rf front-end module comparison 2020 volume 4 · 2020. 10. 28. · ©2020 by system plus consulting...
TRANSCRIPT
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
RF Front-End Module Comparison 2020 – Volume 4Technical and cost overview of the latest radio frequency front-end module technologies integrated in Asian based smartphones manufacturers.
SP20524 - RF report by Stéphane ELISABETHLABORATORY ANALYSIS by Youssef EL GMILI
October 2020 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 2
Table of Contents
Overview / Introduction 4o Executive Summaryo Reverse Costing Methodology
Company Profile 12o Huawei, OnePlus, Oppo, Vivo, Xiaomi, ZTEo Smartphones Teardown:
P40 Pro, 8 5G, Reno3 5G, X30 Pro 5G, Mi 10 Pro, Nubia Red Magic 5Go Summary of the analyzed RF components
Physical Analysis Summary 34
o Database Contains: Number of phones, LTE/5G bands per smartphones, Module in RF Area
o Comparative Analysis:RFFE Area, Design Win, Main Supplier, Function, OEMs main Supplier
Physical Comparison 45
o Area Distribution per Supplier & Function
o Die Design Win in Number & Area
o Die Distribution per Function
o Filter Distribution per Smartphone: Technology and Substrate
o PA/LNA/Switch Distribution per Smartphone: Technology and Substrate
o Material Substrate Distribution per Smartphone
Cost Comparison 57
o Cost Distribution per Supplier & Function
Market Analysis 61
o Wifi Evolution
o Connectivity Market Ecosystem & Forecast
Physical Analysis 67o Summary of the analyzed RF componentso Summary of Comparative Studyo Broadcom – Front-End Analysis 70
o OnePlus 8 5G – RFFE Architectureo AFEM-9206 Analysis
✓ Package View & Dimensions✓ Package Opening
✓ Die View And Dimensions✓ Estimated Front-End Bloc Diagram
o AFEM-9206 vs. AFEM-8100o HiSilicon – Front-End Analysis 83
o Huawei P40 Pro – RFFE Architectureo Front-End Analysiso Hi6HD05V100 vs. SKY77643-61
o Murata – Front-End Analysis 95o Huawei P40 Pro – RFFE Architecture
o Front-End Analysiso 429 vs. SKY58255
o Qorvo – Front-End Analysis 111o Vivo X30 Pro vs. Xiaomi Mi 10 Pro 5G vs. Huawei P40 Pro – RFFE
Architectureo Front-End Module Analysiso QM75005 vs. SKY58254-11
o Qualcomm – Front-End Analysis 135o OnePlus 8 5G vs. Xiaomi Mi 10 Pro 5G vs. ZTE/Nubia Red Magic 5G –
RFFE Architectureo Front-End Module Analysiso QPM5679 vs. Hi6D03V100
o Skyworks – Front-End Analysis 137o Oppo Reno3 5G – RFFE Architecture
o Front-End Module Analysiso SKY58254-11 vs. QPM6585
Feedbacks 139
SystemPlus Consulting services 141
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
RF Front-End Module Comparison 2020 – Vol. 1Study on smartphones on Q3 2019
RF Front-End Module Comparison 2020 – Vol. 2Study on Huawei smartphones
The report includes the study of at least twenty FEM and severalcomponents found in three smartphones: Apple iPhone 11 Pro,Samsung Galaxy Note10+ and OnePlus 7 Pro 5G. Also, it comesalong with a database including information on 485 componentsin 17 smartphones.
The report includes the study of at least eighty FEM and severalcomponents found in ten smartphones: Mate and P series from2015 to 2019. Also, it came along with a database includinginformation on 483 components in 13 smartphones.
