system board d3030 for bx920 s2 - technical...

Technical Manual - English

System Board D3030for BX920 S2 Technical Manual

Edition March 2011

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cognitas. Gesellschaft für Technik-Dokumentation mbHwww.cognitas.de

Copyright and Trademarks

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Copyright © 2011 Fujitsu Technology Solutions GmbH.

All rights reserved.Delivery subject to availability; right of technical modifications reserved.

All hardware and software names used are trademarks of their respective manufacturers.

– The contents of this manual may be revised without prior notice.

– Fujitsu assumes no liability for damages to third party copyrights or other rights arising from the use of any information in this manual.

– No part of this manual may be reproduced in any form without the prior written permission of Fujitsu.

Microsoft, Windows, Windows Server, and Hyper V are trademarks or registered trademarks of Microsoft Corporation in the USA and other countries.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the USA and other countries.

mailto:[email protected]

http://www.cognitas.de

D3030 (BX920 S2) Technical Manual

Before reading this manual

For your safety

This manual contains important information for safely and correctly using this product.

Carefully read the manual before using this product. Pay particular attention to the accompanying manual "Safety Notes and Regulations" and ensure these safety notes are understood before using the product. Keep this manual and the manual "Safety Notes and Regulations" in a safe place for easy reference while using this product.

Radio interference

This product is a "Class A" ITE (Information Technology Equipment). In a domestic environment this product may cause radio interference, in which case the user may be required to take appropriate measures. VCCI-A

Aluminum electrolytic capacitors

The aluminum electrolytic capacitors used in the product's printed circuit board assemblies and in the mouse and keyboard are limited-life components. Use of these components beyond their operating life may result in electrolyte leakage or depletion, potentially causing emission of foul odor or smoke.

As a guideline, in a normal office environment (25°C) operating life is not expected to be reached within the maintenance support period (5 years). However, operating life may be reached more quickly if, for example, the product is used in a hot environment. The customer shall bear the cost of replacing replaceable components which have exceeded their operating life. Note that these are only guidelines, and do not constitute a guarantee of trouble-free operation during the maintenance support period.

High safety use

This product has been designed and manufactured for general uses such as general office use, personal use, domestic use and normal industrial use. It has not been designed or manufactured for uses which demand an extremely high level of safety and carry a direct and serious risk to life or body if such safety cannot be ensured.

Technical Manual D3030 (BX920 S2)

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These uses include control of nuclear reactions in nuclear power plants, automatic airplane flight control, air traffic control, traffic control in mass transport systems, medical devices for life support, and missile guidance control in weapons systems (hereafter, "high safety use"). Customers should not use this product for high safety use unless measures are in place for ensuring the level of safety demanded of such use. Please consult the sales staff of Fujitsu if intending to use this product for high safety use.

Measures against momentary voltage drop

This product may be affected by a momentary voltage drop in the power supply caused by lightning. To prevent a momentary voltage drop, use of an AC uninterruptible power supply is recommended.

(This notice follows the guidelines of Voltage Dip Immunity of Personal Computer issued by JEITA, the Japan Electronics and Information Technology Industries Association.)

Technology controlled by the Foreign Exchange and Foreign Trade Control Law of Japan

Documents produced by Fujitsu may contain technology controlled by the Foreign Exchange and Foreign Trade Control Law of Japan. Documents which contain such technology should not be exported from Japan or transferred to non-residents of Japan without first obtaining authorization in accordance with the above law.

Harmonic Current Standards

This product conforms to harmonic current standard JIS C 61000-3-2.

Only for the Japanese market:About SATA hard disk drives

The SATA version of this server supports hard disk drives with SATA / BC-SATA storage interfaces. Please note that the usage and operation conditions differ depending on the type of hard disk drive used.

