Three Dimensional System Integration
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Antonis Papanikolaou ● Dimitrios SoudrisRiko RadojcicEditors
Three Dimensional System Integration
IC Stacking Process and Design
EditorsAntonis PapanikolaouDepartment of Electrical and Computer EngineeringNational Technical University of Athens157 80 Athens Zographou [email protected]
Riko RadojcicQualcomm Inc.San Diego, [email protected]
Dimitrios SoudrisDepartment of Electrical and Computer EngineeringNational Technical University of Athens157 80 Athens Zographou [email protected]
ISBN 978-1-4419-0961-9 e-ISBN 978-1-4419-0962-6DOI 10.1007/978-1-4419-0962-6Springer New York Dordrecht Heidelberg London
© Springer Science+Business Media, LLC 2011All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden.The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights.
Printed on acid-free paper
Springer is part of Springer Science+Business Media (www.springer.com)
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Contents
1 Introduction to Three-Dimensional Integration .................................. 1Antonis Papanikolaou, Dimitrios Soudris, and Riko Radojcic
2 TSV-Based 3D Integration ..................................................................... 13James Burns
3 TSV Characterization and Modeling .................................................... 33Michele Stucchi, Guruprasad Katti, and Dimitrios Velenis
4 Homogeneous 3D Integration ................................................................ 51Robert Patti
5 3D Physical Design .................................................................................. 73Jason Cong and Guojie Luo
6 Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs .......................................................................... 103Young-Joon Lee, Michael Healy, and Sung Kyu Lim
7 PathFinding and TechTuning ................................................................. 137Dragomir Milojevic, Ravi Varadarajan, Dirk Seynhaeve, and Pol Marchal
8 3D Stacking of DRAM on Logic ............................................................ 187Trevor Carlson and Marco Facchini
9 Microprocessor Design Using 3D Integration Technology .................. 211Yuan Xie
10 3D Through-Silicon Via Technology Markets and Applications ........ 237E. Jan Vardaman
Index ................................................................................................................. 243
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Contributors
James BurnsLincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
Trevor CarlsonGhent University, Ghent, Belgium
Jason CongUniversity of California, Los Angeles, CA, USA
Marco FacchiniIMEC vzw & Katholieke Universiteit Leuven, Leuven, Belgium
Michael HealyGeorgia Institute of Technology, Atlanta, Georgia, USA
Guruprasad KattiIMEC vzw & Katholieke Universiteit Leuven, Leuven, Belgium
Young-Joon LeeGeorgia Institute of Technology, Atlanta, Georgia, USA
Sung Kyu LimGeorgia Institute of Technology, Atlanta, Georgia, USA
Guojie LuoUniversity of California, Los Angeles, CA, USA
Pol MarchalIMEC vzw, Leuven, Belgium
Dragomir MilojevicUniversite Libre de Bruxelles, Brussels, Belgium
Antonis PapanikolaouDepartment of Electrical and Computer Engineering, National Technical University of Athens, 157 80 Athens, Zographou Campus, Greece
Robert PattiTezzaron Semiconductor, Naperville, IL, USA
viii Contributors
Riko RadojcicQualcomm Inc., San Diego, California, USA
Dirk SeynhaeveAutoESL, Cupertino, California, USA
Dimitrios SoudrisNational Technical University of Athens, Athens, Greece
Michele StucchiIMEC vzw, Leuven, Belgium
Ravi VaradarajanAtrenta Inc., San Jose, California, USA
E. Jan VardamanTechSearch International, Austin, TX, USA
Dimitrios VelenisIMEC vzw, Leuven, Belgium
Yuan XiePenn State, University Park, Pennsylvania, USA