the mos transistorcse.iitkgp.ac.in/~debdeep/teaching/vlsi/slides/mos.pdf · mos characteristics •...
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The MOS Transistor
Debdeep MukhopadhyayIIT Madras
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Introduction• So far, we have treated transistors as ideal switches• An ON transistor passes a finite amount of current
– Depends on terminal voltages– Derive current-voltage (I-V) relationships
• Transistor gate, source, drain all have capacitance– I = C (∆V/∆t) -> ∆t = (C/I) ∆V– Capacitance and current determine speed
• Also explore what a “degraded level” really means
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MOS Characteristics
• MOS – majority carrier device• Carriers: e-- in nMOS, holes in pMOS• Vt – channel threshold voltage (cuts
off for voltages < Vt)
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nMOS Enhancement Transistor• Moderately doped p type Si substrate• 2 Heavily doped n+ regions
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I vs. V Plots
• Enhancementand depletiontransistors– CMOS – uses
only enhancement transistors
– nMOS – uses both
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Materials and Dopants
• SiO2 – low loss, high dielectric strength – High gate fields are possible
• n type impurities: P, As, Sb• p type impurities: B, Al, Ga, In
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Bipolar vs. MOS• Bipolar – p-n junction – metallurgical• MOS
– Inversion layer / substrate junction field-induced– Voltage-controlled switch, conducts when Vgs Vt
– e-- swept along channel when Vds > 0 by horizontal component of E
– Pinch-off – conduction by e–- drift mechanism caused by positive drain voltage
– Pinched-off channel voltage: Vgs – Vt (saturated)– Reverse-biased p-n junction insulates from the
substrate
≥
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MOSFET Transistors• MOSFET – For given Vds & Vgs, Ids
controlled by:– Distance between source & drain L– Channel width W– Threshold VoltageVt– Gate oxide thickness tox– dielectric constant of gate oxide ε– Carrier mobility µ
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MOS Capacitor
• Gate and body form MOS capacitor• Operating modes
– Accumulation– Depletion– Inversion
polysilicon gate
(a)
silicon dioxide insulator
p-type body+-
Vg < 0
(b)
+-
0 < Vg < Vt
depletion region
(c)
+-
Vg > Vt
depletion regioninversion region
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Terminal Voltages• Mode of operation depends on Vg, Vd, Vs
– Vgs = Vg – Vs
– Vgd = Vg – Vd
– Vds = Vd – Vs = Vgs - Vgd
• Source and drain are symmetric diffusion terminals– By convention, source is terminal at lower voltage– Hence Vds ≥ 0
• nMOS body is grounded. First assume source is 0 too.• Three regions of operation
– Cutoff– Linear– Saturation
Vg
Vs Vd
VgdVgs
Vds+-
+
-
+
-
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nMOS Cutoff
• No channel• Ids = 0
+-
Vgs = 0
n+ n+
+-
Vgd
p-type body
b
g
s d
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nMOS Linear• Channel forms• Current flows from d to s
– e- from s to d• Ids increases with Vds
• Similar to linear resistor• At drain end of channel,
only difference between gate & drain voltages effective for channel creation
+-
Vgs > Vt
n+ n+
+-
Vgd = Vgs
+-
Vgs > Vt
n+ n+
+-
Vgs > Vgd > Vt
Vds = 0
0 < Vds < Vgs-Vt
p-type body
p-type body
b
g
s d
b
g
s d Ids
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nMOS Saturation
• Channel pinches off• Ids independent of Vds
• We say current saturates• Similar to current source
+-
Vgs > Vt
n+ n+
+-
Vgd < Vt
Vds > Vgs-Vt
p-type bodyb
g
s d Ids
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I-V Characteristics
• In Linear region, Ids depends on– How much charge is in the channel?– How fast is the charge moving?
