rf front-end module comparison 2020 volume 4 · 2020. 10. 28. · ©2020 by system plus consulting...

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22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr RF Front - End Module Comparison 2020 Volume 4 Technical and cost overview of the latest radio frequency front-end module technologies integrated in Asian based smartphones manufacturers. SP20524 - RF report by Stéphane ELISABETH LABORATORY ANALYSIS by Youssef EL GMILI October 2020 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

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  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 1

    22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

    RF Front-End Module Comparison 2020 – Volume 4Technical and cost overview of the latest radio frequency front-end module technologies integrated in Asian based smartphones manufacturers.

    SP20524 - RF report by Stéphane ELISABETHLABORATORY ANALYSIS by Youssef EL GMILI

    October 2020 – Sample

    REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 2

    Table of Contents

    Overview / Introduction 4o Executive Summaryo Reverse Costing Methodology

    Company Profile 12o Huawei, OnePlus, Oppo, Vivo, Xiaomi, ZTEo Smartphones Teardown:

    P40 Pro, 8 5G, Reno3 5G, X30 Pro 5G, Mi 10 Pro, Nubia Red Magic 5Go Summary of the analyzed RF components

    Physical Analysis Summary 34

    o Database Contains: Number of phones, LTE/5G bands per smartphones, Module in RF Area

    o Comparative Analysis:RFFE Area, Design Win, Main Supplier, Function, OEMs main Supplier

    Physical Comparison 45

    o Area Distribution per Supplier & Function

    o Die Design Win in Number & Area

    o Die Distribution per Function

    o Filter Distribution per Smartphone: Technology and Substrate

    o PA/LNA/Switch Distribution per Smartphone: Technology and Substrate

    o Material Substrate Distribution per Smartphone

    Cost Comparison 57

    o Cost Distribution per Supplier & Function

    Market Analysis 61

    o Wifi Evolution

    o Connectivity Market Ecosystem & Forecast

    Physical Analysis 67o Summary of the analyzed RF componentso Summary of Comparative Studyo Broadcom – Front-End Analysis 70

    o OnePlus 8 5G – RFFE Architectureo AFEM-9206 Analysis

    ✓ Package View & Dimensions✓ Package Opening

    ✓ Die View And Dimensions✓ Estimated Front-End Bloc Diagram

    o AFEM-9206 vs. AFEM-8100o HiSilicon – Front-End Analysis 83

    o Huawei P40 Pro – RFFE Architectureo Front-End Analysiso Hi6HD05V100 vs. SKY77643-61

    o Murata – Front-End Analysis 95o Huawei P40 Pro – RFFE Architecture

    o Front-End Analysiso 429 vs. SKY58255

    o Qorvo – Front-End Analysis 111o Vivo X30 Pro vs. Xiaomi Mi 10 Pro 5G vs. Huawei P40 Pro – RFFE

    Architectureo Front-End Module Analysiso QM75005 vs. SKY58254-11

    o Qualcomm – Front-End Analysis 135o OnePlus 8 5G vs. Xiaomi Mi 10 Pro 5G vs. ZTE/Nubia Red Magic 5G –

    RFFE Architectureo Front-End Module Analysiso QPM5679 vs. Hi6D03V100

    o Skyworks – Front-End Analysis 137o Oppo Reno3 5G – RFFE Architecture

    o Front-End Module Analysiso SKY58254-11 vs. QPM6585

    Feedbacks 139

    SystemPlus Consulting services 141

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 3

    Overview / Introductiono Executive Summaryo Reverse Costing

    Methodologyo Glossary

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Executive Summary

    RF Front-End Module Comparison 2020 – Vol. 1Study on smartphones on Q3 2019

    RF Front-End Module Comparison 2020 – Vol. 2Study on Huawei smartphones

    The report includes the study of at least twenty FEM and severalcomponents found in three smartphones: Apple iPhone 11 Pro,Samsung Galaxy Note10+ and OnePlus 7 Pro 5G. Also, it comesalong with a database including information on 485 componentsin 17 smartphones.