Serie Generation Version # of Components
11 Pro 26
11 - 20
11 Pro Max 27
Note 10 Plus 19
Note 10 - 33
A80 - 22
Fold - 24
Xcover 4 S 21
OnePlus OnePlus 7 Pro 5G 33
Meizu - 16 S 22
Xiaomi Black Shark 2 - 41
Asus ROG Phone II - 33
Motorola One Vision - - 28
Huawei Mate 20 X (5G) 45
Oppo Reno - 5G 24
Royole FlexPai - - 31
LG Electronics V50 ThinQ 5G 36
Total 485
Smartphone List
iPhone
Galaxy Samsung
AppleSerie Generation Version Addon # of Components
30 Pro 5G 60
20 X 5G 45
20 - - 22
10 Lite - 34
10 - - 28
9 - - 40
8 - - 42
30 Pro - 41
30 - - 31
20 Pro - 37
10 - - 45
9 - - 30
9 Lite - 28
Total 483
Smartphone List
Mate
PHuawei
Huawei
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 4
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
RF Front-End Module Comparison 2020 – Vol. 3Wifi & Connectivity
The report includes the study of several FEMs and componentsfound in 14 smartphones: From Apple to Xiaomi. Also, it camealong with a database including information on 281 componentsin 44 smartphones.
Serie Generation Version Addon # of Components
11 - - 5
11 Pro - 4
11 Pro Max 3
SE (2020) - - 3
Asus Rog Phone II - - 8
Google Pixel 4 XL - 6
HTC Desire 19s - - 4
20 X 5G 8
30 Pro 5G 9
Xs - - 8
P 40 Pro - 10
LG V60 ThinQ - - 8
Edge + - - 7
Moto G8 Plus - 5
Hyper - - 6
Macro - - 4
Razr 2019 - - 5
7 Pro - 5G 9
8 - - 5G 10
Find X2 - - 10
3 - 5G 6
3 Pro 5G 6
Ace - - 7
A10 s - 4
A50 - - 7
A51 - - 6
Fold - - 5
M11 - - 4
M31 - - 7
Note10 - - 7
Note10 + - 8
S20 Ultra 5G 8
S20 + 5G 8
Xcover 4S - 5
Z Flip - - 5
Sharp Aquos R - 5G 5
Nex 3s - - 8
Nex S - - 5
X30 Pro - - 7
Mi 10 Pro 5G 8
Mi Note 10 - 5
K30 - 5G 6
Note 8 Pro 5
ZTE Nubia Red Magic - 5G 7
Total 281
Redmi
One
Reno
Vivo
Xiaomi
GalaxySamsung
Smartphone List
HuaweiMate
Apple iPhone
Motorola
OnePlus
Oppo
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 5
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
RF Front-End Module Comparison 2020 – Vol. 4Study on Chinese/Asian OEMs
The report includes the study of at least 50 FEM and severalcomponents found in Five smartphones: Huawei P40 Pro,OnePlus 8 5G, Oppo Reno3 5G, Vivo X30 Pro, Xiaomi Mi 10 Pro 5Gand ZTE Nubia Red magic 5G. Also, it comes along with adatabase including information on 516 components in 19smartphones.
Smartphone List Serie Generation Version Addon # of Components
Asus ROG Phone II - - 30
HTC Desire 19s - - 29
Mate 30 Pro 5G 36
Mate Xs - - 39
P 40 Pro - 41
OnePlus 8 - - 5G 16
Find X2 - - 32
Reno Ace - - 15
Reno 3 - 5G 19
Reno 3 Pro 5G 32
Sharp Aquos R - - 5G 21
Nex 3s - - 31
X30 - Pro - 22
Realme X50 - - 5G 31
Mi 10 Pro 5G 28
Mi Note 10 - - 24
Redmi K30 - 5G 22
Redmi Note 8 Pro - 28
ZTE Nubia Red Magic - 5G 20
Total 516
Oppo
Huawei
Vivo
Xiaomi
RF Front-End Module Comparison 2020 – Vol. 5Study on Apple Smartphones
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Huawei Smartphone Teardown – Huawei P40 Pro
Huawei P40 Pro Front & Back View©2020 by System Plus Consulting
Huawei P40 Pro Opened View©2020 by System Plus Consulting
Huawei P40 Pro Main Board©2020 by System Plus Consulting
LTE PAMiD
Footprint PCB Area: ~ XX mm²Total PCB Area: ~ XX mm²Total RF Area: ~ XX mm²
5G PAM
LTE/5G RxTx
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Vivo Smartphone Teardown – Vivo X30 Pro 5G
RF Board Area : XX mm²
RF Components(Marking)
Manufacturer Band Type Area(mm²)