Please refer to the following internet address for further information on the usage and operation conditions of each available type of hard disk drive:

http://primeserver.fujitsu.com/primergy/harddisk/

D3030 (BX920 S2) Technical Manual

Only for the Japanese market:

I Although described in this manual, some sections do not apply to the Japanese market. These options and routines include:

– CSS (Customer Self Service)

– Replacing the lithium battery

Technical Manual D3030 (BX920 S2)

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D3030 (BX920 S2) Technical Manual 7

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.1 Notational conventions . . . . . . . . . . . . . . . . . . . . . 9

2 Important notes . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.2 CE certificate of conformity . . . . . . . . . . . . . . . . . . 14

2.3 Environmental protection . . . . . . . . . . . . . . . . . . . 15

3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.2 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 213.2.1 Memory speed . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.3 Screen resolution . . . . . . . . . . . . . . . . . . . . . . . 29

3.4 Temperature/system monitoring . . . . . . . . . . . . . . . 29

3.5 LED indicators . . . . . . . . . . . . . . . . . . . . . . . . . 313.5.1 Internal indicators . . . . . . . . . . . . . . . . . . . . . . . . 313.5.2 External indicators . . . . . . . . . . . . . . . . . . . . . . . . 32

3.6 Interfaces, connectors and DIP switch . . . . . . . . . . . . 33

3.7 Settings with switches and jumpers . . . . . . . . . . . . . 34

4 Replacing the lithium battery . . . . . . . . . . . . . . . . . 37

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1 IntroductionThis technical manual describes the D3030 system board, which can be equipped with two processors.

For additional driver information (if available), refer to the supplied DVDs (see Installation DVD of ServerView Suite - ServerView Software Products).

You will find further information about the BIOS setup in the "D3030 BIOS Setup Utility for PRIMERGY BX920 S2 Server Blade" manual.

I PRIMERGY manuals are available in PDF format on the ServerView Suite DVD 2. The ServerView Suite DVD 2 is part of the ServerView Suite supplied with every server.

PRIMERGY Abbreviations and Glossary can also be found on the ServerView Suite DVD 2.

1.1 Notational conventions

The following notational conventions are used in this manual:

Text in italics indicates commands or menu items.

"Quotation marks" indicate names of chapters and terms that are being emphasized.

Ê describes activities that must be performed in the order shown.

V CAUTION! pay particular attention to texts marked with this symbol. Failure to observe this warning may endanger your life, destroy the system or lead to the loss of data.

I indicates additional information, notes and tips.

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2 Important notesThis chapter provides safety instructions which you must observe when handling your server.

V CAUTION!

With the system board installed you must open the system to access the system board. How to access the system board of your system is described in the appropriate service supplement (except for the Japanese market).

When handling the system board, refer to the specific notes on safety in the operating manual and/or service supplement for the respective server.

2.1 Notes on safety

V CAUTION!

● The actions described in these instructions should only be performed by authorized, qualified personnel. Equipment repairs should only be performed by qualified staff. Any failure to observe the guidelines in this manual, and any unauthorized openings and improper repairs could expose the user to risks (electric shock, fire hazards) and could also damage the equipment. Please note that any unauthorized openings of the device will result in the invalidation of the warranty and exclusion from all liability.

● Transport the device only in the antistatic original packaging or in packaging that protects it from knocks and jolts.

● Only install expansions that are allowed for the system board. If you install other expansions, you may damage the requirements and rules governing safety and electromagnetic compatibility or your system. Information on which system expansions are approved for installation can be obtained from our customer service center or your sales outlet.

● The warranty expires if the device is damaged during the installation or replacement of system expansions.

12 Technical Manual D3030 (BX920 S2)

Notes on safety

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V CAUTION!

● Components can become very hot during operation. Ensure you do not touch components when making extensions to the system board. There is a danger of burns!

● Transmission lines to peripheral devices must be adequately shielded.

● Ethernet cabling has to comply with EN 50173 and EN 50174-1/2 standards or ISO/IEC 11801 standard respectively. The minimum requirement is a Category 5 shielded cable for 10/100 Ethernet, or Category 5e for Gigabit Ethernet.

● Never connect or disconnect data transmission lines during a storm (risk of lightning hazard).

Batteries

V CAUTION!

● Incorrect replacement of batteries may lead to a risk of explosion. The batteries may only be replaced with identical batteries or with a type recommended by the manufacturer (this information doesn’t apply to the Japanese market).

It is essential to observe the instructions in chapter "Replacing the lithium battery".


