single mode connector evaluation · thereby will identify gaps in the board-level technologies...
TRANSCRIPT
iNEMI-IPSR Board-Level Optical Interconnect Project
Single Mode Connector Evaluation
Project Leader: Tom Marrapode, Molex iNEMI Staff: David Godlewski, Bob Pfahl
Background
• Project is aligned with AIM (American Institute for Manufacturing Integrated Photonics), iNEMI, MIT MicroPhotonics Consortium, and industrial roadmaps
• These roadmaps predict that silicon-photonics-based transceiver modules will provide the most cost-effective solutions for on-board interconnections in the future
• This is based on the expected reduction of optoelectronic chip cost to be achieved via leveraging of the CMOS silicon foundry infrastructure
• Before the anticipated cost benefits of silicon photonics can be realized, new high-performance and cost effective solutions to optical packaging and connectorization must be developed
• Optimum performance and functionality from silicon photonics devices requires single mode (SM)
Background
• Single mode operation requires precision (sub-micron) alignment in optical connections, both inside the package and in optical connectors; the tight mechanical tolerances needed in connector parts result in high cost components
• To address the need for more lower-cost SM connections, manufacturers have begun developing expanded-beam optical connectors
• The optical mode of the SM fiber (~ 10 microns diameter) is expanded to a larger collimated beam (e.g. 80 microns in diameter) thus relaxing the alignment tolerance between connector elements from submicron to a few microns....tolerances that can be held in injection molded parts
• However, to date, expanded-beam versions of SM connectors have higher losses than desired by system designers, and thus have not been commercialized
Project Purpose
• Assess the mechanical system-level benefits and issues associated with SM expanded beam coupling for on-board interconnect
• Therefore, allowing the industry to properly prioritize component development required to accelerate the silicon-photonics-implementation inherent in the roadmaps
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AIM Photonics Proprietary and Confidential 4
Project Overview
• The assessment of the performance of prototypes of board-level interconnect systems based on single-mode (SM) fiber, expanded-beam optical coupling, and silicon photonics transceivers. This activity will allow evaluation of existing and developing components, and thereby will identify gaps in the board-level technologies needed for practical implementation.
Need Being Addressed:• This need was one of three identified in
the 2016 Roadmap as being critical to the wide spread implementation of board level integrated photonic systems. The team has met weekly this fall to develop this self-funded project to address the need.
Proposed Solution:
• This solution is dependent on all participants honoring the commitments they have made to the project
• Participants will be required to sign a statement of work (SOW) and IP Agreement.
Funding• This project is self-funded by the
industrial participantsConstraints:
Timeline:• One Year (2017)
Participants
Affiliation Participant Title Proposed ContributionsMolex Tom Marrapode,
IPSR Project LeaderDirector of Advanced Technology Development
Interconnects; backplane, front panel, I/O and cablesPrototype single mode expanded beam MT ferrules
Celestica Tatiana Berdinskikh Principal Optical Engineer Rack Hardware
Juniper Networks
Valery KugelDistinguished Engineer
Link test parameters and performance evaluationIn house testing
US Conec Darrel ChildersSharon Lutz
Director of DevelopmentProduct Manager
Prototype single mode expanded beam MT ferrules. Interconnects; backplane, front panel, I/O
