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iNEMI-IPSR Board-Level Optical Interconnect Project Single Mode Connector Evaluation Project Leader: Tom Marrapode, Molex iNEMI Staff: David Godlewski, Bob Pfahl

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Page 1: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

iNEMI-IPSR Board-Level Optical Interconnect Project

Single Mode Connector Evaluation

Project Leader: Tom Marrapode, Molex iNEMI Staff: David Godlewski, Bob Pfahl

Page 2: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Background

• Project is aligned with AIM (American Institute for Manufacturing Integrated Photonics), iNEMI, MIT MicroPhotonics Consortium, and industrial roadmaps

• These roadmaps predict that silicon-photonics-based transceiver modules will provide the most cost-effective solutions for on-board interconnections in the future

• This is based on the expected reduction of optoelectronic chip cost to be achieved via leveraging of the CMOS silicon foundry infrastructure

• Before the anticipated cost benefits of silicon photonics can be realized, new high-performance and cost effective solutions to optical packaging and connectorization must be developed

• Optimum performance and functionality from silicon photonics devices requires single mode (SM)

Page 3: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Background

• Single mode operation requires precision (sub-micron) alignment in optical connections, both inside the package and in optical connectors; the tight mechanical tolerances needed in connector parts result in high cost components

• To address the need for more lower-cost SM connections, manufacturers have begun developing expanded-beam optical connectors

• The optical mode of the SM fiber (~ 10 microns diameter) is expanded to a larger collimated beam (e.g. 80 microns in diameter) thus relaxing the alignment tolerance between connector elements from submicron to a few microns....tolerances that can be held in injection molded parts

• However, to date, expanded-beam versions of SM connectors have higher losses than desired by system designers, and thus have not been commercialized

Page 4: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Project Purpose

• Assess the mechanical system-level benefits and issues associated with SM expanded beam coupling for on-board interconnect

• Therefore, allowing the industry to properly prioritize component development required to accelerate the silicon-photonics-implementation inherent in the roadmaps

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Page 5: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

AIM Photonics Proprietary and Confidential 4

Project Overview

• The assessment of the performance of prototypes of board-level interconnect systems based on single-mode (SM) fiber, expanded-beam optical coupling, and silicon photonics transceivers. This activity will allow evaluation of existing and developing components, and thereby will identify gaps in the board-level technologies needed for practical implementation.

Need Being Addressed:• This need was one of three identified in

the 2016 Roadmap as being critical to the wide spread implementation of board level integrated photonic systems. The team has met weekly this fall to develop this self-funded project to address the need.

Proposed Solution:

• This solution is dependent on all participants honoring the commitments they have made to the project

• Participants will be required to sign a statement of work (SOW) and IP Agreement.

Funding• This project is self-funded by the

industrial participantsConstraints:

Timeline:• One Year (2017)

Page 6: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Participants

Affiliation Participant Title Proposed ContributionsMolex Tom Marrapode,

IPSR Project LeaderDirector of Advanced Technology Development

Interconnects; backplane, front panel, I/O and cablesPrototype single mode expanded beam MT ferrules

Celestica Tatiana Berdinskikh Principal Optical Engineer Rack Hardware

Juniper Networks

Valery KugelDistinguished Engineer

Link test parameters and performance evaluationIn house testing

US Conec Darrel ChildersSharon Lutz

Director of DevelopmentProduct Manager

Prototype single mode expanded beam MT ferrules. Interconnects; backplane, front panel, I/O

3M Company Terry Smith Senior Staff Scientist Organizer-Planning for next phases

US Competitors John Mac Williams Principle Advisor-Planning for next phases

MIT Kazumi Wada Professor Advisor-Planning for next phases

Senko Tiger Ninomiya Business Development Prototype expanded core fiber MT

Fraunhofer Dr. Henning Schröder Group Leader Optical Interconnection

Observer for next phases

IPSR Robert Pfahl Director of Roadmapping Facilitator-Planning for next phases

iNEMI Dave Godlewski Manager of Deployment Project Facilitator

Page 7: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Specific Component and System Characterizations

• Connector loss

• Wavelength dependence of connector loss

• Connector return loss

• Connector polarization-dependent loss

• Connector re-mating loss variation

• Signal Bit Error Rate vs. connector number and loss (up to 25 Gbps/channel)