    The report includes the study of at least eighty FEM and severalcomponents found in ten smartphones: Mate and P series from2015 to 2019. Also, it came along with a database includinginformation on 483 components in 13 smartphones.

    Serie Generation Version # of Components

    11 Pro 26

    11 - 20

    11 Pro Max 27

    Note 10 Plus 19

    Note 10 - 33

    A80 - 22

    Fold - 24

    Xcover 4 S 21

    OnePlus OnePlus 7 Pro 5G 33

    Meizu - 16 S 22

    Xiaomi Black Shark 2 - 41

    Asus ROG Phone II - 33

    Motorola One Vision - - 28

    Huawei Mate 20 X (5G) 45

    Oppo Reno - 5G 24

    Royole FlexPai - - 31

    LG Electronics V50 ThinQ 5G 36

    Total 485

    Smartphone List

    iPhone

    Galaxy Samsung

    AppleSerie Generation Version Addon # of Components

    30 Pro 5G 60

    20 X 5G 45

    20 - - 22

    10 Lite - 34

    10 - - 28

    9 - - 40

    8 - - 42

    30 Pro - 41

    30 - - 31

    20 Pro - 37

    10 - - 45

    9 - - 30

    9 Lite - 28

    Total 483

    Smartphone List

    Mate

    PHuawei

    Huawei

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 4

    Overview / Introductiono Executive Summaryo Reverse Costing

    Methodologyo Glossary

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Executive Summary

    RF Front-End Module Comparison 2020 – Vol. 3Wifi & Connectivity

    The report includes the study of several FEMs and componentsfound in 14 smartphones: From Apple to Xiaomi. Also, it camealong with a database including information on 281 componentsin 44 smartphones.

    Serie Generation Version Addon # of Components

    11 - - 5

    11 Pro - 4

    11 Pro Max 3

    SE (2020) - - 3

    Asus Rog Phone II - - 8

    Google Pixel 4 XL - 6

    HTC Desire 19s - - 4

    20 X 5G 8

    30 Pro 5G 9

    Xs - - 8

    P 40 Pro - 10

    LG V60 ThinQ - - 8

    Edge + - - 7

    Moto G8 Plus - 5

    Hyper - - 6

    Macro - - 4

    Razr 2019 - - 5

    7 Pro - 5G 9

    8 - - 5G 10

    Find X2 - - 10

    3 - 5G 6

    3 Pro 5G 6

    Ace - - 7

    A10 s - 4

    A50 - - 7

    A51 - - 6

    Fold - - 5

    M11 - - 4

    M31 - - 7

    Note10 - - 7

    Note10 + - 8

    S20 Ultra 5G 8

    S20 + 5G 8

    Xcover 4S - 5

    Z Flip - - 5

    Sharp Aquos R - 5G 5

    Nex 3s - - 8

    Nex S - - 5

    X30 Pro - - 7

    Mi 10 Pro 5G 8

    Mi Note 10 - 5

    K30 - 5G 6

    Note 8 Pro 5

    ZTE Nubia Red Magic - 5G 7

    Total 281

    Redmi

    One

    Reno

    Vivo

    Xiaomi

    GalaxySamsung

    Smartphone List

    HuaweiMate

    Apple iPhone

    Motorola

    OnePlus

    Oppo

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 5

    Overview / Introductiono Executive Summaryo Reverse Costing

    Methodologyo Glossary

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Executive Summary

    RF Front-End Module Comparison 2020 – Vol. 4Study on Chinese/Asian OEMs

    The report includes the study of at least 50 FEM and severalcomponents found in Five smartphones: Huawei P40 Pro,OnePlus 8 5G, Oppo Reno3 5G, Vivo X30 Pro, Xiaomi Mi 10 Pro 5Gand ZTE Nubia Red magic 5G. Also, it comes along with adatabase including information on 516 components in 19smartphones.