3M Company Terry Smith Senior Staff Scientist Organizer-Planning for next phases
US Competitors John Mac Williams Principle Advisor-Planning for next phases
MIT Kazumi Wada Professor Advisor-Planning for next phases
Senko Tiger Ninomiya Business Development Prototype expanded core fiber MT
Fraunhofer Dr. Henning Schröder Group Leader Optical Interconnection
Observer for next phases
IPSR Robert Pfahl Director of Roadmapping Facilitator-Planning for next phases
iNEMI Dave Godlewski Manager of Deployment Project Facilitator
Specific Component and System Characterizations
• Connector loss
• Wavelength dependence of connector loss
• Connector return loss
• Connector polarization-dependent loss
• Connector re-mating loss variation
• Signal Bit Error Rate vs. connector number and loss (up to 25 Gbps/channel)
Additional Proposed Testing :
• Dust contamination induced connector loss (Test TBD)
• Environment Thermal Aging, Humidity Aging, Thermal Cycling, and Humidity/Condensation Cycling testing
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Proposed Demonstrator High Level
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Line Card
Back
plan
e
Backplane Connector
SM Fiber ExpandedBeam MT FerrulesSM Fiber
Cables
Fron
t Pan
el
SM Fiber ExpandedBeam MT Ferrules
Front Panel I/O
SiPh TX
SiPh RX
SM Expanded Beam MT Ferrule
Proposed Demonstrator Interface Juniper, Molex
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Line Card
Back
plan
e
4 SM Fiber ExpandedBeam MT Ferrules
(add links by looping)SM FiberCables
Fron
t Pan
el
3 SM Fiber ExpandedBeam MT Ferrules
(add links by looping)
Front Panel I/O 1x3 Circular MT Connector
Parallel SiPhTransceiver
HBMT® Backplane ConnectorDriver and Measurement Instrument
HBMT is a registered trade mark of Molex LLC
Proposed Demonstrator Interface, Juniper, USCONEC
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Line Card
Back
plan
e
MXC® Backplane Connector
6 SM Fiber ExpandedBeam MT Ferrules
(add links by looping)SM FiberCables
Fron
t Pan
el
1 SM Fiber ExpandedBeam MT Ferrules
Front Panel I/O MXC Adaptor
Parallel SiPhTransceiver
Driver and Measurement Instrument
MXC is a registered trade mark of US Conec Ltd.
Optical Cable Details, up to 4 Mated Pairs
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Line Card
Back
plan
e
Backplane ConnectorBody 4 or 6 mated ferrules
SM Fiber ExpandedBeam MT Ferrules
(add links by looping)SM FiberCables
Fron
t Pan
el
SM Fiber ExpandedBeam MT Ferrules
Front Panel I/O Adaptor Body
SiPh TRX
1-8
1-8
1-8
1-8
1-8
1-8
L=3M
L=3M
L=1M
L=1M
L=3M
L=3M loop back L=3M loop back
MTP®-PRO (allows male/female and key change)
MTP-PRO (allows male/female and key change)
IL/RL Test Set
SM Expanded Beam MT Ferrule
MTP is a registered trade mark of US Conec Ltd.
IL/RL Setup
• Based on JDSU MAP-200 with integrating sphere, 2 24x optical switches. Bi-directional IL/integral RL measurements at 1310/1490/1550/1625nm.
JDSU MAP-200 DUT1x12 MTP Elite
FC/APC
3m SMF
Reference cables
RL is measured using integration method (integral of reflected signal 1m from MTP connectors on both sides of the DUT)
Juniper Confidential
1x12 MTP Elite
SW1
SW2
F
MFC/APC
FC/APC5m
FC/APC5m
3m SMF
FC/APC to FC/APC are 5m cables;FC/APC to 1x12 MT are cables
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Silicon Photonic Module 8x25G Setup
Avago Test Board with 25G Tx/Rx
SiPh 8x25G on-
board engine
MTP0
MTP1
femaleMTPTx
Male MTPRx
124487
124488
124527
124528
USConec reference assembly with 1x12 SMF MT Elite ferrules
8x25Rx
8x25TxMTP adapter aligned keys
MTP adapter aligned keys
Juniper Confidential
To Molex DUT
Note: when measured in a loopback (MTP Tx is directly mated to MTP Rx), opposed key MPO adapter is used. This is because the end MT ferrules are flipped in USConec reference assembly compared to a standard setup.
