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TDC’s unique polishing technology of SiC wafers TDC and IMRAM (institute of multidisciplinary Research for advanced materials) Tohoku university have been developing an innovative technology for SiC (silicon carbide) wafers. Why TDC developed SiC polishing technology? SiC is an outstanding material for next generation power devices, but for its stableness and hardness, the process cost is non-negligible problem. Therefore TDC started joint development of polishing technology for SiC wafer with IMRAM, Tohoku univ and AIST. We have been achieving superior quality (roughness and TTV) with short process time and low-cost. Specification of TDC’s SiC wafer For more information, please contact us. SiC wafer Future power device material, Realize ultimate surface roughness and TTV in short time with low cost [Tokyo Sales Office] +81(0)3-5281-2525 [Osaka Sales Office] +81(0)6-6310-7073 [Website] http://mirror-polish.com/en [E-mail] [email protected] Contact Us TDC Corporation !From one piece to large scale production !From material procurement to all processing processe !For more information on delivery time, price and other specifications, please contact us as follows

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Page 1: TDC Corporation - SiC wafermirror-polish.com/wp-content/themes/2016/img/product/pdf/...Specification of TDC’s SiC wafer For more information, please contact us. SiC wafer Future

TDC’s unique polishing technology of SiC wafers TDC and IMRAM (institute of multidisciplinary Research for advanced materials) Tohoku university have been developing an innovative technology for SiC (silicon carbide) wafers.

Why TDC developed SiC polishing technology? SiC is an outstanding material for next generation power devices, but for its stableness and hardness, the process cost is non-negligible problem. Therefore TDC started joint development of polishing technology for SiC wafer with IMRAM, Tohoku univ and AIST.We have been achieving superior quality (roughness and TTV) with short process time and low-cost.

Specification of TDC’s SiC wafer For more information, please contact us.

SiC wafer

Future power device material,Realize ultimate surface roughness and TTV in short time with low cost

[Tokyo Sales Office] +81(0)3-5281-2525 [Osaka Sales Office] +81(0)6-6310-7073 [Website] http://mirror-polish.com/en [E-mail] [email protected]

Contact Us

TDC Corporation

!From one piece to large scale production !From material procurement to all processing processe!For more information on delivery time, price and other specifications, please contact us as follows

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