    Smartphone List Serie Generation Version Addon # of Components

    Asus ROG Phone II - - 30

    HTC Desire 19s - - 29

    Mate 30 Pro 5G 36

    Mate Xs - - 39

    P 40 Pro - 41

    OnePlus 8 - - 5G 16

    Find X2 - - 32

    Reno Ace - - 15

    Reno 3 - 5G 19

    Reno 3 Pro 5G 32

    Sharp Aquos R - - 5G 21

    Nex 3s - - 31

    X30 - Pro - 22

    Realme X50 - - 5G 31

    Mi 10 Pro 5G 28

    Mi Note 10 - - 24

    Redmi K30 - 5G 22

    Redmi Note 8 Pro - 28

    ZTE Nubia Red Magic - 5G 20

    Total 516

    Oppo

    Huawei

    Vivo

    Xiaomi

    RF Front-End Module Comparison 2020 – Vol. 5Study on Apple Smartphones

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 6

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Huawei Smartphone Teardown – Huawei P40 Pro

    Huawei P40 Pro Front & Back View©2020 by System Plus Consulting

    Huawei P40 Pro Opened View©2020 by System Plus Consulting

    Huawei P40 Pro Main Board©2020 by System Plus Consulting

    LTE PAMiD

    Footprint PCB Area: ~ XX mm²Total PCB Area: ~ XX mm²Total RF Area: ~ XX mm²

    5G PAM

    LTE/5G RxTx

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 7

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Vivo Smartphone Teardown – Vivo X30 Pro 5G

    RF Board Area : XX mm²

    RF Components(Marking)

    Manufacturer Band Type Area(mm²)

    Quantity RF Board Proportion

    Cost

    QM77040 Qorvo MB/HB PAMiD XX X XX % $ XXQM77032 Qorvo LB PAMiD XX X XX % $ XX

    434 Murata Diversity XX X XX % $ XXQM78200 Qorvo n77/n78 PAMiD XX X XX % $ XXQM75005 Qorvo n41 PAMiD XX X XX % $ XX

    Total XX X XX % $ XX

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 8

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis o Module Disassemblyo Package Assembly

    o Views & Dimensionso Cross-Sectiono Patent

    o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section

    o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section

    Physical ComparisonManufacturing Process FlowCost AnalysisCost ComparisonSelling Price AnalysisFeedbacksRelated ReportsAbout System Plus

    QM75005 – Die Overview – Filter

    Package Opened View – Optical View©2020 by System Plus Consulting

    • Die area: XX mm²

    (XX x XX mm)

    • Die marking: XX

    • Die substrate: XX

    n41 BAW-SMR Filter Die View – Optical View©2020 by System Plus Consulting

    n41 BAW-SMR Filter Die Schematic View – Optical View©2020 by System Plus Consulting

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 9

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis o Module Disassemblyo Package Assembly

    o Views & Dimensionso Cross-Sectiono Patent

    o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section

    o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section

    Physical ComparisonManufacturing Process FlowCost AnalysisCost ComparisonSelling Price AnalysisFeedbacksRelated ReportsAbout System Plus

    QM75005 vs. SKY58254-11 – Package View & Dimensions

    Skyworks SKY58254-11©2020 by System Plus Consulting

    Qorvo QM75005©2020 by System Plus Consulting

    QM75005 SKY58254

    Total number of dies 4 - 4

    Power amplifier 1 (XX mm²) +XX % 1 (XX mm²)

    Filter 1 (XX mm²) +XX % 1 (XX mm²)

    Switch 1 (XX mm²) +XX % 1 (XX mm²)

    RFIC 1 (XX mm²) -XX % 1 (XX mm²)

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 10

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparisono Module vs Module

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    AFEM-9206 – Package Views & Dimensions

    Package Top View – Optical View©2020 by System Plus Consulting

    Package Bottom View – Optical View©2020 by System Plus Consulting

    Package Side View – Optical View©2020 by System Plus Consulting

    • Package Type : XX BGA

    • Dimensions : XX mm² x XX mm(XX x XX x XX mm)

    • Pin Pitch : XX mm

    • Marking :

    9206

    MD005

    KA008

    XX

    mm

    XX

    mm

    XX mm

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 11

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparisono Module vs Module

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    RF Components(Marking)

    Manufacturer Band Type Area(mm²)

    Quantity RF Board Proportion

    Cost

    QM78202 Qorvo n77/n78/n79 PAMiD XX X XX% $ XX 429 Murata n77/n78 PAMiD XX X XX% $ XX