Additional Proposed Testing :

• Dust contamination induced connector loss (Test TBD)

• Environment Thermal Aging, Humidity Aging, Thermal Cycling, and Humidity/Condensation Cycling testing

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Page 8: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Proposed Demonstrator High Level

7

Line Card

Back

plan

e

Backplane Connector

SM Fiber ExpandedBeam MT FerrulesSM Fiber

Cables

Fron

t Pan

el

SM Fiber ExpandedBeam MT Ferrules

Front Panel I/O

SiPh TX

SiPh RX

SM Expanded Beam MT Ferrule

Page 9: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Proposed Demonstrator Interface Juniper, Molex

8

Line Card

Back

plan

e

4 SM Fiber ExpandedBeam MT Ferrules

(add links by looping)SM FiberCables

Fron

t Pan

el

3 SM Fiber ExpandedBeam MT Ferrules

(add links by looping)

Front Panel I/O 1x3 Circular MT Connector

Parallel SiPhTransceiver

HBMT® Backplane ConnectorDriver and Measurement Instrument

HBMT is a registered trade mark of Molex LLC

Page 10: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Proposed Demonstrator Interface, Juniper, USCONEC

9

Line Card

Back

plan

e

MXC® Backplane Connector

6 SM Fiber ExpandedBeam MT Ferrules

(add links by looping)SM FiberCables

Fron

t Pan

el

1 SM Fiber ExpandedBeam MT Ferrules

Front Panel I/O MXC Adaptor

Parallel SiPhTransceiver

Driver and Measurement Instrument

MXC is a registered trade mark of US Conec Ltd.

Page 11: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Optical Cable Details, up to 4 Mated Pairs

10

Line Card

Back

plan

e

Backplane ConnectorBody 4 or 6 mated ferrules

SM Fiber ExpandedBeam MT Ferrules

(add links by looping)SM FiberCables

Fron

t Pan

el

SM Fiber ExpandedBeam MT Ferrules

Front Panel I/O Adaptor Body

SiPh TRX

1-8

1-8

1-8

1-8

1-8

1-8

L=3M

L=3M

L=1M

L=1M

L=3M

L=3M loop back L=3M loop back

MTP®-PRO (allows male/female and key change)

MTP-PRO (allows male/female and key change)

IL/RL Test Set

SM Expanded Beam MT Ferrule

MTP is a registered trade mark of US Conec Ltd.

Page 12: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

IL/RL Setup

• Based on JDSU MAP-200 with integrating sphere, 2 24x optical switches. Bi-directional IL/integral RL measurements at 1310/1490/1550/1625nm.

JDSU MAP-200 DUT1x12 MTP Elite

FC/APC

3m SMF

Reference cables

RL is measured using integration method (integral of reflected signal 1m from MTP connectors on both sides of the DUT)

Juniper Confidential

1x12 MTP Elite

SW1

SW2

F

MFC/APC

FC/APC5m

FC/APC5m

3m SMF

FC/APC to FC/APC are 5m cables;FC/APC to 1x12 MT are cables

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Page 13: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Silicon Photonic Module 8x25G Setup

Avago Test Board with 25G Tx/Rx

SiPh 8x25G on-

board engine

MTP0

MTP1

femaleMTPTx

Male MTPRx

124487

124488

124527

124528

USConec reference assembly with 1x12 SMF MT Elite ferrules

8x25Rx

8x25TxMTP adapter aligned keys

MTP adapter aligned keys

Juniper Confidential

To Molex DUT

Note: when measured in a loopback (MTP Tx is directly mated to MTP Rx), opposed key MPO adapter is used. This is because the end MT ferrules are flipped in USConec reference assembly compared to a standard setup.

