solid-state lidar tofimage sensor
TRANSCRIPT
Solid-State LiDAR ToF Image Sensor
Nanjing visionICs microelectronic technology Co.,Ltd
Scope
§Address cost, reliability and high-volume production issues inthe existing 3D-Camera and LiDAR Systems
– Leading ToF IC solution provider– Low cost, low-power and high-performance LiDAR receiver SoC– Leading solutions for the chip level optical detection and processing
§Our offerings– ToF receiver sensor & laser driver
– Solid-state LiDAR module
– Single photon detector (400-940nm, 1100-1550nm)
§Oct 2016 founded,Headquarter locates at Jiangbei, Nanjing§ Pre-A: ¥50M, closed at Jun 2018, post-valuation: ¥210M
2visionICs Confidential
ToF for Mobile
• ToF for face ID, challenges?• Depth resolution down to 1mm• Pixel Resolution: 480x320• Against strong sunlight
interference
• Back ToF camera• Sub-cm depth resolution• 10m range• VGA resolution @30fps• Against strong sunlight interference
• Huaiwei P30 Pro and Vivo NEX2 at 2019• Use cases for Mobile, waiting for market proven!
• Augment gaming?
Structured Light approach has been chosen as a starting point for the 3D by Apple. The front 3D module could evolve toward ToF technology in the future.
Low cost, more reliability in direct sunlight and lower computation
Potentiality ofAugmented Reality Complicated
Sensor Design!!!
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Existing ToF application at Mobile (SPAD ToF )
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Major suppliers:ST Microelectronics,Till July 2017,300M shipments, used over 80 different smartphonesof 15 different brands
Brands:AppleHuaweiLGSonyLenovoASUS
HTCOne PlusMEIZUOPPO
[AMS]
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3D Imaging
Triangular Structured Light Time-of-Flight (ToF) FMCW
Direct ToFIndirect ToF
Light Source
APD SPADPIN
CMOS\CCD
APD
PassiveStereos Camera
3D Techniques [AMS]
Direct ToFIndirect ToF
Time-of-Flight
Direct ToF Indirect ToF
Laser Modulation Narrow pulse Continuous or wide pulseMeasurement Round trip time Phase shiftCircuits blocks PIN/APD/SPAD+TDC+MCU PIN/APD/CMOS+TAC+ADC+MCU
Cost Similar SimilarDetection Range Longer @ same optical power Shorter @ same optical power
Multi. Obj. Det. Yes NoDepth Resolution <1cm <1cm
Power Low High
ToF advantagesn Compact constructionn Ease of usen Long detection range
n Accuracy of <1cmn High frame raten Low computation
complexityn work outdoor
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Sensing Area
visionICs ToF Ranging/Imaging SoCs and Modules
ToF Ranging Sensor(S4):2mm×1.8mmSensing Area :264μm × 264μm ,18 × TDCCMOS 130nm
ToF Imaging Sensor (A4):6.3mm×5.5mmPixel Size : 64×32 (Macro) /256×64(Micro)180mW power @ CMOS 130nm
ToF Ranging Sensor(S3):1.5mm×1.3mmSensing Area:80μm× 40μm, 1 × TDCCMOS 180nm
ToF Imaging Sensor (A3):4.8mm×3.4mmMarco Pixel Size:32×32/64×32100mW power @ CMOS 180nm
3rd Generation 4th Generation
3.5×3.3×2 cm3
ToF Ranging Prototype
ToF Imaging Prototype
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Ranging
Imaging
Single Photon Sensing Area
Single Photon Sensing Array Single Photon
Sensing Array
Single Photon Sensing Area
VI4300
VI4302VI3801
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Vacuum Robots:1.Avoidance2.SLAM
Modules Typical Value(Ranging)Distance Measurement: 0.1m - 250mMeasurement Accuracy: <2m:±2cm, >2m:±1%Frame Rate: 1Hz - 5KHzAmbient Light: Up to 100KLuxPower: 30mW
SoCs Typical Value(Ranging)Sensor Size: 2mm x 1.8mmSensing Area: 264um x 264um, 18 x TDC(50ps)CMOS 130nm
AGV:1.Avoidance2.SLAM
Mobile:Camera laser focus
UVA:1.Avoidance2.Altimeter
ADAS: 1.Avoidance2.SLAM
Applications: ToF Range SoCs and Modules
ST ships out over 100M pcs a year
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Modules Typical Value(3D Imaging)Distance Measurement: 0.1m ~ 30mMeasurement Accuracy: <1%@40% ReflectivityFOV: 120° x 60°Frame Rate: Up to 30-FPSAmbient Light: Up to 100KLuxPower: < 200mW
SoCs Typical Value(3D Imaging)Sensor Size: 6.3mm×5.5mmPixel Size: 64×32 (Macro) /256×64(Micro)CMOS 130nm
AGV、Robots:1.SLAM replacing rotation method2.Avoidance
Mobile:1.ToF Camera2.Face ID
ADAS: 1.Gesture recognition2.L3 / L43.Avoidance & SLAM
Others
Applications: ToF Imaging SoCs and Modules
Company Overview
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• Santa Clara Site, CA, USA– 2,000 sqft office
– 5 employees
– Leading technology R & D
– Developing ToF sensor IC for LiDAR system
• Nanjing, Jiangbei New Area, China– 18,000 sqft office
– 46 employees, 2019
– LiDAR IC & system design
– Optical system collaborated with the leading
optics manufacturer at China
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Founder & CEO
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Cheng Li (BS: Southeast University;Ph.D:Texas A&M University)
• Former Principal Scientist, HP Labs, Palo Alto, US: led and participated several USgovernment research projects, accumulated funding of $60M;
• Research topics include: high-speed CMOS SerDes, LiDAR, high-speed & low-power siliconphotonics design and manufacturing;
• Former Senior Scientist, NEC Lab, Princeton, New Jersey: worked on NEC’s long-hauloptical communication projects
• Alcatel-Lucent Shanghai, 3 years of R&D + 3 years of marketing ;• 20+ USA/International patents, 100+ acdamic papers, 1 published book, 800+ citations;• 3 ISSCC and 4 JSSC publications (Top IC design conference and Journal worldwide), 1 TCAD
publication on computer architecture;• 2015-2016: Committee of AIM Photonics (American Institute for Manufacturing, Integrated
Photonic);• Committee of IEEE International Conferences (BCTM, CSICS, MWSCAS);• Invited lecture EE382C (High-speed interconnects section) at Stanford University,2016.
Nanjing visionICs microelectronic technology Co.,Ltd