    Hi6HD05V100 HiSilicon LB/HB/MB PAM XX X XX% $ XX SKY78191 Skyworks LB PAMiD XX X XX% $ XX QM77038 Qorvo MB/HB PAMiD XX X XX% $ XX QDM2310 Qualcomm Diversity XX X XX% $ XX

    Total XX X XX% $ XX

    Huawei P40 Pro – RFFE Architecture

    XXXX Duplexer

    RxTx

    XX XX Duplexer

    XX XXDuplexer

    XX XXDuplexer

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 12

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparisono Module vs Module

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    429 – Package Overview

    Package Opening – Optical View©2020 by System Plus Consulting

    SMD XX number: X

    • The functions of the 8 dies inside the packaging have a following repartition.

    • PA: X

    • Switch: X

    • PMIC: X

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 13

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparisono Module vs Module

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    429 – Front-End Bloc Diagram

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 14

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparisono Module vs Module

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Die Function Distribution

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 15

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparisono Module vs Module

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    62%

    3%

    25%

    2% 8%

    Filter substrate Area

    LT/LN

    Sapphire

    Silicon

    (blank)

    ?

    2%

    66%2%

    20%

    8%

    2%

    Filter Distribution per technology

    SAW IHP

    SAW (blank)

    BAW FBAR

    BAW SMR

    IPD (blank)

    MLC (blank)

    Filter Distribution

    Filter die type distribution©2020 by System Plus Consulting

    Filter die substrate distribution©2020 by System Plus Consulting

    19 Smartphones; From 2019 to 2020; 523 Components; 1,230 Dies

    19 Smartphones; From 2019 to 2020; 523 Components; 1,230 Dies

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 16

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparisono Module vs Module

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Material Distribution per smartphone

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 17

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Components Summary – Module

    Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type

    Broadcom AFEM-9206 MB/HB PAMiD OnePlus Double Side BGA

    HiSilicon Hi6D05V10 LB/MB/HB PAM Huawei MCM LGA

    Murata429 n77/n78 PAMiD Huawei MCM LGA434 Diversity Vivo MCM LGA

    Qorvo

    QM75005 n41 PAMiD Vivo MCM LGAQM77033B LB PAMiD Xiaomi MCM LGAQM77040 MB/HB PAMiD Oppo; Vivo; Xiaomi MCM LGAQM78202 n77/n78/n79 PAMiD Huawei MCM LGA

    Qualcomm

    QDM5630 n28/n5/n2/n66 Diversity OnePlus MCM LGAQDM5677 n77/n78 Diversity OnePlus; Xiaomi; ZTE MCM LGAQDM5679 n79 Diversity ZTE MCM LGAQPA5581 n1/n3/n7/n28 PAM Xiaomi MCM LGAQPM4650 n28/n5/n2/n66 PAMiD OnePlus MCM LGAQPM5677 n77/n78 PAMiD Oppo; Xiaomi; ZTE MCM LGAQPM5679 n79 PAMiD Oppo; ZTE MCM LGAQPM6585 n41 PAMiD Oppo; ZTE MCM LGAQPM8820 LB PAMiD ZTE MCM LGAQPM8885 MB/HB PAMiD ZTE MCM LGA

    QTM525 V3 n260/n261 AiP OnePlus MCM AiP

    Skyworks

    SKY58211 LB PAMiD OnePlus MCM LGASKY53735 LB/LMB/MB/HB Diversity Oppo MCM LGASKY58255 n77/n79 PAMiD Oppo MCM LGASKY58254 B41/n41 PAMiD Oppo MCM LGA

    • The components will be opened to present the internal structure.• The die pictures will be presented in this report with estimated bloc diagram.