Page 14: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

ATCA Standards Based Chassis

Zone 1 Power

Zone 2 Signal

Zone 3 Open

Zone 1 Power

Zone 2 Signal

Zone 3 Open

Page 15: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Cards Top Views

MXC Front Panel & MXC Backplane Circular MT & HBMT Backplane

Page 16: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

ATCA Chassis Status 9/13/17

Front View

HBMT MXC

Back View

HBMTMXC

MXC Circular MT

Page 17: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

ATCA Chassis Status 9/13/17

HBMT Inside View MXC Inside View

Page 18: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Circular MT connector

HBMT connector

Chassis with Molex Lens Ferrule Assembly

Page 19: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Molex Lens Ferrule Assembly (DUT)

Lens F1M1

MTP male

MTP female

Lens M3F3Lens F1M2

Lens M1F4

Lens M3F3Lens F1M2

Lens M1F6

Lens F4M4

Lens F5M5

1 lens connector (Circular MT)

3 lens connectors (1 Circular MT and 2 HBMT Mated Pairs)

5 lens connectors (1 Circular MT and 4 HBMT Mated Pairs)

MTP male

MTP female

MTP male

MTP female

Page 20: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Testing Results: Insertion Loss, Molex VersaBeamSinglemode

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Page 21: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Testing Results: Return Loss, Molex VersaBeam Singlemode

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Page 22: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Testing Results: Matrix Molex VersaBeamSinglemode

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Module channel

TX Power dBm

Rx Power dBm

TX Power dBm

Rx Power dBm

Lens IL @Module

dB

Lens IL Test set

dB

Lens RL Test set

dB TX power dBm

Rx Power dBm

Lens IL @Module

dB

Lens IL Test set

dB

Lens RL Test set

dBTxQpower dBm

Rx Power dBm

Lens IL @Modul

e dB

Lens IL Test set

dB

Lens RL Test set

dB0 -2.80 -2.05 -2.80 -2.60 0.55 0.52 -35.55 -2.80 -3.95 1.90 1.62 -30.80 -2.80 -4.75 2.70 2.48 -29.731 -2.85 -1.90 -2.85 -2.50 0.60 0.61 -35.33 -2.85 -4.35 2.45 2.41 -31.23 -2.90 -5.20 3.30 3.23 -30.172 -2.80 -2.10 -2.80 -3.05 0.95 0.55 -36.01 -2.85 -3.65 1.55 1.44 -31.02 -2.80 -4.80 2.70 2.73 -29.913 -2.65 -2.05 -2.65 -2.50 0.45 0.65 -36.05 -2.65 -3.45 1.40 1.53 -31.62 -2.65 -4.65 2.60 2.87 -30.524 -3.10 -2.70 -3.10 -3.10 0.40 0.78 -36.43 -3.10 -3.70 1.00 1.82 -31.59 -3.10 -5.20 2.50 3.45 -30.435 -2.70 -2.20 -2.70 -2.75 0.55 0.64 -35.96 -2.70 -3.25 1.05 1.59 -31.05 -2.70 -4.70 2.50 3.42 -30.026 -2.60 -2.10 -2.60 -2.60 0.50 0.61 -35.59 -2.60 -3.90 1.80 1.68 -31.51 -2.60 -4.70 2.60 2.87 -30.537 -2.85 -2.60 -2.80 -3.25 0.65 0.67 -35.34 -2.80 -5.05 2.45 2.32 -30.81 -2.80 -6.20 3.60 3.26 -29.77

*25.78125Gbps, PRBS31; Avago SerDes are tuned at loopback measurements, BER is measured at Avago board, optical power - at SiPH engine SW

Loopback - Tx and Rx mated 5 Mated Pairs, Molex Singlemode Lens3 Mated Pairs, Molex Singlemode Lens1 Mated Pairs, Molex Singlemode Lens

bert <4.6e-16, 2.2e15bits, no errorsbert <4e-16, 2.5e15bits (one channel 4.9e-13 burst 1235err)bert <4e-16, 2.5e15bits, no errorsbert <4e-16, 2.45e15bits, no errors

Page 23: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Detail Schedule

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Page 24: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

Deliverables

• Quantification of the performance achievable with singlemode expanded beam MT ferrules and silicon-photonics on-board interconnect

• Understanding of system tradeoffs in designing a silicon-photonics based on-board interconnect system

• Identification of component developments needed to fill gaps in the ecosystem of silicon-photonics-based on-board interconnect

• Build confidence for acceleration of the markets for associated silicon photonics transceivers, connector components, and fiber cables

• White Paper• End of Project Webinar• Phase 2 SOW Development23

Page 25: Single Mode Connector Evaluation · thereby will identify gaps in the board-level technologies needed for practical implementation. Need Being Addressed: • This need was one of

iNEMI ProjectUpdate AIM Photonics OFC 3/8/2018