Quantity RF Board Proportion
Cost
QM77040 Qorvo MB/HB PAMiD XX X XX % $ XXQM77032 Qorvo LB PAMiD XX X XX % $ XX
434 Murata Diversity XX X XX % $ XXQM78200 Qorvo n77/n78 PAMiD XX X XX % $ XXQM75005 Qorvo n41 PAMiD XX X XX % $ XX
Total XX X XX % $ XX
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Sectiono Patent
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical ComparisonManufacturing Process FlowCost AnalysisCost ComparisonSelling Price AnalysisFeedbacksRelated ReportsAbout System Plus
QM75005 – Die Overview – Filter
Package Opened View – Optical View©2020 by System Plus Consulting
• Die area: XX mm²
(XX x XX mm)
• Die marking: XX
• Die substrate: XX
n41 BAW-SMR Filter Die View – Optical View©2020 by System Plus Consulting
n41 BAW-SMR Filter Die Schematic View – Optical View©2020 by System Plus Consulting
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Sectiono Patent
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical ComparisonManufacturing Process FlowCost AnalysisCost ComparisonSelling Price AnalysisFeedbacksRelated ReportsAbout System Plus
QM75005 vs. SKY58254-11 – Package View & Dimensions
Skyworks SKY58254-11©2020 by System Plus Consulting
Qorvo QM75005©2020 by System Plus Consulting
QM75005 SKY58254
Total number of dies 4 - 4
Power amplifier 1 (XX mm²) +XX % 1 (XX mm²)
Filter 1 (XX mm²) +XX % 1 (XX mm²)
Switch 1 (XX mm²) +XX % 1 (XX mm²)
RFIC 1 (XX mm²) -XX % 1 (XX mm²)
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Module vs Module
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
AFEM-9206 – Package Views & Dimensions
Package Top View – Optical View©2020 by System Plus Consulting
Package Bottom View – Optical View©2020 by System Plus Consulting
Package Side View – Optical View©2020 by System Plus Consulting
• Package Type : XX BGA
• Dimensions : XX mm² x XX mm(XX x XX x XX mm)
• Pin Pitch : XX mm
• Marking :
9206
MD005
KA008
XX
mm
XX
mm
XX mm
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Module vs Module
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
RF Components(Marking)
Manufacturer Band Type Area(mm²)
Quantity RF Board Proportion
Cost
QM78202 Qorvo n77/n78/n79 PAMiD XX X XX% $ XX 429 Murata n77/n78 PAMiD XX X XX% $ XX
Hi6HD05V100 HiSilicon LB/HB/MB PAM XX X XX% $ XX SKY78191 Skyworks LB PAMiD XX X XX% $ XX QM77038 Qorvo MB/HB PAMiD XX X XX% $ XX QDM2310 Qualcomm Diversity XX X XX% $ XX
Total XX X XX% $ XX
Huawei P40 Pro – RFFE Architecture
XXXX Duplexer
RxTx
XX XX Duplexer
XX XXDuplexer
XX XXDuplexer
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Module vs Module
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
429 – Package Overview
Package Opening – Optical View©2020 by System Plus Consulting
SMD XX number: X
• The functions of the 8 dies inside the packaging have a following repartition.
• PA: X
• Switch: X
• PMIC: X
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Module vs Module
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
429 – Front-End Bloc Diagram
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Module vs Module
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Function Distribution
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Module vs Module
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
62%
3%
25%
2% 8%
Filter substrate Area
LT/LN
Sapphire
Silicon
(blank)
?