Notes on safety

Modules with Electrostatic-Sensitive Devices

Modules with electrostatic-sensitive devices are identified by the following sticker:

Figure 1: ESD label

When you handle components fitted with ESDs, you must always observe the following points:

● Switch off the system and remove the power plugs from the power outlets before installing or removing components with ESDs.

● You must always discharge static build-up (e.g. by touching a grounded object) before working with such components.

● Any devices or tools that are used must be free of electrostatic charge.

● Wear a suitable grounding cable that connects you to the external chassis of the system unit.

● Always hold components with ESDs at the edges or at the points marked green (touch points).

● Do not touch any connectors or conduction paths on an ESD.

● Place all the components on a pad which is free of electrostatic charge.

I For a detailed description of how to handle ESD components, see the relevant European or international standards (EN 61340-5-1, ANSI/ESD S20.20).


CE certificate of conformity

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Instructions for handling boards

● The specific instructions in the service article for the respective end device must be observed when installing and removing the board.

● Disconnect the device plug from the shock-proof socket before carrying out any work on an installed board.

● Exercise extreme care when installing and removing all boards.

Take care not to tilt boards; they must be installed perfectly straight.

If they are incorrectly handled, the boards and the components on them, or the other components (e.g. EMI spring contacts) and conductors can be damaged.

● Handle all locking mechanisms (engaging lugs and centering pins) carefully when installing/removing the board or components (e.g. memory modules, processors).

● Never use sharp objects (screwdrivers) as levers.

2.2 CE certificate of conformity

The board complies with the requirements of the EC directives 2004/108/EC regarding “Electromagnetic Compatibility” and 2006/95/EC “Low Voltage Directive”. This is indicated by the CE marking (CE = Communauté Européenne).

Compliance was tested in a typical PRIMERGY configuration.


Environmental protection

2.3 Environmental protection

Environmentally-friendly product design and development

This product has been designed in accordance with the Fujitsu standard for "environmentally friendly product design and development". This means that key factors such as durability, selection and labeling of materials, emissions, packaging, ease of dismantling and recycling have been taken into account.

This saves resources and thus reduces the harm done to the environment. Further information can be found at:

– http://ts.fujitsu.com/products/standard_servers/index.html (for the EMEA market)– http://primeserver.fujitsu.com/primergy/concept/ (for the Japanese market)

Energy-saving information

Devices that do not need to be constantly switched on should be switched off until they are needed as well as during long breaks and after completion of work.

Packaging information

This packaging information doesn’t apply to the Japanese market.

Do not throw away the packaging. You may need it later for transporting the system. If possible, the equipment should only be transported in its original packaging.

Information on handling consumables

Please dispose of printer consumables and batteries in accordance with the applicable national regulations.

In accordance with EU directives, batteries must not be disposed of with unsorted domestic waste. They can be returned free of charge to the manufacturer, dealer or an authorized agent for recycling or disposal.

http://ts.fujitsu.com/products/standard_servers/index.html

http://primeserver.fujitsu.com/primergy/concept/



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All batteries containing pollutants are marked with a symbol (a crossed-out garbage can). They are also marked with the chemical symbol for the heavy metal that causes them to be categorized as containing pollutants:

Cd CadmiumHg MercuryPb Lead

Labels on plastic casing parts

Please avoid sticking your own labels on plastic parts wherever possible, since this makes it difficult to recycle them.

Returns, recycling and disposal

Please handle returns, recycling and disposal in accordance with local regulations.

Details regarding the return and recycling of devices and consumables within Europe can also be found in the "Returning used devices" manual, via your local Fujitsu branch or from our recycling center in Paderborn:

Fujitsu Technology SolutionsRecycling CenterD-33106 Paderborn

Tel. +49 5251 525 1410

Fax +49 5251 525 32 1410

The device must not be disposed of with domestic waste. This device is labeled in compliance with European directive 2002/96/EC on waste electrical and electronic equipment (WEEE).

