samsung ht-e5530k.pdf

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Blu-ray Home Theater System Model Name HT-E5530K Model Code HT-E5530K/RU SERVICE MANUAL Blu-ray Home Theater System HT-E5530K Contents 1. Precaution 2. Product Specification 3. Disassembly and Reassembly 4. Troubleshooting 5. PCB Diagram 6. Schematic Diagram Refer to the service manual in the GSPN (see the rear cover) for more information.

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  • Blu-ray Home TheaterSystemModel Name HT-E5530K

    Model Code HT-E5530K/RU

    SERVICE MANUALBlu-ray Home Theater System

    HT-E5530K

    Contents

    1. Precaution

    2. Product Specification

    3. Disassembly and Reassembly

    4. Troubleshooting

    5. PCB Diagram

    6. Schematic Diagram

    Refer to the service manual in the GSPN (see the rear cover) for more information.

  • Contents

    Contents

    1. Precaution........................................................................................................................................ 1 1

    1.1. Safety Precautions ................................................................................................................... 1 1

    1.2. Servicing Precautions ............................................................................................................... 1 3

    1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 4

    2. Product Specification ......................................................................................................................... 2 1

    2.1. Product Feature ....................................................................................................................... 2 1

    2.2. Specifications.......................................................................................................................... 2 2

    2.2.1. HT-E5200 Specifications............................................................................................... 2 2

    2.2.2. HT-E5xxx Specifications............................................................................................... 2 4

    2.3. Specifications Analysis ............................................................................................................. 2 7

    2.4. Disk and Format Compatibility................................................................................................... 2 8

    2.4.1. Disc types and contents your product can play .................................................................. 2 8

    2.4.2. Disc types your product cannot play................................................................................ 2 9

    2.4.3. Region Code............................................................................................................... 2 10

    2.5. Logos of Discs the product can play ............................................................................................ 2 11

    2.5.1. Supported Formats....................................................................................................... 2 12

    2.6. Accessories ............................................................................................................................ 2 14

    2.6.1. Supplied Accessories ................................................................................................... 2 14

    3. Disassembly and Reassembly .............................................................................................................. 3 1

    3.1. Overall Disassembly and Reassembly .......................................................................................... 3 1

    4. Troubleshooting ................................................................................................................................ 4 1

    4.1. Checkpoints by Error Mode ....................................................................................................... 4 1

    4.1.1. No Power................................................................................................................... 4 2

    4.1.2. No Sound................................................................................................................... 4 7

    4.1.3. Disc Loading Error ...................................................................................................... 4 8

    4.1.4. Remote doesnt work ................................................................................................... 4 10

    4.1.5. No Picture (HDMI)...................................................................................................... 4 12

    4.1.6. No Logo (HDMI) ........................................................................................................ 4 16

    4.1.7. No Logo (Composite)................................................................................................... 4 19

    4.1.8. Disc skips or freezing ................................................................................................... 4 22

    4.1.9. No Disc Reading Error ................................................................................................. 4 23

    4.1.10. Network Error............................................................................................................. 4 24

    4.2. Initialization & Upgrade Methods ............................................................................................... 4 25

    4.2.1. How to check F/W version ............................................................................................ 4 25

    4.2.2. How to update firmware................................................................................................ 4 26

    4.2.3. Cold Start Method (Initialize Setup) ................................................................................ 4 29

    4.3. Buyer-Region Code Setting Method ............................................................................................ 4 30

    4.3.1. Inserting the Region Code after replacing the Main PCB..................................................... 4 30

    i Copyright 1995-2012 SAMSUNG. All rights reserved.

  • Contents

    5. PCB Diagram ................................................................................................................................... 5 1

    5.1. Wiring Diagram....................................................................................................................... 5 1

    5.2. FRONT PCB Top .................................................................................................................... 5 2

    5.2.1. Pin Connection ........................................................................................................... 5 3

    5.2.2. Test Point Wave Form .................................................................................................. 5 4

    5.3. FRONT PCB Bottom ............................................................................................................... 5 5

    5.4. MAIN PCB Top ...................................................................................................................... 5 6

    5.4.1. Pin Connection ........................................................................................................... 5 7

    5.4.2. Test Point Wave Form .................................................................................................. 5 9

    5.5. MAIN PCB Bottom.................................................................................................................. 5 10

    5.6. SMPS PCB Top....................................................................................................................... 5 11

    5.7. SMPS PCB Bottom.................................................................................................................. 5 12

    6. Schematic Diagram ........................................................................................................................... 6 1

    6.1. Overall Block Diagram ............................................................................................................. 6 1

    6.2. FRONT ................................................................................................................................. 6 2

    6.2.1. Test Point Wave Form .................................................................................................. 6 3

    6.3. PWM_VARIABLE_FAN .......................................................................................................... 6 4

    6.4. POWER_AMP........................................................................................................................ 6 5

    6.5. DC-DC POWER...................................................................................................................... 6 6

    6.6. AUDIO/VIDEO/IPOD OUT CEC............................................................................................... 6 7

    6.6.1. Test Point Wave Form .................................................................................................. 6 8

    6.7. USB/ETHERNET.................................................................................................................... 6 9

    6.8. USB HUB_IPOD CERTI .......................................................................................................... 6 10

    6.9. FRONT MICOM..................................................................................................................... 6 11

    6.10. DIR/ADC/RX SWITCHING/D.IN.............................................................................................. 6 12

    6.11. HDMI OUT_RX...................................................................................................................... 6 13

    6.11.1. Test Point Wave Form .................................................................................................. 6 14

    6.12. DDR3 INTERFACE................................................................................................................. 6 15

    6.13. INTERFACE/SATA BLOCK ..................................................................................................... 6 16

    6.14. FLASH MEMORY .................................................................................................................. 6 17

    6.15. FIRENCE POWER JTAG DEBUG............................................................................................. 6 18

    6.16. F_END_MORTOR DRIVER ..................................................................................................... 6 19

    6.17. F_END_SC7300...................................................................................................................... 6 20

    6.18. SMPS.................................................................................................................................... 6 21

    Copyright 1995-2012 SAMSUNG. All rights reserved. ii

  • 1. Precaution

    1. Precaution

    Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazardssuch as electrical shock and X-rays.

    1.1. Safety Precautions

    1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the controlknobs and the compartment covers.

    2) Make sure that there are no cabinet openings through which people (particularly children) can make contact withdangerous internal components.

    3) Design Alteration Warning:

    Never alter or add to the mechanical or electrical design of the unit.

    Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.

    Also, any design changes or additions will void the manufacturers warranty.

    4) Leakage Current Hot Check Figure 1.1 AC Leakage Test:

    WARNING

    Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complieswith American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and UnderwritersLaboratories (UL Publication UL1410, 59.7).

    With the unit completely reassembled, plug the AC cord directly into a 120V AC outlet. With the units power switchedfrom the ON to the OFF position, measure the current between a known ground and all exposed metal parts.

    Known Grounds - Earth

    Known Metal parts - screwheads, metal cabinets, etc.

    DEVICEUNDER

    TEST

    LEAKAGECURRENT TESTER

    TEST ALL EXPO SED METAL

    SURFACES

    2-WIRE CORD

    ALSO TEST WITH PLUG REVERSED

    (USING AC ADAPTER PLUG AS R EQUIRED)

    EARTH GROUND

    (READINGSHOULD NOT BE ABOVE 0.5mA)

    Figure 1.1 AC Leakage Test

    1-1 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 1. Precaution

    5) Insulation Resistance Cold Check:

    (1) With the units AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.(2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts.

    Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to thechassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measuredresistance should be infinite. If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2Insulation Resistance Test

    AntennaTerm inal

    ohm

    Expo sedMeta l Part

    Ohmmet er

    Figure 1.2 Insulation Resistance Test

    6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced withparts that meet the original specifications. Always determine the cause of damage or overheating, and correct anypotential hazards.

    7) Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the ACand high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.

    Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage.Make sure that no wires or components touch thermally hot parts.

    8) Product Safety Notice:

    Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visualinspection. These safety features and the protection they give might be lost if the replacement component differs fromthe originaleven if the replacement is rated for higher voltage, wattage, etc.

    9) Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacementcomponents that have the same ratings, especially for flame resistance and dielectric strength specifications. Areplacement part that does not have the same safety characteristics as the original might create shock, fire or otherhazards.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 1-2

  • 1. Precaution

    1.2. Servicing Precautions

    1) Servicing precautions are printed on the cabinet. Follow them.

    2) Always unplug the units AC power cord from the AC power source before attempting to: (a) Remove or reinstall anycomponent or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel withan electrolytic capacitor.

    3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elementsto their original position.

    4) After servicing, always check that the screws, components and wiring have been correctly reinstalled.

    Make sure that the portion around the serviced part has not been damaged.

    5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels,input terminals and earphone jacks).

    6) Insulation Checking Procedure: Disconnect the power cord from the AC source. Connect an insulation resistancemeter (500V) to the blades of the AC plug.

    The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should begreater than 1 megohm.

    7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless allsolid-state heat sinks are correctly installed.

    8) Always connect a test instruments ground lead to the instrument chassis ground before connecting the positive lead;always remove the instruments ground lead last.

    CAUTION

    First read the Safety Precautions section of this manual. If some unforeseen circumstance creates a conflict between theservicing and safety precautions, always follow the safety precautions.

    1-3 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 1. Precaution

    1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

    Some semiconductor (solid state) devices are easily damaged by static electricity.

    Such components are called Electrostatically Sensitive Devices (ESDs).

    Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrenceof component damage caused by static electricity:

    1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from yourbody by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove itprior to applying powerthis is an electric shock precaution.)

    2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to preventaccumulation of electrostatic charge.

    3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

    4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

    5) Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static (these canaccumulate sufficient electrical charge to damage ESDs).

    6) Do not remove a replacement ESD from its protective package until you are ready to install it.

    Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminumfoil or other conductive materials.

    7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective materialto the chassis or circuit assembly into which the device will be installed.

    8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, orlifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 1-4

  • 2. Product Specification

    2. Product Specification

    2.1. Product Feature

    Features for 2012 model BD HTS

    BD-LIVE from the beginning of the Mass Production

    DTS-HD Master Audio decoding from the beginning of the Mass Production

    MP3, MKV, MP4, WMA, WMV, Divx-HD (exclude ZA, ZC buyers)

    Block-Buster, Netflix, Pandora, Youtube, Widget, VUDU

    1 USB port (Front USB / iPod / iPhone)

    Supporting iPod / iPhone

    Wireless Ready / Included

    Various Video Setups- Progressive Mode- Still Mode- BD Wise- Picture Control

    3D Sound

    HDMI 1.4 with ARC (support HDMI 2 In )

    2 HDMI In

    DLNA

    Smart Hub

    Allshare

    Disc to Digital

    2-1 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 2. Product Specification

    2.2. Specifications

    2.2.1. HT-E5200 Specifications

    Basic Specification

    Weight2.54 kg

    7.7 Ibs

    Dimensions430 (W) x 55 (H) x 255.8 (D) mm

    16.9 (W) x 2.3 (H) x 10.1 (D) inches

    Operating Temperature Range+5 C to +35 C

    +41 F to +95 F

    General

    Operating Humidity Range 10 % to 75 %

    Signal/noise ratio 55 dB

    Usable sensitivity 12 dBFM Tuner

    Total harmonic distortion 0.5 %

    BD

    (Blu-ray Disc)Reading Speed : 9.834 m/sec

    Reading Speed : 6.98 ~ 7.68 m/sec.DVD

    (Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.

    Reading Speed : 4.8 ~ 5.6 m/sec.CD : 12 cm / 5 inches

    (COMPACT DISC) Maximum Play Time : 74 min.

