rapid pcb prototyping - tabe.rutabe.ru/pdf/lpkf_catalog.pdf · milling bit minicontac ......

www.lpkf.com Your LPKF-Distributor

Germany (Headquarters)LPKF Laser & Electronics AGOsteriede 730827 GarbsenGERMANYPhone +49-5131-7095-0Fax +49-5131-7095-90e-mail [email protected] info www.lpkf.com

FrankreichLPKF France S.A.R.L.Z.A. de l’Églantier21 Rue des Cerisiers(C.E. 1514 Lisses)91015 Evry CedexFRANCEPhone +33-1-60862691Fax +33-1-60869622e-mail [email protected]

SlowenienLPKF Laser & Elektronika d.o.o.Planina 34000 KranjSLOVENIAPhone +386-4-2013800Fax +386-4-2013820e-mail [email protected] info www.lpkf.si

SpainLPKF Laser & Electronics Spain, S.L.Apartado Nr. 128791 Soto del Real (Madrid)Madrid/SPAINPhone +34-91-8475505Fax +34-91-8475522e-mail [email protected] info www.lpkfspain.com

UK/IrelandLPKF Laser & Electronics Ltd.Coppid Beech Lane, WokinghamBerkshire-RG40 1PDGREAT BRITAINPhone +44-1344-455046Fax +44-1344-860547e-mail [email protected] info www.lpkf.co.uk

North AmericaLPKF Laser & Electronics28220 SW Boberg Rd.P.O. Box 3858Wilsonville, OR 97070USAPhone +1-503-454-4200Fax +1-503-683-7151e-mail [email protected] info www.lpkfusa.com

LPKF distribution network

LPKF Headquarters

LPKF Distribution and

production facilities

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ChinaLPKF Tianjin Co., Ltd.No. 1 Building, Xing Nan Cun,Ke Yan Xi Road, Nan Kai District,Tianjin, 300192PEOPLE'S REPUBLIC OF CHINAPhone +86-22-23005700Fax +86-22-23006965e-mail [email protected]

JapanLPKF Japan Co., Ltd.Yoyogi 5-8-5-304Shibuya-kuTokyo 151000JAPANPhone +81-3-34657105Fax +81-3-34676159e-mail [email protected] info www.lpkf.co.jp

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PRODUCT CATALOG 02/03

RAPID PCB PROTOTYPING

Customer Service (Free advice/support)Germany +49-5131-7095-0China +86-22-23005700 France +33-1-60862691Japan +81-3-34657105

Slovenia +386-4-2013804Spain +34-91-8475505UK/Ireland +44-1344-455046North America +1-503-454-4229

(8 am - 5 pm PST)

LPKF Produktkatalog Umschlag GB 23.04.2003 12:48 Uhr Seite 1

Index

4-layer multilayer6-layer multilayer8-layer multilayerAccessoriesAluminum ApplicationsAutoContacAutomatic tool changeAutoSwitchBase materialsBGA PlacerBoardMasterBrassBuild-up method (sequential)CAD (please use also EDA)CAM StationChemical setsCircuit board plotterCircuitCAMCompressed airCompressorConductive pasteConsumablesContacContact printingContour generatorConvection ovenCustom drill bitsCustom toolsCustomer service lineData conversionData exportData formatsData importDepanelizationDispensingDistribution networkDouble sided printingDrill bitDrill dataDrilling machineDust extractionEasyContacEasySolderEditing capabilitiesEndmillEngravingFine-pitch printingFlex boardsFlexible circuitsFlex-rigid boardsFoil engravingFront panelsFully automaticGalvanicGerberHead lightingHousingInstallationInsulation processLaser

Solder paste printingSound enclosurSpecial applicationsSpindleStarter packsStencil printerStencil printingTech supportTest adapterThrough hole platingTinningTool libraryTool managementTool ring setToolsTrainingTrainingUniversal cutterVacuum table (H100)Working depth limiterWYSIWYGZelFlexZelFlowZelPlaceZelPrint

LayoutMeasurement microscopeMicro cutterMicrometer screwMicrowave circuitsMicrowave layoutMicrowave prototypeMilling bitMiniContacMultilayer boardsMultiPressPastePCB drillingPCB millingPCB post processingPCB prototypePlastic / compositePlastic engravingPneumatic Z-axisPost processing of:· populated boards· bare boardsPrintingProgram wizardProtoLaserProtoMat®

ProtoMat® 95s/IIProtoMat® C100/HFProtoMat® C20ProtoMat® C40ProtoMat® C60ProtoMat® H100ProtoMat® L60ProtoMat® M30sProtoMat® M60ProtoMat® X60PrototypesQuality featuresQuick release colletQuick release frameReflow ovenRegistration pin methodReverse pulse platingRF circuitsRF layoutsRF prototypesRF-EndmillRivetsRoutingSatusLightScreen-printingServiceSet pin systemSign engravingSMD assemblySMD fine pitch printingSMD metal stencilsSMD polymer stencilsSMD solder paste stencilsSoftware upgradeSolder mask

31, 32, 33, 4031, 32, 33, 4031, 32, 33, 4024, 428, 14, 16, 206, 14, 16, 18, 20, 216, 281824394712732101141131025256, 2838294310, 112537351310101010, 1196, 8, 286143351014246, 2734, 4210368, 943888, 2098186, 2910 ff268181121, 54

102436267, 141111, 143529, 417, 31, 32, 33, 39, 4031, 424297968813, 14, 26

9, 209, 2043 ff102114187, 14141414181616162061313, 144553337, 297, 14117, 1436, 386, 277, 2025431313, 38747435454, 95410, 117, 28

43248263813431396, 27 ff30, 4112122535, 381413,183618261245534743

61Index


The Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2In-house Rapid PCB Prototyping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4Utilization of LPKF Systems in the Conventional PCB Process . . . . . . . . . .5Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Software Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

LPKF CircuitCAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10LPKF BoardMaster . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

LPKF Circuit Board PlotterQuality Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13LPKF ProtoMat® C-Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14LPKF ProtoMat® M/L-Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16LPKF ProtoMat® H-Series (Fully Automatic) . . . . . . . . . . . . . . . . . . . . .18LPKF ProtoMat® X-Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20LPKF ProtoLaser . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Accessories/Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

LPKF Through-Hole Plating TechnologyRivets (LPKF EasyContac) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27Conductive Paste (LPKF AutoContac) . . . . . . . . . . . . . . . . . . . . . . . . .28Electro Plating (LPKF Contac III, MiniContac III & MiniContac III/HF) . . .29

LPKF Multilayer TechnologyMultilayer Press (LPKF MultiPress II) . . . . . . . . . . . . . . . . . . . . . . . . .31· Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

LPKF Solder Mask (LPKF EasySolder) . . . . . . . . . . . . . . . . . . . . . . . . .34Tools (Mill and Drill Bits) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35Consumables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38Surface Mount Technology (SMT)

Solder Paste Printing (LPKF ZelPrint) . . . . . . . . . . . . . . . . . . . . . . . .43Quick-Release Stencil Frames (LPKF ZelFlex) . . . . . . . . . . . . . . . . . . .45Assembly (LPKF ZelPlace & BGA Placer) . . . . . . . . . . . . . . . . . . . . . .47Reflow Oven (LPKF ZelFlow) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

Other LPKF Product Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54Imprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56Contact Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61

1Contents

Contents

LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 1

The Company

Tradition and innovationFounded in the seventies, LPKF quickly established a reputation forinnovation by launching new chemical free methods for producingprototype circuit boards. The CAD-supported milling techniqueestablished itself with electronic design engineers worldwide as aclean, efficient and environmentally friendly alternative to chemicaletching. Revolutionary when first introduced, it is now an industrystandard method throughout the world.

Success led to expansion and the opening of branch officesworldwide at an early stage. LPKF gained customers in all sectorsfrom one-man operations to major international corporations. With abroad spectrum of products and services, LPKF covers all aspectsof the in-house prototyping chain. In the beginning of the nineties,the range of products and services was significantly expanded withthe development of laser systems for making ultra-fine circuitboards followed by, the now well known, stencil laser for makingSMD paste stencils.

The company is now the world market leader for in-house “RapidPCB Prototyping” and “StencilLasers”. This status is attributable tothe company’s future-oriented product policy, large investment inR&D and the highest quality standards.

Proactively shaping marketsSpecialists in a wide range of fields continuously analyze theprinted circuit board market to identify trends and set new industrystandards for accuracy and performance. This is highlighted by themajor commitment to research and development resulting in thelarge number of patents registered in recent years. In addition, thecontinuous exchange of information between clients and LPKF’sR&D departments emphasizes the innovative power of the companyand the focus on user-oriented solutions. The aim is, by using LPKFproducts, to optimize important commercial factors for its clientssuch as time-to-market, reduction of outside service cost andflexibility through independence.

2 The Company


Precision based on qualityFiner and finer structures and high density packaging are only feasible with thehighest levels of precision. This requires machines for PCB prototypingand production alike to be extremely precise to meet thesedemands. LPKF develops and manufactures almost everycomponent in its machines and systems. The result is aperfect synthesis of quality and high-tech: this applies tothe materials used as well as the manufacturing process.LPKF’s quality management has been certified to ISO 9001:2000.

Over 26 years experience in printed

circuit board technology

LPKF milling technology:

An efficient alternative to chemical

etching

Complete in-house Rapid PCB

Prototyping

Identifying trends, setting new

standards

Innovation through exchange of

ideas with customers

Individually tailored solution packages

for future-oriented customers

Global service network

Perfect synthesis of quality and

high-tech

ISO 9001:2000 certified supplier

Package solutionsLPKF is far more than a supplier of high-end solutions: clients around the world in a widespectrum of industry sectors also benefit from the company’s broad expertise in all aspectsof printed circuit boards. LPKF supplies individually tailored solution packages enabling itsclients to profit from rapid, flexible and independent production processes. In addition tothe machines themselves, this is accomplished with LPKF’s comprehensive consultingservices and supply of superior tools and consumables for every day jobs. The completerange of products in the LPKF Rapid PCB Prototyping segment includes circuit boardplotters, through-hole plating systems, SMD solder paste printers, component placementsystems, reflow ovens and a wide range of accessories.

The global service network keeps LPKF close to its customers and shows thecommitment to excellent customer service.

3The Company

to DIN EN ISO 9001

Certified by


In-house Rapid PCB Prototyping

Subject to technical modifications. See imprint for details.

4 In-house Rapid PCB Prototyping

CAM (CircuitCAM/BoardMaster)

LPKFss/ds withoutthrough-hole plating

LPKFss/ds with galvanicthrough-hole plating

LPKFss/ds withmechanicalthrough-hole plating

LPKFss/ds withconductive pastethrough-hole plating

LPKFMultilayer

Structuring the internal layers

Bonding the layers

Galvanic through-hole plating

Structuring

Contour routing

Conductive paste plating

Solder mask

Tin plating

Mechanical through-hole plating

DrillingDrilling


Structuring of outer layers

Prototype printed circuit board

Contour routing

Optional

LPKF PCB Prototyping Milling Technology

ss – single-sided circuit boardds – double-sided circuit boardpth – plated through holenpth – non-plated through hole



Use in conventional PCB production

5Use in conventional series production


Creating negative artwork film

Exposing photo resist

Developing photo resist

Rinsing circuit board

Drilling pth Drilling npth

Deburring

Cleaning

Laminating





Pb/Sn

Resist stripping

Etching, rinsing, cleaning, drying


Resist stripping

Differential etching, rinsing, cleaning, drying

Pb/Sn resist

Drilling npth

Contour routing

Solder mask

De-panelling

Solder paste printing

Assembling (SMD, BGA)

Reflow soldering

Bonding the layers


Drilling pth

Deburring

Cleaning


Desmearing etch-back






Resist stripping

Tin plating

ss/ds withthrough-hole plating(photo resist)

ss/ds withthrough-hole plating(Pb/Sn) (metaletching resist)

ss/ds withthrough-hole plating(tenting technology)

ss/ds withthrough-hole plating(metal etchingresist) Multilayer

Laminating

ss/ds withoutthrough-hole plating

Use of LPKF systems in conventional PCB production


Prototype circuit boards with up to 8 layers

Use of circuit board plotters for Rapid PCB Prototyping

100 µm (4 mil) track and gap150 µm (6 mil) hole diametersThe electrical characteristics of the prototype can be accurately produced from the designdata. This is guaranteed by the precise reproduction of the geometrical properties by theLPKF circuit board plotters. The capability to create 100 µm (4 mil) tracks and gaps as wellas 150 µm (6 mil) holes enables the production of state-of-the-art circuits including BGAand fine-pitch SMD components.

LPKF ProtoMats have a broad range of applications: an enormous spectrum of rigid andflexible materials, as well as soft substrates for RF and microwave technology, can easily bemachined to produce prototype boards of production quality.

Through-hole platingAn essential part of most prototype boards are through-hole connections. LPKF offersalternative methods including: Rivets (LPKF EasyContac), conductive paste (LPKFAutoContac) and galvanic through-hole plating (LPKF MiniContac III and Contac III).

Through-hole plating with rivetsThe LPKF EasyContac system is a simple, low cost method for through-hole platingon less complex circuit boards. The process uses rivets, manually inserted with aspecial tool and then soldered. This through-hole plating method is suitable forlow-density circuit boards with up to 50 via holes.

ElectroplatingLPKF offers two different sized electroplating systems – LPKF Contac III andMiniContac III. These galvanic through-hole plating systems were specially develo-ped to provide in-house plating solutions without compromising layout density orlimiting design rules. The process takes 60 - 120 min and produces production qua-lity through-hole plating. Holes as small as 0.2 mm (8 mil) are easily plated andthere is no limit to the number of holes.

Through-hole plating with conductive pasteA dispenser mounted on the head of the LPKF circuit board plotter automaticallyinjects a special conductive paste into the holes of the board and then vacuumsout the excess paste leaving an open hole.

The paste is cured in a convection oven and creates a plated through-hole thatis solderable and can be populated with wired components. LPKF AutoContac issuitable for low-density circuit boards with up to 300 via holes with diameters of0.5 mm - 1.4 mm (20 mil - 55 mil).

Applications


6 Applications



Production of multilayer circuit boardsMultilayer circuit boards can easily be produced in house using LPKF solutions. Today theproduction of 8-layer multilayers in ultra-fine technology is becoming a standard require-ment as much as simple double sided boards. In the production of multilayer circuit boardsin particular, electroplating systems (Contac III or MiniContac III) combined with the LPKFMultiPress II, are the backbone of the cost and time saving production of such complexprototype circuit boards.

RF and microwave circuitsDesigners of RF and microwave circuits often require a substantial number of differentprototype boards during a development project, all made with superior accuracy. Only somePCB manufacturers are set up to produce boards on special RF substrates and some of thechemical methods used are unable to provide the precise geometries required.

The LPKF ProtoMat® C100/HF was developed specifically for the RF and microwave market. It mostly uses custom designed precision tools to guarantee straight sidewalls andminimum penetration into the substrate.

Prototypes can be quickly produced for testing as soon as the design is complete, thensmall batches can also be economically made with this machine. The LPKF ProtoMat®

C100/HF easily handles all common RF substrates including PTFE and ceramic filledsubstrates (RO® 4000).

Routing slots, cut outs and board profileThe routing of slots, cut-outs and board contours or larger openings or routing of circuitboard contour to depanelize it from sheet material is no problem even with complex shapes.

Solder maskSolder masks are used in PCB mass production to increase soldering precision and protectthe boards from environmental influences. With LPKF EasySolder, LPKF has developed aneasy, inexpensive method of producing instant solder masks for prototype boards using theLPKF circuit board plotter. The mask is simply cut into an adhesive polymer material andthen bonded to the finished board.

Reverse pulse platingThe introduction of reverse pulse plating (RPP) in 2003 has considerably improvedthe quality of through-hole plating. This method guarantees uniform platingthickness in the entire hole and allows plating of more difficult aspect ratios. The “bone effect” (thicker plating at the top and bottom of the hole) is now a thingof the past. This technology is based on accurately timed reverse pulsing (anodicpolarisation of the circuit board) which precisely ablates excess material to givesmoother plating.

