Linecard SUPPLIER & TECHNOLOGY PORTFOLIO

3

Portfolio Avnet ASIC Solutions

2 AVS-004-E_Linecard | August 2020 avnet-silica.com

Avnet ASIC Solutions is your one-stop-shop for ASIC Design Services and Turnkey manufacturing services, operating for over 30 years with 350 successful completed projects. We can step in with a very skilled design team and offer you flexible business models.

We offer a complete range of ASIC services, from specification to mass production, with robust design practices and smooth ramp path to mass production.

Avnet ASIC Solutions has strong established relationships with the main foundries like Samsung, TSMC, Global Foundry, ST, Xfab and SocioNext. We choose the technology that is most suited for a particular application and your specific needs and we take charge to enable you to work with a single point of contact only: Avnet ASIC Solutions. Our proven technology nodes expertise get down to advanced EUV 7nm for Digital, Analog or Mix Signal designs.

The ASIC focus application areas are: Automotive, Industrial, Artificial Intelligent, Consumer, Internet of Things, Bio- Medical, Communication, Crypto Currency and many more.

END OF LIFE SOLUTIONS:

The current and upcoming market changes bring more and more mature technology to an End of Life Status. The needed re-designs can often not be implemented in time with all re-design and re-qualification needs.

Avnet ASIC Solutions offers you to develop pin compatible solutions which avoid system re-design and re-qualification. Our replacement capabilities are Analog, Digital, Mix Signal as well as old ASIC (standard cell and gate array) and FPGAs with the capability to offer 5V and 5V/3.3V core voltage.

Visit avnet-asic.com for more information or contact us at asic-solutions@avnet.eu.

OUR SERVICE FOR YOU:

• Logic Design • Verification • Emulation • Synthesis • Backend (Chip Layout) • Design for Test • Physical Verifications • Package Development • Production Test Program • Production Test H/W Development • Mass Production Logistics Management

4 5

ARM®

Arm

9

ARM

Cor

tex

A5

ARM

Cor

tex

A7

ARM

Cor

tex

A8

ARM

Cor

tex

A9

ARM

Cor

tex

A15

ARM

Cor

tex

A35

ARM

Cor

tex

A53

ARM

Cor

tex

A57

ARM

Cor

tex

A72

ARM

v7-A

Com

patib

le

ARM

Cor

tex

R4

ARM

Cor

tex

R5

Arm

Cor

tex

M0

Arm

Cor

tex

M0+

Arm

Cor

tex-

M23

ARM

Cor

tex

M3

Arm

Cor

tex-

M33

ARM

Cor

tex

M4

Arm

Cor

tex

M7

Digi • • • •Infineon • •Marvell • • • •

Maxim Integrated • • •Microchip • • • • •

Nordic • • •NXP • • • • • • • • • • • • • • •

Renesas Electronics • • • • • • • • • • • •STMicroelectronics • • • • • • •

Teledyne e2v • •Texas Instruments • • • • • • •

Xilinx • • • •

MCUs I MPUS

MC

U

MC

U W

irele

ss

MPU

x86

AMD • •Digi • • •

Echelon / Adesto • •Infineon • •

Intel • •ISSI •

Marvell • •Maxim Integrated •

Microchip • • •Nordic • •

NXP • • •ON Semiconductor • •

Renesas Electronics • • •Rohm •

STMicroelectronics • • •Teledyne e2v • • •

Xilinx •

OTHER

8 Bi

ts C

ore

16 B

its C

ore

32 B

its C

ore

RISC

-V

Echelon / Adesto proprietary

Infineon 8051 C166 Tricore

ISSI 8051

Maxim Integrated 8051 MAXQ MAXQ

Microchip AVR , PIC AVR, MIPS •

NXPHC08,

HCS08, LPC9x, 8051

ColdFire, ColdFire+, Power Architecture •

ON Semiconductor LC87, 8051

Renesas Electronics RL78 "RX100/200/600/700 V850, RH850"