    Reading Speed : 4.8 ~ 5.6 m/sec.

    Disc

    CD : 8 cm / 3 1/2 inches

    (COMPACT DISC) Maximum Play Time : 20 min.

    1 channel : 1.0 Vp-p (75 load)

    VideoOutput

    Composite Video Blu-ray Disc : 576i/480i (America : 480i)

    DVD : 576i/480i (America : 480i)

    1080p, 1080i, 720p, 576p/480p (America : 480i)Video/Audio HDMI

    PCM multichannel audio, Bitstream audio, PCM audio

    Front speaker output 165 W x 2 (3 )

    Subwoofer speaker output 170 W (3 )

    Analog input 20 Hz ~ 20 kHz ( 3 dB)Frequency response

    Digital input 20 Hz ~ 40 kHz ( 4 dB)

    S/N Ratio 70 dB

    Channel separation 60 dB

    Amplifier

    Input sensitivity (AUX) 500 mV

    Copyright 1995-2012 SAMSUNG. All rights reserved. 2-2

  • 2. Product Specification

    HT-E5200 Speaker Specification

    2.1ch speaker systemSpeaker system

    Front Subwoofer

    Impedance 3 3

    Frequency range 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz

    Output sound pressure level 87 dB/W/M 88 dB/W/M

    Rated input 165 W 170 W

    Maximum input 330 W 340 W

    Dimensions

    (W x H x D)

    Front : 90 x 207.5 x 68.5 mm

    Subwoofer : 168 x 350 x 285 mm

    Speaker

    WeightsFront : 0.71 kg

    Subwoofer : 2.6 kg

    NOTE

    Network speeds equal to or below 10 Mbps are not supported.

    Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.

    Weight and dimensions are approximate.

    Design and specifications are subject to change without prior notice.

    For the power supply and Power Consumption, refer to the label attached to the product.

    2-3 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 2. Product Specification

    2.2.2. HT-E5xxx Specifications

    Basic Specification

    Weight2.54 kg

    7.7 Ibs

    Dimensions430 (W) x 55 (H) x 255.8 (D) mm

    16.9 (W) x 2.3 (H) x 10.1 (D) inches

    Operating Temperature Range+5 C to +35 C

    +41 F to +95 F

    General

    Operating Humidity Range 10 % to 75 %

    Signal/noise ratio 55 dB

    Usable sensitivity 12 dBFM Tuner

    Total harmonic distortion 0.5 %

    BD

    (Blu-ray Disc)Reading Speed : 9.834 m/sec

    Reading Speed : 6.98 ~ 7.68 m/sec.DVD

    (Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.

    Reading Speed : 4.8 ~ 5.6 m/sec.CD : 12 cm / 5 inches

    (COMPACT DISC) Maximum Play Time : 74 min.

    Reading Speed : 4.8 ~ 5.6 m/sec.

    Disc

    CD : 8 cm / 3 1/2 inches

    (COMPACT DISC) Maximum Play Time : 20 min.

    1 channel : 1.0 Vp-p (75 load)

    VideoOutput

    Composite Video Blu-ray Disc : 576i/480i (America : 480i)

    DVD : 576i/480i (America : 480i)

    1080p, 1080i, 720p, 576p/480p (America : 480i)Video/Audio HDMI

    PCM multichannel audio, Bitstream audio, PCM audio

    Front speaker output 165 W x 2 (3 )

    Center speaker output 170 W (3 )

    Surround speaker output 165 W x 2 (3 )

    Subwoofer speaker output 170 W (3 )

    Analog input 20 Hz ~ 20 kHz ( 3 dB)Frequency response

    Digital input 20 Hz ~ 40 kHz ( 4 dB)

    S/N Ratio 70 dB

    Channel separation 60 dB

    Amplifier

    Input sensitivity (AUX) 500 mV

    Copyright 1995-2012 SAMSUNG. All rights reserved. 2-4

  • 2. Product Specification

    HT-E5300 / HT-E5400 / HT-E5500 Speaker Specification

    5.1ch speaker systemSpeaker system

    Front Surround Center Subwoofer

    Impedance 3 3 3 3

    Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz

    Output sound pressurelevel

    87 dB/W/M 87 dB/W/M 87 dB/W/M 88 dB/W/M

    Rated input 165 W 165 W 170 W 170 W

    Maximum input 330 W 330 W 340 W 340 W

    Dimensions

    (W x H x D)

    Front : 90 x 141.5 x 68.5 mm / 3.54 x 5.57 x 2.69 inches

    Surround : 90 x 141.5 x 68.5 mm / 3.54 x 5.57 x 2.69 inches

    Center : 360 x 74.5 x 68.5 mm / 14.17 x 2.93 x 2.69 inches

    Subwoofer : 200 x 390 x 350 mm / 6.61 x 13.78 x 11.22 inches

    Speaker

    Weights

    Front : 6.1 kg / 1.37 Ibs

    Surround : 6.1 kg / 1.37 Ibs

    Center : 8.8 kg / 1.98 Ibs

    Subwoofer : 5.5 kg / 8.06 Ibs

    HT-E5330 / HT-E5530 Speaker Specification

    5.1ch speaker systemSpeaker system

    Front Surround Center Subwoofer

    Impedance 3 3 3 3

    Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz

    Output sound pressurelevel

    87 dB/W/M 87 dB/W/M 87 dB/W/M 88 dB/W/M

    Rated input 165 W 165 W 170 W 170 W

    Maximum input 330 W 330 W 340 W 340 W

    Dimensions

    (W x H x D)

    Front : 90 x 1200 x 70 (Stand base: 240 x 240) mm / 3.54 x 47.24 x 2.75(Stand base : 9.44 x 9.44) inches

    Surround : 90 x 141.5 x 68.5 mm / 3.54 x 5.57 x 2.69 inches

    Center : 360 x 74.5 x 68.5 mm / 14.17 x 2.93 x 2.69 inches

    Subwoofer : 200 x 390 x 350 mm / 6.61 x 13.78 x 11.22 inches

    Speaker

    Weights

    Front : 10.4 kg/ 8.59 Ibs

    Surround : 6.1 kg / 1.37 Ibs

    Center : 8.8 kg / 1.98 Ibs

    Subwoofer : 5.5 kg / 8.06 Ibs

    2-5 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 2. Product Specification

    HT-E5350 / HT-E5550 Speaker Specification

    5.1ch speaker systemSpeaker system

    Front Surround Center Subwoofer

    Impedance 3 3 3 3

    Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz

    Output sound pressurelevel

    87 dB/W/M 87 dB/W/M 87 dB/W/M 88 dB/W/M

    Rated input 165 W 165 W 170 W 170 W

    Maximum input 330 W 330 W 340 W 340 W

    Dimensions

    (W x H x D)

    Front : 90 x 1200 x 70 (Stand base: 240 x 240) mm / 3.54 x 47.24 x 2.75(Stand base : 9.44 x 9.44) inches

    Surround : 90 x 1200 x 70 (Stand base: 240 x 240) mm / 3.54 x 47.24 x 2.75(Stand base : 9.44 x 9.44) inches

    Center : 360 x 74.5 x 68.5 mm / 14.17 x 2.93 x 2.69 inches

    Subwoofer : 200 x 390 x 350 mm / 6.61 x 13.78 x 11.22 inches

    Speaker

    Weights

    Front : 10.4 kg/ 8.59 Ibs

    Surround : 10.4 kg /8.59 Ibs

    Center : 8.8 kg / 1.98 Ibs

    Subwoofer : 5.5 kg / 8.06 Ibs

    SWA-5000 Specification

    Weight1.1 kg

    2.52 lbs

    Dimensions (W x H x D)76.2 x 228.6 x 152.4 mm

    3 x 9 x 6 inches

    Operating Temperature Range+5 C to +35 C

    +41 F to +95 F

    Operating Humidity Range 10 % to 75 %

    Output 165 W x 2 CH

    Frequency range 20 Hz ~ 20 KHz

    S/N Ratio 65 dB

    NOTE

    Network speeds equal to or below 10 Mbps are not supported.

    Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.

    Weight and dimensions are approximate.

    Design and specifications are subject to change without prior notice.

    For the power supply and Power Consumption, refer to the label attached to the product.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 2-6

  • 2. Product Specification

    2.3. Specifications Analysis

    Model Name HT-E5xxx HT-D5500

    Photo

    Profile Blu-ray 5 from the beginning. Blu-ray 5 from the beginning.

    DVD, CD O O

    MP3, JPGO

    (MP4, MKV, WMA, WMV)

    O

    (MP4, MKV, WMA, WMV)

    USB HOST O O

    iPod / iPhone

    O

    (Digital USB AUDIO, Composite VideoWith New Cradle)

    O

    (Digital USB AUDIO, Composite VideoWith New Cradle)

    DivX

    O

    (DivX-HD support)

    (not supported for U.S, Canada)

    O

    (DivX-HD support)

    Memory Slot Internal Storage Support Internal Storage Support

    DLNA, WidgetO

    (Smart Hub)

    O

    (Smart Hub)

    Energy-Star 0.5 W 0.65 W

    2D / 3D3D

    (2D 3D Convergence)

    3D

    (2D 3D Convergence)

    SMPS1 trans

    Stand-By Power Consumption 0.6 W

    2 trans

    Stand-By Power Consumption 0.6 W

    Dual Free Voltage

    DECK Tray Type Slot-In type

    Pick Up 7G Pickup 6G VE Pickup

    Front Micom SANYO SANYO

    MAIN CHIP SAMSUNG SOC SAMSUNG SOC

    Wireless Rear SpeakerIncluded

    (SWA-5000)

    Included

    (SWA-5000)

    Wi-Fi LAN Dongle Built-in Ready (EU) / Built-In (Others)

    HDMI IN 2 Inputs 2 Inputs (Exclude U.S., Canada)

    Main LoaderBACKEND Firenze

    + Frontend Sunext

    BACKEND Firenche

    + Frontend Raptor

    TIP

    O : Feature Included

    X : Not Included

    2-7 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 2. Product Specification

    2.4. Disk and Format Compatibility

    2.4.1. Disc types and contents your product can play

    Media Disc Type Details

    Blu-ray Disc,3D Blu-ray Disc

    BD-ROM or BD-RE/-R disc recorded in the BD-RE format.

    VIDEO DVD-VIDEO, DVD-RW,DVD-R, DVD+RW,

    DVD+R

    DVD-VIDEO, recorded DVD+RW/DVD-RW(V)/DVDR/+R discs that havebeen recorded and finalized, or a USB storage media containing DivX, MKV,MP4 contents.

    MUSICCD-RW/-R, DVD-RW/-R,

    BD-RE/-RMusic recorded on CD-RW/-R, DVD-RW/-R, BD-RE/-R discs or a USBstorage media containing MP3 or WMA contents.

    PHOTOCD-RW/-R, DVD-RW/-R,

    BD-RE/-RPhotos recorded on CD-RW/-R, DVD-RW/-R, BD-RE/-R discs or a USBstorage media containing JPEG contents.

    NOTE

    The product may not play certain CD-RW/-R and DVD-R because of the disc type or recording conditions.

    If a DVD-RW/-R disc has not been recorded properly in DVD video format, it will not be playable.

    Your product will not play content that has been recorded on a DVD-R at a bit rate that exceeds 10 Mbps.

    Your product will not play content that has been recorded on a BD-R or USB device at a bit rate that exceeds 30 Mbps.

    Playback may not work for some types of discs, or when you use specific operations, such as angle change and aspect ratioadjustment. Information about the discs is written in detail on the disc box. Please refer to this if necessary.