This directive sets the framework for returning and recycling used equipment and is valid across the EU. When returning your used device, please use the return and collection systems available to you. Further information can be found at http://ts.fujitsu.com/recycling.

http://ts.fujitsu.com/recycling

http://ts.fujitsu.com/recycling


3 Features

3.1 Overview

Processors

– 1 or 2 Intel® Xeon® processors of the 5500 and 5600 series– 2 processor sockets LGA1366 for Intel® Xeon® processors– Integrated memory controller (DDR3)– 32 KB L1 cache (on-die data cache per core)– 32 KB L1 cache (on-die instruction cache per core)– 256 KB L2 cache (mid-level per core)– Up to 12 MB on chip shared L3 cache (among all cores)– 2x Intel® QuickPath Interconnect with up to 6,4 GT/s in each direction

Main memory

– 9 slots for main memory DDR3 1066 / 1333 single-, dual- or quad-ranked DIMM memory modules with 2 GB, 4 GB, 8 GB and 16 GB

– Buffered and unbuffered DIMMs with ECC are supported, mix of memory is not permitted

– Maximum 144 GB of memory– Minimum 2 GB (1 memory module)– Maximum 32 Gbit/s band width (DDR3)– CPU0 has 2 DIMM slots for memory rows per channel, CPU1 has 1 DIMM

slot for memory row per channel– ECC multiple-bit error detection and single-bit error correction– Memory scrubbing functionality– Single Device Data Correction (SDDC) function (Chipkill™)

Chips on the system board

– Intel® 5500 chipset – Intel® ICH10 Base– 2x Intel® 82575EB dual-port Gigabit Ethernet controller– Hard disk controller LSI1064E SAS for 2 SAS hard disks– iRMC S2 (integrated Remote Management Controller) with integrated

graphic controller– 2 MB Flash ROM– 32Mx16-667 DDR2 SRAM for iRMC S2– ADT7462 temperature/system monitoring controller


Overview

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Graphic

– Integrated VGA controller with PCIe x1 interface (PILOT-II)– 16 MB graphic memory available via driver

LAN – Ethernet controller

– 2x Intel® 82575EB dual-port 10/100/1000 Mbit/s Base-T Ethernet controller– 1x BCM5221 for iRMC S2

Storage devices

– 2x SAS (1.5 Gbit/s) or 2x SATA– 2.5“ drive slide-in modules are supported– UFM (USB Flash Module)

External connectors (via Y cable)

– 4x USB 2.0 interfaces at the front side– 1x serial interface at the front side– 1x VGA

Internal connectors

– 1x video connector (VGA) at the front side– 1x universal USB port for 4 USB connectors at the front side– 1x UFM connector (USB Flash Module connection) for USB Flash ROM– 9x slots for DDR3 memory modules– Power supply (12 V and 5 V auxiliary supply)

iRMC S2 server management controller

– Basic features: Temperature monitoring, System Event Log and ASR&R (Automatic Server Reconfiguration and Restart)

– PDA– Global Error/CSS/ID LED– Pre-failure warranty for memory– HD LED support (SAS, SATA)– Inventory Identification Control– CSS functionality– Energy consumption control– Console redirection (text console)– Graphic console redirection (Advanced Video Redirection - AVR)– Provision of remote memory media (Remote Storage)


Overview

Security features

– Password protection for system and BIOS– BIOS restore support– Virus protection through Flash Write Protection

Energy saving functions

– ACPI (States S0, S1, S4, S5)– On/Off/Idle state/Reactivate via power switch– Switch on and off via software– Reactivate the server from standby via RTC, external serial ports, LAN, PCIe

controller and iRMC S2– Switch on the server via the power switch, external serial ports, LAN, PCIe

controller and iRMC S2

BIOS features

– AMI– SMBIOS 2.5 (DMI)– MultiProcessor specification– Server Hardware Design Guide– WfM– ACPI support– LSI SAS/RAID BIOS– USB keyboard/mouse– boot possible from:

– hard disk (SATA, SAS, SCSI, USB)– USB stick– CD/DVD (SATA, SAS)– LAN

– console redirection support– OEM logo– CPU, memory disable– Mirroring and Spare memory support


Battery in holder for recycling

Form factor, slot compatibility list

– 491 x 200mm


Overview

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– ACPI 2.0, OnNow, PCI Express 2.0, LPC 1.1, WfM 2.0, SHDG 3.0, MPS 1.4, IPMI 1.5, PCI SHPC 1.0 and PCI Express card electromechanical specification rev. 1.0, USB2.0, SATAII 2.0

CSS (Customer Self Service)

This system board supports the CSS functionality. You will find a description of CSS functionality in the operating manual of your server.