7Applications


Flexible circuit boardsWith LPKF’s patented non-contact air bearing it is possible to process a wide range offlexible circuit materials. The crucial factor in this application is the ratio of flexiblematerial thickness to the copper layer thickness but many flexible circuits have been proto-typed on an LPKF circuit board plotter equipped with this device.

Rigid-flex circuit boardsLPKF circuit board plotters have a proven track record in the production of rigid-flex circuitboards. In small batch production as well as prototyping, the LPKF circuit board plotterswith non-contact air bearing (LPKF ProtoMat® C100/HF, H100, 95s/II and X60) highlightthe benefits of defined depth milling. Prototyping of rigid-flex circuit boards is completedquickly and easily with these machines.

Front panels and sign productionLPKF circuit board plotters can also be used for engraving and routing front panels andsigns. These high-precision systems open up numerous options for the very fine machiningof various materials, e.g.:· Plastic· Plexiglass· Aluminum· Brass, and many more.

HousingsThe multi-functional character of LPKF circuit board plotters in electronics development isalso highlighted by their ability to machine other parts such as housings. This involves theuse of different tools to suit the materials used.

Special Applications

DispensingWith the LPKF AutoContac system fitted onto an LPKF circuit board plotter it is possible todispense media of various kinds including solder paste, adhesive, conductive paste andsealing compounds.


8 Applications



Perhaps you have come up with a new idea, or want to machine other new materials. Maybeyou have a special application but have not yet found a solution, simply give us a call! Our application engineers are happy to perform tests and help you find the solutions to yourproblems any time.

Reworking assembled/unassembled circuit boardsLPKF circuit board plotters can be used in numerous positions of PCB production lines andeasily integrated. LPKF ProtoMat® systems are ideal and cost-effective additions tocongested production lines particularly for the de-panelling of circuits (LPKF ProtoMat®

X60), or the subsequent creation of holes and openings after board manufacture. Other usesinclude configuring or coding, e.g. by removing a plated hole or by severing one or moretracks. LPKF systems can also be used to rework circuit boards, which have been producedby etching.

Solder frames and inspection templatesA crucial aspect in the production of solder frames and inspection templates is precisemachining of the carrier materials to ensure a perfect fit with the mass production circuitboards. This is another ideal area of application for LPKF circuit board plotters.

Milling and engraving of special films and instant solder masksLPKF circuit board plotters can be used to produce precision artwork for the mass produc-tion of circuit boards. This saves the expense of buying and running a photoplotter or thecost of using an outside service.

The ability to cut very precisely defined openings in special films opens up other areasof application for LPKF circuit board plotters including the production of:· Instant solder mask· Prototype SMD stencils for the application of solder paste on prototype printed circuit

boards using the printing machine LPKF ZelPrint LT300

Drilling circuit boards or test adaptersLPKF circuit board plotters can be used as CNC drilling machines. The software suppliedwith each circuit board plotter system can read in drilling co-ordinates from circuit boardsif no data is available by using a camera (LPKF CircuitView) in conjunction with the teach-inmethod. Test adapters for the pinhole bed of automatic circuit board testers can be drilledor milled in materials such as plexiglass, Pertinax and antistatic fiberglass reinforced epoxyoften used for vacuum test adapters.

Use of circuit board plotters in PCB production

!

9Applications


Software package (LPKF CircuitCAM & BoardMaster)

Each LPKF circuit board plotter is delivered complete with a comprehensive software package for the import ofdata from any PCB layout CAD package and control of the machine itself. The development of the softwarefocused on three key aspects: simple operation, perfect match to the hardware, and compatibility with allstandard CAD programs. This ensures an easy to learn, easy to use and compatible package.

Plug & Play for a fast start

• Data input: Gerber®, GerberX, HP-GL™, Excellon®, Sieb & Meier, DXF, Barco®, ODB++®

• Data output: Gerber®, GerberX, HP-GL™, LMD, Excellon® formats

• Intelligent insulation: This process guarantees removal of copper using various automatic and individually adjustable insulation options, which optimize milling time and tool life, with up to four different tools per insulation strategy and freely definable rub-outs – including polygons

• Design rule check: Automatic checking of track/gap spaces• Auto contour routing: Automatic generation of routing path

with definable breakout tabs• Auto ground plane: automatic generation of ground planes• Direct drawing input: Drawing of simple front panels or PCB’s• Editing: e.g. modifying line-widths, changing hole diameters,

shifting holes, add copper areas, etc.• The WIZARD: Integrated program assistant to guide the user

and cut the learning curve.• True type fonts: (TTF) in CircuitCAM text function• Auto assign: Automatic assignment of production phases/tools

for BoardMaster• Machining order control: Modification of cutting direction

and sequence

LPKF CircuitCAMThe software interface to your CAD/EDA system

Simple integrationLPKF CircuitCAM processes the same data, which would be sent tothe PCB manufacturer. The usual data flow does not need to bechanged. Automatic importing of the aperture tables and tool listsis followed by reading in of the Gerber and NC drilling files, whichare then graphically displayed on screen. LPKF CircuitCAM providesnumerous editing options for data modification (version-dependent):

LPKF CircuitCAM is one of the few user friendly programs offeringpowerful editing options for data modification. Its core is the intelli-gent insulation process used to produce the milling paths for theLPKF circuit board plotter.

Compatible with every standard CAD/EDACircuitCAM supports all standard data formats

CAD data accepted

· GERBER®

· Extended GERBER

(RS 274 X)

· DPF (BARCO®)

· EXCELLON

· SIEB & MEIER

· DXF

· HP-GL™

· ODB ++®

Simple and functionalLPKF CircuitCAM is very easy to operate via the Windows interfacethanks to its intelligent structure. Particularly fast and effectiveoperation through programmable tool bars and input instructions.A program assistant (Wizard) guides the user through the programsequence step by step: from importing data, through generation ofmilling/routing paths, to the export of production data. Even un-skilled users can rapidly learn this software and successfullygenerate the data for the circuit board plotter.

CircuitCAM

for Windows

· CAD data

importing and

editing

· Milling data and

routing path

generation

BoardMaster

for Windows

Controlling the LPKF

circuit board plotter

· Tool library

· Process control


10 Software package (LPKF CircuitCAM & BoardMaster)



High performance CAM stationWith LPKF CircuitCAM PCB software, the user also has access to an indepen-dent CAM station. This opens up a wide range of options: production datacontrol, editing, modification, step and repeat, different design rule checks,generation of ground planes or text in true type fonts as well as contour routingpaths. LPKF CircuitCAM PCB is also a very high-performance data converter,e.g. for the conversion of AutoCAD® DXF data into Gerber files.

Upgrading LPKF CircuitCAM LITE to PCB is possible any time for a single flatfee.

Import formats

Supported shapes

Export formats

Editing functions

Special functions

Display functions

Marker functions

Graphic functions

Control functions

Insulation methods

Insulation tools

Languages

Hardware and software

specifications

Supplied with

Gerber Standard (RS-274-D), Gerber Extended (RS-274-X),

Excellon NC Drill (version 1 and 2), Sieb & Meier NC Drill, HP-GL™

LPKF BoardMaster (LMD)

Contour routing path generator with breakout tabs

Measuring

1 - 2 tools

LPKF ProtoMat® C20, C40, M30/S

Specifications

Gerber Standard (RS-274-D), Gerber Extended (RS-274-X), Excellon NC Drill (version 1 and 2),

Sieb & Meier NC Drill, HP-GL™, Barco® DPF, AutoCAD™ DXF, ODB ++®

LPKF BoardMaster (LMD), Gerber Standard (RS-274-D), Gerber Extended (RS-274-X),

Excellon NC Drill, HP-GL™

Contour routing path generator with breakout tabs, volume operations, joining/separating objects,

step & repeat (multiple PCB), polygon cut-out, ground plane generation with defined clearance,

batch functions

Measuring, design rule check

1 - 4 tools

LPKF ProtoMat® C60, C100/HF, M60, 95s/II, H100, X60, L60, Upgrade from LITE available

LPKF CircuitCAM LITE LPKF CircuitCAM PCB

Circle, square, rectangle (also rounded or angled), octagon, oval, marker, IEC 1182 (1000 - 1024) including thermal reliefs, fiducials, etc., special (arbitrary

definable).

Original modification, relocating, duplicating, rotating, mirroring, erasing, extending/severing lines, line/path extension/shortening, line path/segment parallel

shifting, line path/object polygon conversion (Fill), curve linking/closing

Zoom window (freely definable), zoom in/out, overview, redraw, individual layers selectable/visible, panning (keyboard), layer in solid/outline/center line display,

16 pre-set colors (up to 16 million freely available), different colors for tracks and pads of the same layer, different colors for insulation tools

Single element, total layer, all layers, pad groups, selection and limiting to specific layers possible for lines/polygons/circles/rectangles/pads/holes (multiple choice

and restriction to specific layers possible)

Lines (open/closed), circle, polygon, rectangle, pad, hole, text (TTF)

Single insulation method, additional multiple insulation of pads, removal of residual copper spikes (spike option), milling out of large insulation areas (rub-out),

concentric or in serpentines maintaining minimum insulation spaces, zone insulation (only PCB version)

Microsoft® Windows® 95/98/NT/2000/XP, 700 MHz processor or better, min. 128 MB RAM (256 MB recommended), screen resolution min. 1024x768 pixels

Special applications with LPKF CircuitCAM software

• Defined insulation at the push of a button

• RF- and microwave layouts

• Contour routing path generator

Because of its special functions, it is particularly easy to use LPKFCircuitCAM to process RF and microwave layouts from any original data. The intelligent polygon-fill function for instance makes the processing ofDXF data really easy.

LPKF CircuitCAM also has the option to generate routing paths auto-matically. This includes the creation of cutting paths for internal slots oropenings as well as the outer contour of the circuit board. Defined breakouttabs are created at the same time to hold the circuit board in the material.

The diverse insulation parameters and options of LPKF CircuitCAM can beindividually adjusted and easily executed. The use of several toolsguarantees optimal, reliable removal of the copper around the conductorlines.

11Software package (LPKF CircuitCAM & BoardMaster)

English, German, French, Spanish, Japanese and Chinese


LPKF BoardMasterThe powerful and comfortable control software

Automatic data transmissionAll of the processing phases and associated tools are automatically output byCircuitCAM straight into BoardMaster. The production of the circuit board canstart immediately the cutting data is processed without any program change.

This intelligent control software for LPKF circuit board plotters combines a highdegree of user-friendliness with perfect process control. The graphic userinterface can handle milling and drilling data created by CircuitCAM as well asHP-GL™ files from various design software packages.

User-friendly operating interfaceThe WYSIWYG (What-You-See-Is-What-You-Get) user interface shows all millingand drilling data as well as the size of the base material. Through a simple clickof a mouse various different layouts and step-and-repeat copies can be placedon one sheet of material. The actual machining status is constantly displayed.

Intelligent tool managementAll tool parameters such as feed rate and rpm are controlled by LPKFBoardMaster and managed in the tool library. The life of the bits is constantlymonitored and the user is prompted to change tools when the maximum tool lifeis reached. The tool change process is optimized to reduce the number ofchanges necessary. The tool changing on the LPKF ProtoMat® 95s and H100 isfully automatic and requires no user interaction.

Import formats

Control

Display function

Placement functions

Selection methods

Tool management

Tool Library

Programming the

material size

Languages

Other

Hard and software

requirements

LPKF-Mill-Drill (*.LMD), HP-GL™

All ProtoMat® plotters and LPKF 101 LC, LPKF LC/VS, LPKF HI-P, LPKF AutoMill, LPKF 91, LPKF 91s and LPKF 92s

WYSIWYG display of machining data, zoom in/out/working area/projects, previous view, all viewing methods available at all times, even during the machining process

Copy, move, step and repeat, handles multiple artworks and placements simultaneously

Total production phase, specific tools, individual drill holes/lines/segments, selection from/up to a specific hole/line segment

RPM and head down time, registering and saving actual tool life, initiating the tool change procedure if tool lifetime is exceeded

Unlimited, individual library for different material types, individual customizable parameters

Positioning with corner coordinates, with the mouse, coordinates input via keyboard, option of saving frequently used material sizes

English, German, Spanish, Japanese, French, Chinese

Acoustic signal at end of production phase and display of production time remaining, estimated production time is displayed before start

Microsoft® Windows® 95/98/NT/2000/XP, 400 MHz processor or better, min. 64 MB RAM (recommended 128 MB), screen resolution min. 800 x 600 pixels, serial port

Technical data LPKF BoardMaster

Simultaneous processing of several projects

Tool library

Selection of separate elementsLPKF BoardMaster in use


12 Software package (LPKF CircuitCAM & BoardMaster)


LPKF ProtoMat® – Quality features

State-of-the-art technology and materials of the highest quality ensure that LPKF circuitboard plotters comply with the most stringent specifications for precision. This appliesto the machines themselves as well as to the boards produced by them. These systemshave an extremely long and useful operational life. Each and every LPKF ProtoMat®

plotter is built to be the best of its class with thousands of installed systems to prove it.

High precision and long life

System Design• Precision linear shafts• Anti-backlash lead screws• Solid, high-precision cast machine table• Variable high-speed spindle motors

· up to 100,000 rpm· Increased tool lifetimes· Automatic, software-supported, smart warm-up

phase doubles motor lifetimes• Software-supported registration hole system• Enclosed LPKF dust extraction

· with electronic control and absolute filter to prevent micro dust particles from becoming airborne

• Quick-release tool collet· For standard and special tools with 1/8“ shaft

• Coaxial milling depth limiterEither mechanical foot or non-contact air bearing· Scans the material surface

and compensates for irregularities

· This allows the defined penetration of the tool and the production of ultra-fine structures even on soft microwave substrates

· The shape of the depth limiter provides efficientdust extraction of the entire cutting area.

Software solutions• CAM software package (CircuitCAM, BoardMaster)

For circuit boards and front panel applications: included (Windows® 95/98/2000/NT and XP compatible)· CircuitCAM: conversion and editing software with

intelligent insulation process

· BoardMaster: circuit board plotter control, process control; intelligent toolmanagement guarantees optimal use of LPKF high-precision tools. Both standard bits and special tools for RF circuits do not require any liquid cooling.

Important Parameters• Step resolution as small as 1 µm (0.004 mil) with a

repeatability of ± 1 µm (0.004 mil)• Circuit structures

· Minimum 80 µm (3.1 mil) tracks partially with 100 µm (4 mil) spacing

· Drill holes 150 µm (6 mil) and bigger

• Machining of various materials· FR3, FR4, G10, other glass fiber reinforced epoxies· PTFE, filled substrates (e.g. RT/duroid®, TLX®, etc.)· ceramic filled substrates (e.g. Rogers RO® and TMM)· brass and aluminum· plastic materials

Upgrading Options• The software already includes options such as

· dispensing and conductive paste through-hole plating.

· Teach-in-camera (LPKF CircuitView)

• Accessories and additional equipment options allow the adaptation of the systems to an enormous range of tasks

Integrated dust

extraction system

Rigid cast aluminium

table

CircuitCAM

U

U

U

U

U

Coaxial milling depth

limiter

O

BoardMaster

O

O

13LPKF ProtoMat® – Quality features



Slovenia +386-4-2013804Spain +34-91-8475505UK/Ireland +44-1344-455046North America +1-503-454-4229 (8 am - 5 pm PST)


1 and 2-sided circuit boards

FR3, FR4, FR5, G10

Flexible substrates

RF & microwave substrates

Front panels/sign engraving

Machining cut outs in front panels

Contour routing of circuit boards

Multilayer PCBs up to 4 layers*


Test adapter drilling

Milling film artworks

SMD solder stencil cutting

Rigid-flex circuit milling

Depanelization and reworking of bare

and populated boards

Solder frames for circuit board assembly

Housing production

Applications C2

0

LPKF ProtoMat®

C4

0

C6

0

C1

00

/HF

Simple and affordable 2-sided PCBsThis circuit board plotter is an ideal entry-levelsystem for users that demand precision proto-types on an affordable budget. This model isparticularly popular in schools, colleges, anduniversities. The ProtoMat® C20 is ideal forsingle and double sided boards using analogand digital technology with medium layoutdensity.

