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Page 1: Teknek Limited

Teknek

Limited

Page 2: Teknek Limited

Who are we?

• Company formed 1984

• Acquired by ITW (Illinois Tool Works) in July 2011.

- $18billion sales

• Inventors & world leaders in the manufacture & design of roller

contact cleaning systems

• Global footprint

• Distribution world-wide

• Over 20,000 machines manufactured and delivered to diverse range

of industries

• Produces its own cleaning rollers & adhesives

– 10,000 cleaning rollers per year

– Design and Produce in UK, adhesive centres in UK, USA & UK

– Use around 1.2 million sq. metres of adhesive product per year

Page 3: Teknek Limited

Contact Cleaning Technology

The Teknek Cleaning Core

PPT 7 / 21

Page 4: Teknek Limited

Our Capabilities

• Inventors & world leaders in Contact Cleaning

• Unique chemistry and elastomer formulations

• Unique in house Roller & Adhesive facilities– Cleaning rollers up to 4metres

• Roller Production – Semi clean area Facility investment >$1m

– Just ordered new production machine at $160,000

• Research & Development Facilities

• Wide range of external scientific projects

• Most experienced people

• Vacuum Chamber Certified

Page 5: Teknek Limited

Contemporary Manufacturing

Page 6: Teknek Limited

Teknek Approach

• Partnership Approach

– Develop specific solutions

• We lead, others follow

– Polymers

» After 20 years competitors cannot match our silicone

products

» Nanocleen is still unique

• Machines

– New ideas – fast development

– Competitors – poor copies, no innovation

Page 7: Teknek Limited

External R&D

# Project Title PartnersA HiQSurf DuPont Teikin Films, Plastic Logic,

Centre for Process Innovation, Teknek

B Clean4Yield DuPont Teijin Films, Phillips, Horiba, Dr Shenk

GmbH, IBS Precision Engineering, Teknek,

Innophysics BV, Eight19 Ltd,

Thermosensorik GmbH, Orbotech Ltd,

Coatema Coating machinery GmbH

TNO Netherlands, Riso Denmark, TU Delft

Netherlands.

C Cleaning in High Vacuum The Holst Centre Netherlands, Teknek

D Macromolecular and Particle Adsorption on Different Surfaces University of Sheffield, Teknek

E Advanced Organic Polymers Aston University, Teknek

Innovation Partnerships

June 2013

Page 8: Teknek Limited

Global Expertise

• Internal R&D

– We know our stuff

• Rollers and Adhesive

– Dr June Calliston, Polymer Expert

– Sheila Hamilton, Engineer and 30 years roller experience

– Steve Mitchell, Managing Director, Physicist and Chemist

• External collaboration

– Teknek works with the best Universities and

companies to develop the science

Page 9: Teknek Limited

Scale

• Big is sometimes Beautiful?!

– To supply good rollers you have to MAKE

many not BUY many

• In 2013 will MAKE over 10,000 rollers

– To be able to produce reliable adhesive you

have to Specify the paper, the adhesive, the

production process etc. etc.

• In 2013 we will make around 1.2 million sq. metres

Page 10: Teknek Limited

Trust in us – Teknek Brand

• All rollers are made to International

Standard– ISO 6123 Rubber or Plastics covered rollers -Parts 1,2 & 3

– Rollers used above 200 mtrs per min are balanced to ISO 1940-

1:2003 G6.3

• Large rollers now available at G2.5

• We test, everything• Rollers for pick up, leach, straightness, TIR etc.

• Adhesive for pick up, sheer, peel, etc.

– Tested to FTM 1,8,9 &12 (International Standards)

• And we test all competitors the same way

Page 11: Teknek Limited

We speak – others Listen

• Teknek is invited to speak at International

conferences on

– Cleaning advanced electronics

– Coating & converting

• Why?

– We have information that scientists and

engineers need

– What we do advances the industry

Page 12: Teknek Limited

Technical conferences

# Paper/Workshop Title Conference Organisation1 Short Course Instructor for Ultra Barrier Coatings Flexible and Printed Electronics

Conference

Flextech Alliance

2 Contact Cleaning for Barrier Coatings 18th New Industrial Chemistry and

Engineering Workshop on Barrier

Technologies

Council for Chemical Research

3 Contact Cleaning for Functional Coating in Emerging

Technologies

AIMCAL Fall Conference AIMCAL

4 Improved Yields through Elastomeric Contact Cleaning AIMCAL European Conference AIMCAL

5 Role of Surface Cleanliness in Yield Enhancement European Electronics Assembly

Reliability Summit

6 Reducing Waste in Plastic Electronics LOPEC Organic Electronics Association

7 Improving Yields in High Gloss Laminates Decorative Surfaces Conference TCM

8 Optimising Cleaning Techniques for Increasing

Manufacturing Yields

Think Light Conference Ligna

9 Reducing Waste in Thin Film Manufacture ICE Conference International Converting

Association

UPCOMING

10 Cleaning in a High Vacuum Environment International Meeting Information

Display (Aug 13)

IMID Korea

11 Web cleaning Requirements for Vacuum Coating AIMCAL Fall Conference

(Oct 13)

AIMCAL

Page 13: Teknek Limited

What are we saying?

