China 14%

Europe

14%

India 1%

Japan

22%

Korea

10%

Americas 26%

Singapore 2%

Taiwan 11%

1’926 Members As of June 2012

Location of SEMI Member

Total Members by Size

Under $5 M

67%$1B - $2B

1%

$500M - $1B

1%

$100M - $500M

3%

Over $2.5B

>1%

$25M - $100M

6%

$5M - $25M

22%

Global presence:

Offices in Silicon Valley, Washington D.C., Belgium, China, France, Germany, India, Japan, Korea, Russia, Singapore and Taiwan

Mike Allison

Managing Dir

Edwards

Alain Astier

Group VP

STMi

Heinz M. Esser

CEO

R&R Ortner

Gilbert Declerck

Board Member

IMEC

Rob Hartman

VP,

ASML

Volker Braetsch

VP Marketing

Siltronic

André Auberton

CEO,

Soitec

Michael Hummel

General Manager

Texas Instruments

Eric Maiser

Sector Head

VDMA

Eicke Weber

President

ISE

Paul Hyland

CEO,

Aixtron

Steenkamp

COO

Centrotherm

Andreas Dill

CEO, Oerlikon

Advanced Tech.

Gabriel Crean

VP

CEA / Letî

Frank Averdung

CEO

Suss MicroTec

Alain Jarre

CEO

Recive Techn.

SEMI Europe Advisory Board

7 7

European Advisory Board • Mike Allison, Edwards

• Alain Astier, STMicroelectronics • André-Jacques Auberton-Hervé, Soitec

• Harald Binder

• Volker Braetsch, Siltronic • Gilbert Declerck, IMEC

• Heinz-Martin Esser, Roth&Rau

• Rob Hartman, ASML • Michael Hummel, Texas Instruments

• Eric Maiser, VDMA Productronic

• Gerhard Rauter • Franz Richter, Thin Materials

• Andreas Dill, Oerlikon

• Eicke Weber, FhG ISE

Russian Advisory Committee • Alain Astier, ST Microelectronics

• Martin Beigl, M+W Group

• Jacques Berg, Tokyo Electron • Alois Brandner, Applied Materials

• Jarek Dolak, SVCS

• Valery Dshkhunyan, Angstrem • Andrey Golushko, Mikron

• Andrey Kotenko, NITOL Solar

• Igor Kucheryavy, Tronic Pte. (chairman) • Alexander Kurliandsky, Electronintorg SP

• Michael Lev, Camtek

• Elena Lysyak, Centrotherm SiTec GmbH • Hermann Marsch, Maicom Quartz

• Anatoly Sukhoparov, Angstrem T

• Manfred Schroeder, EBARA • Torsten Thieme, Memsfab

• Dagmar Vogt, Vogt Group SE

SEMI PV Group Europe Committee • Harald Binder • Jim Thompson, Executive Vice President Sales & Marketing, Oerlikon Solar

• Andreas Guenther, President, Linde Nippon Sanso Europe

• Dagmar Vogt, Managing Director, ibVogt Group • Dieter Manz, CEO, Manz Automation

