sip module moldability project call for participation webinar may...
TRANSCRIPT
SiP Module Moldability Project
Call for Participation Webinar
May 13, 2016
Project Leaders:Billy Ahn - STATSChipPAC Anthony Yang, Core Tech System (Moldex3D)
iNEMI Staff: M. Tsuriya
Agenda
• Introduction of Project Chairs and Facilitators
• iNEMI Project Development Process
• Project Briefing–Background & Objectives
–Project Scope• Project IS/IS Not
• Preliminary Measurement Plan
– Timeline
• How to Join
• Q&A
Note: All phones will be on mute until the end of the presentation
Introduction of Project Chairs & Facilitators
3
Project Leader:Billy Ahn, STATS ChipPAC
Project Leader:Anthony Yang,
Core Tech System (Moldex3D)
iNEMI Staff:M. Tsuriya
INPUT
SELECTION
DEFINITION
PLANNING
EXECUTION / REVIEW
CLOSURE
1
2
3
4
5
iNEMI Project Development Process - 5 Steps
“ Project”
Limited to committed Members
“ Initiative”
Open for Industry input
0
------------------- iNEMI Technical Committee (TC) Approval Required for Execution
iNEMI Project Management Policy
• Two governing documents for projects
– SOW (statement of work): sets out project scope,
background, purpose, benefits, and outlines required
resources, materials, processes, project schedule,
etc.
– Project Statement (PS): signed by participating
companies to secure commitment on resource and
time contributions.
• iNEMI Project requires iNEMI membership
– Signed membership agreement
– Commitment to follow iNEMI By-laws and IP policy
5
Project Briefing
Problem Statements
SIPs turn to be complex
Increased number of components in a given space
Narrower gap between die-to-passive or passive-to-
passive
Narrower clearance between Mold top to components
7
Complex
& Narrower design
Apple Watch(Source: chipworks)
Narrower component to component
33x33mm PKG, 36 components
Component to Component : Min. 500um
Problem Statements
Need to understand molding and its impact
To understand the filling characteristics per density of
components on a substrate
To understand failure modes(Incomplete fill, Voids, Solder
bridge, etc.)
To understand the relationship between warpage and
components density
8
Filling characterization with Moldex3D
VoidBump bridge
Bump bridge due to EMC void
Potential voids
Purpose
• Provide basic design rules based on mold flow simulation for a
variety of cases with component of different geometries.
• Verify the validity of the simulation results through experimental
work.
9
Scope 1
• This project will focus on comparing the mold flow ability for different
component geometries in substrate by simulation and actual experiment.
The mold flowability will be compared as outlined below:
– 3 different component densities.
– 3 different gaps between mold top and the highest components top.
– 3 different clearances between passive-to-passive and IC-to-passive in mold flow simulation
and actual experiment.
– 2 different unit arrays of vertical and horizontal unit array to compare the mold flow and
voiding performance.
– 4 different EMC types.
– 2 different substrate thicknesses to compare the warpage performance by component density.
10
Scope 2
• The simulation will be performed with several factors of substrate layout,
mold compound resins and molding condition.
– Component density difference: The density of components will be approximately 42%, 49%
and 65% coverage in 9x15mm PKG size.
– Mold clearance between mold top and the highest passive top: Clearance is from 10um to
37um.
– Clearance of passive-to-passive or passive-to-IC: clearance is from 75um to 125um distance.
– The various geometries will provide guidelines for mold flow with SiP products and give
indications on how to optimize the component layout and the gap and distance between
components without any failure issues.
• The experiment will be performed per below DoE plan.
– Experiment results will be compared with the simulation results, which associates with flow
ability and void level.
– It will be evaluated by visual inspection, scanning acoustic microscopy, X-ray inspection, and
scanning electron microscopy to compare with simulation result.
– Furthermore, the warpage of the test vehicle will be measured to study the impact of the
component density on warpage.