• Cleaning is difficult but we understand it

– The Science of Cleaning

• Contact Cleaning Conceptual Framework

• Model developed by Teknek & University of Sheffield

– Key Scientific Outcomes

» Cleaning efficiency≠ Shore Hardness

» Contact pressure ≠ Cleaning efficiency

» Processing ≠ Cleaning

» More rollers ≠ More Cleaning

Page 14: Teknek Limited

AIMCAL 2012 14

INTERFACIAL FORCES

Page 15: Teknek Limited

AIMCAL 2012 15

EXAMPLES OF ADHESION FORCES

Page 16: Teknek Limited

What are we saying 2

• Not all cleaning rollers are the same

• Smooth tacky rollers don’t work best

• Our roughest rollers work best – why?

• Topographic mapping & Atomic Force

Spectroscopy have lead to advanced roller

surfaces which have unique properties

Page 17: Teknek Limited

Innovation 1

• Silicone Free Cleaning Engine

– Silicone free cleaning rollers

– Silicone free adhesive

– Silicone free confirmed by

– FTIR,

– Edx (Energy-dispersive X-ray spectroscopy)

– RGA (residual gas analysis)

Page 18: Teknek Limited

Innovation 2

• Nanocleen

– Silicone free

– Static dissipating NO conductive particles – clever

polymers not cheap additives

– Dyne Neutral, contact angle (Measurements

on PET)

• Uncleaned contact angle 71.57, SD +/- 1.49

• Cleaned with Nanocleen 71.80, SD +/- I.46

Page 19: Teknek Limited

Innovation 3

• UTF Elastomer

– Surface modified

– High cleaning capacity

– Can clean sheets of film as thin as 15 microns

– Can clean thin copper foil without wrinkles

Page 20: Teknek Limited

Innovation 4

• Vacuum Compatibility

– Can be used in high vacuum environments

– No outgassing from elastomer or adhesive

– Silicone free system

– No reduction in cleaning performance

– No detriment to vacuum system

Introduction

Vacuum Process

Teknek Technology

Page 21: Teknek Limited

100 75 50 30 25 10 5 1 0.5 0.2

Air Knife

Brush & Vac

High Velocity Vacuum

Ultrasonic

Contact Clean Machine

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Particle Size, Microns

Efficiency of Cleaning Methods

$

Comparison of cleaning efficiency's

(End of sub-section) 5/5

Page 22: Teknek Limited

Primary Converting Secondary Converting FPD and BLU Assembly

一次加工 二次加工 组装

www.teknek.com.cn

一次加工 二次加工 アッセンブリー工程

Page 23: Teknek Limited

World leader in Contact Cleaning

www.teknek.com

Customer Results 1

16/05/2013 23

Cleaning the edge of polyester web

before coating

Page 24: Teknek Limited

World leader in Contact Cleaning

www.teknek.com

Customer Results 2

16/05/2013 24

Cleaning the impression roller in

hot foil coating

Page 25: Teknek Limited

Customer ROI: SMT

16/05/2013 25

Page 26: Teknek Limited

Environment

Wide web

16/05/2013 26

Ca

len

da

rin

g

Sp

utt

eri

ng

Pri

nti

ng

Co

ati

ng

La

min

ati

on

Se

alin

g

Pri

ma

ry

slit

tin

g/r

ew

ind

Slit

tin

g n

ew

ma

ch

ine

s o

nly

Em

bo

ss

ing

Ins

pe

cti

on

Ro

ller

cle

an

ing

Film production Cast

Cast/Stretched

Extrusion

co-extrusion

Blown

Label stock production

Siliconising Film Film

Paper

Window tinting film

Packaging Drink

FPD Films Diffuser/Polariser

Battery production Separator film

Cathode/anode

Abrasives

CCL

Paper Technical

co-extruded

Medical Pouch

Blister

Films/tape

Holographic /security

Photo Imagable film Dry film

Filter / screen mesh

Flexible circuits FPCB

Digital

BIB/BIC

Ceramics

Glass

Existing application

Requested Requested

Page 27: Teknek Limited

Teknek – Leading SupplierFilms and Conversion

• 3M

• Bayer

• DuPont Teijin

• Nitto Denko

• Sumitomo Bakelite

• Toray TAF

• SKC Group

• Mitsibushi Group

• Sekisui

• Unitika

• COSMO

• Cheil (Samsung Group)

