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European 3D TSV Summit On the road towards Manufacturing January 22-23, 2013 Grenoble SPECIAL THANKS ….

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European 3D TSV Summit On the road towards Manufacturing

January 22-23, 2013 Grenoble

SPECIAL THANKS ….

http://www.siliconsemiconductor.net/

To our Steering Committe

• Eric Beyne, director of Advanced Packaging, IMEC

• Kevin Crofton, EVP and COO, SPTS

• Albert Koller, VP and head of Semiconductor, Oerlikon Systems

• Hannes Kostner, director of R&D Datacon, BESI

• Thorsten Matthias, director of Business Development, EV Group

• Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics

• James Quinn, VP of Marketing and Sales, Multitest

• Martin Schrems, director of R&D, austriamicrosystems

• Nicolas Sillon, head of 3D Integration, CEA-Leti

• Juergen Wolf, department head of HDI WLP/ ASSID, Fraunhofer-IZM

• Margarete Zoberbier, Business Development Manager 3D, SUSS Microtec

Page 3: European 3D TSV Summit - SEMI for closing.pdf · European 3D TSV Summit ... January 22-23, 2013 Grenoble SPECIAL THANKS …. To our Steering Committe • Eric Beyne, ... Jurgen Wolf,

To all the Speakers, Chairmen

Page 4: European 3D TSV Summit - SEMI for closing.pdf · European 3D TSV Summit ... January 22-23, 2013 Grenoble SPECIAL THANKS …. To our Steering Committe • Eric Beyne, ... Jurgen Wolf,

To our sponsors

Page 5: European 3D TSV Summit - SEMI for closing.pdf · European 3D TSV Summit ... January 22-23, 2013 Grenoble SPECIAL THANKS …. To our Steering Committe • Eric Beyne, ... Jurgen Wolf,

To our partners

• Minatec event

• Insight Outside

• Pierre Jaillet

• Papillon

• Feu Follet

• Balades gourmandes

• Pignol

• etc…

Page 6: European 3D TSV Summit - SEMI for closing.pdf · European 3D TSV Summit ... January 22-23, 2013 Grenoble SPECIAL THANKS …. To our Steering Committe • Eric Beyne, ... Jurgen Wolf,

To YOU!

• 315 attendees – 21 Exhibitors

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