LPKF ProtoMat® C-series

LPKF ProtoMat® C20

Robust basic model with quick tool changeInstant prototypes right out of the lab at ahigher level – The ProtoMat® C40 is setting anew standard in the industry combining thecapability to create precision single and doublesided PCBs with the operating comfort of aquick-release tool collet and the high perfor-mance of 40,000 rpm programmable motorspeed. This makes this entry-level circuit boardplotter the perfect fit for users from smallbusinesses to corporate engineering.

LPKF ProtoMat® C40

LPKF ProtoMat® C60

Ideal for RF substrates and flexThis system, especially designed for RF andmicrowave PWBs, takes prototyping to extremes.A motor speed of 100,000 rpm allows thewidest range of tools including 0.15 mm (6 mil)endmills for high performance designs. In addi-tion the ProtoMat® C100/HF is extremely versa-tile. A contact-less air bearing depth limiter isideal for use on flexible or gold plated circuits.Micrometer depth adjustment can be used to millprecise pockets into brass or aluminum backedcircuits or to route beryllium copper sheets.

The ProtoMat® C100/HF is fully compatiblewith multilayer applications and all commonmaterials including FR4, Rogers RO 4000® andTMM®, as well as PTFE substrates such asRT/duroid®, UltraLAM®, TLX®, TLY® and manyothers.

LPKF ProtoMat® C100/HF

For tight specs and diverse applicationsThe 60,000 rpm programmable speed motorallows the use of an extended range of tools,including small rectangular profiled endmillswith diameters as small as 0.25 mm (10 mil).These tools have superior characteristics for RF and microwave applications and allow maxi-mum precision with minimum penetration intothe substrate. The high-speed motor also allowsthe production of dense digital designs withtrack/gap geometries of 100 µm (4 mil) and0.2 mm (8 mil) drill holes as well as multilayerapplications.

Suitable for application

* combined with MultiPress II and Contac III/MiniContac III

C-S

erie

s

M-S

erie

s

X-S

erie

s200 x 340(7.8 x 14.4)

375 x 540(14.8 x 21.3)

530 x 650(20.9 x 25.6)

Working area in mm (inch)

Training for LPKF ProtoMat® C, M,and X-series

All LPKF products are supplied with compre-hensive operating instructions, with easy to

understand manuals to make installation andcommissioning quick and simple for the user.

Additional software assistant and multimediatraining CD allow complete self-conducted training atthe user’s convenience.

We also provide private installation and trainingclasses, both on-site or at one of LPKF’s worldwideservice facilities.

!


14 LPKF ProtoMat® C-series


Part number

Minimum track width

Minimum gap

Minimum hole diameter

Working area

Resolution

Repeatability

Front-to-back registration accuracy

Milling motor

Tool change

Collet

Drilling capacity

Positioning speed (max.)

Depth adjustment

X/Y positioning system

Z drive

Machine table base

X/Y linear system

Dimensions (W/H/D)

Weight

Power supply

Compressed air supply

Options/accessories

Software package CircuitCAM LITE

Software package CircuitCAM PCB

Dust extraction unit

Dust extraction AutoSwitch

Tooling starter kit (board material/tools etc.)

Measuring microscope

Mobile sound enclosure

Head illumination

CircuitView camera system

Micrometer depth adjustment

3-phase motor, 10,000 to 100,000 rpm


EC motor, 10,000 to 40,000 rpm

DC motor, 20,000 rpm

Pneumatic Z-stroke

Pneumatic non-contact air bearing

Raising Z-axis by 30 mm (1.2”)

109419

0.2 mm (8 mil)

0.2 mm (8 mil)

0.5 mm (20 mil)

340 mm x 200 mm (13.4“ x 7.8“)

7.937 µm (0.312 mil)

+/- 0.005 mm (0.2 mil)

+/- 0.02 mm (0.8 mil)

DC, 20,000 rpm

Semi-automatic

1/8” collet

78 holes/min

35 mm/sec (1.38“/sec)

Mechanical scanning,

coaxial foot

stepper motors, precision lead

screws ActiveCAM®

anti-backlash Supernuts®

electromagnetic with hydraulic

damper

75mm (3”) cast aluminum

precision linear bushings and

dual shafts

16.5“ x 13.75“ x 22.25“ 1)

24 kg (53 lb)

120/240V, 50 - 60 Hz/150VA

--

•

+

+

+

+

+

+

++

+

+

++

++

++

•

++

++

++

110517

0.1 mm (4 mil)

0.2 mm (8 mil)

0.3 mm (12 mil)

340 mm x 200 mm (13.4“ x 7.8“)

7.937 µm (0.312 mil)

+/- 0.005 mm (0.2 mil)

+/- 0.02 mm (0.8 mil)

EC (brushless), 10,000 -

40,000 rpm, programmable

Semi-automatic

1/8” quick-release collet

78 holes/min

35 mm/sec (1.38“/sec)


coaxial foot

stepper motors, precision

lead screws ActiveCAM®


electromagnetic with

hydraulic damper


precision linear bushings

and dual shafts

16.5“ x 13.75“ x 22.25“ 1)

24 kg (53 lb)

120/240V, 50 - 60 Hz/150VA

--

•

+

+

+

+

+

+

++

+

+

++

++

•

–

++

++

++

Specifications LPKF ProtoMat® C20 LPKF ProtoMat® C40

106511

0.1 mm (4 mil)

0.1 mm (4 mil)

0.2 mm (8 mil)

340 mm x 200 mm (13.4“ x 7.8“)

7.937 µm (0.312 mil)

+/- 0.005 mm (0.2 mil)

+/- 0.02 mm (0.8 mil)

3-phase motor, 10,000 -


Semi-automatic


90 holes/min

35 mm/sec (1.38“/sec)


coaxial foot




electromagnetic with

hydraulic damper



and dual shafts

16.5“ x 13.4“ x 22.25“ 2)

24 kg (53 lb)

120/240V, 50 - 60 Hz/200VA

--

–

•

+

+

+

+

+

++

+

+

++

•

–

–

++

++

++

LPKF ProtoMat® C60

107973

0.1 mm (4 mil)

0.1 mm (4 mil)

0.2 mm (8 mil)

340 mm x 200 mm (13.4“ x 7.8“)

7.937 µm (0.312 mil)

+/- 0.005 mm (0.2 mil)

+/- 0.02 mm (0.8 mil)

3-phase motor, 10,000 -


Semi-automatic


120 holes/min

35 mm/sec (1.38“/sec)

Non-contact air bearing




pneumatic, 14 mm (0.55“)

movement



and dual shafts

16.5“ x 13.0“ x 22.25“ 3)

25 kg (55 lb)

120/240V, 50 - 60 Hz/200VA

6 bar (87 psi), 50 l/min (1.7 cfm)

–

•

+

+

+

+

+

++

+

•

•

–

–

–

•

•

++

LPKF ProtoMat® C100/HF

• standard equipment

+ optional (can be retrofitted)

++ optional (needs to be factory mounted)

– not available


Simple and affordable

2-sided PCBs

Robust basic model with quick

tool change

Multifunctional for tight specs

and diverse applications

Ideal for RF substrates

and flex

recommended basic equipment

15LPKF ProtoMat® C-series

Dimensions (W/H/D)

1) 420 mm x 350 mm x 565 mm

2) 420 mm x 340 mm x 565 mm

3) 420 mm x 330 mm x 565 mm


LPKF ProtoMat® M/L-series


FR3, FR4, FR5, G10

Flexible substrates














Housing production

Applications M3

0/s

LPKF ProtoMat®

M6

0

L60

Robust basic model with quick-release colletfor 2-sided PCBs, large panelsThe large table size makes the ProtoMat® M30very valuable for large analog and digitalboards with medium population density as wellas production of multiple copies of the same ordifferent layouts. For increased operatingcomfort, this system provides programmablespindle speed and quick-release tool collet.

LPKF ProtoMat® M30/s

LPKF ProtoMat® M60

LPKF ProtoMat® L60For extremely long circuit boards, antennasand front panelsThis circuit board plotter provides a longworking area that accommo-dates extra large circuitsincluding antennae and frontpanels. It is equipped with a60,000 rpm motor capableof handling small endmillsfor RF and microwave circuitryand a pneumatic Z-axis with extra clearance forthick substrates.



C-S

erie

s

M-S

erie

s

X-S

erie

s200 x 340(7.8 x 14.4)

375 x 540(14.8 x 21.3)

530 x 650(20.9 x 25.6)



16 LPKF ProtoMat® M/L-series

For precise large and multilayer boardsThe ProtoMat® M60 is truly a multi-talentedsystem. Its large table size allows the pro-duction of large circuit boards. This isespecially helpful when producing multilayerboards as this plotter can handle multiplelayers simultaneous.

A 60,000 rpm motor guarantees perfectdrill hole quality, which is essential for properinterconnection on multilayer boards, andproduces dense circuitry from DC to RF.

It is also able to engrave and route inspec-tion templates, aluminum panels and other two-dimensional mechanical items.



Part number

Minimum track width

Minimum gap


Working area

Resolution

Repeatability


Milling motor

Tool change

Collet

Drilling capacity


Depth adjustment


Z drive

Machine table base

X/Y linear system

Dimensions (W/H/D)

Weight

Power supply


Options/accessories








Head illumination






Pneumatic Z-stroke



108001

0.1 mm (4 mil)

0.2 mm (8 mil)

0.3 mm (12 mil)

540 mm x 375 mm (21.3“ x 14.8“)

7.937 µm (0.312 mil)

+/- 0.005 mm (0.2 mil)

+/- 0.02 mm (0.8 mil)

EC (brushless), 10,000 - 30,000 rpm,

programmable

Semi-automatic

1/8“ collet

78 holes/min

35 mm/sec (1.38“/sec)

Mechanical scanning, coaxial foot

stepper motors, precision lead screws

ActiveCAM® anti-backlash Supernuts®

electromagnetic with hydraulic damper

75mm (3“) cast aluminum

precision linear bushings and dual shafts

620 x 420 x 760 mm (24.4“ x 16.5“ x 29.9“)

43 kg (94.6 lb)

120/240V, 50 - 60 Hz/150VA

--

•

+

+

+

+

+

+

++

+

+

++

++

•

++

++

++

108002

0.1 mm (4 mil)

0.1 mm (4 mil)

0.2 mm (8 mil)

540 mm x 375 mm (21.3“ x 14.8“)

7.937 µm (0.312 mil)

+/- 0.005 mm (0.2 mil)

+/- 0.02 mm (0.8 mil)

3-phase motor, 10,000 - 60,000 rpm,

programmable

Semi-automatic

1/8“ collet

90 holes/min

35 mm/sec (1.38“/sec)

Mechanical scanning, coaxial foot

stepper motors, precision lead screws

ActiveCAM® anti-backlash Supernuts®

electromagnetic with hydraulic damper



620 x 420 x 760 mm (24.4“ x 16.5“ x 29.9“)

43 kg (94.6 lb)

120/240V, 50 - 60 Hz/200VA

--

–

•

+

+

+

+

+

++

+

+

++

•

–

++

++

++

Specifications LPKF ProtoMat® M30/s LPKF ProtoMat® M60

109797

0.1 mm (4 mil)

0.1 mm (4 mil)

0.2 mm (8 mil)

375 mm x 1,250 mm (14.75“ x 49.2“)

7.937 µm (0.312 mil)

+/- 0.005 mm (0.2 mil)

+/- 0.02 mm (0.8 mil)

3-phase motor, 10,000 - 60,000 rpm,

programmable

Semi-automatic

1/8“ collet

120 holes/min

35 mm/sec (1.38“/sec)


stepper motors, precision lead screw

assemblies with internal ball recirculating

system

pneumatic, 14 mm (0.55“) movement

precision milled aluminum bed


620 x 420 x 1,543 mm (24.4“ x 16.5“ x 60.7“)

110 kg (242 lb)

120/240V, 50 - 60 Hz/200VA

6 bar (87 psi), 100 l/min (3.528 cfm)

–

•

+

+

+

+

–

++

+

+

++

•

–

•

++

++

LPKF ProtoMat® L60




– not available

Robust basic model with quick-release

collet for 2-sided PCBs, large panels

Multifunctional system for precise large

and multilayer boards

For extremely long circuit boards,

antennas and front panels


17LPKF ProtoMat® M/L-series


95s/

II, H

100

380 x 420(14.9 x 16.5)



FR3, FR4, FR5, G10

Flexible substrates














Housing production

Applications 95

s/II

LPKF ProtoMat®

H1

00

The fastest prototyping system yetThis system allows significant reduction in theproduction time of prototype PCBs. The maxi-mum milling speed is now almost doubledcompared to prior top-of-the-range systemsand the integrated smart following-vector pathgeneration allows the system to maintain ahigher average speed. The combination of bothof these features pushes the performance factorof this machine 2 - 3 times. Now prototype pro-duction of multilayer boards is accomplishedin-house comfortably. The resolution has beenincreased five fold to 1 µm, which combinedwith 100,000 rpm milling motor allows thisplotter to partially create 80 µm (3.1 mil)tracks with 100 µm (4 mil) spacing whichaccommodates all state of the art packagesincluding BGA and µBGA®.

Along with the increased performance, theH100 also includes many new features derivedfrom high volume production systems, whichup to now have been unknown in this class ofprototyping equipment. These features includeautomatic tool change, automatic tool adjust-ment by scanning sensor, and a camera systemfor automatic fiducial recognition. This elimi-nates user interaction and simplifies the boardalignment process. The H100 system alsoincludes an integrated vacuum tabletopallowing proper mounting of thin and flexiblesubstrates on the plotter.

LPKF ProtoMat® H100

Precision system with automatic tool changeThe LPKF ProtoMat® 95s offers high-speed andprecision combined with the convenience of a 30-station fully automatic tool change. A contact-less air bearing depth limiter is idealfor use on flexible or gold plated circuits.

This circuit board plotter is designed forPCB labs with a high volume of prototypes inany technology including analog, digital, powersupplies, flex boards as well as RF and micro-wave circuits. The high production speed isalso a substantial advantage for the in-housefabrication of quick turn multilayer circuitboards and small batch production.

LPKF ProtoMat® 95s/II



LPKF ProtoMat® H-series

Installation and training for LPKFProtoMat® 95s/II and H100

These systems are offered with installation andtraining packages to support users in their

correct operation for the many applications thatthe high end LPKF ProtoMat® 95s/II and

ProtoMat® H100 can perform.

!


18 LPKF ProtoMat® H-series



Part number

Minimum track width

Minimum gap


Working area

Resolution

Repeatability


Milling motor

Tool change

Collet

Drilling capacity


Depth adjustment


Z drive

Machine table base

X/Y linear system

Dimensions (W/H/D)

Weight

Power supply


Options/accessories








Head illumination






Pneumatic Z-stroke



111424

0.1 mm (4 mil); 0.08 mm (3.1 mil) partially

0.1 mm (4 mil)

0.15 mm (6 mil)

420 mm x 380 mm (16.5“ x 14.9“)

1 µm (0.04 mil)

± 0.001 mm (0.04 mil)

± 0.02 mm (0.8 mil)

3-phase motor, 10,000 - 100,000 rpm, programmable

Automatic, 30 positions

1/8“ pneumatic-release collet

120 holes/min

100 mm/sec (3.94“/sec)

Non-contact air bearing: automatic setting

stepper motors, precision ball screw assemblies with internal

ball recirculating system


75 mm (3“) cast aluminum


650 mm x 430 mm x 750 mm (25.6“ x 16.9“ x 29.5“)

50 kg (110 lb) (without acoustic cabinet)

120/240V, 50 - 60 Hz/240VA

6 bar (87 psi), 100 l/min (3.528 cfm)

–

•

+

+

+

+

•

•

+

•

•

–

–

•

•

–

106333

0.1 mm (4 mil)

0.1 mm (4 mil)

0.2 mm (8 mil)

420 mm x 380 mm (16.5“ x 14.9“)

5 µm (0.2 mil)

± 0.005 mm (0.2 mil)

± 0.02 mm (0.8 mil)

3-phase motor, 10,000 - 60,000 rpm, programmable



90 holes/min

60 mm/sec (2.36“/sec)





75 mm (3“) cast aluminum


650 mm x 430 mm x 750 mm (25.6“ x 16.9“ x 29.5“)

50 kg (110 lb) (without acoustic cabinet)

120/240V, 50 - 60 Hz/240VA

6 bar (90 psi), 100 l/min (2.4 cfm)

–

•

+

+

+

+

•

++

+

+

+

•

–

•

•

–

Specifications LPKF ProtoMat® H100LPKF ProtoMat® 95s/II




– not available

The fastest prototyping system yet!Precision system with automatic tool change


19LPKF ProtoMat® H-series


C-S

erie

s

M-S

erie

s

X-S

erie

s200 x 340(7.8 x 14.4)

375 x 540(14.8 x 21.3)

530 x 650(20.9 x 25.6)


LPKF ProtoMat® X60Drilling, Routing & DepanelingThe ProtoMat® X60 is placed between two worlds – rapidPCB prototyping plotter on one hand and versatile production drilling and routing system on the other. The large table holds panel sizes of 650 mm x 530 mm(26“ x 21“). The X60 is equipped with pneumatic z-stroke and non-contact air bearing depth limiter. The extended Z-axis range en-ables depaneling and millingof deep trenches for rigidand rigid-flex boards.