2%
66%2%
20%
8%
2%
Filter Distribution per technology
SAW IHP
SAW (blank)
BAW FBAR
BAW SMR
IPD (blank)
MLC (blank)
Filter Distribution
Filter die type distribution©2020 by System Plus Consulting
Filter die substrate distribution©2020 by System Plus Consulting
19 Smartphones; From 2019 to 2020; 523 Components; 1,230 Dies
19 Smartphones; From 2019 to 2020; 523 Components; 1,230 Dies
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Module vs Module
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Material Distribution per smartphone
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Components Summary – Module
Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type
Broadcom AFEM-9206 MB/HB PAMiD OnePlus Double Side BGA
HiSilicon Hi6D05V10 LB/MB/HB PAM Huawei MCM LGA
Murata429 n77/n78 PAMiD Huawei MCM LGA434 Diversity Vivo MCM LGA
Qorvo
QM75005 n41 PAMiD Vivo MCM LGAQM77033B LB PAMiD Xiaomi MCM LGAQM77040 MB/HB PAMiD Oppo; Vivo; Xiaomi MCM LGAQM78202 n77/n78/n79 PAMiD Huawei MCM LGA
Qualcomm
QDM5630 n28/n5/n2/n66 Diversity OnePlus MCM LGAQDM5677 n77/n78 Diversity OnePlus; Xiaomi; ZTE MCM LGAQDM5679 n79 Diversity ZTE MCM LGAQPA5581 n1/n3/n7/n28 PAM Xiaomi MCM LGAQPM4650 n28/n5/n2/n66 PAMiD OnePlus MCM LGAQPM5677 n77/n78 PAMiD Oppo; Xiaomi; ZTE MCM LGAQPM5679 n79 PAMiD Oppo; ZTE MCM LGAQPM6585 n41 PAMiD Oppo; ZTE MCM LGAQPM8820 LB PAMiD ZTE MCM LGAQPM8885 MB/HB PAMiD ZTE MCM LGA
QTM525 V3 n260/n261 AiP OnePlus MCM AiP
Skyworks
SKY58211 LB PAMiD OnePlus MCM LGASKY53735 LB/LMB/MB/HB Diversity Oppo MCM LGASKY58255 n77/n79 PAMiD Oppo MCM LGASKY58254 B41/n41 PAMiD Oppo MCM LGA
• The components will be opened to present the internal structure.• The die pictures will be presented in this report with estimated bloc diagram.
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Database Contains
Smartphone List Serie Generation Version Addon Availability 5G Support # of Components
Asus ROG Phone II - - 09/09/2019 None 30
HTC Desire 19s - - 14/11/2019 None 29
Mate 30 Pro 5G 18/10/2019 Sub-6 36
Mate Xs - - 26/03/2020 Sub-6 40
P 40 Pro - 07/04/2020 Sub-6 42
OnePlus 8 - - 5G 29/04/2020 Sub-6/mmWave 16
Find X2 - - 06/05/2020 Sub-6 32
Reno Ace - - 18/10/2020 None 15
Reno 3 - 5G 26/12/2019 Sub-6 19
Reno 3 Pro 5G 26/12/2019 Sub-6 33
Sharp Aquos R - - 5G 09/04/2020 Sub-6 21
Nex 3s - - 10/03/2020 Sub-6 31
X30 - Pro - 24/12/2019 Sub-6 22
Realme X50 - - 5G 05/03/2020 Sub-6 32
Mi 10 Pro 5G 07/04/2020 Sub-6 29
Mi Note 10 - - 12/02/2020 None 25
Redmi K30 - 5G 07/01/2020 Sub-6 23
Redmi Note 8 Pro - 22/11/2019 None 28
ZTE Nubia Red Magic - 5G 21/04/2020 Sub-6 20
Total 523
Oppo
Huawei
Vivo
Xiaomi
0
1
2
3
4
5
6
7
8
9
Q4-2019 Q1-2020 Q2-2020
Nu
mb
er
of
5G
Ph
on
es
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
5G Band Distribution
0 2 4 6 8 10 12 14
n5
n2
n66
n260
n261
n28
n3
n77
n79
n1
n41
n78
Number of devices
# of Phones with known 5G spectrum support
0 2 4 6 8 10 12 14 16 18 20
B14B71B30B48B29B66B42B46B13
B9B25
B6B32B17B12B26B28B19B18B20B34
B2B4
B39B7
B41B38
B5B40
B3B8B1
Number of devices
# of Phones with known 4G spectrum support
Number of Phones with known 5G Spectrum Support©2020 by System Plus Consulting
Number of Phones with known 4G Spectrum Support©2020 by System Plus Consulting
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Module in RF
Module area in RF Front-End Module Area©2020 by System Plus Consulting