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Channel Charge
• MOS structure looks like parallel plate capacitor while operating in inversion– Gate – oxide – channel
• Qchannel =
n+ n+
p-type body
+
Vgd
gate
+ +source
-
Vgs
-drain
Vds
channel-
Vg
Vs Vd
Cg
n+ n+
p-type body
W
L
tox
SiO2 gate oxide(good insulator, εox = 3.9)
polysilicongate
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Channel Charge
• MOS structure looks like parallel plate capacitor while operating in inversion– Gate – oxide – channel
• Qchannel = CV• C =
n+ n+
p-type body
+
Vgd
gate
+ +source
-
Vgs
-drain
Vds
channel-
Vg
Vs Vd
Cg
n+ n+
p-type body
W
L
tox
SiO2 gate oxide(good insulator, εox = 3.9)
polysilicongate
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Channel Charge
• MOS structure looks like parallel plate capacitor while operating in inversion– Gate – oxide – channel
• Qchannel = CV• C = Cg = εoxWL/tox = CoxWL• V =
n+ n+
p-type body
+
Vgd
gate
+ +source
-
Vgs
-drain
Vds
channel-
Vg
Vs Vd
Cg
n+ n+
p-type body
W
L
tox
SiO2 gate oxide(good insulator, εox = 3.9)
polysilicongate
Cox = εox / tox
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Channel Charge
• MOS structure looks like parallel plate capacitor while operating in inversion– Gate – oxide – channel
• Qchannel = CV• C = Cg = εoxWL/tox = CoxWL• V = Vgc – Vt = (Vgs – Vds/2) – Vt
n+ n+
p-type body
+
Vgd
gate
+ +source
-
Vgs
-drain
Vds
channel-
Vg
Vs Vd
Cg
n+ n+
p-type body
W
L
tox
SiO2 gate oxide(good insulator, εox = 3.9)
polysilicongate
Cox = εox / tox
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Carrier velocity
• Charge is carried by e-• Carrier velocity v proportional to lateral E-
field between source and drain• v =
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Carrier Velocity
• Charge is carried by e-• Carrier velocity v proportional to lateral E-
field between source and drain• v = µE µ called mobility• E =
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Carrier Velocity
• Charge is carried by e-• Carrier velocity v proportional to lateral E-
field between source and drain• v = µE µ called mobility• E = Vds/L• Time for carrier to cross channel:
– t =
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Carrier Velocity
• Charge is carried by e-• Carrier velocity v proportional to lateral E-
field between source and drain• v = µE µ called mobility• E = Vds/L• Time for carrier to cross channel:
– t = L / v
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nMOS Linear I-V
• Now we know– How much charge Qchannel is in the channel– How much time t each carrier takes to crossdsI =
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nMOS Linear I-V
• Now we know– How much charge Qchannel is in the channel– How much time t each carrier takes to cross
channelds
QIt
=
=
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nMOS Linear I-V
• Now we know– How much charge Qchannel is in the channel– How much time t each carrier takes to cross
channel
ox 2
2
ds
dsgs t ds
dsgs t ds
QIt
W VC V V VL
VV V V
µ
β
=
⎛ ⎞= − −⎜ ⎟⎝ ⎠
⎛ ⎞= − −⎜ ⎟⎝ ⎠
ox = WCL
β µ
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nMOS Saturation I-V
• If Vgd < Vt, channel pinches off near drain– When Vds > Vdsat = Vgs – Vt
• Now drain voltage no longer increases current
dsI =
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nMOS Saturation I-V
• If Vgd < Vt, channel pinches off near drain– When Vds > Vdsat = Vgs – Vt
• Now drain voltage no longer increases current
2dsat
ds gs t dsatVI V V Vβ ⎛ ⎞= − −⎜ ⎟
⎝ ⎠
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nMOS Saturation I-V
• If Vgd < Vt, channel pinches off near drain– When Vds > Vdsat = Vgs – Vt
• Now drain voltage no longer increases current
( )2
2
2
dsatds gs t dsat
gs t
VI V V V
V V
β
β
⎛ ⎞= − −⎜ ⎟⎝ ⎠
= −
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nMOS I-V Summary
• Shockley transistor models
( )2
cutoff
linear
saturatio
0
2
2n
gs t
dsds gs t ds ds dsat
gs t ds dsat
V VVI V V V V V
V V V V
β
β
⎧⎪ <⎪⎪ ⎛ ⎞= − − <⎜ ⎟⎨ ⎝ ⎠⎪⎪
− >⎪⎩
0, ,g insg
C WLWK K CL WL D
µβ ∈ ∈= = =Note the dependencies
on W, L
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Activity1) If the width of a transistor increases, the current willincrease decrease not change
2) If the length of a transistor increases, the current willincrease decrease not change
3) If the supply voltage of a chip increases, the maximum transistor current will
increase decrease not change4) If the width of a transistor increases, its gate capacitance
willincrease decrease not change
5) If the length of a transistor increases, its gate capacitance will
increase decrease not change6) If the supply voltage of a chip increases, the gate
capacitance of each transistor willincrease decrease not change
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MOS as switch
• MOS can be viewed as switches.• The switches are electrically controlled.
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NMOS as a switch• Assume capacitor
(CL) is initially discharged
• Gate=1, Vin=1– CL begins to conduct
and charges toward 1 (Vdd) and stops at (Vdd-Vt)
– Signal is degraded
Gate=Vdd
Vin=VddVout
Ground
Load Capacitor
Vgs
I
Gate=Vdd
Vin=0Vout=Vdd
Ground
Load Capacitor
Vgs
I• Gate=1, Vin=0
– CL begins to discharge toward 0
– Good passer of 0.
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CMOS Signal Transfer Property
Open1Closed0PathGate
Gate
Drain
Source
Gate
Source
Drain
Closed1Open0PathGate
pMOS
nMOS
• Transmits 1 well• Transmits 0 poorly
• Transmits 0 well• Transmits 1 poorly
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CMOS Transmission Gate
• Transmit signal from INPUT to OUTPUT when Gate is closed
Gate (complementary of Gatecomplementary of Gate)
Source Drain
Gate
INPUT OUTPUTINPUTONON1
ZZOFFOFF0
OUTPUTnMOSpMOSGate
ZZ : High-Impedance State, consider the terminal is “floating”
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CMOS Inverter
• Combines the best of both.