• Innox Group

• Ube

• Solutia

• Tsujiden Group

• Ashai Kasei

• Lintec

• Zeon Optes

Page 28: Teknek Limited

Teknek Benefits

• Teknek technology can now

– Remove particles down to 100 nm

– From all types of substrates

– As thin as 15 microns

– In both sheet and roll format

– At speeds from 1m/min to 300m/min

– In a high vacuum environment

– Without silicone

– Gives significant yield improvements

Page 29: Teknek Limited

Questions?

Page 30: Teknek Limited

Questions?

Adhesion Forces

Page 31: Teknek Limited

Introduction To Vacuum

Page 32: Teknek Limited

What is a vacuum chamber

• It is a large strong metal container

• It is completely sealed to stop any air

getting in

• The materials to be coated are put in the

chamber before it is sealedWhen the

chamber is sealed a pump is activated

which pumps out all gases

• The pump will also extract moisture

32

Page 33: Teknek Limited

Issue

• Particles of contamination on substrates

cause defects in vacuum deposition

processes used in Flat Panel display

manufacturing

• Defects cause significant yield loss

• Removal of particles is essential for high

functionality and reliability

33

Page 34: Teknek Limited

How particles cause defects1

• The particles prevent the coating reaching

the substrate

• The particles get covered in coating

• When the substrate is moved or rewound

the particles are knocked loose from the

substrate leaving uncoated areas called

pinholes in the coating

• These pinholes affect the functionality of

the film34

Page 35: Teknek Limited

How particles cause defects 2

• Particles can fall from the walls and roof of

the vacuum chamber

• If they land on the surface of the film and

the film is wound up the particles will

cause a depression or dent in the film

which will repeat for several layers

• The particles can also fracture brittle

ceramic coatings during rewind

35

Page 36: Teknek Limited

Technology Drivers

36

• Films are getting thinner – easier to

damage by particles in the wind of the roll

• Coatings are getting thinner – even

nanoscale particles can cause pinholes

• No air or wet systems can be used in

vacuum environments

• The functional requirements on coatings

are becoming more demanding

Page 37: Teknek Limited

Challenges

37

• Need a cleaning system which can

operate under vacuum

• Needs to be able to remove very small

particles

• Cannot use air or liquid for cleaning

• Must not alter the surface energy

• Must not outgas

Page 38: Teknek Limited

Pinhole reduction in metallised film

0

10

20

30

40

50

60

70

No cleaning CRC Vacuum Plasma

Cleaning Operation

Pin

ho

le D

en

sit

y (

>5

µ)

/ c

(x1

00

) Average Pinhole

Density of commercially

available metallised

polyester film

38

Teknek

Data courtesy of Dupont

Teijin UK

Page 39: Teknek Limited

39

Areas of Application

• After stripping of protective film to remove

possibility of static induced recontamination

• Immediately prior to sputtering to remove any

particles deposited from the walls of the

chamber

• Before rewind to stop particles imprinting on the

layer below or fracturing the film

• Cleaning the protective film at rewind prior to

application to stop damage to the coating

Page 40: Teknek Limited

40

Page 41: Teknek Limited

Benefits

• Teknek technology can now

– Remove particles down to 100 nm

– From all types of substrates

– As thin as 15 microns

– In both sheet and roll format

– At speeds from 1m/min to 300m/min

– In a high vacuum environment

– Without silicone

– Gives significant yield improvements

41

Page 42: Teknek Limited

Vacuum Processes

Page 43: Teknek Limited

Thermal Evaporation

• Thermal Evaporation often called vacuum

metallising.

• Metal is melted and turns into vapour

• Long established relatively low technology

• Used mainly in food packaging

applications to provide and oxygen barrier

• Metal used is mainly aluminium

43

Page 44: Teknek Limited

Chemical Vapour Deposition(CVD)

• Different chemicals are injected into the

vacuum chamber

• They react to form a material which is

condensed onto the film surface

• They can form conductive or insulative

materials

• They can also form ceramic coatings

• Used for barrier coatings and TFT

44

Page 45: Teknek Limited

Sputtering

• Sputtering

• A solid metal target is hit with ions which

knock particles of metal off

• The particles of metal are attracted to the

film surface by an electric field

• The most common material is ITO

• This gives a conductive surface which is

transparent

45

Page 46: Teknek Limited

ALD

46

Page 47: Teknek Limited

R2R vacuum line

47

Page 48: Teknek Limited

Challenges

IMID 2013 48

• Need a cleaning system which can

operate under vacuum

• Needs to be able to remove very small

particles

• Cannot use air or liquid for cleaning

• Must not alter the surface energy

• Must not outgas

Page 49: Teknek Limited

Teknek Technology

Page 50: Teknek Limited

Outgassing Test

• Scud Vacuum System 032

• 2 small rollers

• 2 sheets adhesive

• Pumped down to 1E-7 mbar

• Time in vacuum 66 hours

• Each sample weighed before and after.