    When you play a BD-J title, loading may take longer than a normal title or some functions may perform slowly.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 2-8

  • 2. Product Specification

    2.4.2. Disc types your product cannot play

    HD DVD

    DVD-ROM/PD/MV-Disc,etc

    DVD-RAM

    Super Audio CD(except CD layer)

    DVD-RW (VR mode)

    CVD/CD-ROM/CDV/CD-G/CD-I/LD(CD-Gs play audio only,not graphics.)

    3.9 GB DVD-R Disc forAuthoring.

    NOTE

    This product may not respond to all operating commands because some Blu-ray Disc, DVD, and CD discs allow specific orlimited operation and provide only certain features during playback. Please note that this is not a defect in the product.

    Samsung cannot guarantee that this product will play every disc bearing the Blu-ray Disc, DVD or CD logo because discformats evolve, and problems and errors may occur during the creation of Blu-ray Disc, DVD, and CD software and/orthe manufacture of discs.

    Please contact the SAMSUNG Customer Care Centre, if you have questions or encounter difficulty when playing Blu-rayDisc, DVD, or CD discs in this product. Also, refer to rest of this user manual for additional information on playbackrestrictions.

    Some commercial discs and DVD discs purchased outside your region may not play on this product.

    2-9 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 2. Product Specification

    2.4.3. Region Code

    Both products and discs are coded by region.These regional codes must match for a disc to play. If the codes do not match, the disc will not play.The Region Number for this product is displayed on the rear panel of the product.

    Disc Type Region Code Area

    North America, Central America, South America, Korea, Japan, Taiwan, Hong Kongand South East Asia

    Europe, Greenland, French territories, Middle East, Africa, Australia and NewZealand

    Blu-ray Disc

    India, China, Russia, Central and South Asia

    The U.S., U.S. territories and Canada

    Europe, Japan, the Middle East, Egypt, South Africa, Greenland

    Taiwan, Korea, the Philippines, Indonesia, Hong Kong

    Mexico, South America, Central America, Australia, New Zealand, Pacific Islands,Caribbean

    Russia, Eastern Europe, India, most of Africa, North Korea, Mongolia

    DVD-VIDEO

    China

    NOTE

    If the Region number of a Blu-ray Disc/DVDs does not correspond to the Region number of this product, the productcannot play the disc.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 2-10

  • 2. Product Specification

    2.5. Logos of Discs the product can play

    Blu-ray Disc 3D Blu-ray Disc

    BD-LIVE Dolby

    DTS DivX

    NTSC broadcast system inU.S.A, Canada, Korea, Japan

    PAL broadcast system inU.K, France, Germany, etc.

    Java

    2-11 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 2. Product Specification

    2.5.1. Supported Formats

    Music File Support

    File Extension Container Audio Codec Support Range

    *.mp3 MP3 MP3 -

    *.wma WMA WMA

    Compliant with WMA version 10

    * Sampling rates (in kHz) - 8, 11, 16, 22, 32, 44.1, 48

    * Bitrates - All bitrates in the range 5 kbps to 384 kbps

    Video File Support

    File Extension Container Video Codec ResolutionFrame rate

    (fps)Bitrate(Mbps)

    Audio Codec

    DivX 3.11/4.x/5.1/6.0

    1920 x 1080 6 ~ 30 8

    H.264BP/MP/HP

    1920 x 1080 6 ~ 30 25*.avi AVI

    MPEG4SP/ASP

    1920 x 1080 6 ~ 30 8

    MP3

    AC3

    LPCM

    DTS Core

    DivX 3.11/4.x/5.1/6.0

    1920 x 1080 6 ~ 30 8

    H.264BP/MP/HP

    1920 x 1080 6 ~ 30 25*.mkv MKV

    MPEG4SP/ASP

    1920 x 1080 6 ~ 30 8

    MP3

    AC3

    LPCM

    DTS Core

    DivX 3.11/4.x/5.1/6.0

    1920 x 1080 6 ~ 30 8

    H.264BP/MP/HP

    1920 x 1080 6 ~ 30 25*.asf ASF

    MPEG4SP/ASP

    1920 x 1080 6 ~ 30 8

    MP3

    AC3

    LPCM

    WMA

    *.wmv ASFWindow Media

    Video v91920 x 1080 6 ~ 30 25 WMA

    H.264BP/MP/HP

    1920 x 1080 6 ~ 30 25

    *.mp4 MP4MPEG4SP/ASP

    1920 x 1080 6 ~ 30 8

    MP3

    AAC

    H.264BP/MP/HP

    1920 x 1080 6 ~ 30 25

    *.3gp 3GPPMPEG4SP/ASP

    1920 x 1080 6 ~ 30 8

    AAC

    MPEG2 1920 x 1080 24/25/30 25

    *.vroVRO

    VOB MPEG1 1920 x 1080 24/25/30 25

    AC3

    MPEG

    LPCM

    Copyright 1995-2012 SAMSUNG. All rights reserved. 2-12

  • 2. Product Specification

    File Extension Container Video Codec ResolutionFrame rate

    (fps)Bitrate(Mbps)

    Audio Codec

    MPEG1 1920 x 1080 24/25/30 25

    MPEG2 1920 x 1080 24/25/30 25*.mpg

    *.mpegPS

    H.264 1920 x 1080 6 ~ 30 25

    AC3

    MPEG

    LPCM

    AAC

    MPEG2 1920 x 1080 24/25/30 25

    H.264 1920 x 1080 6 ~ 30 25*.ts

    *.tp

    *.trp

    TS

    VC1 1920 x 1080 6 ~ 30 25

    AC3

    AAC

    MP3

    DD+

    Limitations

    Even when a file is encoded by a supported codes listed above, the file might not be played if its content has a problem.

    Normal playback is not guaranteed if the files container information is wrong or the file itself is corrupted.

    Files having higher bit or frame rates than standard may stutter when played back.

    2-13 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 2. Product Specification

    2.6. Accessories

    2.6.1. Supplied Accessories

    Accessories Item Item code Remark

    Remote Control AH59-02407A

    Ferrite Core 3301-000144

    Batteries (AAA size) 4301-000116

    Video Cable AH39-40001V

    FM Antenna AH42-00021A

    User Manual AH68-02438H

    Local Samsung Dealer

    Copyright 1995-2012 SAMSUNG. All rights reserved. 2-14

  • 3. Disassembly and Reassembly

    3. Disassembly and Reassembly

    3.1. Overall Disassembly and Reassembly

    CAUTION

    Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

    Be sure to carefully read and understand the safety instructions before performing any work as the IC chips onthe PCB are vulnerable to static electricity.

    In order to assemble reverse the order of disassembly.

    Description Description Photo

    1. Unfasten 4 screws on the rear side.: BH,+,B,M3,L10,ZPC(BLK),SWRCH18A

    2. Slide the COVER-TOP back to remove.Pull and lift up COVER-TOP rear side.

    CAUTION

    Be careful not to make any scratches as you remove them.

    3. Disconnect the FPC cable between the COVER-FRONT ASSYand the MAIN PCB.

    3-1 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 3. Disassembly and Reassembly

    Description Description Photo

    1) Loosen the bottom and side clips and tilt up.

    2) Lift the COVER-FRONT at a 45 degree angle upward. then thehooks on the top side can be automatically removed.

    (1) (1) (1)

    (1)

    (2)

    (2) (2) (2)

    Copyright 1995-2012 SAMSUNG. All rights reserved. 3-2

  • 3. Disassembly and Reassembly

    Description Description Photo

    4. Disconnect the DECK cable from the MAIN-PCB.

    Unfasten the screws of 4 points around the.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF

    Remove the DECK from the COVER-BOTTOM.

    5. For WiI-Fi, unfasten 1 connector to MAIN ASSY and 1 screw.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF

    3-3 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 3. Disassembly and Reassembly

    Description Description Photo

    6. To remove the MAIN+AMP ASSY, PCB unfasten 5 screws on theboard and 2 on the rear.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF

    Remove the bridge connection between the main and power,remove the fan cable connection and remove the metal supportpost in the center.

    Remove the MAIN from the case.

    7. Unplug the FAN cable connected to the main board and thenremove the main board from the case.

    8. Before pull out the SMPS PCB, Unplug the connector.

    9. For SMPS, PCB unfasten 4 screws on bottom-side.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF

    Copyright 1995-2012 SAMSUNG. All rights reserved. 3-4

  • 4. Troubleshooting

    4. Troubleshooting

    4.1. Checkpoints by Error Mode

    Oscilloscope Setting Values Normal Voltage 24 MHz 32.768 KHz

    Voltage/DIV 1 V/div 200 mV/div 500 mV/div

    TIME/DIV 100 ms/div 100 ns/div 100 us/div

    4-1 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    4.1.1. No Power

    Yes

    Yes

    Replace Fuse (FP801S)or SMPS PCB.

    Check MAIN ASS'Y- Specia lly check a round

    MICOM IC. (Vcc)Check primary side .

    Fuse (FP8 01S) OK?

    Check D-DC IC(ICM823) sh ort tes t pin 7

    to p in 1, 2 , 3, 4 , 5, 6 , 8 OK(me ans not sh ort)?

    (1)3.4 V Output Check

    (CNA821, P in 10, 11) 3.4 V ~ 3 .6 V

    (3)Replace IC (ICA801)

    or SMPS PCB.

    (4)Replace FET (MA801)

    or SMPS PCB.

    Check Check FET(MA801) a ll pins a re not shorte d to

    each other.

    Check Sw itch ing IC (ICA801) short te st p in 8 to

    pin 1, 2, 3, 4, 5, 6, 7 OK(means not sh ort)?

    YesNo

    No

    No

    No

    No

    (5)Replace DIODE (DRA821,

    DM824) or SMPS PCB.

    (2)Replace DC-DC IC (ICM823)

    or SMPS PCB.

    (6)Replace DC-DC IC (ICM822)

    or SMPS PCB.

    Replace SMPS PCB.

    No

    No

    Yes

    Yes

    Yes

    Yes

    Check D-DC IC (ICM822) short tes t pin 3 to

    pin 1, 2, 4, 5 OK(means not sh ort)?

    Check DRA821, DM824short test Anode to ca thode .

    No Power De tecte d(Stand by LED OFF)

    * Refer to wave pa ttern image of Fig. 4-1 . * Refer to wave pa ttern image of Fig. 4-2.

    * Refer to wave pa ttern image of Fig. 4-3.

    * Refer to wave pa ttern image of Fig. 4-3.

    * Refer to wave pa ttern image of Fig. 4-4.