I This feature is not available for the japanese market.

UFM (optional)

By the manufacturer the system board is equipped with a slot for an UFM (USB Flash Module). The module can be used as optional memory for software (e.g. VMware) or as a software dongle.

Trusted Platform Module (TPM)

A Trusted Platform Module (TPM) for safer storage of keys can be implemented as an option. This module enables programs from third party manufacturers to store key information (e.g. drive encryption using Windows Bitlocker Drive Encryption).

The TPM is activated via the BIOS system (for more information, refer to the BIOS manual).

V CAUTION!

– When using the TPM, note the program descriptions provided by the third party manufacturers.

– You must also create a backup of the TPM content. To do this, follow the third party manufacturer's instructions. Without this backup, if the TPM or the system board is faulty you will not be able to access your data.

– If a failure occurs, please inform your service about the TPM activation before it takes any action, and be prepared to provide them with your backup copies of the TPM content.


Main memory

3.2 Main memory

The system board supports up to 144 GB main memory. 9 slots for main memory are available. Each slot can be populated with 2 GB, 4 GB, 8 GB or 16 GB single-, dual- or quad-ranked DIMM memory modules. The minimum population is 1 DIMM in independent channel mode.

ECC with memory scrubbing and with the Single Device Data Correction (SDDC) function is supported.

I You will find the descriptions how to install memory modules in the Options Guide of your server blade.

Configuration of the main memory

Figure 2: Main memory configuration

● The memory modules are organized in 3 channels per CPU. CPU1 has 3 channels with 2 slots each (0 and 1) and CPU2 has 3 channels with 1 slot each.

● The channels A - C are controlled by CPU 1 and the channels D - F are controlled by CPU 2.

● x4 or x8 organized registered (RDIMMs) or unbuffered (UDIMMs) memory modules with ECC are supported.

CPU 1

CPU 2

DIMM 2A

DIMM 1A

DIMM 2B

DIMM 1FDIMM 1EDIMM 1D

FrontChannel 2Channel 1Channel 0

DIMM 1B

DIMM 1C

DIMM 2C

Channel 0

Channel 1

Channel 2

Slot 1

Slot 0

Slot 0Slot 0Slot 0

Slot 1

Slot 0

Slot 0

Slot 1


Main memory

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● SDDC (Chipkill) is supported only for registered memory modules.

Main memory operating modes

There are four operating modes for the main memory:

– Independent channel mode (maximum population)

The populated memory of the six channels (A - F) can be used completely (max. 144 GB).

– Mirrored channel mode (maximum security)

Only the populated memory of the two channels A and D can be used (max. 48 GB). The channels B and E serve as safeguarding against failure. The memory belonging to the channels B and E contain the mirrored data of the memory belonging to channel A and D. The channels C and F are not used.

– Performance channel mode (maximum performance)

The populated memory of the six channels (A - F) can be used completely (max. 144 GB).

– Spare channel mode (large population and large security)

Only the populated memory of the four channels A, B, D and E can be used (max. 96 GB). The channels C and F serve as safeguarding against failure.

I Spare channel mode is only supported by Intel® Xeon® 5600 processor series.

Depending on the mode of operation there are different population requirements for the main memory.

I For system relevant information please refer to the configurator of the server:

https://sp.ts.fujitsu.com/dmsp/docs/cnfgbx920s2.pdf (for the EMEA market)

http://primeserver.fujitsu.com/primergy/system.html (for the Japanese market)

https://sp.ts.fujitsu.com/dmsp/docs/cnfgbx920s2.pdf

http://primeserver.fujitsu.com/primergy/system.html


Main memory

Figure 3: Main memory operating modes

I Spare channel mode is installed the same as performance channel mode.

Independent Channel Mode

This mode allows the memory modules to be arranged in any order in each channel. The channels do not have to be populated identically.

