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o RD_FASE2: 2015 Activities and Funding G. Darbo – INFN / Genova 23 January 20145
RD_FASE2
2015 Activities and Funding
RD_FASE2 Pixel & HVR_CCPD Joint Meeting23 January 2015
G. Darbo – INFN / Genova
Indico: https://agenda.infn.it/conferenceDisplay.py?confId=9145
RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 2
2015 Activities 1/3
• Sensor with FBK – Work in progress: • IBL like 3D sensor on 6” wafers
• batch completed from FBK. Test structures show good breakdown behaviour. Defect rate higher than IBL.
• No totally good FE-‐I4 devices out of the whole batch: we should consider if we have second quality Iles worth bump-‐bonding with FE-‐I4 and test in the beam an lab. Probably not worth to irradiate FE-‐I4 modules
• Planar sensors (FBK batch2) with SiSi DWB substrates
• batch completed, good yield!
• One wafer will be bonded at Selex now by ATLAS (5 at IZM by CMS) to FE-‐I4 to study BB and beXer qualify substrates. We should consider a second wafer at Selex with sensor thinning
• CMS is planning 5 wafer BB at IZM, sensor thinning, back metallisaIon with a mask aYer thinning, BCB isolaIon of the electronic chips. Some FE-‐I4 modules (single/double) inside their order with IBL contract residual pre-‐paid processing.
• should consider test beam? IrradiaIon of modules?
• 3D Sensors with new technology (SiSi DWB) and layout (FBK batch 3) will be available in late spring/summer
• Consider modules / test beam / irradiaIon in the second half of 2015.
RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 3
2015 Activities 2/3 • Bump-‐bonding: for tes(ng FBK sensors and to develop for future RD53
requirements (high-‐density bump-‐bonding with indium)
• Complete experience with FE-‐I4: use planar SiSi DWB batch of sensors and a new FE-‐I4 wafer (unthinned) + available thin chip
• Try thinning of planar SiSi DWB – Important experience for future 3D on new substrates.
• Discuss with Selex Management future of BB with 12” wafers, high density of bumps, and interest to be compeIIve and qualified for possible ITK producIon.
• Decide how to proceed with Selex aYerward.
• Module Assembly and Test, IrradiaBon, Test-‐beam: plan 30-‐40 modules with FBK sensor designs and FE-‐I3/FE-‐I4 chips.
• We should coordinate with Barcelona and other sensor communiIes for 3D sensor studies in test-‐beam and aYer irradiaIon – this is inside ITk
RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 4
2015 Activities 2/3 • Mechanics and CO2 cooling:
• We propose to contribute to ATLAS stave R&D, thermal simulaIon and test with CO2 plant
• ExperIse mainly on Milano, interest of Genova. We should evaluate manpower in both group and see how to contribute. Funding will be made available in 2015.
• MulB-‐module R/O: use leading experience of ROD designer (BO) to develop a 16 module table-‐top road for architecture study and for test-‐beam applica(on.
• See Paolo’s talk – several acIviIes and proposals in ITk • Need steering of the project coordinated within ITk.
RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 5
Funding INFN agreed on a ~2 M€ of RD_FASE2 funding envelopes • 3 year funding • ~50 % for Pixel acIviIes Money will come from “Giunta”. • Should be available by end of the month, the database is sIll empty • CSN1 in September 2015 has almost fully assigned what requested. Finanziamenti 2015
CSN1- Settembre 2014 21
proposte '' 2015''' ATL' CMS' Com'
tracker'
3D' '' '' ''AE' '' ''HV' 100.5' ''BB' '' ''MOD' '' ''Mod'R0' '' ''cooling' '' ''
Totali' 150' 133.5' 107.5'391'
TrackTrig'
WP1%sim' '' ''WP2%transm' '' ''WP3%New'AM' '' ''Wp4%packing' '' ''
Totali' 0' 0' 115'115'
RPC'
electrodes' '' 10' 15'Prototypes' '' 28'front%end' '' 5' 45'eco%gas' '' 15'GIF++' '' 20'
Totali' 0' 15' 123'138'
BIS7/8'16'chambers' '' '' ''
Totali' 0' 0' 0'0'
MUONS'DT' '' 11'''GEM' '' ''
Totali' 0' 11' 0'11'
Lar'
DC'power' 20' ''trigger' 20' ''
Totali' 40' 0' 0'40'
TileCal'
Sviluppo'FE' '' 15'''TEST'parZtori' '' ''
Totali' 0' 15' 0'15'
EndCap'
fibre+pmt+proto' '' 101'''
Totali' 0' 101' 0'101'
''