The ProtoMat® X60is also ideal forproducing anti-static inspectiontemplates forcircuit boards.

Part number

Minimum track width

Minimum gap


Working area

Resolution

Repeatability


Milling motor

Tool change

Collet

Drilling capacity


Depth adjustment


Z drive

Machine table base

X/Y linear system

Dimensions (W/H/D)

Weight

Power supply


Options/accessories








Head illumination






Pneumatic Z-stroke



109643

0.1 mm (4 mil)

0.1 mm (4 mil)

0.2 mm (8 mil)

650 mm x 530 mm (25.6“ x 20.9“)

1 µm (0.04 mil)

± 0.001 mm (0.04 mil)

± 0.02 mm (0.8 mil)

3-phase motor, 10,000 - 60,000 rpm,

programmable

Semi-automatic

1/8” collet

120 strokes/min

50 mm/sec (1.97“/sec)


stepper motors, precision ball screw assemblies

with internal ball recirculating system




750 mm x 420 mm x 900 mm (29.5“ x 16.5“ x 35.4“)

69 kg (151.8 lb)

120/240V, 50 - 60 Hz/240VA

6 bar (87 psi), 100 l/min (3.528 cfm)

–

•

+

+

+

+

–

++

+

+

+

•

–

•

•

+

Specifications LPKF ProtoMat® X60




– not available

Model for use in series production.

Working area matches standard

PCB production panels


FR3, FR4, FR5, G10

Flexible substrates











Depanelization and reworking of bare and

populated boards


Machining of enclosures

Applications X60

LPKF ProtoMat®





LPKF ProtoMat® X-series

20 LPKF ProtoMat® X-series


LPKF ProtoLaser for Rapid PCB Prototyping


LPKF ProtoLaser

Ultra fine geometries with laserTo be able to prototype HDI circuitry the LPKF ProtoLaser combinesthe best of both worlds. This circuit board plotter features a mecha-nical milling head with fully automatic tool change for milling,drilling and routing as well as a laser beam to create circuitgeometries as small as 40 µm (1.6 mil) with 100 µm (4 mil) pitch.The laser is also capable of drilling and skiving ceramic substrates.This system is designed to meet the needs of engineers pushing theenvelope with top-level designs without compromising theturnaround time for prototypes.

Product features• 60 µm (2.4 mil) track with 40 µm (1.6 mil) gaps• Capable of drilling and skiving Alumina and other ceramic

substrates• Fine marking and engraving of components and front panels• Extremely simple operation• Powerful software with intuitive user interface• Laser Safety Class 1

Micro coil

High-end versatility

HDI circuit structuringThe LPKF ProtoLaser uses a hybrid cutting head consisting of botha mechanical tool and a laser beam that can be used alternatively.The laser beam creates the critical fine structures, whereas themechanical milling bit removes larger copper areas, drills holes orroutes the board’s contour. A completely integrated software toolmanagement automatically handles all tool parameters as well asthe interaction between laser and mechanical machining. If particu-larly high specifications are demanded an optional cleaning processcan be applied subsequently.

Substrate cuttingAnother application of the LPKF ProtoLaser is the cutting of varioussubstrates including aluminium oxide, silicon nitride, polycrystal-line silica and others.

Laser-cut ceramics

Laser cutting head

21LPKF ProtoLaser


High-performance CAM softwareThe LPKF ProtoLaser uses the LPKF CircuitCAM/BoardMaster software package. LPKF CircuitCAM imports the artwork (Gerber® Standard [RS-274-D], Gerber® Extended[RS-274-X], DBF [Barco], Excellon® NC Drill [versions 1 and 2], Sieb & Meier NC Drill, DXF,HP-GL™, ODB++), provides the extensive functionality of a CAM package, calculates thecutting paths for the laser and the milling tools, and transfers the production data to theProtoLaser control software (LPKF BoardMaster). In addition to numerous control functions,this also incorporates comprehensive tool management and a comfortable WYSIWYG userinterface which permanently informs about the current status of the production process.

If you have any questions, or inquiries about your special applications, please contact ourLPKF application engineers at any time.

Sensor

60/40 µm (2.4/1.6 mil) ultra fine circuit

Circuit with 40 µm (1.6 mil) geometries

Micro coil 50 µm (2 mil)

Data preparation with CircuitCAM


22 LPKF ProtoLaser



Part number

Wavelength

Output

Frequency

Beam diameter

Minimum track and gap

Copper thickness

106821

1,064 nm

70 W multi-mode system

0 - 50 kHz (regulated by cutting speed)

40 µm (1.6 mil)

60 µm/40 µm (2.4 mil/1.6 mil)

< 35 µm (1 oz.)

Specifications: Laser

· HDI circuits

· Compatible with all common circuit substrates

· Engraving of components, front panels, etc.

· Machining and circuit structuring of ceramic substrates (max. thickness 635 µm [25 mil])

Applications

Milling motor

Tool change

Collet

Drilling capacity


Depth adjustment

Minimum track and gap


3-phase motor, programmable 10,000 - 60,000 rpm



120 strokes/min

60 mm/sec (2.4“/sec)


0.1 mm/0.1 mm (4 mil/4 mil))

0.2 mm (8 mil)

Specifications: milling/drilling head

Working area

Resolution

Repeatibility


Z drive

Dimensions (W/H/D)

Machine table unit

Laser control unit

Unit separation

Weight

Machine table unit

Laser control unit

Power supply

Machine table unit

Laser control unit

420 x 380 mm (16.5“ x 15“)

for laser applications: 415 mm x 320 mm (16.3“ x 12.6“)

5 µm (0.2 mil)

0.005 mm (0.2 mil)



pneumatic, 14 mm / 0.55” movement

730 mm x 1,340 mm x 850 mm (28.7“ x 52.8“ x 33.5“) with housing

570 mm x 1100 mm x 750 m (22.4“ x 43.3“ x 29.5“)

215 mm (8.5“)

110 kg (242 lbs) (with cover)

180 kg (396 lbs)

230 V, 50/60 Hz, 240 VA; 6 bar (87 psi) compressed air, min. 100 l/min (3.5 cfm)

3-phase, 3 x 400 V, 50 Hz, 4 kVA, 10 bar (145 psi) comp. air, min. 120 l/min (4.2 cfm),

cooling water 10 l /min (0.35 cfm), 2 - 6 bar (29 - 87 psi), max. 20 °C (68 °F)

General specifications

23LPKF ProtoLaser


Accessories/options

Part number

Machine

W/H/D approx. (mm)*

Noise reduction

101097

C series

650/1,320/700

Approx. 8 dB

Size cabinets Small cabinet

108731

M series

730/1,320/950

Approx. 8 dB

Large cabinet

Standard

95s/II, H100

730/1,320/850

Approx. 8 dB

95s/II cabinet

Measuring microscopeThe measuring microscope magnifies 50 times and has a metric scale for theprecise setting of insulation gap widths and quality control.Part number 104475

LPKF acoustic cabinetsThe acoustic cabinets reduce noise and dust emissions to ensure comfortableoperations in electronic design labs or CAD offices. Storage shelves for tools andbasic materials, as well as a space for the integrated dust extraction, simplifyroutine work. LPKF acoustic cabinets are optionally available for all circuitboard plotters but are supplied standard with the LPKF ProtoMat 95s/II and theH100 for safety purposes due to the automatic tool change. The protectivecover is mobile to ensure easy travel to various locations.

Dust extractionMilling and drilling dust must be removed from the machining head to ensurethe proper operation of the milling depth limiter. The dust extraction systemguarantees reliable removal of the dust generated by machining.

LPKF AutoSwitchAutoSwitch is a useful addition to the dust extraction system. When fitted, thedust extraction system is switched on and off automatically. This ensures safety,increases the lifetime of the dust extraction system and reduces noise when themachine is not running.Part number 101473

The LPKF accessories/options are practical additions to themachines and systems. A very high degree of functionality isguaranteed by the perfect match between each component.High quality materials and precise finishing ensures productswith long lifetime.

Part number

Vacuum pressure

Air flow rate

Power consumption

Filter surface

Dim. W/H/D mm (inch)

Acoustic pressure

Absolute filter

Filter material

Surface filter cartridge

Filter efficiency

109039

Max. 20,000 Pascal

40 l/sec (1.411 cfm)

800 W (230 V)

1,200 cm2 (47.2“2) (cotton wool)

300/360/400 (11.8/14.2/15.7)

50 db(A)

HEPA filter

Glass fiber

4,300 cm2 (169.3 sq. in)

Particle size 0.5 - 0.9 µm (0.02 - 0.036 mil) 100 %

Technical data


24 Accessories/options

Front and rear view of the cabinet with

optional accessories * Dimensions W/H/D (inch) 25.6“/52“/27.6“ 28.7“/52“/37.4“ 28.7“/52“/33.5“



Hot air ovenThe hot air oven has an integrated timer and precise temperature controller,creating optimal conditions for hardening paste plated-holes and for laminatingsolder-resist films.

CompressorSome LPKF systems (e.g. ProtoMat® C100/HF, H100, 95s/II, MultiPress II, Auto-Contac) require compressed air. The compressors supplied by LPKF guaranteeclean, dry and reliable compressed air supplies.

LPKF precision ring setterThe LPKF ring setter includes a tool ring press, adjusting unit, and a measuringmicroscope. The precise adjustment of spacing rings allows different tools to beused without readjusting the milling depth settings.

LPKF CircuitViewThe LPKF CircuitView provides a camera option for the visual positioning of themilling head. This system is particularly suitable for the reworking of circuitboards, as well as the coding, and teach-in functions. CircuitView contains amonochrome camera and a frame grabber card. This option is available for allLPKF circuit board plotters.

Part number

Feature

Power

External dim. W/H/D mm (inch)

Internal dim. W/H/D mm (inch)

102073

Timer, temperature controller

1,800 W

580/290/350 (22.8/11.4/13.8)

440/210/290 (17.3/8.3/11.4)

Technical data

Part number

Tank size in liters

Max. pressure bar (psi)

Output l/min (cfm)

External dim. W/H/D mm (inch)

Weight kg (lb)

Acoustic noise level db(A)

At a distance of 4 m (LPA4)

For LPKF system

101092

9

8 (116)

33 (1.1)

360/430/360 (14.2/16.9/14.2)

21 (46.2)

33

AutoContac, MultiPress

104863

50

10 (145)

165 (5.8)

1,000/770/390 (39.4/30.3/15.4)

56 (123.2)

67

C100/HF, 95s/II, X60, H100

Technical data Compressor type

Small Large

Part number 110368

Available for All LPKF ProtoMat® LPKF ProtoMat® 95s/II, H100

Standard

Part number 106345

Available for LPKF ProtoMat® C & M series LPKF ProtoMat® 95s/II, H100

107168

LPKF StatusLightLPKF acoustic cabinets for the LPKF circuit board plotters can also beequipped with a multi-colored indicator light. The StatusLight, which isvisible from a long distance, indicates the operating status of themachine.Part number 111093

25Accessories/options


Optional accessories are typically factory mounted to the circuit board plotter and are standard on somesystems, however the user can retrofit some options.

Non-contact air bearing depth limiterThe pneumatic depth limiter has an air cushion which makes it possible to machinesensitive materials without coming into direct contact.Part number is available upon request

Pneumatic Z-strokeThe pneumatic Z-stroke makes it possible to machine thicker materials (up to a maximumof 14 mm [0.55“]). It also gives a 15 mm (0.59“) z-movement (standard: 5 mm [0.2“]),and can use tools with much smaller diameters thanks to the adjustable lowering pressure.Part number is available upon request

Micrometer screwThe micrometer screw is for the infinite adjustment of the milling depth when operating onmaterials without a milling depth limiter. Available for all LPKF circuit board plotters thisdevice works off of a backstop to control milling depth.Part number 109688

100,000 rpm motorThis motor is capable of using very small endmills (0.15 mm [6 mil]) for RF /microwaveapplications and drilling very small holes. The higher speed provides longer tool life andalso allows higher travel speeds.Part number is available upon request

Increased Z-axis height (to max. 30 mm [1.18“])Setting the Z-axis higher enables the surface machining of thicker material. The system isalso suitable for reworking assembled circuit boards. The stroke remains unchanged at 5 mm (0.2“) (15 mm [0.59“] in the case of pneumatic stroke). This option is available forall LPKF circuit board plotters with the exception of LPKF ProtoMat® 95s/II, H100 andProtoLaser.Part number is available upon request

Option

Standard

•

LPKF ProtoMat ®

C20

Integrated head illuminationThe high-performance LED ring surrounds the tool holding fixture and guarantees shadow-free illumination of the immediate machining area. This makes direct quality control ofdrilling and milling faster and easier. The head illumination is available for all LPKFProtoMat® circuit board plotters. · for mechanical depth limiter: part number 109153 · for non-contact air bearing depth limiter: part number 109154

(retrofitting upon request)(retrofitting upon request)


•

C40

•

C60

•

C100/HF

•

M30/s

•

M60

•

L60

•

95s/II*

•

H100*

•

X60

Option

Standard

•

LPKF ProtoMat ®

C20

•

C40

•

C60

•

C100/HF

•

M30/s

•

M60

•

L60

•

95s/II

•

H100

•

X60

Option

Standard

•

LPKF ProtoMat ®

C20

•

C40

•

C60

•

C100/HF

•

M30/s

•

M60

•

L60

•

95s/II

•

H100

•

X60

26 Accessories/options

* without Z-extension



LPKF EasyContac was developed for prototype circuit boards andPCB repairs with up to 50 through-plated holes per circuit board.All the necessary parts are conveniently packed in a handy box sothat it can also be used by service engineers.

The key components of the LPKF EasyContac are through-holeplating rivets made of a special copper alloy. These rivets are avail-able with external diameters of 0.8 mm (32 mil), 1.0 mm (40 mil),1.2 mm (48 mil) and 1.4 mm (56 mil). The internal diameter is 0.2 mm (8 mil) or 0.4 mm (16 mil) smaller than the desiredexternal diameter. They are manually placed in the hole and rivetedwith a stamping tool. A component lead can still be fed through thehole if necessary. The rivet is then simply soldered.

Manual system for through-hole plating

LPKF EasyContac delivers a simple and easy-to-operatesystem for the through-hole plating of circuit boardholes. The minor effort involved and low costs are the major benefits of this manual solution. LPKF EasyContac is particularly suitable where two-sided soldering is not possible, e.g. beneathcomponents. The set contains all of the necessarytools and materials with the exception of a solderingiron.