• Horst Reichardt, CEO & President, DAS

• Jürgen Gutekunst, CEO, Rena • Lutz Redmann, Jonas & Redmann

• Prof. Eicke Weber, Fraunhofer ISE

• Louis Shaffer, Edwards Vacuum • Karl Hesse, Director Process Design, Wacker

• Manfred Schröder, President, Ebara Europe

• Mr. Roth, Founders, Roth & Rau • Peter Abel, CEO, PVA TePla

• Peter Pauli, CEO, Meyer Burger

Semiconductor Technology Conferences • Wolfgang Arden, Infineon

• Michael Arnold, PEER Group • Livio Baldi, Numonyx

• Prof. J.W. BarthaJohann Bartha, Technical University Dresden

• Tom Beens, Umicore • Jacques Berg, Tokyo Electron

• Alain Brochet, STMicroelectronics

• Roger de Keersmaecker, IMEC • Guy Dubois

• Bruno Ghyselen, Soitec

• Mart Graef, TU Delft (chairman) • Martin Heerschop, GE Capital

• Didier Louis, CEA-Leti

• Martin McCallum, Nikon • Richard Oechsner, Fraunhofer IISB

• Lothar Pfitzner, Fraunhofer IISB

• Ivo Raaijmakers, ASM International • Peter Schaeffler, Texas Instruments

• Karsten Schneider, Applied Materials

• Francis Taroni, Altis Semiconductor

Manufacturing Test Conference • Davide Appello, STMicroelectronics

• Roger Barth, Numonyx

• Stefan Eichenberger, NXP • Stefan Gasteiger, Advantest

• Michael Goldbach, LTX

• Klaus-Detlef Paesch, GlobalFoundries • Chris Portelli-Hale, STMicroelectronics (co-chair)

• Ulrich Schoettmer, Verigy

• Martin Stadler, Teradyne (co-chair) • René Segers

MEMS Conference • Jérémie Bouchaud, iSuppli

• Jean-Christophe Eloy, Yole Développement • Markus Gabriel, Suss MicroTec

• Erik Jung, Fraunhofer IMZ

• Gerhard Lammel, Bosch (chairman)

• Paul Lindner, EVG • Mikko Montonen, Okmetic

• Felix Rudolf, Colibrys

• Christian Schaefer, PVA Tepla • Uwe Schwarz, X-Fab

Advanced Packaging Conference • Rolf Aschenbrenner, Fraunhofer IZM

• Eef Bagerman, NXP • Eric Beyne, IMEC

• Andreas Dill, Oerlikon

• Andreas Fischer, Bosch • Philip Homami, F+K Delvotec

• Andy Longford, PandA Europe (chairman)

• Jens Mueller, IMAPS Europe Chapter • Graham Jones, Henkel

• Steffen Kroehnert, Nanium

• Thomas Oppert, PAC TECH • Klaus Pressel, Infineon

• Mark Shaw, STMicroelectronics

• Ignas van Dommelen, Sencio

ISS Conference • Alain Astier, STMicroelectronics • Paul Boudre, Soitec

• David Brough, Tokyo Electron

• Cor Claeys, IMEC (chairman) • Peter Connock, memstar® Technology

• Horst Gant, Infineon

• Maurice Geraets, NXP • Bernd Haeuser, Bosch

• Leonard Hobbs, Intel

• Hans Richter, IHP • Gerd Teepe, GlobalFoundries

SEMI International Standards Program • Werner Bergholz, University of Bremen (chairman)

• Roland Bindemann, Freiberger Compound Materials • Massimo Carrubba, Numonyx

• Jean-Marie Collard, Solvay (chairman)

• Gummaar De Vos, FFEM • Gordon Ferrier, Air Products

• Alfred Honold, InReCon

• Wolfgang Jantz, SemiMap • Andy Longford, PandA Europe

• Frank Petzold, Trustsec IT Solution

• Lothar Pfitzner, Fraunhofer IISB • Bert Planting, ASML

• Peter Wagner

• Arnd-Dietrich Weber, SiCrystal

IP Committee • Brandon Clark, Air Liquide

• Menso Hendriks, ASM

• Erik Johannesson, Micronic Laser Systems • Gerhard Kontrus, LAM

• Cees Lanting, CSEM

• Michael Lev, Camtek • Jan Halbe Lunshof, MAPPER

• Thomas Renner, Siltronic

• Vincent Ryckaert, IMEC • Gerd Strauch, Aixtron

• Thierry Sueur, Air Liquide

• Dieter Franke, SCHOTT Solar • Geert Defieuw, Umicore

• Véronique Robert-Dussouillez, CEA

• Joerg Baur, Oerlikon • Robert Harrison, 24 IP Law Group

• Ton van Hoef, ASML

SEMI European Award • Brendan Bold, X-Fab • Michel Brillouet, CEA-LETI

• Elmar Cullmann, Suss MicroTec

• Giorgio De Santi, Numonyx • Mart Graef, TU Delft (chairman)