● You can use memory modules with different speed ratings within a channel, whereby the settings of the slowest memory module are used for each channel.

● All channels work with the fastest common frequency.

● All timings except for the clock frequency can vary between the channels.

● Always start by populating the main memory at CPU 1.

● If CPU 2 is installed, the following applies:

– For CPU 2, there must be at least one DIMM module (DIMM 1D) installed.

– The DIMM slots must be fitted in the following sequence:

CPU 2

CPU 1DIMM 1F

DIMM 1D

DIMM 1E

DIMM 2A

DIMM 2B

DIMM 2C

DIMM 1B

DIMM 1C

DIMM 1A CPU 2

CPU 1DIMM 1F

DIMM 1D

DIMM 1E

DIMM 2A

DIMM 2B

DIMM 2C

DIMM 1B

DIMM 1C

DIMM 1A

IndependentChannel Mode

MirroredChannel Mode

PerformanceChannel Mode

required required, if 2nd CPU is configured optional, same type in bank per CPU

optional, any type not used

CPU 2

CPU 1DIMM 1F

DIMM 1D

DIMM 1E

DIMM 2A

DIMM 2B

DIMM 2C

DIMM 1B

DIMM 1C

DIMM 1A


Main memory

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V CAUTION!

If only CPU 1 is installed, the empty DIMM slots of CPU 1 must be fitted with dummy DIMM modules to ensure sufficient cooling of the system (this does not apply if two CPUs are installed).

● If memory modules with different memory capacities are to be installed for a CPU then the rule applies that the higher the capacity, the further away from the CPU the memory module has to be mounted per channel.

The DIMM sockets must be populated per channel in the following order:

Channel 0 CPU 1: DIMM1A -> DIMM1B -> DIMM1CChannel 0 CPU 2: DIMM1D -> DIMM1E -> DIMM1FChannel 1 CPU 1: DIMM2A -> DIMM2B -> DIMM2C


Main memory

Mirrored Channel Mode

In this mode, channels A and B of CPU 1 and channels D and E of CPU 2 form exact copies of each other.

● Channel A and channel B of CPU1 must be fitted identically and channel D and channel E of CPU2 must be fitted identically (channel C and F cannot be used in Mirrored Channel Mode since the "counterpart" is missing).

● Memory modules with different clock frequencies and different speed ratings can be used within a channel, whereby the settings of the slowest memory module are used for the channel.

● In Mirrored Channel Mode, the total main memory available in the system is half as large as the installed memory.

Figure 4: Fitting in Mirrored Channel Mode

CPU 1

CPU 2

DIMM 2A

DIMM 1A

DIMM 2B

DIMM 1F empty

empty

empty

1.

2.

1.

2.

1.1.

DIMM 1EDIMM 1D


DIMM 1B

DIMM 1C

DIMM 2C

Channel 0

Channel 1

Channel 2

Slot 1

Slot 0

Slot 0Slot 0Slot 0

Slot 1

Slot 0

Slot 0

Slot 1


Main memory

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Performance Channel Mode

In this mode, the maximum performance and capacity can be achieved.

● All three channels of a CPU must be populated identically as regards the size and organization of the memory modules.

● Memory modules with different clock frequencies and different speed ratings can be used within a channel, whereby the settings of the slowest memory module are used for this channel.

Figure 5: Fitting in Performance Channel Mode

V CAUTION!


CPU 1

CPU 2

DIMM 2A

DIMM 1A

DIMM 2B

DIMM 1F 3.

3.

6.

2.

5.

1.

4.

2.1.

DIMM 1EDIMM 1D


DIMM 1B

DIMM 1C

DIMM 2C

Channel 0

Channel 1

Channel 2

Slot 1

Slot 0

Slot 0Slot 0Slot 0

Slot 1

Slot 0

Slot 0

Slot 1


Main memory

Spare Channel Mode

I This mode is only supported by Intel® Xeon® 5600 processor series.

In this mode, channel C forms a replacement for the two channels A and B and channel F forms a replacement for the two channels D and E. Channels C and F are not available as regular main memory. The channels are populated in the same way as in Performance Channel Mode.

● All three channels must be populated identically as regards the size and organization of the memory modules.