110914

No limit

< 50

2

Approx Euro 0.35 (US$ 0.35)

10 m Ω

++

2 - 3

+

Any substrate with 1.5 mm (59 mil) thickness

Technical data

Part number

Max. base material size

Number of through-plated holes per circuit board

Number of layers

Material costs/through-hole plating

Max. resistance

Environmental compatibility

Through-plated holes/min

Process reliability

Base material types

Available through-hole plating rivets, approx. dimensions in mm (mil)

110907

110758

110906

110759

Part

number

Internal

diameter

0.6 (24)

0.8 (32)

1.0 (40)

1.2 (48)

2.2 (88)

2.2 (88)

2.5 (100)

2.6 (104)

1.3 (52)

1.6 (64)

2.2 (88)

2.6 (104)

0.8 (32)

1.0 (40)

1.4 (56)

1.6 (64)

External

diameter

Collar

diameter

Length Hole diameter

0.9 (36)

1.1 (44)

1.5 (60)

1.7 (68)

LPKF EasyContac

27LPKF EasyContac

The set contains the following:· 1 automatic punch tool with

stamp tip A for 0.6 (24 mil) and 0.8 mm (32 mil) (inner diameter) rivets

· 1 stamp tip B for 1.0 (40 mil) and 1.2 mm (48 mil) (inner diameter) rivets

· 1 pair of tweezers· 1 anvil plate· 1,000 rivets per size


Conductive paste through-hole platingwith the LPKF circuit board plotter

LPKF AutoContac

Product features• Conductive epoxy paste through-hole plating• Easily integrated on any existing LPKF circuit board plotters • Suitable for boards with up to 300 holes • Option for the dispensing of various pastes (solder paste, adhesive,

conductive paste and sealants)

The patented LPKF AutoContac system is ideal for fast environmen-tally friendly in-house through-hole plating without chemicals. A special conductive paste produces plated holes suitable for com-ponent insertion and soldering in double-sided circuit boards directlyusing the LPKF circuit board plotter.

This simple and easy-to-learn technique, along with the minorinvestment required, makes independent Rapid PCB Prototypingpractical for even the smallest enterprise.

ProcedureLPKF AutoContac is suitable for circuit boards with max. 300 holesand hole diameters of 0.5 - 1.4 mm (20 - 55 mil).

A special conductive paste is automatically injected into the holeby a dispenser mounted to the head of the LPKF circuit boardplotter. The second step involves the vacuum extraction of theexcess paste. The subsequent hardening in a hot-air oven creates apermanent through-plated hole suitable for component assembly.The complete through-hole plating process is precisely andautomatically controlled by the LPKF BoardMaster circuit boardplotting software. The parameters for a specific drill hole diameterare stored in the tool library of the software.

This tried-and-tested technique combined with the individualdefinition of dispenser parameters is also used for the applicationof solder paste, adhesives, and sealants.

Through-plated hole:

view from top

101261

Varies depending on the circuit board plotter

0.5 mm - 1.4 mm (20 - 55 mil)

< 300

2

Approx. 2 Cents

150 m Ω

++

15

+

~ 45 min*

FR4, RO® 3000, RO® 4000, TMM®

Connected to LPKF circuit board plotter

6 bar (87 psi)

Specifications

Part number


Hole diameter

Number of through-plated holes

Number of layers

Material costs/through-plated hole

Max. resistance


Through-plated holes/min

Process reliability

Process duration

Base material types

Power supply



view from bottom


with soldered

component lead;

view from top

Dispenser

LPKF ProtoMat® C60

with LPKF AutoContac

Cross section

3

2

* Average value dependent on circuit board size


Vacuum removal

Thermal curing

28 LPKF AutoContac

Solder pasteDispensing needleCopper padCircuit board

Backing material

1



LPKF Contac III, MiniContac III & MiniContac III/HF

The LPKF through-hole plating systems were specially developed forthe professional production of prototype and small batch productionprinted circuit boards to be used in combination with an LPKFcircuit board plotter. These systems enable production qualityboards to be produced independently without the need for outsidesuppliers.

The through-plated holes comply with the highest specificationsand can be made quickly in house to avoid day long hold-ups in thedesign process. This system is particularly suitable for complexcircuit boards with any number of holes.

The LPKF Contac III can be optionally equipped for tin plating.

In house professional quality through-hole plating

Product features• No development work hold-ups• No chemical expertise or analysis required• Only four tanks• No chemical pre-coppering• Reverse pulse plating

8-layer circuit board 6-layer circuit board 4-layer circuit board

Reverse Pulse PlatingTo ensure that tomorrow’s demands are fully satisfied, the LPKFMiniContac III and Contac III systems use reverse pulse platingtechnology, providing uniform copper plating that allows plating ofmore difficult aspect ratios and smaller holes. It avoids the “bone-effect” (thicker copper growth at hole entrance) that can clog upsmall via holes entirely before they are completely plated.

This option is also very useful for small holes on high densityPCBs and improves production reliability during soldering.

Reverse pulse plating is achieved using control electronics thatmonitors the whole through-hole plating process and removesexcess material by the precise setting of reverse pulses (anodicpolarisation of the workpiece).

LPKF Contac III

LPKF MiniContac III

Conventional through-

hole plating method

(bone effect)

Reverse Pulse Plating

29LPKF Contac III, MiniContac III & MiniContac III/HF


LPKF through-hole plating technologiesStandard technology: Carbon-based through-hole plating

(black hole method)Special technology: Palladium-based through-hole plating,

especially for PTFE basedmicrowave substrates

We will be happy to provide you with a list of applicable basematerials upon request!

111253

Carbon

360 mm x 420 mm (14.2” x 16.5”)

270 mm x 330 mm (10.6” x 13.0”)

LPKF ProtoMat® 95s/II: 254 mm x 305 mm ( 10.0” x 12.0”)

≥ 0.2 mm (8 mil)

Unlimited

8

< 10 m Ω

Good

Very good

90 minutes

FR4, RO 3000, RO 4000®, TMM **

120***/240 V, 50 - 60 Hz, max. 2,000 VA

18 - 25 °C (64.4 - 77 °F)

1,150 mm x 1,110 mm x 715 mm ( 45.3” x 43.7” x 28.1”)

Yes

Specifications

Part number

Activator


Max. board size *

Hole diameter

Number of plated holes

Max. number of layers

Max. resistance


Processing reliability

Process duration

Base material types

Power supply

Ambient temperature

Dimensions( W/H/D)

Optional chemical tinning

LPKF Contac III

111252

Carbon

220 mm x 340 mm (8.7” x 13.4”)

130 mm x 250 mm (5.1” x 9.8”)

LPKF ProtoMat® 95s/II: 110 mm x 230 mm (4.3” x 9.1”)

≥ 0.2 mm (8 mil)

Unlimited

8

< 10 m Ω

Good

Very good

90 minutes

FR4, RO 3000, RO 4000®, TMM **

120/240 V, 50 - 60 Hz, 600 VA

18 - 25 °C (64.4 - 77 °F)

870 mm x 640 mm x 570 mm ( 34.2” x 25.2” x 22.4”)

No

LPKF MiniContac III

111251

Palladium

210 mm x 340 mm (8.3” x 13.4”)

130 mm x 250 mm (5.1” x 9.8”)

LPKF ProtoMat® 95s/II: 110 mm x 230 mm (4.3” x 9.1”)

≥ 0,2 mm (8 mil)

Unlimited

8

< 10 m Ω

Good

Very good

90 minutes

Various special materials

120/240 V, 50 - 60 Hz, 600 VA

18 - 25 °C (64.4 - 77 °F)

870 mm x 640 mm x 570 mm ( 34.2” x 25.2” x 22.4”)

No

LPKF MiniContac III/HF

* Smaller board size applicable if milled with air-foot circuit board plotter (C100/HF, 95s II, H100)

** Other materials upon request

*** upon request

Methods for both technologiesOptimal through-hole plating requires a very high standard holequality. The through-hole plating process starts with the pre-treat-ment of the circuit boards in three tanks for approx. 30 minutes alltogether. This process involves degreasing, pre-treatment andactivation. The circuit boards are then copper-coated in a galvanicbath. This takes 60 - 90 minutes depending upon the specifiedthickness of the copper coating.

The equipment is very environmentally friendly because it is aclosed system: all of the chemicals remain in the tank during use.The only external connection required is a cold water supply for therinsing tank. One set of chemicals lasts approximately one year. No technical expertise is required to operate or look after the tanks.

Chemical tinning optionFor the Contac III, LPKF offers the additional option of a heatedtank to provide chemical tin plating for optimal soldering ofthrough-hole plated circuit boards and oxidation protection.Part number 108267

Tin-plated circuit boards

LPKF Contac III in use

!


30 LPKF Contac III, MiniContac III & MiniContac III/HF



LPKF MultiPress II – time and cost saving in-houseproduction of prototype multilayer circuit boards.

LPKF MultiPress II

Product features• Up to eight layers• Multilayer boards to 305 mm x 254 mm (12“ x 10“)• Microprocessor controlled• Small footprint

106328

420 mm x 360 mm (16.5“ x 14.1“)

305 mm x 254 mm (12“ x 10“)

150 kN (15 t)

210 °C (410 °F)

Max. 10 bar, min. 6 bar (max. 145 psi, min. 87 psi)

Approx. 30 l/min (1 cfm)

8

After pre-heating, approx. 90 min. plus

hardening time prior to drilling *

530 mm x 600 mm x 480 mm (20.9“ x 23.6“ x 18.9“) **

Approx. 210 kg (463 lb)

240 V/50 - 60 Hz, 2000 VA

4 pressure/temperature/time profiles

FR4, others upon request

Part no. 107050

Specifications

Part number

Max. press area (gross)

Max. circuit board size (recommended)

Max. pressure

Max. temperature


Compressed air volume per minute

Max. number of layers

Pressing time

Dimensions (W/H/D)

Weight

Power supply

Microprocessor controlled

Base materials

Options

Mobile stand

The MultiPress II stores various time, temperature and pressureprofiles for processing different materials. Combined with an LPKFcircuit board plotter and an electroplating system, this equipmentis all that is required for complete in-house multilayer prototyping.

* depending upon Prepreg and selected through-hole plating process

** desk-top model

8-layer circuit board

31LPKF MultiPress II


Different LPKF technologies for the production of multilayers

Technology

Example: 4-layer multilayer

1. Sequential build-up method for multilayer production

Applications· 4, 6 and 8-layer multilayer boards with a maximum net size of 305 mm x 254 mm (12“ x 10“)· Laminating prototype solder mask (LPKF EasySolder)

Insulation engraving of both inner layers(layer 2 & 3) of the circuit board withthe LPKF circuit board plotter.

Bonding of outer layers (layer 1 & 4)with LPKF multilayer press.

Drilling multilayer through-holes withthe LPKF circuit board plotter.

Electroplating of the through-holes withLPKF MiniContac III or Contact III(connecting the inner layers).

5. Insulation engraving of the outerlayers (layer 1 & 4) of the circuit board

Surface finish: mechanical cleaning, tin plating, flux or conformal coating,prototype solder mask (LPKFEasySolder)

1.

2.

3.

4.

5.

6.


32 Technology



1. Creating layer 2 + layer 3· Layer 3

· Drilling the registration pin holes· Insulation milling

· Layer 2· Insulation milling


· Drilling the registration pin holes for the MultiPress II setting pins

· Insulation milling· Layer 4

· Insulation milling


· Drilling the registration pin holes for the MultiPress II setting pins

· Insulation milling· Layer 6

· Insulation milling

4. Bonding materialAccording to the layer construction (see figure above), the layers arepinned in the pressing package and bonded in the MultiPress II.

5. Drilling and through-hole plating· Drilling of the plated through-holes· Electroplating with LPKF MiniContac III or Contac III· Drilling of the non-plated holes

6. Creating layer 1 + layer 8· Insulation milling

7. ContourRouting the internal/external contours

8. Surface finishMechanical cleaning, tin plating, flux or conformal coating, prototype solder mask (LPKF EasySolder)

Example: 8-layer multilayer

2. Registration pin method for multilayer production

Registration pin locations

33Technologie


Instant solder mask for prototype circuit boards

LPKF EasySolder

Fast, precise, flexible: mechanically made prototype solder maskscan be produced extremely quickly using LPKF EasySolder. Thesolder mask is made out of high-quality, temperature-resistant anddimensionally stable polyimide film. A solder mask increases solde-ring reliability and protects the circuit board from environmentalinfluences. This process requires no screen printing and nophotographic technology or chemical-etching.

180 mm x 120 mm (7“ x 5“) net

Manual w/ torque wrench

60 minutes plus pre-heating

Approx. 60 - 90 min

Specifications LPKF EasySolder

300 mm x 250 mm (12“ x 10“) net

Automatic, programmable

60 minutes, automatic pre-heating

A few minutes

LPKF EasySolder withLPKF MultiPress II

Max. circuit board size

Pressure setup

Laminating time

Cool off period

s. consumables

210 mm x 297 mm (8.3“ x 11.7“), temp. resistant to 255 °C (491 °F) for 5 min. (IPC compliant),

adhesive: modified epoxy resin, 10 per pack (custom sizes available).

LPKF micro plotter (1/8“ shaft)

Metal scalpel, glue stick

and adhesive tape

Rubber, reusable up to 50 times

Accessory set LPKF EasySolder

s. consumables

210 mm x 160 mm (8.3“ x 6.3“)

210 mm x 160 mm (8.3“ x 6.3“)

210 mm x 160 mm (8.3“ x 6.3“)

210 mm x 297 mm (8.3“ x 11.7“)

210 mm x 297 mm (8.3“ x 11.7“)

210 mm x 297 mm (8.3“ x 11.7“)

LPKF EasySolder for LPKF MultiPress II

Part number

Solder mask film

Tools and accessories

Pressure compensation mat

Press sheet (stainless steel)

Cut backing material

Press cushion

Process descriptionLPKF CircuitCAM software uses the soldermask CAD data to createthe cutting paths for the circuit board plotter to mechanicallyproduce the solder mask. Structuring is done by cutting the padsout of the polyamide material using the LPKF circuit board plotter.The solder-resist mask is then bonded to the circuit board using apressing tool. The subsequent lamination process takes place in ahot-air oven at a temperature of 180 °C (356 °F) and takes about60 minutes. The bonding pressure is individually adjusted to thesize of the circuit board to ensure optimal results. LPKF EasySoldermasks are suitable for all standard soldering processes such as waveand reflow soldering, as well as manual soldering. It is temperatureresistant to 288 °C (550 °F), compliant with IPC standards. LPKF EasySolder is supplied complete with accessories and con-sumables. A hot air oven for laminating the solder mask on thecircuit board is also available from LPKF as an optional accessory.

Solder mask lamination with LPKF MultiPress IIThe LPKF MultiPress II can also be used to laminate prototypesolder masks. The advantages are a shorter process time and theability to handle larger circuit boards. The complete laminatingprocess is fully automatic and press parameters are convenientlypre-programmed.

System accessories for

applying the solder

mask

Hot air oven

LPKF MultiPress II

Part number 104425


34 LPKF EasySolder

Part number 102073

Part number 106328


Tools

Quality and precision – LPKF tools


LPKF’s development to satisfy the extreme precision andperformance requirements of current state of the art circuit boardshas produced a large range of high performance precision cuttingtools. These tools are custom designed for LPKF and made of 100 %top quality carbide resulting in significantly longer tool life, precisecuts, and diminished drill flux. The proprietary designs are accom-plished with extensive testing and design reconfiguration until the

1 2 3 4 5 6 7

Tools (1/8“-Shaft)

A Surface machining tools

(l = 36 mm/1.42“)

B Penetrating tools

(l = 38 mm/1.5“)Drills (5)

Contout router (6)

Endmill (long) (7)

A.2 Cylindrical tools

A.1 Conical tools

RF Endmill (3)

Universal cutter (2)

Microcutter (1)

Endmill (4)

35Tools

38 mm(1.50“)

36 mm (1.42“)

highest quality results are met. LPKF’s leading commitment is anongoing research and development process to continually suit theuser demands and approaching technologies.

For ease of use and to minimize the set-up time, LPKF toolscome in two different lengths: 36 mm (1.42“) for tools working onthe surface (milling bits and endmills) and 38 mm (1.5“) for toolsthat work through the material (drill and router bits).