    * Refer to wave pa ttern image of Fig. 4-4.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-2

  • 4. Troubleshooting

    N11VN11VN11V

    3.4V3.4V

    R12V

    28V_34V

    28V_34V28V_34V

    28V_34V28V_34V

    AH62-30 122AHEATSINK

    SS

    EN

    VIN

    BT PH

    VSNS

    COMP

    GND

    GND

    GND

    GNDGND

    VPS

    GNDGND

    GNDGNDGND

    R12VP-ON

    3.4V_S

    TP7

    TP8

    R12 V_STP5

    TP1TP2

    20

    1817161514

    VPS

    GND_01_S

    1N5819 40VDM830

    25V470U FCM836

    1N5819 40VDM829

    1MF25V

    CM828

    330KOHM 1/10WRM839

    CM827

    60V

    SB36 0DM821

    50VCM825

    LM8241/10W18KOHM

    RM837

    LM822

    GND_01_S

    1/10W2.1KOH M

    RM829

    AP1501-T5 RICM822

    1

    2

    3

    4

    5

    1/4W10KOHMRM828

    GND_01_S

    EY826

    EY828

    SRC1203STRM821

    22NF50V

    CM829

    RM833

    TPS 54331DICM823

    1234

    5678

    100N F50V

    CM846

    DM831

    GND_01_S

    10UHLM823

    GND_01_ S

    10UF10V

    CM833

    1MF10V

    CM834

    GND_01_S

    16V1UF

    CM845

    3857S TFBM821

    470UF10V

    CM835

    GDZJ4.3BZDM822

    KLG123E

    LED851

    1.8KOHM1/10W

    RM841

    TP13

    TP14

    GND_01_S

    TP11 TP1 2

    TP6

    TP10

    TP9

    TWG-P23P-A1CNA821

    123456789

    10111213

    19

    212223

    TP3 TP4

    FBGND

    OUT

    SDVIN

    E

    BC

    VSENSESS

    GND

    PH

    COMPEN

    VIN

    BOOT

    AH62-30 122AHEATSINK

    SS

    EN

    VIN

    BT PH

    VSNS

    COMP

    GND

    GND

    GND

    GNDGND

    VPS

    GNDGND

    GNDGNDGND

    R12VP-ON

    GND_01_S

    1N5819 40V

    25V470U F

    1N5819 40V

    1MF25V

    330KOHM 1/10W

    25V

    60V

    SB36 0

    50V

    1/10W18KOHM

    GND_01_S

    1/10W2.1KOH M

    AP1501-T5 R 1/4W10KOHM

    GND_01_S

    SRC1203S

    22NF50V

    TPS 54331D

    100N F50V

    GND_01_S

    10UH

    GND_01_S

    10UF10V

    1MF10V

    GND_01_S

    16V1UF

    3857S T

    470UF10V

    GDZJ4.3B

    KLG123E

    1.8KOHM1/10W

    GND_01_S

    TWG-P23P-A1

    DM830

    CM836

    DM829

    CM828

    RM839

    CM827

    DM821

    CM825

    LM824

    RM837

    LM822

    RM829

    ICM822RM828

    EY826

    EY828

    TRM821

    CM829

    RM833

    ICM823

    CM846

    DM831

    LM823 CM833

    CM834

    CM845

    FBM821

    CM835

    ZDM822

    LED851

    RM841

    TP13

    TP14

    TP11 TP1 2

    TP6

    TP10

    TP9

    CNA821

    TP3 TP4

    VPS

    20

    1817161514

    1

    2

    3

    4

    5

    1234

    5678

    123456789

    10111213

    19

    212223

    FBGND

    OUT

    SDVIN

    E

    BC

    VSENSESS

    GND

    PH

    COMPEN

    VIN

    BOOT

    * 6.18. SMPS

    * 5.6. SMPS PCB Top

    (1)

    (1)

    4-3 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    SS

    EN

    VIN

    BT PH

    VSNS

    COMP

    GND

    40VDM830

    40V

    1MF25V

    CM828

    1UF25V

    CM8301/10W62KOHM

    RM840

    330KOHM 1/10WRM839

    GND_0 1_S

    22NF50V

    CM829

    30KOHM1/10W

    RM833

    TPS54 331DICM823

    1234

    5678

    100NF50V

    CM846

    50V1NF

    CM831

    DM831

    GND_0 1_S

    10UHLM823

    GND_0 1_S

    10UF10V

    CM833

    1MF10V

    CM834

    GND_0 1_S

    16V1UF

    CM845

    3857STFBM821

    470UF10V

    CM83

    GND_0 1_S

    VSENSESS

    GND

    PH

    COMPEN

    VIN

    BOOT

    SS

    EN

    VIN

    BT PH

    VSNS

    COMP

    GND

    40V

    40V

    1MF25V

    1UF25V

    1/10W62KOHM

    330KOHM 1/10W

    GND_0 1_S

    22NF50V

    30KOHM1/10W

    TPS54 331D

    100NF50V

    50V1NF

    GND_0 1_S

    10UH

    GND_0 1_S

    10UF10V

    1MF10V

    GND_0 1_S

    16V1UF

    3857ST

    470UF10V

    GND_0 1_S

    DM830

    CM828

    CM830RM840

    RM839

    CM829

    RM833

    ICM823

    CM846

    CM831

    DM831

    LM823 CM833

    CM834

    CM845

    FBM821

    CM83

    1234

    5678

    VSENSESS

    GND

    PH

    COMPEN

    VIN

    BOOT

    * 6.18. SMPS

    * 5.7. SMPS PCB Bottom

    (2)

    (2)

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-4

  • 4. Troubleshooting

    HEAT

    SINK

    AH62

    -00

    201H

    OPTION

    ZC_02_P

    CS_04_ P

    18V_VCC_03_P

    HV_P

    GA_03_ P

    ZC_01_P

    18V_VCC_ 05_P

    GA_02_ P

    GA_01_P

    CS_01_P

    18V_VCC_02_

    SN_A_01_P

    450V_A_02_P

    18V_VCC_01_P

    450V_A_01_P

    UDZSNPTE-17 9.1B

    22UFCA806

    KTC3875S S-BLTRA801

    50V220P FCA813

    GND_P

    1/10W3.3KOHM

    RA810

    ICE2QS03ICA801

    1234 5

    678

    1/10W33KOHM

    RA813

    GDZJ 24BZDM823

    50V1NFCA807

    1/10W15KOHM

    RA808

    1KOHM 1/4WRA805

    SS1 4DA805

    10NF 630VCA811

    1N4148WS

    33KOHM 2W

    SN_A_02_P

    RA804

    1N4148WS

    33KOHM 2WRA803

    1N4148WSDA807

    220OHM 1/10WRA809

    1SR154-400TE25DA806

    220OHM1/4W

    RA807

    4.7OH M 1/4WRA806

    5W0.1OHM

    RA811

    EY825SPA11N80C3

    MA801

    EY8241000VDA804

    1000VDA803

    68PF 1KV

    1KV560PF

    CA810

    EY82

    3857STFBA801

    E

    BC

    HVHV

    VCC

    GND

    GATECS

    FB

    ZCS

    D

    G

    HEAT

    SINK

    AH62

    -00

    201H

    OPTION

    UDZSNPTE-17 9.1B

    22UF

    KTC3875S S-BL

    50V220P FGND_P

    1/10W3.3KOHM

    ICE2QS03

    1/10W33KOHM

    GDZJ 24B

    FN1 V05

    1/10W15KOHM

    1KOHM 1/4WSS1 4

    10NF 630V

    1N4148WS

    33KOHM 2W

    1N4148WS

    33KOHM 2W

    1N4148WS

    220OHM 1/10W

    1SR154-400TE25

    220OHM1/4W

    4.7OH M 1/4W

    5W0.1OHM

    SPA11N80C3

    1000V

    1000V

    68PF 1KV

    1KV560PF

    3857ST

    CA806

    TRA801

    CA813

    RA810

    ICA801

    RA813

    ZDM823

    CA807

    RA808

    RA805 DA805

    CA811

    RA804 RA803

    DA807

    RA809

    DA806

    RA807

    RA806

    RA811

    EY825

    MA801

    EY824

    DA804

    DA803

    CA810

    EY82

    FBA801

    ZC_02_P

    CS_04_ P

    18V_VCC_03_P

    HV_P

    GA_03_ P

    ZC_01_P

    18V_VCC_ 05_P

    GA_02_ P

    GA_01_P

    CS_01_P

    18V_VCC_02_

    SN_A_01_P

    450V_A_02_P

    18V_VCC_01_P

    450V_A_01_PSN_A_02_P

    1234 5

    678

    E

    BC

    HVHV

    VCC

    GND

    GATECS

    FB

    ZCS

    D

    G

    * 6.18. SMPS

    * 5.6. SMPS PCB Top

    (3)

    (3)

    (4)

    (4)

    4-5 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    AH62-30122AHEATSINK

    HEAT

    SINK

    AH62

    -00

    201H

    OP TION

    AH62-00201HHEATSINK

    11V_S

    TP7

    TP8

    28V_34V_S

    R12V_STP5

    TP2

    VPS

    IC_1

    18V_VCC_03_ P

    GA_02_P

    GA_01_P

    CS_01_ P

    18V_VCC_02_ P

    450 V_A_02_ P

    18V_VCC_01_ P

    450 V_A_01_ P

    IC_1

    VPS

    IC_1 FB_2

    3.3 KOHM1/10W

    RM823

    50V100N F

    CM822

    GND_P

    CA8081SR 154- 400TE2 5DA808

    GND_P

    3857STLM821

    AP1501 -T5RICM822

    1

    2

    3

    4

    5

    1/4W10KOHMRM828

    EY826

    EY828

    SDA807

    220OH M 1/10WRA809

    1SR 154- 400TE2 5DA806

    220OH M1/4W

    RA807

    4.7OHM 1/4WRA806

    5W0.1OHM

    RA811

    EY825SPA11N 80C 3

    MA801

    EY8241000VDA804

    1000VDA803

    68PF 1KVCA812

    1/4W2.2OHM

    RA812

    GND_P

    1KV560PF

    CA810GND_P

    470PF400V

    CY805S12

    400V 1NFCY803S

    EY821

    EY827

    3857STFBA801

    EY818 ER4 220TA801S

    1234

    56 7

    89

    101112

    EY820

    EY822

    SF3004 PT 200VDRA821

    EY823

    50V1MF

    CA821

    GND_01_S

    SHK75-11 100VDM824A

    100VSHK75-11

    DM824

    TP6

    TP3 TP4

    1MF50V

    CA8221MF50V

    CA823

    50V1MFCA824

    GND_01_S

    1/4W1OHM

    RA822

    2.9UHLA821

    1/10W33KOHM

    RA821

    FBGND

    OUT

    SDVIN

    S

    D

    G

    AH62-30122AHEATSINK

    HEAT

    SINK

    AH62

    -00

    201H

    OP TION

    AH62-00201HHEATSINK

    3.3 KOHM1/10W

    50V100N F

    GND_P

    1SR 154- 400TE2 5

    GND_P

    3857ST

    AP1501 -T5R 1/4W10KOHM

    S

    220OH M 1/10W

    1SR 154- 400TE2 5

    220OH M1/4W

    4.7OH M 1/4W

    5W0.1OHM

    SPA11N 80C 3

    1000V

    1000V

    68PF 1KV

    1/4W2.2OHM

    GND_P

    1KV560PF

    GND_P

    470PF400V

    400 V 1NF

    3857ST

    ER4 220

    SF3004 PT 200V

    50V1MF

    GND_01_S

    SHK75-11 100V

    100VSHK75-11

    1MF50V

    1MF50V

    50V1MF

    GND_01_S

    1/4W1OHM

    2.9UH

    1/10W33KOHM

    RM823

    CM822

    8 DA808

    LM821

    ICM822RM828

    EY826

    EY828

    DA807

    RA809

    DA806

    RA807

    RA806

    RA811

    EY825

    MA801

    EY824

    DA804

    DA803

    CA812

    RA812

    CA810

    CY805S

    CY803S

    EY821

    EY827

    FBA801

    EY818TA801S EY820

    EY822

    DRA821

    EY823

    CA821

    DM824A

    DM824

    TP6

    TP3 TP4

    CA822 CA823CA824

    RA822

    LA821

    RA821

    VPS

    IC_1

    18V_VCC_03_ P

    GA_02_P

    GA_01_P

    CS_01_ P

    18V_VCC_02_ P

    450 V_A_02_ P

    18V_VCC_01_ P

    450 V_A_01_ P

    IC_1

    VPS

    IC_1 FB_2

    1

    2

    3

    4

    5

    12

    1234

    56 7

    89

    101112

    FBGND

    OUT

    SDVIN

    S

    D

    G

    * 6.18. SMPS

    * 5.6. SMPS PCB Top

    (5)

    (5)

    (6)

    (5)

    (5)

    (6)

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-6

  • 4. Troubleshooting

    4.1.2. No Sound

    Change speaker cable .No

    Yes

    Yes

    Speaker j ack(including pins) OK?