● Memory modules with different clock frequencies and different speed ratings can be used within a channel, whereby the settings of the slowest memory module are used for the channel.

● The timings in the active channels (A and B) and in the spare channel (C) can be set differently.

● Only 2/3 of the maximum memory bandwidth is available in Spare Channel Mode.

● In Spare Channel Mode, the total main memory available in the system is 2/3 the size of the installed memory.

Figure 6: Fitting in Spare Channel Mode

CPU 1

CPU 2

DIMM 2A

DIMM 1A

DIMM 2B

DIMM 1F 1.

1.

2.

1.

2.

1.

2.

1.1.

DIMM 1EDIMM 1D


DIMM 1B

DIMM 1C

DIMM 2C

Channel 0

Channel 1

Channel 2

Slot 1

Slot 0

Slot 0Slot 0Slot 0

Slot 1

Slot 0

Slot 0

Slot 1


Main memory

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V CAUTION!


3.2.1 Memory speed

The maximum DDR3 memory speed depends on the memory configuration on one memory channel and on the CPU speed.

One DIMM per channel = max. 1333 MHz, two DIMMs per channel = max. 1333 MHz for 1.5 V memory / max. 1066 MHz for 1.35 V memory. The memory channel with the lowest speed defines the speed of all CPU channels in the system.

DIM

M t

ype

DIM

M s

lots

p

er c

han

nel

DIM

Ms

po

pu

late

d

per

ch

ann

el

Max

. mem

ory

sp

eed

(C

PU

-d

epen

den

t)

Ran

ks p

er

DIM

M *

2 / 2 1 800, 1066, 1333 SR / DR

RDIMM 2 / 2 1 800, 1066 QR

1.5 V 2 / 2 2 800, 1066, 1333 Mix of SR + DR

1333 MHz 2 / 2 2 800 Mix of QR + SR /DR

2 / 2 1 800, 1066, 1333 SR / DR

RDIMM 2 / 2 1 800, 1066 QR**

LV /1.35 V 2 / 2 2 800, 1066 Mix of SR + DR

1333 MHz 2 / 2 2 800 Mix of QR** + SR /DR

UDIMM 1.5 V 2 / 2 1 800, 1066, 1333 SR / DR

1333 MHz 2 / 2 2 800, 1066, 1333 Mix of SR + DR

UDIMM LV / 1.35 V 2 / 2 1 800, 1066, 1333 SR / DR

1333 MHz 2 / 2 2 800, 1066 Mix of SR + DR

* SR = single rank, DR = dual rank, QR = quad rank

** No memory modules released for this configuration

*** Lost LV-mode memory will automatically switch to 1,5 V Vcc


Screen resolution

3.3 Screen resolution

Depending on the operating system used the screen resolutions in the following table refer to the graphic controller on the system board. The graphic controller is integrated in the iRMC (integrated Remote Management Controller).

3.4 Temperature/system monitoring

Temperature and system monitoring aim to reliably protect the computer hardware against damage caused by overheating. In addition, any unnecessary noise is also prevented by reducing the fan speed, and information is provided about the system status.

The temperature and system monitoring are controlled by the iRMC S2 (integrated Remote Management Controller).

The following functions are supported:

Temperature monitoring

Measurement of the processor and the system internal temperature by an onboard temperature sensor, measurement of the ambient temperature by a I2C temperature sensor.

Fan control

The fans are regulated according to temperature.

Sensor monitoring

The removal of, or a fault in, a temperature sensor is detected. Should this happen all fans monitored by this sensor run at maximum speed, to achieve the greatest possible protection of the hardware.

Screen resolution Max. color depth Max. frequency

1280 x 1024 Hz 24 Bit 60 Hz

1600 x 1200 Hz 16 Bit 60 Hz


Temperature/system monitoring

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Power monitoring

When voltage exceeds warning level high or falls below warning level low an alert will be generated.

System Event Log (SEL)

All monitored events of the system board are signalized via the Global Error LED and recorded in the System Event Log. The events could be retrieved in the BIOS Setup, in the Management Blade Web interface, via the iRMC S2's Web interface or via ServerView Operations Manager.