100 µm (4 mil) Copper layer

Base material

200 µm (8 mil)

150 µm (6 mil)

1

2

3

4

A - Engraving tools (36 mm [1.42“] length)

A.1 Conical Tools

A.2 Cylindrical tools

Micro cutter· For copper thickness up to 18 µm (1/2 oz.)· Minimum insulation space: 100 µm (4 mil)

(min. 60,000 rpm required)

Universal cutter· For milling insulation on any type of base

material· Minimum insulation space: 200 µm (8 mil)

Endmill· For rub-outs and wide insulations· Engraving of aluminum front panels· 0.8 mm (31 mil), 1 mm (39 mil),

2 mm (79 mil), 3 mm (118 mil) diameter

Endmill (RF)· For RF circuit outlines: 150 µm (6 mil),

250 µm (10 mil) or 400 µm (15.7 mil) diameter (min. 60,000 rpm required)

· Minimal substrate removal· Straight side walls


36 Tools

0.8 - 3 mm (31 - 118 mil) Øinsulations

0.8 - 3 mm (31 - 118 mil) Øengraving

Aluminum



1 - 3 mm (39 - 118 mil)Routing

1 - 2 mm(39 - 79 mil)

Ø

Aluminum dielectricmaterial

1 - 2 mm(39 - 79 mil)

Ø

max. 2.4 mm (95 mil) Ø

min. 0.15 mm (6 mil) Ø

5

6

7

B - Drilling /routing tools (38 mm [1.5“] length)

Spiral drill· To drill circuit boards and other materials · 0.15 mm (6 mil) to 3 mm (118 mil)· Diameters bigger than 2.4 mm (96 mil) are

automatically routed· 2.95 mm (116 mil) and 3 mm (118 mil) to

drill registration pin holes

Contour router· Routes inner and outer board contours· Routes large holes without size limitation· 1 mm (39 mil), 2 mm (79 mil), 3 mm (118 mil)

diameter

Endmill (long)· For cutting out aluminum front panels and to

mill clean contours in soft RF substrates· Also to mill pockets in brass and aluminum

backed substrates and to mill enclosures· 1 mm - 2 mm (39 mil - 79 mil) diameter

37Tools


Part number

Drill underlay material panel A41

Drill underlay material panel A32

FR4, A41, 1-sided, 35 µm (1 oz.)

FR4, A41, 2-sided, 35 µm (1 oz.)

FR4, A41, 2-sided, 18 µm (1/2 oz.)

FR4, A32, 1-sided, 35 µm (1 oz.)

FR4, A32, 2-sided, 35 µm (1 oz.)

Tool set 1/8“ shaft

Micro cutter 1/8“, l = 36 mm,

0.1 - 0.15 mm (4 - 6 mil)

Endmill (RF) 1/8“, l = 36 mm,

d = 0.25 mm (10 mil)

Adhesive tape

Circuit board cleaning pad

RF and microwave tool set

Rogers data sheet set

102368

10

10

10

1

1

3

102374

10

10

5

5

1

5

5

1

3

Product/accessory set Accessory set for LPKF ProtoMat®

C20, C40 C60

102375

5

5

5

5

5

5

1

1

3

M30/S, M40

102377

5

5

5

2

3

5

5

1

5

5

1

3

M60, 95s/II, X60, H100

111249

10

10

5

5

1

5

5

1

3

1

1

C100/HF

Consumables

ExplanationEvery LPKF circuit board plotter has a registration set pin hole system to ensurethe precise positioning of double-sided base materials in particular. This loca-tion hole system consists of set pin holes (1) positioned exactly on the centeraxis of the machine in permanent set pin hole strips (3).

A special adhesive tape (2) leaves no residue and is used to mount the basematerial. It also ensures that warped objects are held down flat on the machinestabletop. The PCB cleaning pad removes minor burrs and residues from themechanical milling process and gives the base material surface a great finish.

Start sets for LPKF circuit board plotters

Tool set 1/8“ shaft5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.6 mm (24 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.7 mm (28 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.8 mm (31.5 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.9 mm (35.4 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.0 mm (39 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.1 mm (43.3 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.3 mm (51.2 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.5 mm (59 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 3.0 mm (118 mil)1 Contour Router 1/8“, l = 38 mm (1.5“), d = 1.0 mm (39 mil)1 Contour Router 1/8“, l = 38 mm (1.5“), d = 2.0 mm (79 mil)2 Endmill 1/8“, l = 36 mm (1.42“), d = 1.0 mm (39 mil)1 Endmill 1/8“, l = 36 mm (1.42“), d = 2.0 mm (79 mil)2 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.4 mm (15.7 mil)

10 Universal cutters 1/8“, l = 36 mm (1.42“), 0.2 - 0.5 mm (8 - 20 mil)Part number 102375

RF and microwave tool set1 RO4003, 0.8 mm (32 mil) thick, 230 x 305 mm (9“ x 12“)5 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.25 mm (10 mil)3 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.4 mm (15.7 mil)5 Endmills 1/8“, l = 36 mm (1.42“), d = 1.0 mm (39 mil)2 Endmills 1/8“, l = 36 mm (1.42“), d = 2.0 mm (79 mil)2 Endmills 1/8“, l = 38 mm (1.42“), d = 2.0 mm (79 mil)3 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.15 mm (6 mil)Part number 111535

For all LPKF circuit board plotters, LPKF has comprehensive start and accessory sets available with high-qualitytools and consumables to ensure the highest levels of quality and precision. All of these components can alsobe ordered separately.

1

3

31

2

2


38 Consumables

1 210 mm x 297 mm (8“ x 12“) 2 297 mm x 420 mm (12“ x 16“)



For single or double-sided circuit boardsNominal thickness = copper layer + insulation layer

Example:The nominal thickness is calculated as follows:1.464 mm + 2 x 0.018 mm = 1.5 mm57.63 mil + 2 x 0.71 mil = 59 mil

Base materials

Copper layer

Copper layer

Fiberglass reinforced epoxy resin

(insulation layer)

Nominal thickness of the base material

Nom

inal

thi

ckne

ss

Copper layer

Copper layer

Fiberglass reinforced epoxy resin

(Insulation layer)

Nom

inal

thi

ckne

ss

For internal layers of multilayersNominal thickness = insulation layer

Example:The nominal thickness is calculated as follows:1.5 mm - 2 x 0.018 mm = 1.464 mm59 mil - 2 x 0.71 mil = 57.63 mil

Resin

Reinforcement

Dielectric constant εR

LPKF standard article

Phenol resin

Paper

4.70

Epoxy resin

Paper

4.90

•

Usual base material types for prototyping*

* Other materials upon request, e.g. RO4000® (Non PTFE)

Name FR2 FR3

Epoxy resin

Glass fiber

4.70

•

FR4/FR5 (G10)

Polyimide resin

None

4.2 - 4.6

Flex

RT/duroid® etc.

Polytetrafluorethylene (PTFE)

2.2 - 10.2

PTFE

Base material

Circuit board specifications are becoming ever more complex: higher packaging densities, finer structures,tighter spaces and smaller holes all require first-class base materials. This is the only way of guaranteeing high-quality results to match the increasing demands for RF and microwave technology and multilayerproduction.

Copper layer

Copper layer

Reinforcement (glass fiber)

Resin

39Consumables


LPKF multilayer start set

The selection of the proper material is particularly crucial forthe production of multilayer circuit boards. The carefullyselected components in LPKF material sets include all thenecessary materials of tried-and-tested quality to ensure thebest results and smooth production of multilayer prototypes.

The following material sets are available depending on the number of layers tobe produced:

* This requires the accessories for MultiPress II to produce multilayers with pinned layers:1 x pressing frame with positioning pins2 x pressing sheet for 400 mm x 360 mm (15.7“ x 14“)

4-layer multilayer

6-layer multilayer

8-layer multilayer


Part number 111493

40 Consumables

LPKF 4-layer multilayer setFloating method for ten panels with 254 mm x 304 mm (10“ x 12“) net sizePart number 106836

Contents:20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective

film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5“ x 14.2“)40 x Prepeg, size 380 mm x 320 mm (15“ x 12.6“)20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)10 x double sided FR4 laminate, 35 µm (1 oz.) Cu clad, thickness 1 mm (39 mil),

size 420 mm x 360 mm (16.5“ x 14.2“)4 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)

LPKF 8-layer multilayer setMethod with pinned layers* for ten panels with 254 mm x 304 mm (10“ x 12“) net sizePart number 111250

Contents:30 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.2 mm (8 mil),

size 420 mm x 360 mm (16.5“ x 14.2“)20 x laminate multi-layer 5 µm (1/8 oz.) copper base, thickness 0.2 mm (8 mil),

size 420 mm x 360 mm (16.2“ x 14.5“)60 x Prepreg, size 380 mm x 320 mm (15“ x 12.6“)20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)6 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)

LPKF 6-layer multilayer setFloating method for ten panels for 254 mm x 304 mm (10“ x 12“) net sizePart number 108826

Contents:20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective

film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5“ x 14.2“)20 x laminate multi-layer 18 µm (1/2 oz.) copper base, thickness 0.2 mm (8 mil),

size 420 mm x 360 mm (16.2“ x 14.5“)80 x Prepreg, size 380 mm x 320 mm (15“ x 12.6“)40 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)10 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.46 mm (18.1 mil),

size 420 mm x 360 mm (16.5“ x 14.2“)4 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)



Chemicals

LPKF has put together different chemical sets for use withLPKF Contac III and MiniContac III through-hole platingsystems as well as for circuit board surface finish. The setcontains high-quality perfectly matched components speciallyselected for each system to ensure the production of first classthrough-hole plated contacts.

LPKF Contac III chemical setFor through-hole plating, complete set with approx. one year’s supplyPart number 106920

Contents:4 x 13 liters (3.435 gal.) Cleaner 1104 x 10 liters (2.642 gal.) Cleaner 2101 x 10 liters (2.642 gal.) Activator 3104 x 10 liters (2.642 gal.) Copper Plater 4001 x 0.5 liters (0.132 gal.) Shine 400

Chemical set LPKF MiniContac IIIFor through-hole plating, complete set with approx. one year’s supplyPart number 108764

Contents:4 x 6 liters (1.585 gal.) Cleaner 1104 x 5 liters (1.321 gal.) Cleaner 2101 x 5 liters (1.321 gal.) Activator 3102 x 5 liters (1.321 gal.) Copper Plater 400 and2 x 1 liters (0.2642 gal.) Copper Plater 400 1 x 0.25 liters (0.066 gal.) Shine 400

Chemical set for LPKF MiniContac III/HFFor through-hole plating, complete set with approx. one year’s supplyPart number 108766

Contents:4 x 6 liters (1.585 gal.) Cleaner 1104 x 5 liters (1.321 gal.) Cleaner 2101 x Activator 310

· 4,740 ml (1.2523 gal.) Catalyst A· 265 ml ( 0.0697 gal.) Catalyst B· 100 ml (0.0264 gal.) Replenisher

2 x 5 liters (1.321 gal.) Copper Plater 400 and2 x 1 liters (0.2642 gal.) Copper Plater 4001 x 0.25 liters (0.066 gal.) Shine 400

Tin plating for Contac IIITin-plates prototype circuit boards. Protects against oxidation and providesexcellent solderability.Part number 109131

• Filled in Contac III tin plating tank 13 liters (3.5 gal.)• Good for over 500 boards 100 x 160 mm (4“ x 6“)• Shipped in powder form 1,170 gr. (39 oz.), distilled water required for setup

Tin plated circuit board

41Consumables


Accessories for LPKF AutoContacFor rapid and environmentally-friendly in-house through-hole plating withoutchemicals, LPKF AutoContac is the ideal solution. The special conductive pasteis applied by the LPKF circuit board plotter to ensure optimal through-holeplating.

LPKF AutoContac paste setTwo pre-filled cartridges with 25 gr. (0.83 oz.) paste, and one empty cartridge.Part number 106280

Polypropylene refill fitting (luer)To connect two cartridges with one another for mixing.Part number 106281

Accessory set for LPKF EasySolder for LPKF MultiPress IIPart number 106244

Contents:10 x solder mask film 75 µm (3 mil) 200 mm x 300 mm (7.87“ x 11.81“)10 x pressing cardboard cushion 210 mm x 297 mm (8.27“ x 11.7“)4 x drill underlay material 210 mm x 297 mm (8.27“ x 11.7“)2 x pressing sheet (stainless steel) 210 mm x 297 mm (8.27“ x 11.7“)2 x press compensation mat 210 mm x 297 mm (8.27“ x 11.7“)3 x micro cutter1 x scalpel1 x glue stick and adhesive tape

LPKF EasySolder accessory set for LPKF MiniPress (manual system)Part number 107644

Contents:10 x solder mask film 75 µm (3 mil) 200 mm x 300 mm (7.87“ x 11.81“)10 x pressing cardboard cushion 210 mm x 297 mm (8.27“ x 11.7“)4 x drill underlay material 210 mm x 297 mm (8.27“ x 11.7“)2 x pressing sheets (stainless steel) 210 mm x 160 mm (8.27“ x 6.3“)2 x press compensation mat 210 mm x 297 mm (8.27“ x 11.7“)3 x micro cutter1 x scalpel1 x glue stick and adhesive tape

Accessories for LPKF EasySolderThe following accessory sets are specially prepared for the LPKF EasySoldermethod. These sets ensure the production of high-quality solder masks tosimplify the assembly of SMT components. Each set contains the right amountof material to produce at least ten solder masks.

Accessories for LPKF AutoContac and LPKF EasySolder


42 Consumables


Product descriptionLPKF ZelPrint LT300 is a precision manual stencil printer. This tabletop modelcan be utilized for both prototypes and small batches of fine pitch SMT boards.Precise vertical separation between stencil and circuit board is guaranteed tomeet the specifications of contact printing. This unique solution allows printingof 0.3 mm (12 mil) pitch (ultra-fine-pitch area).

High positioning accuracy, simple operation and the ability to use milledpolymer stencils (limited to 0.65 mm [26 mil] pitch) reduces costs and in-creases efficiency in the production of circuit board prototypes.

This printer is shipped with a ZelFlex quick-release stretching frame forstencils but is also compatible with various other frames. The precise three-dimensional adjustment of the stencil with micrometer screws (X, Y, theta andclearance) is vital for superior printing results. The ZelPrint LT300 has freelyadjustable, high clearance PCB nesting pins that allow printing of boards thatare already populated on the other side.

LPKF provides two professional stencil printers for prototypesand small batches. Both LPKF ZelPrint models have extremelyhigh levels of precision and efficiency: Manual or semi-auto-matic: the sophisticated technology guarantees easy operationand perfect printing results.

LPKF ZelPrint with test screen, rubber squeegee and metal stencil,

clamped into a ZelFlex ZR quick-release frame (can also be

used for polymer stencils).

Manual tabletop stencil printer

LPKF ZelPrint LT300

LPKF ZelPrint PTC 350

Semi-automatic tabletop stencil printer

Product descriptionThis semi-automatic fine-pitch SMD stencil printer is designed for prototypecircuit board production as well as for the production of small to mediumquantity batches.

The powered squeegee is speed and pressure controlled and guaranteeshighly reproducible printing results. The fast and simple circuit board clamping,and the automatically switched vacuum table, allows up to 100 printing cyclesper hour. Straightforward settings and simple operation of four operating modesincluding single and dual pass printing and print-flood/flood-print cycles. The printing process can be started automatically just by closing the printer, orbe initiated manually at the push of a button. The stencil/PCB alignment isprecisely done in X/Y/Z and theta and a test print screen overlay allows quicksetup.

Stencil frames are held in place with pneumatic latches and can beexchanged quickly through slide rails. Smaller frames are held in frameadapters. The PTC 350’s rigid construction ensures the highest level of precisionand efficiency.