    Speaker c able ok?

    Check wire less co nnection o rmicom option.

    Yes

    No so und in a ll ch anne ls?

    Change speaker jack.No

    Change MAIN PCB.No

    There is n o au dio soun d from speaker.

    4-7 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    4.1.3. Disc Loading Error

    Change SMPS.

    No

    No

    Reinsert DECK cable correctly.

    Yes

    Is th e Deck cabl e (be tween MAIN & DECK)

    inserted correct ly?

    (1)Check Po wer

    R12V of MAIN PCB.

    Disc Loading Error

    Yes

    Change the DECK.

    * Refer to wave pa ttern image of Fig. 4-5 .

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-8

  • 4. Troubleshooting

    PVDD (+28V ~ 34V)

    D12V

    _3D1

    2V_2

    D12V

    _1

    - - -

    BD1 0.01OHM5000MABD13 0.01OHM5000MABD14 0.01OHM5000MA

    D12V_PW

    ST3.

    4VST

    3.4V

    _10

    --

    BD92 5000MA

    0.01OHM

    BD930.01OHM

    5000MA

    +35V

    P_O N

    VARI_SMPS

    127301123K2CN2001

    1234567891011121314151617181920212223

    -

    R12V_ 2

    -

    DGND

    _12

    -

    DGND

    _11

    -

    DGND

    _10

    -

    DGND

    _9

    -

    P_O N

    -

    PGND

    6

    -

    PGND

    8

    -

    PGND

    7

    -

    PGND

    10

    - PGND

    9-

    R12V_ 1

    R12V

    47K

    OHM

    R204

    5

    -PVDD

    1

    -PVDD

    2

    -PVDD

    3

    -PVDD

    4

    - PVDD

    5

    8E8>

    10UF

    10V

    C833

    10UF

    10V

    C904

    1.5OH

    M

    R205

    5

    100N

    F

    C208

    8

    - VARI

    _SM

    PS

    2E3>PGND

    6.3VC9

    05

    PVDD (+28V ~ 34V)

    - - -

    0.01OHM5000MA0.01OHM5000MA0.01OHM5000MA

    D12V_PW

    --

    5000MA

    0.01OHM0.01OHM

    5000MA

    +35V

    127301123K2

    -

    - - --

    -

    - -

    -

    -

    -

    -

    R12V

    47K

    OHM

    -

    -

    - - -

    10UF

    10V

    10UF

    10V

    -

    PGND

    6.3V

    D12V

    _3D1

    2V_2

    D12V

    _1

    BD1BD13BD14

    ST3.

    4VST

    3.4V

    _10

    BD92BD93

    CN2001

    R12V_ 2

    DGND

    _12

    DGND

    _11

    DGND

    _10

    DGND

    _9

    P_O N

    PGND

    6

    PGND

    8PG

    ND7

    PGND

    10PG

    ND9

    R12V_ 1

    R204

    5

    PVDD

    1PV

    DD2

    PVDD

    3PV

    DD4

    PVDD

    5

    C833

    C904

    R205

    5C2

    088

    VARI

    _SM

    PS

    C905

    8E8>

    2E3>

    P_O N

    VARI_SMPS

    1234567891011121314151617181920212223

    * 6.5. DC-DC POWER

    CN

    20

    01

    IC2 00 2 IC2 0 01

    IC9 1 * 5.6. SMPS PCB Top

    (1)

    (1)

    4-9 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    4.1.4. Remote doesnt work

    Change the Batte ry.

    No

    No

    Re-insert FFC cable correctly.

    No Change REYE1 or change the FRONT PANEL PCB.

    Yes

    Yes

    Yes

    Remote Battery OK?

    (1)REYE1 Pin 1 S igna l OK?

    Remote control does not work

    Change the power of IC23 Pin 7, change the MAIN PCB.

    Is th e FFC Cab le (be tween Fro nt pane l & MAIN)

    OK?

    * Refer to wave pa ttern image of Fig. 4-6 .

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-10

  • 4. Troubleshooting

    V5

    TP V_5V

    ST3 .4

    TP

    ST3.4V

    USB5VTPUSB5V

    1/10W

    R16

    47O HM

    ST3. 4V

    FUNCSTO P

    REMOT_IN

    V_GNDDGND

    AVGND

    40000 OHM*BD2

    40000 OHM*BD1

    DGND

    FCON1

    DGND

    47NF50V

    C70

    TPUSB-

    TDATP

    TCLK

    11MLVS-0603-E08

    C17

    DGND

    R96FS1A

    REYE1

    1

    2

    3

    1/10W220O HM

    VR30

    220O HMVR29

    6.2

    UDZS

    TE-

    17 6

    .2B

    D12

    47O HM1/10W

    R76

    DGND

    GND

    VCC

    VOUT

    TP V_5V

    TP

    ST3.4V

    TPUSB5V

    1/10W47O HM

    ST3. 4V

    V_GNDDGND

    AVGND

    40000 OHM*

    40000 OHM*

    DGND

    DGND

    47NF50V

    TPTP

    11MLVS-0603-E08

    DGND

    R96FS1A1/10W220O HM220O HM

    6.2

    UDZS

    TE-

    17 6

    .2B

    47O HM1/10W

    DGND

    V5

    ST3 .4 USB5V

    R16

    BD2

    BD1

    FCON1

    C70

    USB-TDA TCLK

    C17

    REYE1VR30VR29

    D12

    R76

    FUNCSTO P

    REMOT_IN 1

    2

    3 GND

    VCC

    VOUT

    * 6.2. FRONT

    * 5.2. FRONT Top

    (1)

    (1)

    (1)

    4-11 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    4.1.5. No Picture (HDMI)

    Select correct TV mode .

    No

    No

    Add some solder creamthrough HD7 ~ 10.

    No Check HIC1 prephera l ircuit.If a ll is ok, change HIC1.

    Yes

    Yes

    Yes

    Yes

    (1)Check HD7 ~ 10 Signa l.

    Video se lection accords with ca ble co nnection and

    TV mode?

    (2)Check HOE5, HOE6 Signa l.

    No Picture (HDMI)

    HDMI ca ble Erro r.

    No Check HIC1 prephera l circuit.If a ll is ok, change HIC1.Check HO1 Soldering sta tus .

    * Refer to wave pa ttern image of Fig. 4-9 .

    * Refer to wave pa ttern image of Fig. 4-7 an d Fig. 4-8 .

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-12

  • 4. Troubleshooting

    HD_INPO RT0

    HS0_R1+HS0_R1- 10E10 Support > Software Upgrade.

    7) Select By USB.

    NOTE

    The disc tray must be empty when you upgrade the software using the USB Host jack.

    When the software upgrade is done, check the software details in the software Upgrade menu.

    Do not turn off the product during the software upgrade. It may cause the product to malfunction.

    Software upgrades using the USB Host jack must be performed with a USB memory flash stick only.

    By Disc

    To upgrade by Disc, follow these steps:

    1) Visit www.samsung.com/bluraysupport.

    2) Download the latest disc software upgrade zip archive to your computer.

    3) Unzip the zip archive to your computer. You should have a single folder with the same name as the zip file.

    4) Write the folder onto a disc. We recommend a CD-R or DVD-R.

    5) Finalize the disc before you remove it from your computer.

    6) Insert the disc into product.

    7) In the products menu, go to Settings > Support > Software upgrade.

    8) Select By Disc.

    NOTE

    When the system upgrade is done, check the software details in the software Upgrade menu.

    Do not turn off the product during the Software Upgrade. It may cause the product malfunction.

    4-27 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    By Downloaded

    The By Downloaded option lets you upgrade using a file the product downloaded earlier but you decided not to installimmediately or a file downloaded by the product in Standby Mode (See Download in Standby Mode below).

    To upgrade By Downloaded, follow these steps:

    1) If upgrade software has been downloaded, you will see the software version number to the right of By Downloaded.

    2) Select By Downloaded, and then press the ENTER button.

    3) The product displays a message asking if you want to upgrade. Select Yes. The product begins the upgrade.

    4) When the update is complete, the product turns off automatically, and then turns on.

    NOTE

    When the system upgrade is done, check the software details in the software Upgrade menu.

    Do not turn off the product during the software Upgrade. It may cause the product to malfunction.

    To use the By Downloaded function, your product must be connected to the Internet.

    Download in Standby Mode

    You can set the Download in Standby Mode function so that the product downloads new upgrade software when it is inStandby mode. In Standby mode, the product is off, but its Internet connection is active. This allows the product todownload upgrade software automatically, when you are not using it.

    To set Download in Standby Mode, follow these steps:

    1) Press the buttons to select Download in Standby Mode, and then press the ENTER button.

    2) Select On or Off.

    Off : If you select Off, the product will notify you with a pop up message when new upgrade software is available.

    On : If you select On, the product will automatically download new upgrade software when it is in Standbymode with the power off. If it downloads new upgrade software, the product will ask you if you want to install itwhen you turn the product on.

    NOTE

    To use the Download in Standby Mode function, your product must be connected to the Internet.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-28

  • 4. Troubleshooting

    4.2.3. Cold Start Method (Initialize Setup)

    1) This is useful for forgotten Parental Lock password.

    2) Press button on the front panel for over 5 seconds while no disc status.

    3) Then, VFD sign : INIT Power will be turned off automatically.

    4) System Micom Cold Start :During Stand-By, just press the Stop Button " of remote-controller for over 5 seconds. Then, VFD sign : "RESET".

    4-29 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    4.3. Buyer-Region Code Setting Method

    4.3.1. Inserting the Region Code after replacing the Main PCB

    NOTE

    After replacing the Main PCB and System Micom (IC23), the region code should be inserted.

    The unit will not work properly if you do not insert the correct region code.

    You must use the remote control.

    1) Select the "AUX" mode and then press the "Tuner Memory" button on the remote control for 4-5 seconds.

    (1)

    (2)

    2) You should see the T-MODE message display on the VFD. Press the direction button during this message.

    NOTE

    The T-MODE indicator on the VFD only appears for a very short time.

    T-MODE

    3) You can see TEST on the VFD. Insert the number 46 to select the Region Code.

    TEST

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-30

  • 4. Troubleshooting

    4) After step (3), you can see on the VFD.

    Insert the Region Code (see Table on next page) corresponding to the model and area in which you reside in using the0-9 buttons on the remote control. And then turn off the power.

    5) In order to check if you inputted correctly, please do Number 1, 2, 3 again and then during TEST MODE insertnumber 47. After that, you can check the option code which you inserted. For example, you can see 000US5. It meansthat you inserted region code 000 and the region is USA which supports 5.1CH Audio output. If it is 047EU2, itmeans that you inserted region code 047 and the region is Europe which supports 2.1ch Audio output.

