solder ball attach wb-300 - wagenbrett · isit fraunhofer institut siliziumtechnologie device...
TRANSCRIPT
![Page 1: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/1.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Device qualification at ISITDevice qualification at ISIT
Solder Ball Attach WB-300
![Page 2: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/2.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Device qualification at ISITDevice qualification at ISIT
Solder Ball Attach WB-300
![Page 3: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/3.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
• unlimited umber of balls
• standard SMD stencil tooling
• throughput ca. 20 substrates / h
• ball diameter : 760 – 250 µm
• series production
Vakuum Feeding Gravity Feeding
• number of balls limited
• tooling expensive, long supplytime
• throughput ca. 4 substrates / h
• ball diameter : 760 – 300 µm
• prototyping
PlacementAlignment
![Page 4: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/4.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300• application of solder spheres300 µm - 760 µm Ø
• wafer 4“- 300 mm, PCB
• qualified for WLP-CSPproduction at Fraunhofer ISIT
• 52.000 solder balls per 6“-wafer,500 µm Pitch, 300 µm Ø
• throughput: typ. 21 wafer/h
• Yield: 99,994 %
![Page 5: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/5.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300• ball attach after UBM and grinding
• ball fixation with stencil printed tacky flux
• positioned balls are tolerant to waferhandling
• rework is possible after flux print and ball attach
![Page 6: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/6.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300• “Gravity Feeding“ works with excessive
ball numbers
• multiple balling runs with the same ballsis uncritical
• 3 point adjust is very effective for fastsubstrate exchange
• surplus balls run off the stencil by tilting
• stencil cleaning is usually not requiredduring the processing!
![Page 7: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/7.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300
monitor
X,Y, Θ adjust
cameras
stencil
machine control
cross hairs generator (optional)
![Page 8: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/8.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
semi automatic machine conceptsemi automatic machine concept
• simplified process control concept for ease of operation
• robust substrate vacuum fixation
• controlled roll off of surplus solder balls without operatorintervention
![Page 9: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/9.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
substrate preadjustsubstrate preadjust
exchangable vacuum plate cavity for
vacuum tweezer
universal fixation of different substrate diameters up to 300 mm
preadjust with 3 points
customer specific vacuum plates on request
ESD-conform design
![Page 10: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/10.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
solder ball mangementsolder ball mangement
Surplus balls are removed by stencil tilting!
stencil
wafer flux deposit
solder ball
distance
![Page 11: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/11.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
solder ball mangementsolder ball mangement
• ESD-conform ball container forsurplus balls
• very low risk of ball defects
• reduced number of manualhandling
• solder ball management workswith SAC lead free alloys, tested with 300 µm Ø, 500 µm Ø
![Page 12: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/12.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
machine setupmachine setup
• easy machine setupwith precision heightadjust gauge
• available as option
![Page 13: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/13.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Experience in balling througput Experience in balling througput WBWB--300 solder ball attach tool300 solder ball attach tool
processing time for ball attach < 3 minutes/wafernew tooling setup < 10 minutesnumber of missing balls in mean: 2 balls per 52000 balls placed, equals 99,994 % yieldquality is nearly independet of operatorlow demand on operator qualificationattached balls can be reworked if necessary
![Page 14: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/14.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
statistics of missing balls for statistics of missing balls for ball attach with WBball attach with WB--300300
0
1
2
3
4
5
6
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
W21
W22
W23
W24
Wafer Nummer
Number of missing balls after reflow
Example of 2 lots á 24 wafers
52000 solder balls per wafer,
6“, 300 µm Ø, pitch 500 µm
Yield
100 %
99,998 %
99,996 %
99,994 %
99,992 %
99,990 %
![Page 15: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/15.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
solder ball attach on alternative solder ball attach on alternative substratessubstrates
FR4 substrate silicon die
![Page 16: Solder Ball Attach WB-300 - Wagenbrett · ISIT Fraunhofer Institut Siliziumtechnologie Device qualification at ISIT Solder Ball Attach WB-300](https://reader031.vdocuments.us/reader031/viewer/2022030909/5b568d597f8b9a3f7e8c8f2d/html5/thumbnails/16.jpg)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
application specific modifications application specific modifications WBWB--300300
machine options:ESD-blowercross hair generatorcustom design vacuum platereduction frameprecision height adjust gaugeapplication training at ISIT