Rohm 8051

STMicroelectronics STM8

Teledyne e2v ColdFire, ColdFire+, Power Architecture

Texas Instruments MSP430

Xilinx MicroBlaze, ARC, FPGA Soft Core

MCUs | MPUs

6 7

Switc

h &

Mux

Op

Amps

&

Com

para

tors

Cur

rent

Sen

se A

mps

Digi

tal P

ots

ADC

s &

DAC

s

Anal

og S

igna

l C

ondi

tione

rs

Ener

gy M

easu

rem

ent

AFE

Audi

o/Vi

deo

Proc

essin

g

Prog

ram

mab

le

Mix

ed S

igna

l

Volta

ge R

efer

ence

s

Cirrus Logic • • • • •Dialog Semiconductor • •

Diodes • • • • • •Elmos •

Maxim Integrated • • • • • • • • • •Microchip • • • • • • • •

Monolithic Power Systems • • • • •Nexperia •

NXP • • •ON Semicondutor • • • • • • •

Renesas Electronics • • • • • • • • •ROHM Semiconductor • • • • •

Semtech • • •STMicroelectronics • • • • • • • •

Teledyne e2v •

Analog Sensors

EnvironmentMotion

HMI & OthersAxis Sensors Speed/Position

Tem

pera

ture

Ligh

t/Pr

oxim

ity

Pres

sure

Hum

idity

Gas

/Sm

oke

Ultr

ason

ic

Mas

s Fl

ow

ToF

Rang

ing

Rada

r

Audi

o (M

ic.)

Acce

lero

met

er

Gyr

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pe

Com

pass

Hal

l

Mag

netic

Opt

ical

Indu

ctiv

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Enco

der

Cur

rent

Touc

h Se

nse

IF

Imag

e

PIR

Con

trol

lers

3D S

ensin

g

Bios

ensin

g

Allegro • • • •Cirrus Logic •

Coilcraft •Dialog Semiconductor •

Diodes • • • • •*Elmos • • • •* •* • •*

Infineon • • • • • • •ISSI •

Maxim Integrated • • • •* •* • •Microchip • •* •* •* • •* • •

Monolithic Power Systems • •NXP • • • • • • •

ON Semicondutor • • • • • •*Renesas Electronics • • • • • • • • •

ROHM Semiconductor • • • • • • • • •*Semtech •

Sharp • • • •STMicroelectronics • • • • •* • • • • • • • •

TD next •Torex • •

*: signal conditioning only

8 9

DRAM NAND NOR MCP SRAM EEPROM

NVRA

M

Raw NAND Managed NAND Flash

Solid State Storage

EDO

& F

ast P

age

Mod

eSD

RAM

DDR

DDR2

DDR3

DDR4

GDD

R5RL

DRAM

Mem

ory

LPDR

AMDR

AM M

odul

es3D

NAN

DTL

C N

AND

MLC

NAN

DSL

C N

AND

Seri

al N

AND

Embe

dded

USB

Embe

dded

Mul

timed

ia C

ard

SD +

uSD

Car

dsC

F C

ards

PCM

CIA

USB

Flas

h Dr

ive

2.5"

mSA

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M.2

BGA

Para

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OR

Flas

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rial

NO

R Fl

ash

Oct

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OR

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Base

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CP

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D-Ba

sed

MC

PAs

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RAM

Sync

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SRAM

Sync

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DDR

SRAM

Sync

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QDR

SRA

MSy

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SRAM

Low

Pow

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Seri

al n

vSRA

M

Para

llel E

EPRO

Mv

Seri

al E

EPRO

M

MRA

M

Alliance • • • • • • • • • •Delkin Devices • • • • • • • • • •

Greenliant • • • • • • •GSI Technology • • • • •

Intel • • • •ISSI • • • • • • • • • • • • • • • • • • •

Macronix • • • • • • • •Mercury Systems • • • • • • • • • • • • •

Microchip • • • • • •Micron • • • • • • • • • • • • • • • • • • • • • • • • • •

On Semiconductor • • •Renesas Electronics • • • • • • •

ROHM • •SK Hynix • • • • • • • • • • • •

Smart Modular Technologies • • • • • • • • • • • •ST • •

Teledyne e2v • • • • • • • • • • • • • • • • • • • • •Western Digital • • • • • • • • •

Power

Hig

h Po

wer

WBG

(SiC

, GaN

)

Bipo

lar T

rans

isto

rs (>

1W)