    4-31 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 4. Troubleshooting

    Table 4.1 HT-E5xxx 5.1CH DECK Option Table

    Region Code Area

    000 USA(ZA)

    001 JAPAN

    002 KOREA(KR)

    003 TAIWAN(ZW)

    004 PHILIPPINES(XP)

    005 MAXICO, PANAMA, COLOMBIA(ZL)

    006 PERU(PE), CHILE(ZS), ARGENTINA(ZB)

    007 EU(ZF), (XN), (XE), (EN), (ZV), (EN), (XU), TURKY(TK)

    008 SINGPORE, VIETNAM(XS), INDONESIA(XD), MALAYSIA(XM), THAILAND(XT), INDIA(XL)

    009

    010 RUSSIA, UKRAINE, KAZAKHSTAN(RU)

    011 AUSTRALIA, NEWZILAND(XY)

    012ARAB, PAKISTAN, EGYPT, IRAQ, LEBANON, SYLBIA, MOROCCO, TUNIS(ZN), SAUDI(UM),ALGERIA(SH), S.AFRICA(XA), ISRAEL(SQ), NIGERIA(SW), SUDAN(SJ), ETIOPIA, KENYA(KE)

    013 CHINA(XZ), HONGKONG(ZK)

    014 BRAZIL(ZD)

    015 CANADA(ZC)

    016 IRAN(HC)

    017 ETC1

    018 ETC2

    019 ETC3

    Copyright 1995-2012 SAMSUNG. All rights reserved. 4-32

  • 4. Troubleshooting

    Table 4.2 HT-E5200 2.1CH DECK Option Table

    Region Code Area

    020 USA(ZA)

    021 JAPAN

    022 KOREA(KR)

    023 TAIWAN(ZW)

    024 PHILIPPINES(XP)

    025 MAXICO, PANAMA, COLOMBIA(ZL)

    026 PERU(PE), CHILE(ZS), ARGENTINA(ZB)

    027 EU(ZF), (XN), (XE), (EN), (ZV), (EN), (XU), TURKY(TK)

    028 SINGPORE, VIETNAM(XS), INDONESIA(XD), MALAYSIA(XM), THAILAND(XT), INDIA(XL)

    029

    030 RUSSIA, UKRAINE, KAZAKHSTAN(RU)

    031 AUSTRALIA, NEWZILAND(XY)

    032ARAB, PAKISTAN, EGYPT, IRAQ, LEBANON, SYLBIA, MOROCCO, TUNIS(ZN), SAUDI(UM),ALGERIA(SH), S.AFRICA(XA), ISRAEL(SQ), NIGERIA(SW), SUDAN(SJ), ETIOPIA, KENYA(KE)

    033 CHINA(XZ), HONGKONG(ZK)

    034 BRAZIL(ZD)

    035 CANADA(ZC)

    036 IRAN(HC)

    037 ETC1

    038 ETC2

    039 ETC3

    4-33 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 5. PCB Diagram

    5. PCB Diagram

    5.1. Wiring Diagram

    M_B- 40 M_B-M_B W 15 W M_BM_A V V M_AM_A- U U M_A-GND CM CM GNDCD LD SLO2- SLO2- CD LDBDLD SLO2+ SLO2+ BDLDDVD LD SLO1- SLO1- DVD LDGND SLO1+ SLO1+ GND 23 +35V +35V 23CD_VR NC NC CD_VR +35V +35VDVD_MP D GND GND DVD_MP D +35V +35VDVD_VR OP EN OP EN DVD_VR +35V +35VBD MP D CLOSE CLOSE BD MP D +35V +35VP U_SEL LDO- LDO- P U_SEL P GND P GNDBD_P D_FSW LDO+ LDO+ BD_P D_FSW P GND P GNDDVD_P D_FSW DISCIN 1 DISCIN DVD_P D_FSW P GND P GNDVREF_2.1V VREF_2.1V P GND P GNDVCC_5V VCC_5V P GND P GNDVREF_1.65V VREF_1.65V R12V R12VBD RF+ BD RF+ VARI_SMP S VARI_SMP SBD RF- BD RF- ST3.4V ST3.4VH H ST3.4V ST3.4VG G DGND DGNDF F DGND DGNDE E D12V_P W D12V_P WD D D12V_P W D12V_P WC C D12V_P W D12V_P WB B DGND DGNDA A P _ON P _ONGND GND R12V R12VT- T- 1 DGND DGND 1F2- F2-F2+ F2+F1- F1-F1+ F1+T+ T+GND GNDGND GNDGND GNDBD_HFM 1 BD_HFM

    USB5V 28 1 USB5V

    USB5V USB5V

    USB - USB -

    USB+ USB+

    Touch Key CLK TOUCH CLK

    Touch Key DATA TOUCH DATA

    DGND GND

    BUZZER BUZZER

    REMOT REMOT

    V5V D5V

    ST3.4V ST3.3V

    DGND GND

    VGND GND

    VFD12V_P W R12V

    VFD12V_P W R12V

    VGND GND

    VFD CE VFD CE

    VFD DATA VFD DATA

    VFD CLK VFD CLK

    T_RES ET T_RESET

    MIC SIG MIC IN

    AVGND GND

    MIC SEN MIC SEN

    MIC DATA MIC DATA

    MIC CLK MIC CLK

    AVGND GND

    TACT TACT

    DGND 1 28 GND

    FRONT

    DECK

    CN2001

    CN22FCON1 SMPS

    CN3CN2

    MAIN + AMP

    Copyright 1995-2012 SAMSUNG. All rights reserved. 5-1

  • 5. PCB Diagram

    5.2. FRONT PCB Top

    FCON1

    VCN5

    KCN1 KCN2 US CN1

    KIC1

    (1)

    TP1

    5-2 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 5. PCB Diagram

    5.2.1. Pin Connection

    1) FCON1

    Touch Key / VFD / USB Interface Connector

    Pin No. Signal

    1 DGND

    2 TACT

    3 AVGND

    4 MIC CLK

    5 MIC DATA

    6 MIC SEN

    7 AVGND

    8 MIC SIG

    9 T_RESET

    10 VFD CLK

    11 VFD DATA

    12 VFD CE

    13 VGND

    14 VFD12V_PW

    15 VFD12V_PW

    16 VGND

    17 DGND

    18 ST3.4V

    19 V5V

    20 REMOT

    21 BUZZER

    22 DGND

    23 Touch Key DATA

    24 Touch Key CLK

    25 USB+

    26 USB -

    27 USB5V

    28 USB5V

    Copyright 1995-2012 SAMSUNG. All rights reserved. 5-3

  • 5. PCB Diagram

    5.2.2. Test Point Wave Form

    TP1

    5-4 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 5. PCB Diagram

    5.3. FRONT PCB Bottom

    IC5 VCN6 VIC1

    Copyright 1995-2012 SAMSUNG. All rights reserved. 5-5

  • 5. PCB Diagram

    5.4. MAIN PCB Top

    (1)

    TP2

    TP3

    TP4

    TP2

    CN95

    CN 1

    HCN2CN6

    CN703

    VCN1 HCN2 HCN1PCN1

    YCN10 0 5WCN2 CN2 0 0 2 CN2 0 0 3

    CN

    20

    01

    CN2 2CN2

    CN

    3

    CN2 5

    CN4

    BCN1

    CN99

    WCN1 HC

    N7

    IC3

    IC9

    IC2 9

    IC13

    IC17

    IC801

    IC14

    HIC1

    US BIC1

    IC23

    IC2

    ZIC 20 03 IC2002 IC2001

    IC8

    IC 41

    IC7IC9 1

    (2)

    (3)

    (4)

    (5)

    (6)

    5-6 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 5. PCB Diagram

    5.4.1. Pin Connection

    1) WCN1

    Wi-Fi Module

    Pin No. Signal

    1 WI 5V

    2 WIFI-

    3 WIFI+

    4 GND

    5 GND

    2) CN3

    Deck Pickup Connector

    Pin No. Signal

    1 BD_HFM

    2 GND

    3 GND

    4 GND

    5 T+

    6 F1+

    7 F1-

    8 F2+

    9 F2-

    10 T-

    11 GND

    12 A

    13 B

    14 C

    15 D

    16 E

    17 F

    18 G

    19 H

    20 BD RF-

    21 BD RF+

    22 VREF_1.65V

    23 VCC_5V

    24 VREF_2.1V

    25 DVD_PD_FSW

    26 BD_PD_FSW

    27 PU_SEL

    28 BD MPD

    29 DVD_VR

    30 DVD_MPD

    31 CD_VR

    32 GND

    33 DVD LD

    Pin No. Signal

    34 BDLD

    35 CD LD

    36 GND

    37 M_A-

    38 M_A

    39 M_B

    40 M_B-

    3) BCN1

    Bluetooth Module (exclude ZA buyer)

    Pin No. Signal

    1 GND

    2 BT+

    3 BT-

    4 D5V

    4) CN2

    Deck Motor Connector

    Pin No. Signal

    1 DISCIN

    2 LDO+

    3 LDO-

    4 CLOSE

    5 OPEN

    6 GND

    7 NC

    8 SLO1+

    9 SLO1-

    10 SLO2+

    11 SLO2-

    12 CM

    13 U

    14 V

    15 W

    5) CN22

    Touch Key / VFD / USB Interface Connector

    Pin No. Signal

    1 USB5V

    2 USB5V

    3 USB -

    4 USB+

    5 TOUCH CLK

    6 TOUCH DATA

    7 GND

    8 BUZZER

    9 REMOT

    10 D5V

    11 ST3.3V

    12 GND

    13 GND

    14 R12V

    15 R12V

    16 GND

    17 VFD CE

    18 VFD DATA

    19 VFD CLK

    20 T_RESET

    21 MIC IN

    22 GND

    23 MIC SEN

    24 MIC DATA

    25 MIC CLK

    26 GND

    27 TACT

    28 GND

    Copyright 1995-2012 SAMSUNG. All rights reserved. 5-7

  • 5. PCB Diagram

    6) CN2001

    MAIN Power Connector

    Pin No. Signal

    1 DGND

    2 R12V

    3 P_ON

    4 DGND

    5 D12V_PW

    6 D12V_PW

    7 D12V_PW

    8 DGND

    9 DGND

    10 ST3.4V

    11 ST3.4V

    12 VARI_SMPS

    13 R12V

    14 PGND

    15 PGND

    16 PGND

    17 PGND

    18 PGND

    19 +35V

    20 +35V

    21 +35V

    22 +35V

    23 +35V

    5-8 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 5. PCB Diagram

    5.4.2. Test Point Wave Form

    TP2 TP3 TP4

    Copyright 1995-2012 SAMSUNG. All rights reserved. 5-9

  • 5. PCB Diagram

    5.5. MAIN PCB Bottom

    5-10 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 5. PCB Diagram

    5.6. SMPS PCB Top

    CN802

    CN801

    Copyright 1995-2012 SAMSUNG. All rights reserved. 5-11

  • 5. PCB Diagram

    5.7. SMPS PCB Bottom

    5-12 Copyright 1995-2012 SAMSUNG. All rights reserved.

  • 6. Schematic Diagram

    6. Schematic Diagram

    6.1. Overall Block Diagram

    Bac k E ndFIRENZESDP1004

    VideoDec oder

    AudioDecoder

    Ethe rMAC

    Ethern et

    HDMITX

    MotorDriver

    SATA

    DDR3 DDR3 DDR3

    2Gb (128M x 16)

    MEM A MEM B

    VIDEOAMPMM1756AURE

    HDMI TX

    TMDS

    ADCCS53 46

    SPI I/FSys temU-com

    LC87F5 WC8A

    Pick -up / Loa de r

    AUX

    Tuner

    iPodCP CHIP

    USB 1 /2

    SMPSPOW ER

    PWMModula torTAS5538I2S 5.1ch

    WIFI

    IiPod CVBS VIDEO

    CVBS

    Fron t EndSC73 00

    iPodExtern e lDOCKING

    Wireles s TX Module

    I2S RearWireles s RX Module

    I2C USB1

    Swi tch ICTS5A23159

    HDMI RX EP9 2AS

    HDMI RX1

    HDMI RX2

    BUFFERSWITCH

    Aud ioDec oder

    SPD IF_EXTSPD IF_F

    I2S 2 CH

    Movi Nand2Gb

    HUBAU6259

    FRONTUSB

    IC- ETHRTL8201E

    VFD ITO FILM

    TouchCor e

    CVBS

    SYST EMMain Mico m

    I2C

    Pow er S ta geTAS5613 5.1CH

    H_SP

    DIF(S

    PD

    IF)

    I2C

    MIC/ASC

    I2C

    (768) G Byte

    Optical In

    I2C

    ARC

    SWITCH

    TMDS

    Bluet oothModule

    (OP TION)

    2Gb (128M x 16 ) 2Gb (128M x 16 )

    Extern a l WIFI

    USB2

    From DISC, RF signal is transmitted to BACKEND SDP93.The decoder SDP93 decodes the RF signal to VIDEO and AUDIO DATA. About Digital Video signal, HDMI goes to DSP Boardthough system cable. And HDMI TX jack. in case of supporting HDMI IN, HDMI SOC EP94A2E gets TMDS DATA fromSDP93.And HDMI IN Jack and after packing the data, it sends the data to TX Jack. HT-D7200B supports 2 USB ports.