LPKF ZelPrint PTC 350

Product features• Semi-automatic stencil printer• Printing of rigid and flex boards• Vacuum table• Precision stencil adjust with micrometer screws• 4 printing modes• Compatible with various stencil frames, including

quick release• Test print screen included

LPKF ZelPrint


Product features• Manual stencil printer• Parallel stencil separation• Quick-release stencil frame included (ZelFlex ZR)• Precision stencil adjustment with micrometer screws• Compatible with various stencil frames• Test print screen included• Printing of two side populated boards

43LPKF ZelPrint


*Option

Part number

Frame dimensions

Maximum printing area

Squeegee action

Print table adjustment

Max. height of printing items

Squeegee speed

Squeegee pressure

Squeegee type

Accuracy (machine)

Accuracy (printing)

Double side printing

Dimensions (W/H/D)

Height with optional stand

Weight

Power

Compressed air

Vacuum requirements

Vacuum connection

Ambient conditions

107356

width up to 430 mm (16.92“);

length adjustable from 420 mm - 520 mm (16.54“ x 20.47“),

height adjustable from 20 - 40 mm ( 0.78“ x 1.57“)

300 x 300 mm (11.8“ x 11.8“)

manual

X and Y ±10 mm (0.4“/400 mil); υ ± 5°

5 mm (0.2“), optionally more

-

-

rubber

± 0.025 mm (± 0.98 mil)

± 0.04 mm (1.57 mil)

max. height of components 15 mm (0.59“)

740 mm x 180 mm x 530 mm (29.1“ x 7.1“ x 20.9“)

-

30 kg (66 lb)

-

-

-

-

Temperature: 5 - 35 °C (41 - 95 °F)

Humidity: 30 - 95%

Specifications LPKF ZelPrint LT300 LPKF ZelPrint PTC350

105393

457 x 584mm (18“ x 23“),

height adjustable from 30 - 33 mm (1.18“ - 1.29“)

350 x 350 mm (13.8“ x 13.8“)

power sweep

X and Y ±10 mm (0.4“/400 mil); υ ± 5°

20 mm (0.8“)

10 to 120 mm/s (0.38“ - 4.72“/s)

adjustable 0 - 6 bar (0 - 87 psi) + downstop

dual squeegee, rubber or metal*

± 0.025 mm (± 0.98 mil)

0.04 mm (1.57 mil)

max. height of components 10 mm (0.39“)

600 mm x 380 mm x 800 mm ( 23.6“ x 14.9“ x 31.5“)

1200 mm (47.4“)

80 kg (176 lb), with base 122 kg (268.4 lb)

220V-240V/50 Hz or 100V-120V/60 Hz, 300 VA

6 bar, 10 l/min (87 psi, 0.3528 cfm)

approx. 40 m3/h

40mm (1.6“) hose

Temperature: 20 - 30 °C (68 - 86 °F)

Humidity: 30 - 95%

• standard

+ optional

– not available


Floor-standing base for semiautomatic

stencil printer PTC350

Vacuum pump, built-in floor-standing base

Vacuum pump (external)

Compressor

Dual rubber squeegee 250 mm (9.85“)

Dual metal squeegee 350 mm (13.77“)

Manual quick release frame ZR 457 x 580 mm (18“ x 23“);

Inner area 407 x 470 mm (16“ x 18.5“)

Pneumatic quick release frame Z4P 457x584

Adapter for smaller frames

Test screen overlay

Squeegee height setting with two measuring gauges

Rubber blade for squeegee

Metal blade for squeegee

ZelFlex ZR 362 x 480 mm (14.25“ x 18.89“)

ZelFlex ZR 406 x 508 mm (16“ x 20“)

Rubber squeegee 260 mm (10.23“)

Rubber squeegee 150 mm (5.9“)

Rubber/metal squeegee – custom width

Accessories LPKF ZelPrint

PTC350

–

–

–

–

–

–

–

–

+

•

–

+

+

•

+

•

+

+

+

+

+

+

+

•

+

•

+

+

+

+

+

–

–

–

–

–

LT300


44 LPKF ZelPrint



LPKF ZelFlex

LPKF offers two different quick-release stencil frame systems, onewith mechanical and the other with pneumatic stretching mecha-nism. For ease of use the ZelFlex Z4P maintains tension without airbeing constantly connected to it. Both versions allow the stencil tobe directly mounted in the frame using a perforation system. The simple perforation pattern is royalty free and shipped as aGerber® file with every frame.

LPKF ZelFlex – quick-release stencil frames

Available for virtually every stencil printer

Product features• Available for virtually any stencil printer• Fast and simple changeover of stencils• Reduces storage space for archiving stencils• Uniform tension over the whole surface• ZelFlex Z4P maintains tension without air being connected• Environmentally friendly: no adhesives, lacquers and cleaning

solvents required

1. LPKF ZelFlex ZRMechanically stretched two-sided quick-release stencil frame forboth metal and polymer stencils

2. LPKF ZelFlex Z4PProfessional quick-release stencil frame with pneumatic 4-sideaction: Ideal for high volume environment. Frame maintains tensionafter air is disconnected.

LPKF ZelFlex Z4P

LPKF ZelFlex ZR frame with metal and polymer stencil LPKF ZelFlex Z4P with compressed air hose

45LPKF ZelFlex


Product description LPKF ZelFlex Z4P4-sided quick-release stencil frame is a flexible, cost and space saving alter-native for professional stencil print operations.

The patented stencil perforation pattern guarantees simple, fast and repeat-able stencil changeover. The stretching mechanism uses compressed air tocreate a uniform tension over the whole working area. Once charged, the framemaintains the tension and can be used for more than 24 hours without beingre-connected to an air supply. This feature allows simplified operation and easyintegration into the printer.

IMPORTANT NOTEAll LPKF ZelFlex frames are produced in many different dimensions and with different

adapters to fit most available screen printers. A Gerber® file of the royalty-free perforationpattern is supplied with every frame.

Product description LPKF ZelFlex ZRLPKF ZelFlex mechanical quick-release frames are manufactured from rigid,high-quality aluminum profiles and enable the direct mounting of stencils in theframes.

Equal tension of the stencil is achieved with patented tensioning regulators,that protect the stencil from damage through over-tensioning. Smaller stencilscan also be fitted in these frames without any problems. The tension of thestencil can be adjusted or changed even if the frame is already installed in theprinter.

Part number

Outer dimensions (W/D)*

Max. inner dimensions (W/D) **

Max. printing area (W/D)***

Max. squeegee width

Weight

ZelPrint type

101321

362 mm x 480 mm

(14.2“ x 18.9“)

312 mm x 370 mm

(12.28“ x 14.56“)

250 mm x 320 mm

(9.87“ x 12.59“)

260 mm (10.23“)

2.8 kg (6.16 lb)

LPKF ZelPrint LT300

111244

406 mm x 508 mm

(16“ x 20“)

356 mm x 398 mm

(14.01“ x 15.66“)

300 mm x 350 mm

(11.81“ x 13.77“)

300 mm (11.81“)

3.1 kg (6.82 lb)

LPKF ZelPrint LT300

LPKF ZelFlex ZR Specifications

* External dimensions without tension screws

** Rear clamping bar can be moved to reduce stencil length

*** Depending on the position of rear bar and stencil size

LPKF ZelFlex ZR 362 x 480 LPKF ZelFlex ZR 406 x 508

101318

457 mm x 584 mm

(18“ x 23“)

407 mm x 474 mm

(16.02“ x 18.66“)

350 mm x 420 mm

(13.77“ x 16.53“)

350 mm (13.77“)

3.5 kg (7.70 lb)

LPKF ZelPrint PTC350

LPKF ZelFlex ZR 457 x 584

Part number

External dimensions (W/H/D)

Max. inner dimensions (W/D)

Max. printing area (W/D)

Max. squeegee width


Air refill

Height of frame

Weight

Ambient conditions

105802

457 mm x 33 mm x 584 mm (18“ x 1.30“ x 22“)

357 mm x 484 mm (14“ x 19.05“)

337 mm x 464 mm (13.26“ x 18.26“)

340 mm (13.38“)

Dependant on the stencil thickness

Max. 6 bar (87 psi) (6 x 10 Pa) for stencils > 150 µm (6 mil)

Max. 4 bar (58 psi) (6 x 10 Pa) for stencils 100 - 150 µm (4 - 6 mil)

Every 48 hours min.

33 mm (1.29“) without adapters

5 to 10 kg (11 - 22 lb)

Temperature: 5 - 35 °C (41 - 95 °F)

Humidity: 30 - 95 %

LPKF ZelFlex Z4P Specifications

!Subject to technical modifications. See imprint for details.

46 LPKF ZelFlex



LPKF ZelPlace & BGA Placer

LPKF ZelPlace 110, 220, 330, 340

Manual Pick and Place systems for prototype circuitboards and small batches

Product features• Fine-pitch assembly• Vacuum pick-up nozzle and precision manipulator• Modular system design• Dispenser• Various feeders• Upgradable at any time

General product descriptionLPKF ZelPlace is a manual Pick & Place system for professionalSMD assembly of prototype PCBs and small production batches.The basic unit of all LPKF ZelPlace machines is a multi-functiondispenser for applying various media, and a vacuum pick-up nozzleto place the components.

All LPKF ZelPlace models are based on the same platform.Upgrading to a more sophisticated system is possible at any time.Each ZelPlace system comes with a multifunctional dispenser unitthat features both manual and automatic dispensing mode.

LPKF ZelPlace 110 with component turntable

LPKF ZelPlace 110The LPKF ZelPlace 110 system is the ideal solution for theassembly of SMD components (surface mounted devices) with apitch between 1 mm (39 mil) and 1.27 mm (50 mil), such as SOIC,SOT, PLCC and passive components 1206 and 0805.

The components are picked with a vacuum pick-up nozzle andplaced on the PCB with the help of a guided hand support. Feedersand turntables can be mounted to LPKF ZelPlace 110 on threesides. The multi-function LPKF ZelDisp dispenser for solder pasteor adhesives is part of the Pick & Place system.

LPKF ZelPlace 220LPKF ZelPlace 220 has a guided manipulator head and integratedillumination. This allows precise and vibration-free placement of acomponent in the desired position. When placing the componentthe vacuum is controlled by the LPKF ZelDisp multifunction dis-penser unit and turned on and off automatically. In addition toclassic areas of application, this system is capable of dispensingadhesives and solder paste. Turntables (for bulk components) andfeeders can be conveniently placed on all three sides.

LPKF ZelPlace 220 enables the assembly of digital SMDs with alarge number and high density of leads. Components such as SSOPwith 0.65 mm (26 mil) pitch, TSOP with 0.5 mm (20 mil) pitch,QFP with 0.65 mm (26 mil) pitch and 160 leads, or 0402 passivecomponents, can be precisely placed with this system.

LPKF ZelPlace 220 with component turntable, tape and stick feeder

47LPKF ZelPlace & BGA Placer


LPKF ZelPlace 330/340LPKF ZelPlace 330 and 340 are the most advanced LPKF ZelPlacesystems. Both systems allow the placing of fine-pitch componentssuch as QFP with 0.5 mm ( 20 mil) and 0.4 mm (16 mil) pitch withup to 300 pins, as well as 0402 components. The edge centring ofBGA components up to 1.27 mm (50 mil) pitch is also no problemfor LPKF ZelPlace 330/340.

The X-Y-guided manipulator can be locked in x and y directionwith fine adjustment using micrometer screws. This allows highlevels of placement accuracy for SMD components. The vacuum ofthe pick-up nozzle is automatically turned on and off when placingthe component.

A swiveling micro camera can be mounted directly on themanipulator to ease placement of large components. Other optionsinclude a stereo microscope with or without a CCD camera, and amonitor, so ZelPlace 330 or 340 can also be used as an inspectionunit.

A turntable for bulk components and a range of different feederscan be placed ergonomically on all three sides (ZelPlace 330).

LPKF ZelPlace 340 contains an additional reworking station forselective soldering of SMD components. In this case, the feederscan be placed on the left side with the turntable sitting in the back.Instead of a feeder rail a second turntable can be placed on the leftside of the system.

LPKF ZelPlace 330/340 with optional stereo microscope and CCD camera

LPKF ZelPlace 330 with component turntable, feeder carrier and

feeder


48 LPKF ZelPlace & BGA Placer


LPKF ZelPlace BGA

Semi-automatic placement of new generation compo-nents to assemble highly integrated circuit boards.


BGA componentLPKF ZelPlace BGA with monitor

Product features• Semi-automatic placement of BGA and QFQ components from

5 mm x 5 mm (0.2“ x 0.2“) up to 45 mm x 45 mm (1.77“ x 1.77“)• Granite base plate• Air-bearing positioning table• Optical placement verification

Product descriptionThe placing of components with pins hidden from the top and sidesrequires reliable and precise alignment to avoid expensive anddifficult rework.

LPKF ZelPlace BGA Placer is designed for the accurate placingof different types of BGA, CSP and flip chip components, as well asfine-pitch and ultra-fine-pitch components. The system is suitablefor R&D labs as well as production facilities focusing on customdesigns and small batches.

Special optics and adjustable two-colour illumination help tosimultaneously view and align the PCB leads and the componentpins. Coarse and fine adjustment is achieved using an air-bearingtable with micrometer screw adjustment.

As soon as the component is aligned, it is automatically placedat a single push of a button.

Placing components

with CCD camera and

monitor

Max. PCB size

Max. size of components

Min. size of components

Pitch

Placement accuracy

Power supply

Compressed air

Dimensions (W/H/D)

Weight

220 mm x 300 mm (8.6“ x 11.8“)

45 mm x 45 mm (1.8“ x 1.8“)

5 mm x 5 mm (0.2“ x 0.2“)

0.3 mm (12 mil)

± 50 µm (± 2 mil)

230 V/50 Hz oder 115 V/60 Hz, 20 VA

6 bar (87 psi), min. 5 l/min (0.18 cfm), oil-free

600 mm x 430 mm x 435 mm

(23.6“ x 17“ x 17.1“)

35 kg (77 lb)

Specifications LPKF ZelPlace BGA



IMPORTANT NOTELPKF ZelPlace 110, 220 and 330 can

be upgraded to LPKF ZelPlace system340.!

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Max. PCB size

Max. placement area

Operating air pressure

Vacuum

Pulse/Pause ratio

Number of dispensing points

Dispensing quantity

Turntable location

Feeder location

Power supply

Air supply

Max. device dimensions

(W/H/D)

Weight

Ambient conditions

106839

370 x 290 mm

(14.56“ x 11.42“)

220 x 300 mm

(8.66“ x 11.81“)

0.1 - 2.5 bar (1.45 - 36.25 psi)

0 - 0.8 bar (0 - 11.6 psi)

0.1 - 2s / 0.1 - 5s

up to 300 /min

minimum 0.2 mm3

left/right/back

left/right

120V or 230V, 50/60Hz. 7VA

6 bar (87 psi), 10 l/min (0.35 cfm)*

1,000 mm x 500 mm x 900 mm

(40“ x 20“ x 35“)

15 - 40 kg (33 - 88 lb)

Temperature: 5 - 35 °C (41 - 95 °F)

Humidity: 30 - 95%

107953

370 mm x 340 mm

(14.56“ x 13.39“)

370 mm x 300 mm

(14.56“ x 11.81“)

0.1 - 2.5 bar (1.45 - 36.25 psi)

0 - 0.8 bar (0 - 11.6 psi)

0.1 - 2s / 0.1 - 5s

up to 300/min

minimum 0.2 mm3

left/right/back

left/right

120V or 230V, 50/60Hz. 7VA

6 bar (87 psi), 10 l/min (0.35 cfm)*

1,000 mm x 500 mm x 900 mm

(40“ x 20“ x 35“)

15 - 40 kg (33 - 88 lb)

Temperature: 5 - 35 °C (41 - 95 °F)

Humidity: 30 - 95%

Specifications

LPKF ZelPlace

Entry level

LPKF ZelPlace 110

Professional system

LPKF ZelPlace 220

106840

370 mm x 340 mm

(14.56“ x 13.39“)

370 mm x 300 mm

(14.56“ x 11.81“)

0.1 - 2.5 bar (1.45 - 36.25 psi)

0- 0.8 bar (0 - 11.6 psi)

0.1 - 2s / 0.1 - 5s

up to 300/min

minimum 0.2 mm3

left/right/back

left/right

120V or 230V, 50/60Hz. 7VA

6 bar (87 psi), 10 l/min (0.35 cfm)*

1,000 mm x 500 mm x 900 mm

(40“ x 20“ x 35“)

15 - 40 kg (33 - 88 lb)

Temperature: 5 - 35 °C (41 - 95 °F)

Humidity: 30 - 95%

High-end system

LPKF ZelPlace 330

106842

370 mm x 340 mm

(14.56“ x 13.39“)

370 mm x 300 mm

(14.56“ x 11.81“)

0.1 - 2.5 bar (1.45 - 36.25 psi)

0 - 0.8 bar (0 - 11.6 psi)

0.1 - 2s / 0.1 - 5s

up to 300/min

minimum 0.2 mm3

left/back

left

230V, 50/60Hz, 780VA

6 bar (87 psi), 10 l/min (0.53 cfm)*

1,000 mm x 500 mm x 900 mm

(40“ x 20“ x 35“)

15 - 40 kg (33 - 88 lb)

Temperature: 5 - 35 °C (41 - 95 °F)

Humidity: 30 - 95%

High-end / repair system

LPKF ZelPlace 340

ZelDisp dispenser

Bridge-guided unit for stereo-microscope and CCD camera

Zoom stereo-microscope unit SM143

CCD Camera

Color monitor 14“

Ball socket turntable 150 mm ( 5.90“)

Turntable set with 45 antistatic component bins

Turntable set with 90 antistatic component bins

Feeder-carrier

Tape feeder 8 mm (0.31“)



Stick feeder SO8 - SO28, SO8L - SO28L

Stick feeder PLCC28 - PLCC44

Stick feeder PLCC52 - PLCC84

Monochrome micro camera (swiveling)

Upgrade kit for LPKF ZelPlace 110 to 220




Set of consumables K1

Set of consumables K2

Stand for 2 cartridges*

Vacuum gripping device*

Vacuum switch*

Foot switch with 2 m (6 ft.) cable

Set of 10 dispensing and vacuum needles*

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LPKF ZelPlace accessories LPKF

ZelPlace 110

LPKF

ZelPlace 220

LPKF

ZelPlace 330

LPKF

ZelPlace 340


+ accessories

– not available

optimal configuration

* clean, dry, oil-free

* items are included in set K1 delivered with LPKF ZelPlace

Part number

104766

104767

109190

105614

105615

101339

101344

101377

101352

101351

101350

101356

101357

103897

106055

Upon request

Upon request

Upon request

Upon request





Accessories for LPKF ZelPlace 110, 220, 330 and 340

Tape and stick feederUp to 13 feeders can be mounted on the feeder carrier for fast changeover ofcomponents. They can be conveniently mounted on both sides of the system.