MO

SFET

s

IGBT

s

MO

SFET

Mod

ules

IGBT

Mod

ules

IPM

Mod

ules

Diod

es

ESD

Prot

ectio

n &

TVS

Dev

ices

Thyr

isto

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Thyr

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r/ D

iode

Mod

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AC/D

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Pow

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acto

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Line

ar &

LD

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egul

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s

DC

/DC

Con

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lers

DC

/DC

Con

vert

ers

PMIC

DC

/DC

Mod

ules

Volta

ge R

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ence

s

Gat

e Dr

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LED

Driv

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& C

ontr

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Spec

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Fun

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ns

Load

Sw

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Pow

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ver E

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USB

Digi

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Batt

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Man

agem

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Mot

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Con

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RF P

ower

Wire

less

Cha

rgin

g

Pow

er M

agne

tics

EMI/

RFI/

LC F

ilter

s

Coilcraft x x x x x x x x x x x x x x • •Dialog Semiconductor • • • • • • • • •

Diodes • • • • • • • • • • • • • • • • • • •Elmos • • • • •

Infineon • • • • • • • • • • • • • • • • • • • • • • • • • •ISSI •

Maxim Integrated • • • • • • • • • • • • • • • • •Microchip • • • • • • • • • • • • • • • • • • • • • • •

Monolithic Power Systems • • • • • • • • • • • • • • • •Nexperia • • • • • •

NXP • • • • • • • • • • • • • • • • • • •On Semiconductor • • • • • • • • • • • • • • • • • • • • • • • •

Qorvo • • • •Renesas Electronics • • • • • • • • • • • • • • • • • • • • • •

ROHM Semiconductor • • • • • • • • • • • • • • • • • • • • • • •Semtech • • • • • • • • • • • • • •

STMicroelectronics • • • • • • • • • • • • • • • • • • • • • • • • • • • •Torex • • • • • • • • • • • • •WeEn • • • •

x: associated components

Memory

10 11

Wireless

C = Chip; M = ModulesG = LoRaWAN Gateway

S = LoRaWAN sensorFEM = Front End Module

* = Automotive market

NFC

/RFI

D

Sub

1GH

Z

Zigb

ee

Thre

ad

Prop

riet

ary

2.4

GH

Z

Blue

toot

h

WIF

I

Cellular

DEC

T

Loca

tion

Sigf

ox

Lora

2G, 3

G, 4

G

LTE

cat.

M1

LTE

cat.

NB1

5G

Azurewave M M

Dialog CM CM M

Digi International M M M M M

Laird M M M M M

Marvell C C

Microchip CM CM CM CM CM

MiroMico MGS

Nordic C C C C M M

NXP C C CM C CM CM C

ON Semiconductor C CM CM C CM C CM

Qorvo* C C C C FEM FEM FEM FEM FEM

Quectel M M M M M M M

Raytac M

Renesas CM

Semtech C C C

STMicroelectronics C CM C C CM M C C

TD-Next M

Datacom

10/1

00 E

ther

net

1G E

ther

net

2.5G

Eth

erne

t

10G

Eth

erne

t

25G

Eth

erne

t

40/5

0G

100G

Eth

erne

t

Opt

ics

Tim

ing

Sign

al In

tegr

ity

SAS

SATA

Indu

stri

al E

ther

net

PCIe

Oth

ers

Diodes • • •Finisar •

Halo •Infineon • • • •

Intel • • • • • • • • • • • • •Marvell • • • • • • • • • • •

Maxim Integrated • •Microchip • • • • • • • • • • • • •Nexperia • •

NXP • • • • • • • • • • •ON Semiconductor • • •

Renesas Electronics • • • • •STMicroelectronics • •

12 13

Programmable & System-on-Chip (SoC)

Security

Tech

nolo

gy (F

lash

/SRA

M)

Low

Pow

er C

apab

ilitie

s

Low

-den

sity

FPG

A (fr

om 0

to 15

0k L

C)

Mid

-Den

sity

FPG

A (fr

om 0

to 5

00k

LC)

Hi-

Den

sity

FPG

A (fr

om 0

to 2

M L

C)

Ultr

a-hi

gh d

ensi

ty F

PGA

(from

0 to

5.5

M L

C)