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 18

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Database Contains

    Smartphone List Serie Generation Version Addon Availability 5G Support # of Components

    Asus ROG Phone II - - 09/09/2019 None 30

    HTC Desire 19s - - 14/11/2019 None 29

    Mate 30 Pro 5G 18/10/2019 Sub-6 36

    Mate Xs - - 26/03/2020 Sub-6 40

    P 40 Pro - 07/04/2020 Sub-6 42

    OnePlus 8 - - 5G 29/04/2020 Sub-6/mmWave 16

    Find X2 - - 06/05/2020 Sub-6 32

    Reno Ace - - 18/10/2020 None 15

    Reno 3 - 5G 26/12/2019 Sub-6 19

    Reno 3 Pro 5G 26/12/2019 Sub-6 33

    Sharp Aquos R - - 5G 09/04/2020 Sub-6 21

    Nex 3s - - 10/03/2020 Sub-6 31

    X30 - Pro - 24/12/2019 Sub-6 22

    Realme X50 - - 5G 05/03/2020 Sub-6 32

    Mi 10 Pro 5G 07/04/2020 Sub-6 29

    Mi Note 10 - - 12/02/2020 None 25

    Redmi K30 - 5G 07/01/2020 Sub-6 23

    Redmi Note 8 Pro - 22/11/2019 None 28

    ZTE Nubia Red Magic - 5G 21/04/2020 Sub-6 20

    Total 523

    Oppo

    Huawei

    Vivo

    Xiaomi

    0

    1

    2

    3

    4

    5

    6

    7

    8

    9

    Q4-2019 Q1-2020 Q2-2020

    Nu

    mb

    er

    of

    5G

    Ph

    on

    es

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 19

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    5G Band Distribution

    0 2 4 6 8 10 12 14

    n5

    n2

    n66

    n260

    n261

    n28

    n3

    n77

    n79

    n1

    n41

    n78

    Number of devices

    # of Phones with known 5G spectrum support

    0 2 4 6 8 10 12 14 16 18 20

    B14B71B30B48B29B66B42B46B13

    B9B25

    B6B32B17B12B26B28B19B18B20B34

    B2B4

    B39B7

    B41B38

    B5B40

    B3B8B1

    Number of devices

    # of Phones with known 4G spectrum support

    Number of Phones with known 5G Spectrum Support©2020 by System Plus Consulting

    Number of Phones with known 4G Spectrum Support©2020 by System Plus Consulting

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 20

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Module in RF

    Module area in RF Front-End Module Area©2020 by System Plus Consulting

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 21

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Components Summary

    Smartphone List Serie Generation Version Addon Availability 5G Support # of Components