Diagnostic LEDs

For signalisation of failures LEDs are situated on the system board.


LED indicators

3.5 LED indicators

3.5.1 Internal indicators

There are several diagnostic LEDs on the system board, which are not visible when the housing is closed.

By pressing the CSS button (INDICATE CSS BUTTON, see item 5 in the following figure), the defective component can also be displayed in the power-off state (power plug disconnected).

Figure 7: LEDs

LED Indicator Meaning

1 Mezzanine card 1 yellow Error on Mezzanine card 1

2 DIMMs 1D - 1F yellow Faulty memory module

3 CPU 1 yellow CPU faulty

4 DIMMs 1A - 1C, 2A - 2C yellow Faulty memory module

5 CSS button none Activates the LEDs in case of an error

6 CPU 2 yellow CPU faulty

7 Mezzanine card 2 yellow Error on Mezzanine card 2

CPU 1

CPU 2

1 2 3

4567


LED indicators

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3.5.2 External indicators

Figure 8: External ports of the system board D3030

Pos. Name LED lighting

Pos. Name LED lighting

1 Power onPower off

greenorange

5 Connection LED Fabric 1

green

2 Identification LED blue 6 Connection LED Fabric 2

green

3 Global Error LED orange 7 Connection LED Fabric 3 and 4

green

4 CSS LED yellow

1 2 3 4 5 6 7


Interfaces, connectors and DIP switch

3.6 Interfaces, connectors and DIP switch

Figure 9: Schematic view of the system board D3030

External connectors

Figure 10: External ports of the system board D3030

1 Slot 1 for Mezzanine card 1 7 Memory slots1A - 1C, 2A - 2C

2 Memory slots 1D - 1F 8 Slot 2 for Mezzanine card 2

3 DIP switch 9 Mezzanine card 2

4 Slot for hard disk 1 10 Mezzanine card 1

5 Slot for hard disk 2 11 TPM

6 UFM 12 Battery

1 4-way connector USB, VGA, serial (Y cable)

CPU 1

CPU 2

HDD 2

HDD 1

Mezzanine Card 1

Mezzanine Card 2

1 2 3

4

5

6

8 7

9

10

11

12

1


Settings with switches and jumpers

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3.7 Settings with switches and jumpers

DIP switch

Figure 11: DIP switch

I Default setting switch 1 to 4 = Off.

Switch 1 - NVRAM Clear

Switch 1 specifies whether the BIOS default settings are to be loaded or not.

Switch 2 - Clear Password

Switch 2 specifies whether the BIOS password should be requested at system boot if password protection is activated in the BIOS setup (the Password on boot field is set to enabled in the SECURITY menu).

on The BIOS default settings are loaded; the user-defined settings are deleted.

off The user-defined settings are retained (default setting).

on The password prompt is skipped. The user-defined BIOS passwords are deleted.

off The password prompt is active (default setting).

ON

1 2 3 4



Switch 3 - BIOS Recovery

Switch 3 allows the system BIOS to be restored after an erroneous update. To restore the system BIOS you need a "BIOS flashing medium" (for more information, refer to the BIOS manual or contact the customer service team).

Switch 4 - No function

This switch currently has no function.

on The system starts from the "BIOS flashing medium" (ODD, USB stick) and reprograms the system BIOS on the board.

off The system starts with the system BIOS of the system board (default setting).



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4 Replacing the lithium batteryIn order to save the system information permanently, a lithium battery is installed to provide the CMOS-memory with a current. When the charge is too low or the battery is empty, a corresponding error message is provided. The lithium battery must then be replaced.

V CAUTION!

The lithium battery must be replaced with an identical battery or a battery type recommended by the manufacturer (CR2450).

Do not throw lithium batteries into the trash can. Batteries must be disposed of in accordance with local regulations concerning special waste.

Make sure that you insert the battery the right way round. The plus pole must be on the top!

Figure 12: Replacing the lithium battery

Ê Press the locking spring into direction of the arrow (1), so that the lithium battery jumps out of its socket.

Ê Remove the battery (2).

Ê Insert a new lithium battery of the same type into the socket (3) and (4).

1

2

3

4

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