science specification table 12 kev - 250 kev for neutral particles 40.5 cm 2 image plane electronic...

Science Specification Table

• 12 keV - 250 keV for neutral particles

• 40.5 cm2 image plane

• Electronic Noise 3 keV FWHM

• Proton Dead Layer <3 keV

• Focal Length 6.16 to 6.95 cm

• FOV 40 degrees

• Pixel size 4 x 4 mm

• 256 Energy Levels (10 Bit A/D)

Taylor University HENA CDR July 9 &10 1997

Engineering Specification Table

• Sensors: XY Position Si solid state sensors

– Two vendors used: Micron and Canberra

• Analog Electronics 250 A225 preamplifiers 16 ASIC amplifiers

• ? Total Power 3 Watts (at supply voltages)

• Voltages +/-3.5, +/-5, and bias voltage (-70V)

• Planned Temperature Operation 10o C +- 20o C

• Survival Temperature: +60oC, -50oC

• ? Mass 3.53 kg (estimated)

• ? Dimensions 7.62 x 22.35 x 24.13 cm

Taylor University HENA CDR July 9 & 10 1997

SENSOR SPECIFICATIONS

• MEASURES NEUTRALS E>12 keV

• 4 - 60 ELEMENT ARRAY (12 X 5)

• ACTIVE AREA: 48.7mm x 20.8mm per SSD

• THICKNESS: >200 MICRONS

• THIN WINDOW: <5keV H+ ENERGY LOSS (Si)

• BIAS APPLIED TO THIN WINDOW SIDE OPPOSITE PIXELS

• LEAKAGE CURENT: <10nA

• ELECTRONIC NOISE RESOLUTION: <1KeV FWHM

• BOND PADS: 4 - 5 MILS

• BOND WIRES: < 1.25 MILS


SSD Design Features

• Parallel processing (240 channels)

• High resolution (240 pixel array @ 256 Energy levels)

• Low Power

• Single Box Assembly


System Design


Weight Breakdown• Middle Box .93 kg (cal.)• Radiation Shielding (outside walls = .23 in.) .7 kg (est.)• ? 240 A225 Preamps (SIP package) ? .94 kg (mes.)• 16 ASICs .12 kg (mes.)• 4 PC Board and MDM connectors .24 kg (cal.)• SSD Assembly .15 kg (cal.)• Processing Boards .21 kg (cal.)• Misc parts (screws, connectors) .2 kg (est.)

Total 3.13 kg


Design Philosophy

• Use Existing Technology

• Use Well Proven Analog Gate Array Technology

– High reliability, Parallel Processing, Low Power, and Low Complexity

• Rigorous Testing and Burn-In of Subsystems

• State-of-the-Art Instrument


SSD Sensor Heritage

• SSD Sensors

– SEPS (Source Loss/Cone Energetic Particle Spectrometer flew in the winter of 95’. It’s mission was to study energetic electrons, ions, and neutrals in the source loss cone.

– IPS (Imaging Proton Spectrometer)


Images from SEPS (HENA has similar SSD design)

FEA Microcircuit Heritage

• FEA Micro circuits

– POLAR Satellite

• SEPS

• IPS

• PIXIE (Polar Ionospheric X-Ray Imaging Experiment)

– SPADUS (flew on the Argos satellite)

– MAXIE (Magnetospheric Atmosphere X-Ray Imaging Experiment) flew on Aug. 9, 1993 on the TIROS satellite. It measured x-rays in the range of 4 - 100 keV.


POLAR Satellite

SEPS

SPADUS

HENA Middle Box Cross Section


HENA Middle Box Design


Middle Box Assembly Renderings


DPU Connection

SSD Assembly

MCPSSD

Shield

SSD Mount

?Middle Box Mass Properties


---------------- SOLIDS ----------------

Mass: 36.1353Volume: 36.1353Bounding box: X: 0.5000 -- 10.0000 Y: 0.5000 -- 9.3000 Z: 0.0000 -- 2.9500Centroid: X: 5.2705 Y: 4.7628 Z: 1.5714Moments of inertia: X: 1286.4188 Y: 1534.5287 Z: 2583.1441Products of inertia: XY: 906.6895 YZ: 270.5600 ZX: 299.2255Radii of gyration: X: 5.9666 Y: 6.5166 Z: 8.4549Principal moments and X-Y-Z directions about centroid: I: 377.4822 along [1.0000 -0.0062 -0.0002] J: 441.5144 along [0.0062 1.0000 0.0003] K: 759.6615 along [0.0002 -0.0003 1.0000]

Preamplifier Board Design


Preamplifier Board Rendering


60 A225 Preamps

4 FEA Chips

MDM Connector

Flex Cable Connection

Actel Chip

A225 Preamp Response Curve

Voltage Vs. Power

0.02.04.06.08.0

10.012.014.016.018.0

0.0 2.0 4.0 6.0 8.0

Voltage

Pow

er(m

W)

A225 Testing for HENA10/11/96

Input (mV) -> 5

Voltage Current Voltage Peak (s) Power Voltage(DC) (DC) (Output Pulse) Delay (mW) Gain7.00 2.38 175 4 16.66 356.00 2.38 175 4 14.28 355.00 2.38 175 4 11.90 354.00 2.37 175 4 9.48 353.55 2.34 175 4 8.31 353.25 2.29 175 4 7.44 352.95 2.22 175 4 6.55 352.70 2.14 175 4 5.78 352.50 2.05 175 4 5.13 352.40 2.01 170 4 4.82 342.05 1.81 150 5 3.71 301.87 1.70 100 6 3.18 201.77 1.63 50 12 2.89 10