    Asus ROG Phone II - - 09/09/2019 None 30

    HTC Desire 19s - - 14/11/2019 None 29

    Mate 30 Pro 5G 18/10/2019 Sub-6 36

    Mate Xs - - 26/03/2020 Sub-6 40

    P 40 Pro - 07/04/2020 Sub-6 42

    OnePlus 8 - - 5G 29/04/2020 Sub-6/mmWave 16

    Find X2 - - 06/05/2020 Sub-6 32

    Reno Ace - - 18/10/2020 None 15

    Reno 3 - 5G 26/12/2019 Sub-6 19

    Reno 3 Pro 5G 26/12/2019 Sub-6 33

    Sharp Aquos R - - 5G 09/04/2020 Sub-6 21

    Nex 3s - - 10/03/2020 Sub-6 31

    X30 - Pro - 24/12/2019 Sub-6 22

    Realme X50 - - 5G 05/03/2020 Sub-6 32

    Mi 10 Pro 5G 07/04/2020 Sub-6 29

    Mi Note 10 - - 12/02/2020 None 25

    Redmi K30 - 5G 07/01/2020 Sub-6 23

    Redmi Note 8 Pro - 22/11/2019 None 28

    ZTE Nubia Red Magic - 5G 21/04/2020 Sub-6 20

    Total 523

    Oppo

    Huawei

    Vivo

    Xiaomi

    27%

    21%

    10%

    9%

    8%

    8%

    6%

    3%

    3%2%

    2%1% 0% 0%

    Component Distribution per Funtion

    Switch

    Filter

    Tuner

    PAMiD

    LNA

    Diversity

    Multiplexer

    ET

    LNA/Switch

    RxTx

    PAM

    RFIC

    FEM

    AiP

    28%

    20%

    14%

    9%

    5%

    4%

    4%

    3%

    3%2%

    2%

    1% 1%

    1%

    1%

    1%1%

    0% 0%

    0%0%

    Component Distribution per Supplier

    QUALCOMM

    QORVO

    MURATA

    MAXSCEND

    WISOL

    HISILICON

    SKYWORKS

    UNIDENTIFIED

    TAIYO YUDEN

    INFINEON TECHNOLOGIES

    ON SEMICONDUCTOR

    NXP

    TST

    MEDIATEK

    STMICROELECTRONICS

    KYOCERA

    SONY

    SAMSUNG

    CANAANTEK

    TOSHIBA

    Share in design win©2020 by System Plus Consulting

    Share in implemented function©2020 by System Plus Consulting

    19 Smartphones; From 2019 to 2020; 523 Components

    19 Smartphones; From 2019 to 2020; 523 Components

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 22

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Comparative StudyManufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type

    Broadcom AFEM-9206 MB/HB PAMiD OnePlus Double Side BGA

    Broadcom AFEM-8100 MB/HB PAMiD Apple Double Side BGA

    Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type

    HiSilicon Hi6D05V10 LB/MB/HB PAM Huawei MCM LGA

    Skyworks SKY77643-61 LB/MB/HB PAM Motorola MCM LGA

    Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type

    Murata 429 n77/n78 PAMiD Huawei MCM LGA

    Skyworks SKY58255-11 n77/n78 PAMiD Oppo MCM LGA

    Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type

    Qorvo QM75005 n41 PAMiD Vivo MCM LGA

    Skyworks SKY58254-11 B41/n41 PAMiD Oppo MCM LGA

    Vs.

    Vs.

    Vs.

    Vs.

    Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type

    Qualcomm QPM5679 n79 PAMiD ZTE MCM LGA

    HiSilicon Hi6D03V100 n79 PAM P40 Pro MCM LGA

    Vs.

    Qualcomm QPM6585 n41 PAMiD ZTE MCM LGA

    Vs.

    Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type

    Skywo SKY58254-11 n41 PAMiD Oppo MCM LGA

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 23

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparisono Module vs Module sensor

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Cost Distribution per function

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 24

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Plus

    Related Reports

    MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

    RF DEVICES• Status of the Radar Industry: Players, Applications and

    Technology Trends 2020

    REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

    RF DEVICES• RF Front-End Module Comparison 2020 – Volume 3• RF Front-End Module Comparison 2020 – Volume 2• RF Front-End Module Comparison 2020 – Volume 1• SAW Filter Comparison 2020• Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiD

    SKY78221• Qualcomm’s Second Generation 5G mmWave Chipset,

    from Modem to Antenna

    http://www.systemplus.fr/https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-3/https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-2/https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-1/https://www.systemplus.fr/reverse-costing-reports/saw-filter-comparison-2020/https://www.systemplus.fr/reverse-costing-reports/skyworks-fbar-baw-filter-technology-in-2guhb-pamid-sky78221/https://www.systemplus.fr/reverse-costing-reports/qualcomms-second-generation-5g-mmwave-chipset-from-modem-to-antenna/https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-1/https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-2/https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-3/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 25

    COMPANYSERVICES

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 26

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Pluso Company serviceso Contact

    Business Models Fields of Expertise

    Custom Analyses(>130 analyses per year)

    Reports(>60 reports per year)

    Costing Tools

    Trainings

    http://www.systemplus.fr/

  • ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 27

    Overview / Introduction

    Company Profile & Supply Chain

    Physical Analysis

    Physical Comparison

    Manufacturing Process Flow

    Cost Analysis

    Cost Comparison

    Selling Price Analysis

    Feedbacks

    Related Reports

    About System Pluso Company serviceso Contact

    Contact

    www.systemplus.fr

    NANTESHeadquarter

    FRANKFURT/MAINEurope Sales Office

    LYONYOLE HQ

    TOKYOYOLE KK

    GREATER CHINAYOLE

    KOREAYOLE

    CORNELIUSYOLE Inc.

    Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

    Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

    Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

    Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]

    America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]

    Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]

    http://www.systemplus.fr/mailto:[email protected]:[email protected]:[email protected]