    One is for USB File play like MP3, JPG, DivX and etc. The other is for WiFi dongle, i-POD, i-Phone are also supported.

    About SDP93 Audio output, I2S data goes through DSP TMS320DA788 and then DSP IC decodes or bypass the data to PWM IC.

    External Audio input also goes through DSP TMS320DA788 and then goes through like SDP93 AUDIO pass.From PWM modulator PS9630B to LPF(Low Pass Filter), Digital Signal is changed to Analog Signal and amplified by OP-AMPand FET IR AMP.

    Copyright 1995-2012 SAMSUNG. All rights reserved. 6-1

  • 6. Schematic Diagram

    6.2. FRONT

    VFD12V -> PC -28V,VFD+,VFD-

    KARAOKE PART

    6514 SERIES USE D -34V6524 SERIES USE D -28V

    USB

    ITO_FILM

    T_RESET

    VFD_-28V1

    BD17

    *

    0.01O

    HM

    VFD12V_PW

    ST3. 4V

    VFD_-28V1

    ST3. 4V

    KBD1

    0.01O

    HM*

    V_5V

    KBD2*

    0.01O HM V_5V

    USB5V

    VFD12V_P W

    V12VTP

    ST3.4V

    V5

    TP V_5V

    ST3.4

    TP

    ST3.4V

    USB5VTPUSB5V

    1/10W

    R16

    47O HM

    ST3.4V

    ST3. 4V

    RCLA

    MP0

    502B

    .TC

    T

    100NF

    MIC_IN

    MIC_CLK

    MIC_DATA

    VFD_CE1

    VFD_DATA1VFD_CLK1

    VGR1

    VGR3

    VGR4

    VGR2

    VGR5

    VGR6

    VP

    MIC_SENSE

    MIC_IN

    VFD-1

    VGR2

    VGR4

    VGR5

    VGR3

    VGR6

    VGR1

    VFD+1

    TK_CLK1

    TK_DATA1

    USB_DATA-USB_DATA+

    MIC_S ENSEMIC_DATAMIC_CLK

    VFD_CE 1

    T_RESETMIC_S IG

    REMOT_INBUZZER

    USB_DATA-

    TK_DATA1TK_CLK1USB_DATA+

    PLAY

    ENTER

    OPEN

    FUNCSTOP

    REMOT_IN

    FUNCSTOPPLAYENTEROPEN

    2.2KO HM1/10W

    KR18

    1UF 50V

    KC24

    AVGND

    AVGND

    16V100NF

    KC8

    16V100NF

    KC7

    50V3.3NF

    KC2

    16V100NF

    KC1

    15KOHM1/10W

    KR4

    1/10W15KOHM

    KR3

    15KOHM1/10W

    KR2

    7.5KO HM1/10W

    KR1

    1/10W4.7KO HM

    KR19

    33PF

    50V

    KC25

    AVGND

    1/10W33KOHM

    KR20

    2.2KO HM1/10W

    KR13

    1/10W4.7KO HM

    KR14

    1UF 50VKC21

    33PF

    50V

    KC22

    1/10W33KOHM

    KR15

    AVGND

    16V100NF

    KC9

    16V100NF

    KC6

    50V680PF

    KC5

    25V1UF

    KC4

    33KOHM1/10W

    KR5

    25V1UF

    KC3

    R2A159 06S P

    KIC1123456789101112131415

    16171819202122232425262728

    MIC_SIG

    V_GND

    11MLVS-0603- E08

    VD11

    10V10UF

    VC18

    PT6325

    IC5

    123456789

    101112

    13 14 15 16 17 18 19 20 21 22 23 24

    252627282930313233343536

    373839404142434445464748

    MGND1

    1/10W100OHM

    VR15

    1/10W100OHM

    VR75

    1/10W100OHM

    VR14

    10KOHM1/10W

    VR18

    1/10W82KOHM

    VR17

    V_GND

    10V10UF

    VC19

    1 2 3 4 5 6 7 8 9

    22 21 20

    1/10W1KOHM

    KR17

    40000OHM*

    KBD5

    1/10W1KOHM

    KR16

    50V

    10N

    F

    KC23

    40000OHM*

    KBD3

    TP

    MICIN2

    TP

    MICIN1

    35V4.7U FKC11

    10V10UFKC10

    AVGND

    1/10W10KOHM

    KR9

    680PF50V

    KC1650V1UF

    KC151UF 50VKC14

    18KOHM1/10W

    KR850V100PF

    KC13

    10NF50V

    KC12

    1/10W33KOHM

    KR7

    1/10W51KOHM

    KR6

    AT12535250C01

    KCN21

    2345

    67

    AVGND

    *40000OHM

    KBD4

    AT12535250C01

    KCN11

    2345

    67 AVGND

    10UF10V

    KC20

    V_GND

    15KOHM1/10W

    KR12

    1/10W15KOHM

    KR11

    15KOHM1/10W

    KR103.3NF50V

    KC19

    AVGND

    220NF16V

    KC18

    10V10UFKC17

    10

    V_GND

    V_GND

    50V

    1NF

    C31

    11121314

    1516

    171819

    50V100NF

    VC23

    50V

    1NF

    C30

    75

    1N41

    48W

    SD1

    4

    751N

    4148

    WS

    D15

    KTC4378Q8

    KTC4378Q7

    25V100NF

    C32

    TPV_GND

    UNDEFINEDDR126 5

    T1

    12345 6

    78910

    1/10W10KOHM

    R37

    V_GND

    50V100NF

    VC68

    22 21 20 19

    006BT35 4NAK_G_03

    VCN5

    1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

    TP

    F-

    TP

    P22

    TP

    P21

    TP

    P20

    TP

    P19

    TP

    P18

    18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

    TP

    P17

    TP

    P16TP

    P15TP

    P14TP

    P13

    TP

    P12

    TP

    P11

    TP

    P10

    TP

    P9

    TP

    P8

    TP

    TP1

    TP

    P6

    TP

    P5

    TP

    P4

    TP

    P3

    TP

    P2

    TP

    P1

    V_GND

    50V100NF

    VC25

    TP

    1G

    TP

    2G

    TP

    3G

    TP

    4G

    TP

    5G

    TP

    6G

    TP

    F+

    1/10W10KOHM

    R38

    MLVS-0603- E0811

    VD1

    0

    RCLAMP0502B.TCT

    UD1

    DGND

    MLVS-0603-E0811

    D8

    TPDN- TPDP+

    100NF16V

    C20

    100NF16V

    C22

    100NF16V

    C21

    DGND

    10UF10V

    C71 16V

    47U

    F

    OP TION

    C69

    UGND

    *40000O HM

    BD3

    DGND

    UGND

    DGND

    16V100NF

    C23

    100NF16V

    C24

    100NF16V

    C25

    UAS2

    1-4K

    590A

    USCN1

    1234

    MGND1

    MGND2

    V_GND

    1N4148WS75

    D19

    1N4148WS75

    D18

    1/10W4.7OHM

    R82

    1/10W16KOHM

    R83

    16KOHM1/10W

    R84

    1/10W16KOHM

    R85

    1/10W16KOHM

    R86

    3.9SDZ3V9GD20

    TP-28V

    10V10UF

    C33

    SS1440

    D17

    SS1440

    D16

    1/10W4.7OHM

    R81

    4.7OHM1/10W

    R80

    TPVFD+

    VFD+1

    10V10UF

    C34

    VFD-1

    DGND

    47UF35V

    C35

    35V47UF

    C80

    TP

    MIC_SIG

    TPVFD-

    DGND

    6.3V1UF

    VC14

    V_GNDDGND

    AVGND

    40000O HM*BD2

    40000O HM*BD1

    DGND

    1/10W33KOHM

    R3

    UNDEFINEDDHT-1107WP

    SW31

    2

    3

    4

    DHT-1107WPUNDEFINED

    SW21

    2

    3

    4

    1/10W10KOHM

    R1

    1/10W10KOHM

    R2

    TP

    PWRUNDEFINEDDHT-1107WP

    SW11

    2

    3

    4

    TP

    MIC_DATA

    TP

    MIC_SENSE

    DGND

    AVGND

    V_GND

    TP

    MIC_CLK

    TPAV_GND

    TPD_GND

    TPVGND

    10022HS -28C00FCON1

    123456789

    10111213141516171819202122232425262728

    VFD_CLK1VFD_DATA1

    TP

    BU TPREMOTP

    TRESET

    TPVCE

    DGND

    47NF50V

    C70

    TPUSB+

    TPUSB-

    TP

    TDATP

    TCLK

    11MLVS-0603-E08

    C17

    DGND

    TPVCLK

    TPVDA

    R96FS1A

    REYE1

    1

    2

    3

    6.3V1UF

    VNC1

    16V

    VNC1

    2

    5.6

    UDZ5V6B

    OP TION

    VNCD

    3

    DGND

    6.3V1UF

    VC13

    VIC1

    1234

    5 6 7 8

    9101112

    13141516M

    GND

    1

    0

    OPT ION

    NCD

    10

    DGND

    1/10W220O HM

    VR30

    1/10W220O HM

    VR29

    1/10W220O HM

    VR28

    1/10W220O HM

    VR34

    1/10W220O HM

    VR35

    6.2

    UDZS

    TE

    -17

    6.2B

    D12

    TPFUNC

    47O HM1/10W

    R76

    0500

    2HR-

    08N2

    (G)

    VCN6

    12345678

    MGND1

    MG

    ND2

    DGND

    TP

    STOP

    TPPLAY

    TP

    OP EN

    TP

    ENTER

    MCLK

    BUS/DC

    NC/FEEDBAC K_VOL

    LPF1_OUT

    VREF

    MIC_INLPF2_IN

    ECHO_VOL _IN

    CC1

    ALC_TC

    VCC

    LPF2_OUT

    OP1_OUTLPF1_IN

    ALC_LC

    CC2

    OP2_IN

    MIX_OUT

    MIC_OUT

    MICVOL_IN

    GND

    OP1_IN

    SDA/MIC_VOL

    SCL_ECHO_V OL

    MIX_OUT

    OP2_OUTMIC_NFIN

    MIX_NFIN

    LED2

    NC

    VDD

    OSC

    LED4

    LED3

    LED1

    K2

    K1

    STB

    CLK

    DIN

    DOUT

    SG4_

    KS4

    NCSG3_

    KS3

    SG2_

    KS2

    SG1_

    KS1

    VDD

    VSS

    SG10_KS10

    SG9_

    KS9

    SG8_

    KS8

    SG7_

    KS7

    SG6_

    KS6

    SG5_

    KS5

    SG16_KS16

    SG15_KS15NC

    SG14_KS14

    SG13_KS13

    SG12_KS12

    SG11_KS11

    SG24

    _G

    R5NC

    SG23

    _G

    R6

    VSS

    GR2

    GR1

    GR4

    GR3

    SG22

    _G

    R7

    SG20

    _G

    R9

    SG21

    _G

    R8

    SG19_GR10

    SG17_GR12

    SG18_GR11

    VEE

    E

    B

    C

    E

    BC

    F+6G5G4G3G2G1GP1P2P3P4P5P6P7P8P9P10

    P11

    P12

    P13

    P14

    P15

    P16

    P17

    P18

    P19

    P20

    P21

    F- P22

    GND

    VCC

    VOUT

    P2.2

    VDDI

    O

    P1.5

    P2.1

    PWM

    0.4/

    P0.4

    VSS

    P1.3/PWM1.3P1.4

    VDDI

    NTS

    INT3

    /P3.