Def

ense

-Gra

de F

PGA

Spac

e-G

rade

FPG

A

Auto

mot

ive-

Gra

de F

PGA

DSP

Mul

ti G

b/s

Seri

al I/

O

10M

/100

M/1

G E

ther

net

100G

Eth

erne

t

Inte

rlak

en

PCIe

ARM

Cor

tex

A9 p

roce

ssor

(up

to)

ARM

Cor

tex

A53

proc

esso

r (up

to)

ARM

Cor

tex

R5 c

ontr

olle

r (up

to)

ARM

Cor

tex

M3

cont

rolle

r (up

to)

RISC

-V

GPU

H26

4/H

265

Vide

o C

odec

14bi

t RF-

DAC

w/u

p to

10G

SPS

DUC

14bi

t RF-

ADC

w/u

p to

5G

SPS

DDC

RF in

put M

ax F

req.

(GH

z)

SD-F

EC

Dec

imat

ion/

Inte

rpol

atio

n

Xilinx

Virtex-5 QV 65 • • • • soft

Spartan 6 45 • • • • • • soft Gen1x1

Spartan 7 28 • • • • soft • •Artix 7 28 • • • • • • • soft Gen2x4 • •

Kintex 7 28 • • • • • • soft Gen2x8 • •Virtex 7 28 • • • • • soft Gen3x8 • •Kintex

Ultrascale 20 • • • • • soft • 150G Gen3x8 • •Virtex

Ultrascale 20 • • • • • soft • 150G Gen3x8 • •Kintex

Ultrascale + 16 • • • • • soft • 150G Gen3x16/Gen4x8 • •

Virtex Ultrascale + 16 • • • • • soft • 150G Gen3x16/

Gen4x8 • •Zynq 7000/S 28 • • • • • • • • Gen2x4/

Gen2x8 2x soft soft

Zynq Ultrascale + 16 • • • • • • • • • • 150G

Gen2x4/ Gen 3x16 / Gen4x8

4x 2x soft soft Mali 400MP2 •

RFSoC 16 • • • • • • 150G Gen2x4/ Gen 3x16 / Gen4x8

4x 2x soft softup to 16

up to 16

up to 6GHz

up to 8

up to

40x

Microchip

ProASIC3 130 • • • •IGLOO 130 • •

SmartFusion 2 65 • • • • • •(hard MAC) / 10G

Gen2x4 (EP) 1x

IGLOO2 65 • • • • • • •(soft IP) / 10G

Gen2x4 (EP) soft

PolarFire FPGA 28 • • • •(soft IP) / 10G

6.375G, 12.7G

Gen2x2 (RC/EP) soft

SX-A Antifuse 0.22µ • • •

Axcelerator Antifuse 0.15µ • • •

Use Cases

Secu

re B

oot M

CU

Secure Element ( SE)

Tran

spor

t Lay

er S

ecur

ity (T

LS)

Dat

agra

m T

rans

port

Lay

er S

ecur

ity (D

TLS)

Phys

ical

Unc

lone

able

Fun

ctio

n PU

F)

Cer

tifica

tion

Avai

labl

e

Key

Prov

isio

ning

by

Avne

t Sili

ca

Low

Pow

er

FPGA / SoC Anti-Tamper

With Operating System (OS) Without Operating System (OS) Passive Active

Bran

d Pr

otec

tion

Usag

e C

ontr

olSe

cure

FW

Upd

ate

Loca

l Net

wor

k (In

tran

et)

Exte

rnal

Net

wor

k (In

tern

et)

Java

Car

d O

STP

M O

SPr

opri

etar

y O

SSi

ngle

Aut

hent

icat

ion

Mut

ual A

uthe

ntic

atio

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mm

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c En

cryp

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Asym

met

ric

Encr

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CRS

APu

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Key

Infr

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re (P

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Rem

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Prov

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Sing

le A

uthe

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utua

l Aut

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icat

ion

Sym

met

ric

Encr

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n As

ymm

etri

c En

cryp

tion

ECC

RSA

AES2

56 (B

BRAM

& e

FUSE

), Se

cure

Con

fig/

Bo

ot (P

L /

PS),

Har

dene

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ck D

isab

le,

Dec

rypt

then

Aut

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icat

e

SEU

Che

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g, J

TAG

Dis

able

/Mon

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BSC

AN),

Inte

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Key

Cle

ar, I

nter

nal C

onfig

Mem

Cle

ar,

Uniq

ue Id

entifi

er D

evic

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NA)

