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SwissLaserNet/DU/26.11.09_#01

Rod-versus Fiberlaser in Thermal Laser Microprocessing

1)Basics Laser Microprocessing

2) Basics: pLPSSL – cwFL

3) Fine cutting: pLPSSL vs cwFL

3) Welding: pLPSSL vs cwFL-seam welding-spot welding

4)Drilling: pLPSSL vs cwFL

5)Summary

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SwissLaserNet/DU/26.11.09_#02

LASAGIndustrial Lasers

Products

CW/pulsed Solid State Lasers(lamp pumped, Diode pumped)

Beam guiding technologiesBeam distribution

Beam formingProcess accessories

Process control

Solution for the customer

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SwissLaserNet/DU/26.11.09_#03

Laser - Applications

� (Fine) cutting� precision drilling� micro-welding� “Scribing”

LASAGIndustrial Lasers

Stents / Hypotubes

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SwissLaserNet/DU/26.11.09_#04

Turbine component(cooling hole)

Fuel Filter

Cracked connecting rod

LASAGIndustrial Lasers

Markets

� Turbines (aero, gas)� Medical (implants,instruments)� Auto (powertrain)� Solar (thermal Absorber)� Electronics (contacts)� White Ware (coffee machine))

IT-plug

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SwissLaserNet/DU/26.11.09_#05

Lase Microprocessing in Industrial Production

System elementsfor

Pre-processing andfeeding

System elementsfor

Post.processingFurther handling

Beamdistribution

Beamformer

LaserLaser-beam

Beamguider

Usersurface

Control

HandlingProcess-control

Process-support.

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SwissLaserNet/DU/26.11.09_#06

Laser Microprocessing: The System

Workpiece (interaction, thermal effects)

Laser technology beam-forming

(temporal/spacial)

Process support

Process-OpticsBeam distribution

PositioningContour movement

(CNC)

Protection

Control(process/system)

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SwissLaserNet/DU/26.11.09_#07

Disruptive Technologies in Laser Mikroprocessing?In

dust

rial m

arke

treq

uire

men

ts:

Cos

tof o

wne

rshi

pim

prov

emen

tP

roce

ssqu

ality

, rel

iabi

lity,

pro

duct

ivity

1990 1995 2000 2005 2010 2015

FL

Diode

Indu

stria

l sho

rtpu

lse

lase

rs

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SwissLaserNet/DU/26.11.09_#08

Influence of disruptive FL-cw technology on LPSSL markets

1990 1995 2000 2005 2010 2015

FL

MacrodrillingMacrocuttingMacroweldingSpotweldingMicrodrillingMicroweldingMicrocutting

Indu

stria

l mar

ketr

equi

rem

ents

:C

osto

f ow

ners

hip

impr

ovem

ent

Pro

cess

qual

ity, r

elia

bilit

y, p

rodu

ctiv

ity

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SwissLaserNet/DU/26.11.09_#09

Basic problem of LPSSL/DPSSL: influence ofheat on beam quality

Laser Material

End mirror Exit mirror

Pump source(Energy)Lampen-strahlung

Wall plug efficiency LP

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SwissLaserNet/DU/26.11.09_#010

Elements of disruptive FL-Technology vs Rod

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SwissLaserNet/DU/26.11.09_#011

Fine cutting: pulsed 200 W Nd:YAG – cw 200 W Fiberlaser

Thickness (mm)

speed (mm/min )

4000

2000

KLS 246 (M2=2 – 20 /pulse power

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SwissLaserNet/DU/26.11.09_#012

Example: Metal - Stent

LLT – Stent Cutter

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SwissLaserNet/DU/26.11.09_#013

200W pulsed YAG – 200W SM Fiberlaser(fine cutting)

Application relevantparametersBeam quality number M2 1.2 2-20Average power/cw power(W) 200 50 - 200frequency(kHz)

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SwissLaserNet/DU/26.11.09_#014

Material Processing: Seam-Welding SLS 200-CFS 200Influence of „Brilliance“

SLS 200(SHADOW)3kW peak

SLS 200(seam)

CFS 200

0.1mm

Court. IPG

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SwissLaserNet/DU/26.11.09_#015

Spot welding:SHADOW®-Microring or single spot

• FL/LPSSL approach: “stiring“• LPSSL approach: single spot

• advantage:• Allows spot welding for low power lasers�High power(densities) for fast coupling�Movement avoids overheating(spattering)� disadvantage�Needs scanner and time

SteplessHigh SpeedAccurate andDiscreteOne Pulse Welding

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SwissLaserNet/DU/26.11.09_#016

Influence of „Brilliance“ on deep welding performance

Brilliance ~Watt/Spot x cone angle (W/cm2sr)

Material: Cu CuLaser: p - Nd:YAG(240W) cw – IPG-FL (4kW)Parameter: 4 kW Pulsleistung 4kW

35 J PulsenergieTiefe: 1 mm 3mmSpeed: 0.1m/min 3m/min

IWS(Dresden)/Dt. Kupferinstitut.

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SwissLaserNet/DU/26.11.09_#017

Drilling of Filters

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SwissLaserNet/DU/26.11.09_#018

1000

100

10

1

1 10 100 1000 10000Holes per Second

Hole Diameter(µm)

Limit:Beam Quality

Limit at necessary energy:Pulse frequencyAverage PowerMovement

Single Shot „on the fly*Drilling (200W)Processing time

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SwissLaserNet/DU/26.11.09_#019

Disruptive Technologies in Laser Mikroprocessing?In

dust

rial m

arke

trqu

irem

ents

:C

osto

f ow

ners

hip

impr

ovem

ent

Pro

cess

qual

ity, r

elia

bilit

y, p

rodu

ctiv

ity

1990 1995 2000 2005 2010 2015

FL

Diode

Indu

stria

l sho

rtpu

lse

lase

rs

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I N D U S T R I A L - L A S E R S

SwissLaserNet/DU/26.11.09_#020

Laser Microprocessing: The System

Workpiece (interaction, thermal effects)

Laser technology beam-forming

(temporal/spacial)

Process support

Process-OpticsBeam distribution

PositioningContour movement

(CNC)

Protection

Control(process/system)

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SwissLaserNet/DU/26.11.09_#021

Um

setz

ung

Lase

r-V

orga

ben

Mar

ktbe

dürf

niss

e

1995 2000 2005 2010 2015 2020

Precision „cost of ownership“ Speed +Precision Superspeed+Precision

„CNC“ disruptive Technology for high speed laserprocessing

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SwissLaserNet/DU/26.11.09_#022

Rod-versus Fiberlaser in Thermal Laser Microprocessing

Each application has its ownOptimized laser

Decision for customer more difficult:needs more „neutral“ counseling

Potential of new lasers is limited byAccessories / CNC properties