    3

    VDDINT

    VSSP0.5/PWM0.5

    P1.2/PWM1.2I2C1_SCL

    I2C1_SDA

    VFD12V -> PC -28V,VFD+,VFD-

    KARAOKE PART

    6514 SERIES USE D -34V6524 SERIES USE D -28V

    USB

    ITO_FILM

    VFD_-28V1

    *

    0.01O

    HM

    VFD12V_PW

    ST3. 4V

    ST3. 4V

    0.01O

    HM*

    V_5V

    *

    0.01O HM V_5V

    USB5V

    TP

    ST3.4V

    TP V_5V

    TP

    ST3.4V

    TPUSB5V

    1/10W47O HM

    ST3.4V

    ST3. 4V

    RCLA

    MP0

    502B

    .TC

    T

    100NF

    2.2KO HM1/10 W 1UF 50V

    AVGND

    AVGND

    16V100NF

    16V100NF

    50V3.3NF

    16V100NF

    15KOHM1/10W1/10W15KOHM

    15KOHM1/10W7.5KO HM1/10W

    1/10W4.7KO HM

    33PF

    50V

    AVGND

    1/10W33KOHM

    2.2KO HM1/10W

    1/10W4.7KO HM

    1UF 50V

    33PF

    50V

    1/10W33KOHM

    AVGND

    16V100NF

    16V100NF

    50V680PF

    25V1UF

    33KOHM1/10W

    25V1UF

    R2A159 06S P

    V_GND

    11MLVS-0603- E0810V

    10UF

    PT6325

    1/10W100OHM

    1/10W100OHM

    1/10W100OHM10KOHM1/10W

    1/10W82KOHM

    V_GND

    10V10UF

    1 2 3 4 5 6 7 8 9

    22 21 20

    1/10W1KOHM

    40000OHM*

    1/10W1KOHM

    50V

    10N

    F

    40000OHM*

    TPTP

    35V4.7U F

    10V10UF AVGND

    1/10W10KOHM

    680PF50V 50V

    1UF1UF 50V

    18KOHM1/10W50V100PF

    10NF50V1/10W33KOHM

    1/10W51KOHM

    AT12535250C01

    AVGND

    *40000OHM

    AT12535250C01

    AVGND

    10UF10V

    V_GND

    15KOHM1/10W

    1/10W15KOHM15KOHM1/10W

    3.3NF50V

    AVGND

    220NF16V

    10V10UF

    10

    V_GND

    V_GND

    50V

    1NF

    11121314

    1516

    171819

    50V100NF

    50V

    1NF

    75

    1N41

    48W

    S75

    1N41

    48W

    S

    KTC4378

    KTC4378

    25V100NF

    TP

    UNDEFINEDDR126 5

    1/10W10KOHM

    V_GND

    50V100NF

    22 21 20 19

    006BT35 4NAK_G_03

    TP TP TP TP TP TP18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

    TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP

    V_GND

    50V100NF

    TP TP TP TP TP TP TP

    1/10W10KOHM

    MLVS-0603- E0811

    0

    RCLAMP0502B.TCT

    DGND

    MLVS-0603-E0811

    TP TP

    100NF16V 100NF16V

    100NF16V

    DGND

    10UF10V

    16V

    47U

    F

    OP TION

    UGND

    *40000O HM

    DGND

    UGND

    DGND

    16V100NF 100NF

    16V100NF16V

    UAS2

    1-4K

    590A

    V_GND

    1N4148WS75

    1N4148WS75

    1/10W4.7OHM

    1/10WMHOK61MHOK61

    W01/1W01/116KOHM

    1/10W16KOHM

    3.9SDZ3V9G

    TP

    10V10UF

    SS1440

    SS1440

    1/10W4.7OHM

    4.7OHM1/10W

    TPVFD+1

    10V10UF VFD-1

    DGND

    47UF35V

    35V47UF

    TP

    TP

    DGND

    6.3V1UF

    V_GNDDGND

    AVGND

    40000O HM*

    40000O HM*

    DGND

    1/10W33KOHM

    UNDEFINEDDHT-1107WP

    DHT-1107WPUNDEFINED

    1/10W10KOHM

    1/10W10KOHM

    TP

    UNDEFINEDDHT-1107WP

    TP

    TP

    DGND

    AVGND

    V_GND

    TP

    TP

    TP

    TP

    10022HS -28C00

    TP

    TP

    TPTP

    DGND

    47NF50V

    TP

    TP

    TP

    TP

    11MLVS-0603-E08

    DGND

    TP

    TP

    R96FS1A

    6.3V1UF

    16V

    5.6

    UDZ5V6B

    OP TION

    DGND

    6.3V1UF

    0

    OPT ION

    DGND

    1/10W220O HM

    1/10W220O HM

    1/10W220O HM

    1/10W220O HM

    1/10W220O HM

    6.2

    UDZS

    TE

    -17

    6.2B

    TP

    47O HM1/10W

    0500

    2HR-

    08N2

    (G)

    DGND

    PT PTPTPT

    BD17

    KBD1

    KBD2

    V12V

    V5

    ST3.4 USB5V

    R16

    KR18 KC24

    KC8KC7

    KC2

    KC1

    KR4

    KR3

    KR2

    KR1

    KR19

    KC25

    KR20

    KR13

    KR14

    KC21

    KC22

    KR15

    KC9

    KC6

    KC5

    KC4

    KR5

    KC3

    KIC1

    VD11

    VC18

    IC5

    VR15VR75VR14VR18

    VR17

    VC19

    KR17 KBD5

    KR16

    KC23

    KBD3

    MICIN2

    MICIN1

    KC11

    KC10

    KR9

    KC16

    KC15KC14

    KR8KC13

    KC12KR7KR6

    KCN2

    KBD4

    KCN1

    KC20

    KR12

    KR11KR10 KC19

    KC18

    KC17

    C31

    VC23

    C30

    D14

    D15

    Q8

    Q7

    C32

    V_GND

    T1

    R37

    VC68

    VCN5

    F-P22P21P20P19P18P17P16P15P14P13P12P11P10P9P8TP1P6P5P4P3P2P1

    VC25

    1G2G3G4G5G6G F+

    R38

    VD1

    UD1

    D8

    DN- DP+

    C20

    C22

    C21

    C71

    C69

    BD3

    C23

    C24

    C25

    USCN1

    D19

    D18 R82

    R83

    R84

    R85

    R86

    D20

    -28V

    C33

    D17

    D16

    R81

    R80

    VFD+

    C34

    C35

    C80

    MIC_SIG

    VFD-

    VC14

    BD2

    BD1

    R3

    SW3

    SW2

    R1

    R2

    PWR

    SW1 MIC_DATA

    MIC_SENSE

    MIC_CLK

    AV_GND

    D_GND

    VGND

    FCON1

    BU REMO

    TRESET

    VCE

    C70

    USB+

    USB-TDA TCLK

    C17

    VCLKVDA

    REYE1

    VNC1

    VNC1

    2

    VNCD

    3

    VC13

    VIC1

    NCD

    10

    VR30VR29

    VR28

    VR34

    VR35

    D12

    FUNC

    R76

    VCN6

    STOPPLAY

    OP EN

    ENTER

    T_RESET

    VFD_-28V1

    VFD12V_P W

    MIC_IN

    MIC_CLK

    MIC_DATA

    VFD_CE1

    VFD_DATA1VFD_CLK1

    VGR1

    VGR3

    VGR4

    VGR2

    VGR5

    VGR6

    VP

    MIC_SENSE

    MIC_IN

    VFD-1

    VGR2

    VGR4

    VGR5

    VGR3

    VGR6

    VGR1

    VFD+1

    TK_CLK1

    TK_DATA1

    USB_DATA-USB_DATA+

    MIC_S ENSEMIC_DATAMIC_CLK

    VFD_CE 1

    T_RESETMIC_S IG

    REMOT_INBUZZER

    USB_DATA-

    TK_DATA1TK_CLK1USB_DATA+

    PLAY

    ENTER

    OPEN

    FUNCSTOP

    REMOT_IN

    FUNCSTOPPLAYENTEROPEN

    MIC_SIG

    VFD_CLK1VFD_DATA1

    123456789101112131415

    16171819202122232425262728

    123456789

    101112

    13 14 15 16 17 18 19 20 21 22 23 24

    252627282930313233343536

    373839404142434445464748

    MGND1

    1

    2345

    67

    1

    2345

    67

    12345 6

    78910

    1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

    1234

    MGND1

    MGND2

    1

    2

    3

    4

    1

    2

    3

    4

    1

    2

    3

    4

    123456789

    10111213141516171819202122232425262728

    1

    2

    3

    1234

    5 6 7 8

    9101112

    13141516M

    GND

    1

    12345678

    MGND1

    MG

    ND2

    MCLK

    BUS/DC

    NC/FEEDBAC K_VOL

    LPF1_OUT

    VREF

    MIC_INLPF2_IN

    ECHO_VOL _IN

    CC1

    ALC_TC

    VCC

    LPF2_OUT

    OP1_OUTLPF1_IN

    ALC_LC

    CC2

    OP2_IN

    MIX_OUT

    MIC_OUT

    MICVOL_IN

    GND

    OP1_IN

    SDA/MIC_VOL

    SCL_ECHO_V OL

    MIX_OUT

    OP2_OUTMIC_NFIN

    MIX_NFIN

    LED2

    NC

    VDD

    OSC

    LED4

    LED3

    LED1

    K2

    K1

    STB

    CLK

    DIN

    DOUT

    SG4_

    KS4

    NCSG3_

    KS3

    SG2_

    KS2

    SG1_

    KS1

    VDD

    VSS

    SG10_KS10

    SG9_

    KS9

    SG8_

    KS8

    SG7_

    KS7

    SG6_

    KS6

    SG5_

    KS5

    SG16_KS16

    SG15_KS15NC

    SG14_KS14

    SG13_KS13

    SG12_KS12

    SG11_KS11

    SG24

    _G

    R5NC

    SG23

    _G

    R6

    VSS

    GR2

    GR1

    GR4

    GR3

    SG22

    _G

    R7

    SG20

    _G

    R9

    SG21

    _G

    R8

    SG19_GR10

    SG17_GR12

    SG18_GR11

    VEE

    E

    B

    C

    E

    BC

    F+6G5G4G3G2G1GP1P2P3P4P5P6P7P8P9P10

    P11

    P12

    P13

    P14

    P15

    P16

    P17

    P18

    P19

    P20

    P21

    F- P22

    GND

    VCC

    VOUT

    P2.2

    VDDI

    O

    P1.5

    P2.1

    PWM

    0.4/

    P0.4

    VSS

    P1.3/PWM1.3P1.4

    VDDI

    NTS

    INT3

    /P3.

    3

    VDDINT

    VSSP0.5/PWM0.5

    P1.2/PWM1.2I2C1_SCL

    I