IMID 2013 50

Page 51: Teknek Limited

Ultracleen RGA

IMID 2013 51

Page 52: Teknek Limited

Ultracleen Outgassing

IMID 2013 52

Page 53: Teknek Limited

Nanocleen RGA

IMID 2013 53

Page 54: Teknek Limited

Adhesive Roll RGA

IMID 2013 54

Page 55: Teknek Limited

Cleaning Efficiency Test

roller

roller vacuum

condition adhesive sheet condition

weight

before

weight

after

Differen

ce [g]

nanocleen ambient ambient 4.31 4.57 0.26

1 weekend in vac (0.1

mbar) 4.31 4.54 0.25

18 hours in high vac (1e-6

mbar) 4.3 4.55 0.25

1 weekend in vac

(0.1 mbar) ambient 4.31 4.57 0.26

1 weekend in vac

(1e-6 mbar) ambient 4.3 4.55 0.25

nanocleen ambient ambient 4.31 4.6 0.26

ambient ambient 4.3 4.55 0.25

IMID 2013 55

Page 56: Teknek Limited

IMID 2013 56

AREAS OF APPLICATION

• After stripping of protective film to remove

possibility of static induced recontamination

• Immediately prior to sputtering to remove any

particles deposited from the walls of the

chamber

• Before rewind to stop particles imprinting on the

layer below or fracturing the film

• Cleaning the protective film at rewind prior to

application to stop damage to the coating

Page 57: Teknek Limited

Benefits

• Teknek technology can now

– Remove particles down to 100 nm

– From all types of substrates

– As thin as 15 microns

– In both sheet and roll format

– At speeds from 1m/min to 300m/min

– In a high vacuum environment

– Without silicone

– Gives significant yield improvements

IMID 2013 57

Page 58: Teknek Limited

Acknowledgements

• European Funding Programme FP7

Clean4Yield project

• The Holst Institute, Eindhoven

• The Technical University of Dresden

IMID 2013 58

Page 59: Teknek Limited

Adhesion Forces

• Adhesion describes how a particle and a surface are

held together

• A number of different forces will act together to produce

the adhesion force combination

• Two bodies in contact, an attractive force occurs that

requires a mechanical load to separate them

• Strength of adhesion is determined by how strong the

interactions are

Page 60: Teknek Limited

van der Waals Force

• Total force between polar and non-polar molecules

• Force between non charged particles (non ionic)

• Particles can have a positive end and a negative end

• Opposite ends can line up and attract

• Dipole formed between particles

• Attracted by positive and negative forces

Surface + Positive Side

Particle

-Negative Side

+

Page 61: Teknek Limited

van der Waals Force due to 1%

Deformation

Surface Positive Side

Particle- Negative Side

+

+

Page 62: Teknek Limited

Electric Double Layer Force

• Charged (ionic) particles

Surface + + + + + +Positive Charge

Negative Charge+ ++++

Charged

Particle

- - - - - - -

Page 63: Teknek Limited

Electrostatic Image Force

• Electrostatic interaction occurs between a particle and

it’s image

Surface

Charged

Particle -

+

Page 64: Teknek Limited

Capillary Force

• Capillary interactions form due to water being present in

the separation gap

• Force increased due to surface tension and liquid

miniscus formed

Surface

Particle

Liquid Film

Page 65: Teknek Limited

Gravitational Force

• Natural phenomenon

• Physical bodies attract each other with a force

proportional to their masses, and inversely proportional

to the square of the distance between them.

Surface

Particle

Page 66: Teknek Limited

Knowledge is Power

• Calculating each individual force makes up the total

adhesion force

• Force is dependent on size of particle, type of particle

and surface, environmental conditions, shape of particle

• Gives an indication of force needed to remove particles

Page 67: Teknek Limited

ISO 6123

• Part 1 covers hardness measurement

• Part 2 covers Surface characteristics

– Grade 1/1 the highest possible

– Surface finish 1 the highest possible

• Part 3 covers Dimensional Tolerances