ATCA Standards Based Chassis
Zone 1 Power
Zone 2 Signal
Zone 3 Open
Zone 1 Power
Zone 2 Signal
Zone 3 Open
Cards Top Views
MXC Front Panel & MXC Backplane Circular MT & HBMT Backplane
ATCA Chassis Status 9/13/17
Front View
HBMT MXC
Back View
HBMTMXC
MXC Circular MT
ATCA Chassis Status 9/13/17
HBMT Inside View MXC Inside View
Circular MT connector
HBMT connector
Chassis with Molex Lens Ferrule Assembly
Molex Lens Ferrule Assembly (DUT)
Lens F1M1
MTP male
MTP female
Lens M3F3Lens F1M2
Lens M1F4
Lens M3F3Lens F1M2
Lens M1F6
Lens F4M4
Lens F5M5
1 lens connector (Circular MT)
3 lens connectors (1 Circular MT and 2 HBMT Mated Pairs)
5 lens connectors (1 Circular MT and 4 HBMT Mated Pairs)
MTP male
MTP female
MTP male
MTP female
Testing Results: Insertion Loss, Molex VersaBeamSinglemode
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Testing Results: Return Loss, Molex VersaBeam Singlemode
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Testing Results: Matrix Molex VersaBeamSinglemode
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Module channel
TX Power dBm
Rx Power dBm
TX Power dBm
Rx Power dBm
Lens IL @Module
dB
Lens IL Test set
dB
Lens RL Test set
dB TX power dBm
Rx Power dBm
Lens IL @Module
dB
Lens IL Test set
dB
Lens RL Test set
dBTxQpower dBm
Rx Power dBm
Lens IL @Modul
e dB
Lens IL Test set
dB
Lens RL Test set
dB0 -2.80 -2.05 -2.80 -2.60 0.55 0.52 -35.55 -2.80 -3.95 1.90 1.62 -30.80 -2.80 -4.75 2.70 2.48 -29.731 -2.85 -1.90 -2.85 -2.50 0.60 0.61 -35.33 -2.85 -4.35 2.45 2.41 -31.23 -2.90 -5.20 3.30 3.23 -30.172 -2.80 -2.10 -2.80 -3.05 0.95 0.55 -36.01 -2.85 -3.65 1.55 1.44 -31.02 -2.80 -4.80 2.70 2.73 -29.913 -2.65 -2.05 -2.65 -2.50 0.45 0.65 -36.05 -2.65 -3.45 1.40 1.53 -31.62 -2.65 -4.65 2.60 2.87 -30.524 -3.10 -2.70 -3.10 -3.10 0.40 0.78 -36.43 -3.10 -3.70 1.00 1.82 -31.59 -3.10 -5.20 2.50 3.45 -30.435 -2.70 -2.20 -2.70 -2.75 0.55 0.64 -35.96 -2.70 -3.25 1.05 1.59 -31.05 -2.70 -4.70 2.50 3.42 -30.026 -2.60 -2.10 -2.60 -2.60 0.50 0.61 -35.59 -2.60 -3.90 1.80 1.68 -31.51 -2.60 -4.70 2.60 2.87 -30.537 -2.85 -2.60 -2.80 -3.25 0.65 0.67 -35.34 -2.80 -5.05 2.45 2.32 -30.81 -2.80 -6.20 3.60 3.26 -29.77
*25.78125Gbps, PRBS31; Avago SerDes are tuned at loopback measurements, BER is measured at Avago board, optical power - at SiPH engine SW
Loopback - Tx and Rx mated 5 Mated Pairs, Molex Singlemode Lens3 Mated Pairs, Molex Singlemode Lens1 Mated Pairs, Molex Singlemode Lens
bert <4.6e-16, 2.2e15bits, no errorsbert <4e-16, 2.5e15bits (one channel 4.9e-13 burst 1235err)bert <4e-16, 2.5e15bits, no errorsbert <4e-16, 2.45e15bits, no errors
Detail Schedule
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Deliverables
• Quantification of the performance achievable with singlemode expanded beam MT ferrules and silicon-photonics on-board interconnect
• Understanding of system tradeoffs in designing a silicon-photonics based on-board interconnect system
• Identification of component developments needed to fill gaps in the ecosystem of silicon-photonics-based on-board interconnect
• Build confidence for acceleration of the markets for associated silicon photonics transceivers, connector components, and fiber cables
• White Paper• End of Project Webinar• Phase 2 SOW Development23
iNEMI ProjectUpdate AIM Photonics OFC 3/8/2018