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Components Summary
Smartphone List Serie Generation Version Addon Availability 5G Support # of Components
Asus ROG Phone II - - 09/09/2019 None 30
HTC Desire 19s - - 14/11/2019 None 29
Mate 30 Pro 5G 18/10/2019 Sub-6 36
Mate Xs - - 26/03/2020 Sub-6 40
P 40 Pro - 07/04/2020 Sub-6 42
OnePlus 8 - - 5G 29/04/2020 Sub-6/mmWave 16
Find X2 - - 06/05/2020 Sub-6 32
Reno Ace - - 18/10/2020 None 15
Reno 3 - 5G 26/12/2019 Sub-6 19
Reno 3 Pro 5G 26/12/2019 Sub-6 33
Sharp Aquos R - - 5G 09/04/2020 Sub-6 21
Nex 3s - - 10/03/2020 Sub-6 31
X30 - Pro - 24/12/2019 Sub-6 22
Realme X50 - - 5G 05/03/2020 Sub-6 32
Mi 10 Pro 5G 07/04/2020 Sub-6 29
Mi Note 10 - - 12/02/2020 None 25
Redmi K30 - 5G 07/01/2020 Sub-6 23
Redmi Note 8 Pro - 22/11/2019 None 28
ZTE Nubia Red Magic - 5G 21/04/2020 Sub-6 20
Total 523
Oppo
Huawei
Vivo
Xiaomi
27%
21%
10%
9%
8%
8%
6%
3%
3%2%
2%1% 0% 0%
Component Distribution per Funtion
Switch
Filter
Tuner
PAMiD
LNA
Diversity
Multiplexer
ET
LNA/Switch
RxTx
PAM
RFIC
FEM
AiP
28%
20%
14%
9%
5%
4%
4%
3%
3%2%
2%
1% 1%
1%
1%
1%1%
0% 0%
0%0%
Component Distribution per Supplier
QUALCOMM
QORVO
MURATA
MAXSCEND
WISOL
HISILICON
SKYWORKS
UNIDENTIFIED
TAIYO YUDEN
INFINEON TECHNOLOGIES
ON SEMICONDUCTOR
NXP
TST
MEDIATEK
STMICROELECTRONICS
KYOCERA
SONY
SAMSUNG
CANAANTEK
TOSHIBA
Share in design win©2020 by System Plus Consulting
Share in implemented function©2020 by System Plus Consulting
19 Smartphones; From 2019 to 2020; 523 Components
19 Smartphones; From 2019 to 2020; 523 Components
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito ASIC Die Front-End Processo ASIC Fabrication Unito Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Comparative StudyManufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type
Broadcom AFEM-9206 MB/HB PAMiD OnePlus Double Side BGA
Broadcom AFEM-8100 MB/HB PAMiD Apple Double Side BGA
Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type
HiSilicon Hi6D05V10 LB/MB/HB PAM Huawei MCM LGA
Skyworks SKY77643-61 LB/MB/HB PAM Motorola MCM LGA
Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type
Murata 429 n77/n78 PAMiD Huawei MCM LGA
Skyworks SKY58255-11 n77/n78 PAMiD Oppo MCM LGA
Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type
Qorvo QM75005 n41 PAMiD Vivo MCM LGA
Skyworks SKY58254-11 B41/n41 PAMiD Oppo MCM LGA
Vs.
Vs.
Vs.
Vs.
Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type
Qualcomm QPM5679 n79 PAMiD ZTE MCM LGA
HiSilicon Hi6D03V100 n79 PAM P40 Pro MCM LGA
Vs.
Qualcomm QPM6585 n41 PAMiD ZTE MCM LGA
Vs.
Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type
Skywo SKY58254-11 n41 PAMiD Oppo MCM LGA
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparisono Module vs Module sensor
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Cost Distribution per function
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Related Reports
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 25
COMPANYSERVICES
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
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About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
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©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contact
Contact
www.systemplus.fr
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FRANKFURT/MAINEurope Sales Office
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