11
Is/Is Not Analysis
12
SiP Module Moldability Study Project
This Project IS: This Project IS NOT:
To conduct the mold flow simulation,
examining several key factorsTo conduct a solder joint reliability study
To conduct molding experiments on test
vehicles based on the output from the
simulation results
To evaluate the substrate materials for
moldability study
To evaluate the moldability through the
inspection of void and incomplete filling
of resin
To evaluate the surface finish of substrate
for the moldability study
To evaluate the warpage performance by
component density and substrate stack-upTo develop a specific standard(s)
Biased towards specific suppliers,
geographies, or market segments
Work PlanMoldability Simulation Study 1
• Task 1 – BOM Selection
• Task 2 – DoE Planning
Proposed substrate design
o Component density and keep-out design (gap between components)
o Unit array (vertical and horizontal unit array)
o 2 layer and 4 layer substrate
Proposed passive design
Design the experiment on the following:
o Component density - 3 design
o Mold clearance between highest components - 3 design
o Component keep-out design study - 3 design
o Unit array study (vertical and horizontal unit array of flow direction)
o EMC type - 4 candidate
13
Work PlanMoldability Simulation Study 2
• Task 3 – Mold Compound Characterization
Perform mold compound property analysis and characterization for
mold filling simulation.
o Viscosity and reaction kinetic and thermal properties are required to
measure by special test instruments
• Task 4 – Mold Filling Simulation
Mold filling simulations are performed by participants who can use CFD
software.
Based on DoE planning, simulation will be implemented
14
Work PlanMoldability Experiment
• Task 5 – Experiment Design
Determine the DoE with simulation results.
• Task 6 – Manufacturing and Assembly
Mold compound formulation
Substrate fabrication for selected design options
SiP Assembly
• Task 8 – Inspection and Measurement
Visual inspection, scanning acoustic microscopy, X-ray inspection.
Dynamic thermal moiré warpage measurement
• Task 9 – Data Analysis, Data Review and Reporting
Publish final report
15
Molding Experiment
• To study Moldflow ability, Void performance and Warpage
• Strip design(240.5x95mm), Mold cavity(116.5x89mm)
• Material properties is required
• Mold process type: Transfer molding method
24 gates design Molding process
Substrate Design
• Line width: 60um
• Line space: ~115um
Full open SR
under Die
18
Package/Component Mount
• Component Keep-out design
Inductor
(L1)
3.2mm
0.075mm
Capacitor
0201
0.6mm
0.015mm
Capacitor
0402
1.0mm
0.015mm
Inductor
(L2)
2.0mm
0.025mm
Leg information Gap btw PAD to PAD Gap btw Components to Components
Leg# Item All PADIC Die to Passive
(Die-Inductor / Die –Capacitor)
Inductor to Inductor(L1-L2)
Inductor to Capacitor(L2-0402)
Capacitor to Capacitor(0402-0201)
#1 Narrow 75um 100um / 90um 125um 115um 105um
#2 Mid 100um 125um / 115um 150um 140um 130um
#3 Wide 125um 150um / 140um 175um 165um 155um
Component outline
PAD
IC
0.100mm
0.025mm
0.075mm
0.125mm 0.075mm
0.115mm
0.075mm
0.105mm
Schedule
Phase Task # Work Plan Duration Remarks
Moldability Situation Task 1 BOM selection 4 weeks Substrate, Mold Resin, Dummy Dies, Passives
Task 2 DoE Planning 4 weeks
Task 3 Mold Compound Characterization 4 weeks
Task 4 Mold filling simulation 8 weeks
Experiment Task 5 Experiment Design 4 weeks
Task 6 Manufacturing and Assembly 12 weeks Use two molding machines types
Task 7 Inspection and Measurement 8 weeks Visual
Warpage
Task 8 Data Analysis 4 weeks
Task 9 Reporting 2 weeks
19
SiP Module MoldabiltyInitiative Members
20
Package TIG 2015.11
Welcome your active participation and leadership!
How to Join
Sign-Up Due on June 4, 2016
• iNEMI membership is required to join the project
• Download SOW and PS from iNEMI web:
– Signature of representative of participants
– Signature of manager approval
– Send scanned PS to [email protected]
– iNEMI VP of Operations will sign and approve your participation
and send you back the completed PS with acceptance
• Join iNEMI membership, or questions, contact M. Tsuriya
22
Questions?
Project web page:
http://community.inemi.org/SiP_Module_Moldability