A225 Preamp Testing Continued

Voltage (DC) vs. Gain

0

5

10

15

20

25

30

35

40

0.0 2.0 4.0 6.0 8.0

Volts

Gai

n

Voltage Vs. Current

0.0

0.5

1.0

1.5

2.0

2.5

0.0 2.0 4.0 6.0 8.0

Voltage

Cur

rent

(mV)


SSD Mounting Assembly


Detector Geometry


Pixel Angular Resolution from Center of Pin Hole


Pixel # Middle Height Angle R Angle L Angle1 0.13 2.4 85.948 92.148 1.9042 0.29 2.4 82.171 95.947 1.8823 0.45 2.4 78.461 99.694 1.8454 0.61 2.4 74.846 103.360 1.7945 0.77 2.4 71.350 106.918 1.7326 0.9105 2.535 68.394 109.936 1.6697 1.0315 2.465 65.941 112.447 1.6128 1.1525 2.395 63.578 114.870 1.5529 1.2735 2.325 61.308 117.201 1.490

10 1.3945 2.255 59.133 119.439 1.428

Angular Resolution From Center of Pixel

1.200

1.300

1.400

1.500

1.600

1.700

1.800

1.900

2.000

0 2 4 6 8 10

Pixel Number

An

gu

lar

Re

so

luti

on

Angle Limit Diversity Over Detector Surface Per Pixel


Pixel Height Right side Left side Angle R Angle L Entry Angle1 2.425 0.01 0.25 90.24 84.11 5.652 2.425 0.17 0.41 94.01 80.40 5.593 2.425 0.33 0.57 97.75 76.77 5.484 2.425 0.49 0.73 101.42 73.25 5.335 2.425 0.65 0.89 105.00 69.85 5.156 2.425 1.012 1.213 112.65 62.75 4.607 2.355 1.133 1.334 115.69 59.72 4.588 2.285 1.254 1.455 118.76 56.70 4.549 2.215 1.375 1.576 121.83 53.69 4.4810 2.145 1.496 1.697 124.89 50.72 4.38

SSD Pixel Angle Limit Resolution

4.00

4.20

4.40

4.60

4.80

5.00

5.20

5.40

5.60

5.80

0 1 2 3 4 5 6 7 8 9 10

Pixel Number

An

gu

lar

Lim

it

Resolution of SSD w/ Increasing Pixels


Pixel # Middle Height Angle1 0.13 2.4 3.12 0.29 2.4 6.93 0.45 2.4 10.64 0.61 2.4 14.35 0.77 2.4 17.86 0.9105 2.535 19.87 1.0315 2.465 22.78 1.1525 2.395 25.79 1.2735 2.325 28.7

10 1.3945 2.255 31.7

Angular Resolution Vs. Number of Pixels

0.0

5.0

10.0

15.0

20.0

25.0

30.0

35.0

0 2 4 6 8 10

Pixel Number

An

gu

lar

Re

so

luti

on

SSD Cap., Noise, Thickness

SSD Noise Variation

0

2

4

6

810

12

14

16

18

0 100 200 300 400 500

Thickness (microns)

No

ise

(FW

HM

)

Thickness cabl/PCB A225 A225 DeadzoneMicrons pF pf FWHM Thres. (KeV) Thres. (Kev)

50 33.99936 38.99936 4.449968 11.12492 16.12492100 16.99968 21.99968 3.599984 8.99996 13.99996150 11.33312 16.33312 3.316656 8.29164 13.29164200 8.49984 13.49984 3.174992 7.93748 12.93748300 5.66656 10.66656 3.033328 7.58332 12.58332400 4.24992 9.24992 2.962496 7.40624 12.40624500 3.399936 8.399936 2.919997 7.299992 12.299992

HENA Cap. vs Det. Thickness

y = 1700x-1

0

5

10

15

20

100 200 300 400 500

Microns

Cap

. (

pf)


Vendor Response List

• Canberra Detailed Proposal and Price Schedule for Detector

• Micron Detailed Proposal (more costly) under iteration

• UDT Sensors Interested (no proposal yet)

• Hamamatsu Interested (no proposal yet)

• Spectrum Sciences Very interested (Proposal in by Dec. 11)

Name of Vendor Response


Procurement Schedule• OCT. 96’

– RECEIVED 2 PROPOSALS FOR PROTOTYPE AND FLIGHT SENSORS

• DEC. 96’

– OBTAIN UPFRONT FUNDING FOR MASK DESIGN

• JAN 97’

– PURCHASE PROTOTYPE TO NEAR FLIGHT SPECIFICATIONS

– RIGOROUSLY TEST PROTOTYPE

• March 97’

– ORDER FLIGHT SENSORS

• Jan 98’

– OBTAIN FLIGHT SENSORS 4-6 MONTHS FROM ORDER


SSD Detector Holder RenderingTaylor University HENA CDR July 9 & 10 1997

SSDMetalized PC Card

Shields

Platform

PC Card for SSD DesignTaylor University HENA CDR July 9 & 10 1997

science specification table 12 kev - 250 kev for neutral particles 40.5 cm 2 image plane electronic...

Documents

o c survival temperature

science specification

supply voltages voltages

planned temperature

image plane electronic

canberra analog electronics

a225 preamplifiers

element array