• Jean-Pierre Joly, INES

• Peter Kuecher, Fraunhofer CNT • Klaus-Dieter Lang, Fraunhofer IZM

• Lode Lauwers, IMEC

• Heiner Ryssel, Fraunhofer IISB

150 SEMI Europe Experts

Sales Trend by Unit

10

Source: SEMI World Fab Forecast, August 2012

Installed Capacity by Region

$0

$5

$10

$15

$20

$25

$30

$35

$40

$45

$50

Wafer Process Assembly & Pack. Test Other

Other 2.00 1.11 1.98 2.07 2.19 3.03

Test 3.45 1.55 4.14 3.77 3.78 3.99

Assembly & Pack. 2.04 1.41 3.88 3.34 3.37 3.48

Wafer Process 22.03 11.84 29.91 34.34 33.04 36.21

2008 (A) 2009 (A) 2010 (A) 2011 (A) 2012 (F) 2013 (F)

US

$ B

illi

on

s

Totals may not add due to rounding

Source: SEMI, July 2012

SEMI Equipment Forecast

$0$5

$10$15$20$25$30$35$40$45$50

N. America Japan Taiwan Europe S.Korea China ROW

ROW 2.61 1.44 3.84 3.41 2.43 3.04

China 1.89 0.94 3.68 3.65 3.10 3.92

S.Korea 4.89 2.60 8.63 8.66 11.48 12.14

Europe 2.45 0.97 2.33 4.22 3.20 3.29

Taiwan 5.01 4.35 11.25 8.52 9.26 9.16

Japan 7.04 2.23 4.44 5.81 4.35 5.03

N. America 5.63 3.39 5.75 9.26 8.56 10.13

2008 (A) 2009 (A) 2010 (A) 2011 (A) 2012 (F) 2013 (F)

Source: SEMI, July 2012 Totals may not add due to rounding

US

$ B

illi

on

s

SEMI 2012 Equipm. Forecast

Source: Rose Associates 1978 to 1995; SEMI SMG 1995 to 2011; SEMI

0

500

1'000

1'500

2'000

2'500

3'000

3'500

4'000

4'500

5'000

5'500

6'0001

97

81

97

91

98

01

98

11

98

21

98

31

98

41

98

51

98

6

19

87

19

88

19

89

19

90

19

91

19

92

19

93

19

94

19

95

19

96

19

97

19

98

19

99

20

00

20

01

20

02

20

03

20

04

20

05

20

06

20

07

20

08

20

09

20

10

20

11

20

12

F2

01

3F

Millio

ns

of

Sq

ua

re In

ch

es

75 mm

100 mm 150 mm

125 mm

200 mm

300 mm

Includes polished and epi wafers. Excludes reclaim, non polished, and SOI.

Wafer Diameter Trend

LED Epitaxy capacity (4” equivalent per month)

Source: SEMI Opto/LED Fab Forecast, August 2012

World LED Capacity Trend

Material Market

Europe7%

Japan20%

North America

10%

Korea15%

Taiwan21%

China10%

ROW17%

Totals may not add due to rounding 2011 = $47.9 Billion

2011 2012F %

$B $B Change

Europe 3.38 3.46 2%

China 4.87 5.17 6%

North America 4.92 5.01 2%

South Korea 7.15 7.46 4%

Southeast Asia 8.17 8.39 3%

Japan 9.34 9.50 2%

Taiwan 10.04 10.27 2%

Total Regions 47.86 49.26 3%

Region

Source: SEMI Materials Market Data Subscription, July 2012

Regional Materials Markets

Source: SEMI Silicon Manufacturers Group, July 2012

Worldwide Wafer Area Shipment Index

(Three-month moving average)

50

70

90

110

130

150

170

190

210

230

250

Jan

-03

May-0

3

Sep

-03

Jan

-04

May-0

4

Sep

-04

Jan

-05

May-0

5

Sep

-05

Jan

-06

May-0

6

Sep

-06

Jan

-07

May-0

7

Sep

-07

Jan

-08

May-0

8

Sep

-08

Jan

-09

May-0

9

Sep

-09

Jan

-10

May-1

0

Sep

-10

Jan

-11

May-1

1

Sep

-11

Jan

-12

May-1

2

Silicon Area Shipment Index

Source: LINX-Consulting (www.linx-consulting.com)

TSV Materials Forecast

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