, Leuven, Belgium

Young-Joon LeeGeorgia Institute of Technology, Atlanta, Georgia, USA

Sung Kyu LimGeorgia Institute of Technology, Atlanta, Georgia, USA

Guojie LuoUniversity of California, Los Angeles, CA, USA

Pol MarchalIMEC vzw, Leuven, Belgium

Dragomir MilojevicUniversite Libre de Bruxelles, Brussels, Belgium

Antonis PapanikolaouDepartment of Electrical and Computer Engineering, National Technical University of Athens, 157 80 Athens, Zographou Campus, Greece

Robert PattiTezzaron Semiconductor, Naperville, IL, USA

viii Contributors

Riko RadojcicQualcomm Inc., San Diego, California, USA

Dirk SeynhaeveAutoESL, Cupertino, California, USA

Dimitrios SoudrisNational Technical University of Athens, Athens, Greece

Michele StucchiIMEC vzw, Leuven, Belgium

Ravi VaradarajanAtrenta Inc., San Jose, California, USA

E. Jan VardamanTechSearch International, Austin, TX, USA

Dimitrios VelenisIMEC vzw, Leuven, Belgium

Yuan XiePenn State, University Park, Pennsylvania, USA