Vin
Vcc
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nMOS Operation
Vgsn >
Vdsn >
Vgsn >
Vdsn <
Vgsn <SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
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nMOS Operation
Vgsn > Vtn
Vdsn > Vgsn – Vtn
Vgsn > Vtn
Vdsn < Vgsn – Vtn
Vgsn < Vtn
SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
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nMOS Operation
Vgsn > Vtn
Vdsn > Vgsn – Vtn
Vgsn > Vtn
Vdsn < Vgsn – Vtn
Vgsn < Vtn
SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
Vgsn = Vin
Vdsn = Vout
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nMOS Operation
Vgsn > Vtn
Vin > Vtn
Vdsn > Vgsn – Vtn
Vout > Vin - Vtn
Vgsn > Vtn
Vin > Vtn
Vdsn < Vgsn – Vtn
Vout < Vin - Vtn
Vgsn < Vtn
Vin < Vtn
SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
Vgsn = Vin
Vdsn = Vout
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pMOS Operation
Vgsp <
Vdsp <
Vgsp <
Vdsp >
Vgsp >SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
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pMOS Operation
Vgsp < Vtp
Vdsp < Vgsp – Vtp
Vgsp < Vtp
Vdsp > Vgsp – Vtp
Vgsp > Vtp
SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
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pMOS Operation
Vgsp < Vtp
Vdsp < Vgsp – Vtp
Vgsp < Vtp
Vdsp > Vgsp – Vtp
Vgsp > Vtp
SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
Vgsp = Vin - VDD
Vdsp = Vout - VDD
Vtp < 0
![Page 43: The MOS Transistorcse.iitkgp.ac.in/~debdeep/teaching/VLSI/slides/MOS.pdf · MOS Characteristics • MOS – majority carrier device • Carriers: e--in nMOS, holes in pMOS • V t](https://reader034.vdocuments.us/reader034/viewer/2022051106/5ad2eb697f8b9abd6c8d3f68/html5/thumbnails/43.jpg)
pMOS Operation
Vgsp < Vtp
Vin < VDD + Vtp
Vdsp < Vgsp – Vtp
Vout < Vin - Vtp
Vgsp < Vtp
Vin < VDD + Vtp
Vdsp > Vgsp – Vtp
Vout > Vin - Vtp
Vgsp > Vtp
Vin > VDD + Vtp
SaturatedLinearCutoff
Idsn
Idsp Vout
VDD
Vin
Vgsp = Vin - VDD
Vdsp = Vout - VDD
Vtp < 0
![Page 44: The MOS Transistorcse.iitkgp.ac.in/~debdeep/teaching/VLSI/slides/MOS.pdf · MOS Characteristics • MOS – majority carrier device • Carriers: e--in nMOS, holes in pMOS • V t](https://reader034.vdocuments.us/reader034/viewer/2022051106/5ad2eb697f8b9abd6c8d3f68/html5/thumbnails/44.jpg)
CMOS Inverter Voltage TransferCharacteristic
Vout
Vin1 2 3 4 5
12
34
5
NMOS linPMOS off
NMOS satPMOS sat
NMOS offPMOS lin
NMOS satPMOS lin
NMOS linPMOS sat
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3 INPUT CMOS NAND GATE
PULL UPNETWORK
PULL DOWNNETWORK
A
B
C
Y=~ABC
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Key Points
• There is always a path from VDD or GND to the output.
• There is no path from the VDD to GND (for our purpose). Thus this gate has a very low power consumption.
• Fully restored logic (why?)
![Page 47: The MOS Transistorcse.iitkgp.ac.in/~debdeep/teaching/VLSI/slides/MOS.pdf · MOS Characteristics • MOS – majority carrier device • Carriers: e--in nMOS, holes in pMOS • V t](https://reader034.vdocuments.us/reader034/viewer/2022051106/5ad2eb697f8b9abd6c8d3f68/html5/thumbnails/47.jpg)
Complex CMOS gates• DesignF=ab+bc+ac
Design the complementary logic…
![Page 48: The MOS Transistorcse.iitkgp.ac.in/~debdeep/teaching/VLSI/slides/MOS.pdf · MOS Characteristics • MOS – majority carrier device • Carriers: e--in nMOS, holes in pMOS • V t](https://reader034.vdocuments.us/reader034/viewer/2022051106/5ad2eb697f8b9abd6c8d3f68/html5/thumbnails/48.jpg)
Exercises
• Design an AND OR Inverter gate:
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Tristate Inverter
011
101
Z10
Z00
OutInpEN
What will be the CMOS level circuit for the above?
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Tristate Inverter