, On-

chip

Tem

p/Vo

lt M

onito

ring,

PRO

G_B

Inte

rcep

t, U

niqu

e Id

entifi

er (U

ser e

FUSE

)

Digi International • • • • • • • • • • • • • • • •Infineon • • • • • • • • • • • • • • • • • • • •

Intel • • • • • • • • • • • • • • • • • • • • • • • • •Marvell • • • • • • • • • • • • • • • • •

Maxim Integrated • • • • • • • • • • • • • • •Microchip • • • • • • • • • • • • • • • • • • • •

NXP • • • • • • • • • • • • • • • • • • • • • • • • • • •Renesas Electronics • • • • • • • • • • • • • • • • • • • • •STMicroelectronics • • • • • • • • • • • • • • • • • • • •

Trusted Objects • • • • • • • • • • • • • • • • • • •Xilinx (FPGA / SoC) • • • •

14 15

LEDs Low Power Mid Power High Power COBs Modules Light Engines Display/signage

CREE • • • • •Lumileds • • • • • •

Seoul Semiconductor • • • • • •

Lighting

Bender+Wirth •LEDIL •

HOLDERS

Mid Power High Power COBs High Voltage

0,3 - 0,9 W 1 - 4 W 4 - 10 W

Mechatronix • • • •

THERMALMANAGEMENT

Low Power Mid Power High Power COBs Modules

Gaggione • • • • •LEDiL • • • • • •

OPTICS

Diodes Elmos Infineon

ISSI Maxim Integrated NXP

ON Semiconductor STMicroelectronics

LED DRIVERS

LEDs Optics

COB Holders Power Thermal Management

LED Drivers

POWER Power Topology Indoor Outdoor Dimming Options Programmable Wireless

Delta Electronics 15-1500 W CV, CC, CP • • AC, 0-10V, R, PWM, DALI Current, Clock, Constant Light •

Lifud 1-250 W CV, CC, CP • • AC, 0-10V, R, PWM, DALI Current, Clock,Constant Light

Moons 12 - 320 W CV, CC, CP • • AC, 0-10V, R, PWM, DALI, DMX/RDM

Current, Clock, Constant Light •

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SLOVENIA (BOSNIA AND HERZEGOVINA, CROATIA, MACEDONIA, MONTENEGRO, SERBIA)Ljubljana Phone: +386 156 097 50 Fax: +386 156 098 78 ljubljana@avnet.eu

SPAIN Barcelona Phone: +34 933 278 530 Fax: +34 934 250 544 barcelona@avnet.eu

Galdàcano. Vizcaya Phone: +34 944 572 777 Fax: +34 944 568 855 bilbao@avnet.eu

Las Matas Phone: +34 913 727 100 Fax: +34 916 369 788 madrid@avnet.eu

SWEDENSundbyberg Phone: +46 8 587 461 00 Fax: +46 8 587 461 01 stockholm@avnet.eu

SWITZERLANDRothrist Phone: +41 62 919 555 5 Fax: +41 62 919 550 0 rothrist@avnet.eu TURKEY (GREECE, EGYPT)Kadikoy Istanbul Phone: +90 216 528 834 0 Fax: +90 216 528 834 4 istanbul@avnet.eu

UNITED KINGDOM (IRELAND)Berkshire Phone: +44 1628 512 900 Fax: +44 1628 512 999 maidenhead@avnet.eu

Bolton Phone: +44 1204 547 170 Fax: +44 1204 547 171 bolton@avnet.eu

Bucks, Aylesbury Phone: +44 1296 678 920 Fax: +44 1296 678 939 aylesbury@avnet.eu

Stevenage, Herts, Meadway Phone: +44 1438 788 310 Fax: +44 1438 788 250 stevenage@avnet.eu

ISRAELTel-MondPhone: +972 (0)9 7780280Fax: +972 (0)3 760 1115avnet.israel@avnet.com

SOUTH AFRICACape Town Phone: +27 (0)21 689 4141 Fax: +27 (0)21 686 4709sales@avnet.co.za

DurbanPhone: +27 (0)31 266 8104 sales@avnet.co.za

JohannesburgPhone: +27 (0)11 319 8600 Fax: +27 (0)11 319 8650sales@avnet.co.za

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