Grand'Total' 190' 275.5' 345.5'811'
Richieste TotaliATLAS 51.5 + (100.5)CMS 133.5Common 98.5Total 283.5 + (100.5)
Richieste (presentate in CSN1) Possono essere lievemente differenI dal database
Proposta Referee
Tasca HV-‐CMOS -‐> funds given in CSN5
X
RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 6
RD_FASE2 – “Richieste 2015” (1/2)
Legend: ATLAS Common ATLAS / CMS Tasca HV-‐CMOS
A?vità Descrizione BO CS GE MI TN UD
3D 6" Wafer procurement (SOI, wafer bonding, epi) -‐ -‐ -‐ -‐ 10.0 -‐ PicoScope 6407 DigiIzer with 1.5 GHz probes and accessories. -‐ -‐ -‐ -‐ 8.5 -‐
BB
6" dummy wafers -‐ test deposiIon on 6" and high-‐density bumps (150 k-‐bumps/chip) -‐ -‐ -‐ 20.0 -‐ -‐
BB for 3D sensor test -‐ -‐ 24.0 -‐ -‐ -‐
MOD Upgarde R/O Systems -‐ 2.0 2.0 2.0 -‐ 2.0
Module assembly and irradiaIon, RD on flex -‐ -‐ 10.0 -‐ -‐ -‐
MM-‐R/O MulI module R/O 15.0 -‐ -‐ -‐ -‐ -‐
CO2/µCH Develop µ-‐channel cooling -‐ -‐ -‐ 10.0 -‐ -‐
Total requested by ATLAS Groups 15.0 2.0 36.0 32.0 18.5 2.0
105.5
Richieste TotaliATLAS 51.5 + (100.5)CMS 133.5Common 98.5Total 283.5 + (100.5)
RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 7
Activities in ITk ITk management looking at interest of Countries in ITk R&D’s
Table from discussion with Paolo. Comments?
For discussion
Italy& Bologna& PIX&PIX&PIX&
HV/HR&CMOS&sensors&Off/detector&DAQ&Simulation&
Genoa& PIX&PIX&PIX&PIX&PIX&PIX&PIX&
3D&sensor&development&HV/HR&CMOS&sensors&Hybridization&Module&development,&construction&and&testing&Local/Global&support&design&Off/detector&DAQ&Simulation&
Cosenza& PIX&PIX&
3D&sensor&development&Simulation&
Lecce& PIX& Simulation&Milan& PIX&
PIX&PIX&PIX&PIX&PIX&PIX&PIX&COM&
HV/HR&CMOS&sensors&3D&sensor&development&RD53&Hybridization&Module&development&and&testing&Local/Global&support&design&and&production&Off/detector&electronics&(LV&power&supplies)&Simulation&Off/line&software&
Udine& PIX&PIX&PIX&
3D&sensor&development&Module&development&and&testing&On/line&monitoring&
Trento& PIX&PIX&PIX&
3D&sensor&development&HV/HR&CMOS&sensors&Module&development&and&testing&
&
RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 8
AIDA-2020 : Funded ! AIDA-‐2020 Funded ! • AIDA-‐2020 has been officially selected by the EC with a funding of 10 M€.
The project has a ranking of 14.5/15 with • 5/5 excellence • 5/5 impact • 4.5 implementaIon
The grant agreement procedure is quite fast
Groups in ATLAS who have been funded: • Genova • Milano • Trento
European Commission - Research - Participants Proposal Submission Forms
Page 1 of 125 Last saved 02/09/2014 at 17:46H2020-CP.pdf - Ver1.88 20140729
Horizon 2020Call: H2020-INFRAIA-2014-2015
Topic: INFRAIA-1-2014-2015Type of action: RIA
Proposal number: 654168
Proposal acronym: AIDA-2020
Table of contents
Section Title Action
1 General information
2 Participants & contacts
3 Budget
4 Ethics
5 Call-specific questions
How to fill in the formsThe administrative forms must be filled in for each proposal using the templates available in the submission system. Some data fields in the administrative forms are pre-filled based on the previous steps in the submission wizard.
This proposal version was submitted by Laurent Serin on 02/09/2014 12:04:24 CET. Issued by the Participant Portal Submission Service.
INFRAIA-1-2014-2015 AIDA-2020
WP1-MGT Project management and coordination
WP2-NA1 Innovation and outreach
WP13-JRA1Innovative gas
detectors
WP14-JRA2Infrastructure for
advanced calorimeters
WP15-JRA3Upgrade of beam and
irradiation test infrastructure
WP10-TA1Beam test facilities
WP12-TA3Detector
characterisation facilities
WP11-TA2Irradiation test
facilities
WP3-NA2Advanced software
WP7-NA6Advanced hybrid pixel detectors
WP4-NA3Microelectronics and
interconnections
WP6-NA5Novel high voltage and resistive CMOS sensors
WP8-NA7Large scale cryogenic liquid
detector
WP5-NA4Data acquisition system for
beam tests
WP9-NA8New support structures and
micro-channel cooling
Transnational Access
Networking
Joint Research
Figure 3.1: Work Package structure and interactions (Pert chart)
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