Turntable for bulk componentsThe turntable with either 45 or 90 ESD safe components bins can be locatedon both sides of the system as well as in the back.

LPKF ZelDispEach LPKF ZelPlace comes with a ZelDisp dispenser unit. This multi-functiondispenser with an integrated non-drop function is also designed for thedispensing of low viscosity fluids like adhesives. The dispensing pressure, timeand repetition rate between the pulses can be set as required. The dispensingcycle is started by activating the foot switch (LPKF ZelPlace 110) or pressingdown the manipulator head (all other LPKF ZelPlace versions). The Pick & Placevacuum is also generated and controlled by the LPKF ZelDisp unit.

Consumables set K1This set contains the following parts: foot switch with 2 m (6 ft.) cable, vacuumpick-up nozzle with vacuum valve, silicon hoses, cartridge adapter 10 ccm (4 inch2), two 10 ccm cartridges with caps and pistons and plungers, set of tendispensing and vacuum needles, two vacuum caps, stand for two cartridges.

LPKF consumables set K2One cartridge adapter 5 ccm, two 5 ccm cartridges with caps and pistons andplungers, set of ten dispensing and vacuum needles, two vacuum caps.

Feeder carrier with feeders

LPKF ZelDisp

ESD safe turntable for bulk components



Passive components in Inch / mm

1206 (3216)

0805 (2012)

0603 (1608)

0402 (1005)

0201 (0603)

IC packages

SOT23

SOT323

SC90-TR

SOIC 1.27 mm (0.05“)

PLCC 1.27 mm (0.05“)

SSOP 0.65 mm (0.025“) - 64 leads

TSOP 0.5 mm (0.019“) - 48 leads

QFP 0.8 mm (0.031“) - 120 leads

QFP 0.65 mm (0.025“) - 100 leads

QFP 0.65 mm (0.025“) - 160 leads

QFP 0.5 mm (0.019“) - 208 leads

QFP 0.4 mm (0.015“) - 256 leads

LQFP 0.3 mm (0.011“) - 168 leads

BGA 1.5/1.27 mm (0.06“/0.05“)

BGA 1 mm (0.039“)

µBGA® 0.75 mm (0.029“)

µBGA® 0.5 mm (0.019“)

Compatible

Limited compatibility (requires skilled user or is time consuming)

additional tools may be required

Entry level

LPKF ZelPlace 110

Professional system

LPKF ZelPlace 220

High-end systems

LPKF ZelPlace 330 & 340

LPKF ZelPlace BGA

Overview of typical SMD components and recommended assembly configurations

Edge Centring

Edge Centring





LPKF ZelFlow

LPKF ZelFlow RO4, RO4/N2 Reflow Ovens

Part number

Maximum circuit board size

Preheating temperature/time

Reflow temperature/time

Long thermal treatments temperature/time

Temperature stabilisation time

Cooling

Power connection

Power consumption max.

Nitrogen gas consumption (N2 model only)

Dimensions (W/H/D)

Weight

Ambient conditions

106006

280 mm x 350 mm

(11.02“ x 13.77“)

50 - 230 °C (122 - 446 °F), 1 - 1800 s

75 - 270 °C (167 - 518 °F), 0 - 600 s

50 - 220 °C (122 - 428 °F), 1 - 1440 min

5 min

variable speed fans, processor controlled

220 - 230 V/50 - 60 Hz single phase

3,500 VA

0.28 m3/h (10 SCFH)*

500 mm x 370 mm x 450 mm

(19.7“ x 14.6“ x 17.7“)

24 kg (52.8 lb)

Temperature: 20 - 30 °C (68 - 86 °F)

Humidity: 30 - 95 %

Specifications

Product descriptionThe LPKF ZelFlow RO4 combined hot-air/quartz reflow oven is theideal tool for rapid SMD prototyping and small batch production.

Compact and versatile, the oven has a large working area andmicro-processor controlled temperature-time profiles. It is capableof SMD Reflow soldering, curing of adhesives and conductivepastes, and other thermal treatments.

The process temperature and time can be easily programmed bythe user. All parameters such as pre-heating/reflow temperaturesand times can be saved as user profiles for later use.

It is also suitable for longer treatments such as temperaturestabilisation of electronic components for up to 24 hours. The startand end of all processes is indicated visually and acoustically. Thetimers can be set to display count-up or count-down to the end ofthe process. The circuit boards are automatically cooled at the endof the process.

Its dual access design features both drawer and a clamshellopening with safety interlocks. The ZelFlow RO4/N2 featuresoptional nitrogen inerting.

Product features• Forced air (convection) and IR (quartz lamp)• Microprocessor controlled• Large working area• Automatic cooling• Programmable time/temperature profiles• Simplified user interface• N2 inerting option available (ZelFlow RO4/N2)

* Standard Cubic Feet per Hour

No special accessories available.

The LPKF ZelFlow RO4 working area is specially designed to matchthe specifications for LPKF AutoContac and LPKF EasySolder.

LPKF RO4/N2 closed LPKF ZelFlow RO4/N2 open

LPKF ZelFlow RO4 LPKF ZelFlow RO4/N2

109568

53LPKF ZelFlow


Laser systems for the production ofmetal and polymer stencils for solder-paste printing.

Laser system for drilling micro-vias,direct circuit board structuring, skivingand contour cutting of flex and rigidcircuit boards.

Laser system for the production of 3Dmolded interconnect devices (MIDs).High-density circuit structures arecreated directly on three-dimensionalplastic components.(Laser based 3D-MID technology,additive/subtractive)

Description Application LPKF system

Polymer stencil Metal stencil

Microvia Cutting

Structuring

LPKF StencilLaser SL 600 Polymer

LPKF StencilLaser SL 800

LPKF MicroLine Drill 600

LPKF MicroLine 3D

Other LPKF products

Assembled MID


Rigid-flex circuit board

54 Other LPKF products

Production steps


Description Application LPKF system


Laser system for the high-resolutionstructuring of thin metal and polymerfilms using a mask projection.Available for panels and reel-to-reel.

Laser system for micro-machiningmetallic, organic and ceramic materials.

Services

50 µm lines and spaces

created by laser

structuring

Etching resist structuring

(ATOTECH) for ultrafine

circuit boards.

High-precision sensors

e.g. for temperature

measurement.

Pho

tos

cour

tesy

of

Phi

lips

Cutting, drilling and engraving

ceramics

LPKF MultifunctionLaser

MF 100 UV

LPKF MicroLine Laser

Interior glass structuring

LPKF Laser Center, North AmericaTelephone +1-503-454-4200

LPKF Laser Center, GermanyTelephone +49-5131-7095-0

3D-MID Application Center, GermanyTelephone +49-5222-944930

Sensor and sensor

elements made out of

flexible substrates, e.g.

for medical technology.

55Other LPKF products


Imprint

This catalogue was prepared with enormous attention to details. LPKF reserves the right tochange specifications and other product information without notice.

Price listsThe price lists in the catalogue or attached to the catalogue are not part of the catalogue.All of the prices contained in the list apply ex works, excluding packaging and local taxes.All prices are subject to changes. Only the latest price list is valid. We will be happy toprovide you with an individual quotation containing detailed specifications based on thelatest price list.

General terms and conditionsWe also draw your attention to our general terms and conditions and terms of delivery andpayment which apply to all transactions and which we will be glad to send you upon requesttogether with the requested quotation. Special agreements must be made in writing.

Privacy protectionAll of the personal data provided by customers are only saved for our own commercialpurposes and in compliance with local privacy protection law.

Trademarks & patents© 2003 LPKF Laser & Electronics AG, Garbsen, Germany. Systems and products offered byLPKF and its subsidiaries are covered by issued and pending German and foreign patents.Products mentioned are for identification purposes only and may be trademarks orregistered trademarks of their respective companies. “LPKF”, the LPKF logo and “LPKFProtoMat” are registered trademarks of LPKF Laser & Electronics AG.

Product catalogue number 111271

Publisher

LPKF Laser & Electronics AG

Osteriede 7

30827 Garbsen

Telephone +49 (0) 51 31/70 95-0

Fax +49 (0) 51 31/70 95-90

e-mail [email protected]

web info www.lpkf.de

Concept, design and layout

AD HOME

Hauptstraße 17

30855 Langenhagen

Telephone +49 (0)5 11/2 15 67-44

Fax +49 (0)5 11/2 15 67-45

e-mail [email protected]

56 Imprint


LPKF has far more products and services available than are listed in thiscatalogue. To ensure you get the best solution for your area of application, wewill be very happy to send you detailed information on other LPKF products.

Fax-No.Germany +49-5131-7095-90China +86-22-23006965 France +33-1-60869622Japan +81-3-34676159Slovenia +386-4-2013820Spain +34-91-8475522UK/Ireland +44-1344-860547North America +1-503-682-7151

Please select from the following options for Rapid PCB Prototyping:

LPKF MicroLine Laser· Sensor technology· Chip interposers· Flexible circuits· Micro-structuring of thin layers

(< 1 µm)

LPKF MicroLine 3D· 3D-MIDs (additive/subtractive)· Material processing· Glass interior structuring

LPKF MultifunctionLaser UV· Ceramic cutting· Ceramic drilling· Ceramic engraving· Glass interior structuring

LPKF HybridLaser· Structuring

LPKF MicroLine Drill 600· Structuring· Micro-via drilling· Cutting· Solder-resist ablation

LPKF StencilLaser· SMD metal stencils· SMD polymer stencils

LPKF MultifunctionLaser IR· Circuit board structuring· Cutting very thin sheets· Trimming resistances

LPKF stencil service· SMD solder stencils· Micro-cutting service· Quick-release frames· Precision shaped parts· Gobos

Demo CDPersonal consultation Sample Board

Information on other product categories

LPKF information order form

Company

Contact

Department, Building,Mail Stop

Address

City, State

Country

Fax

Telephone

e-mail

57Information order form

See imprint LPKF product catalogue for details.

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59Technical questionnaire

Technical questionnaire:Solutions for your specific requirements

Please fill out the following questionnaire to help us better provide you withaccurate information to meet your needs. Your business is very important to us!

DigitalArea of Application

Base material

Max. board size

Circuit board technology

Multilayer

Through-hole plating

Analog RF/Microwave Power Supplies

FR3 FR4 RF substratesPolyimide (rigid) Polyimide (flexible)Ceramic substrate Others:

less than 200 x 340 mm (8“x13“) bigger than 200 x 340 mm (8“x13“)

Single-layer Double-layer FlexMultilayer Rigid-flex

Number of layers (min - max)

Interior layer thickness (min - max)

Separation between interior layers (min - max)

Blind ViasYes YesNo No

No Yes· Max. holes per circuit board

Approx. 50≤ 300> 300

· Min. hole diameter

mm/mil

Buried Vias


PLEASE TURN OVER

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Fax-No.Germany +49-5131-7095-90China +86-22-23006965 France +33-1-60869622Japan +81-3-34676159Slovenia +386-4-2013820Spain +34-91-8475522UK/Ireland +44-1344-860547North America +1-503-682-7151

Company

Contact

Department, Building,Mail Stop

Address

City, State

Country

Fax

Telephone

e-mail


60 Technical questionnaire

Circuit board properties

Circuit geometries

Prototype circuit board assembly

Soldering methods for prototypeproduction

Do you produce front panels?

Fully automatic tool changerequired?

PCB Layout Software

Export file formats

Development projects per year

No. of designs per project

No. of boards per design

How do you currently produce prototypes?

Circuit board (min - max)

Cu clad

mm/inch

µm/oz.

ConventionalSMD

Mixed assembly

Track widths (min)

Gaps (min)

Remaining ring of the pad (min)

µm/mil ( < 200 µm [8 mil])

µm/mil ( < 200 µm [8 mil])

µm/mil ( < 200 µm [8 mil])

Manual solderingConvection

Wave solderingVapor phase

Reflow soldering

Manual assembly Semi-automatic Automatic Others

No Yes

max. thickness

AluminumEngravingMilling

PlasticEngravingMilling

max. thickness

No Yes

Name Version

Gerber® Standard (RS-274-D)Gerber® Extended (RS-274-X)Excellon NC Drill

Sieb & Meyer NC DrillDXFHP-GL™

Others:

In-houseEtchingMillingWirewrap (wiring technique)

External, by service companiesEtchingMilling

Are you happy with the situation?YesNoWhy?

mm/inch mm/inch



Index

4-layer multilayer6-layer multilayer8-layer multilayerAccessoriesAluminum ApplicationsAutoContacAutomatic tool changeAutoSwitchBase materialsBGA PlacerBoardMasterBrassBuild-up method (sequential)CAD (please use also EDA)CAM StationChemical setsCircuit board plotterCircuitCAMCompressed airCompressorConductive pasteConsumablesContacContact printingContour generatorConvection ovenCustom drill bitsCustom toolsCustomer service lineData conversionData exportData formatsData importDepanelizationDispensingDistribution networkDouble sided printingDrill bitDrill dataDrilling machineDust extractionEasyContacEasySolderEditing capabilitiesEndmillEngravingFine-pitch printingFlex boardsFlexible circuitsFlex-rigid boardsFoil engravingFront panelsFully automaticGalvanicGerberHead lightingHousingInstallationInsulation processLaser

Solder paste printingSound enclosurSpecial applicationsSpindleStarter packsStencil printerStencil printingTech supportTest adapterThrough hole platingTinningTool libraryTool managementTool ring setToolsTrainingTrainingUniversal cutterVacuum table (H100)Working depth limiterWYSIWYGZelFlexZelFlowZelPlaceZelPrint

LayoutMeasurement microscopeMicro cutterMicrometer screwMicrowave circuitsMicrowave layoutMicrowave prototypeMilling bitMiniContacMultilayer boardsMultiPressPastePCB drillingPCB millingPCB post processingPCB prototypePlastic / compositePlastic engravingPneumatic Z-axisPost processing of:· populated boards· bare boardsPrintingProgram wizardProtoLaserProtoMat®

ProtoMat® 95s/IIProtoMat® C100/HFProtoMat® C20ProtoMat® C40ProtoMat® C60ProtoMat® H100ProtoMat® L60ProtoMat® M30sProtoMat® M60ProtoMat® X60PrototypesQuality featuresQuick release colletQuick release frameReflow ovenRegistration pin methodReverse pulse platingRF circuitsRF layoutsRF prototypesRF-EndmillRivetsRoutingSatusLightScreen-printingServiceSet pin systemSign engravingSMD assemblySMD fine pitch printingSMD metal stencilsSMD polymer stencilsSMD solder paste stencilsSoftware upgradeSolder mask

31, 32, 33, 4031, 32, 33, 4031, 32, 33, 4024, 428, 14, 16, 206, 14, 16, 18, 20, 216, 281824394712732101141131025256, 2838294310, 112537351310101010, 1196, 8, 286143351014246, 2734, 4210368, 943888, 2098186, 2910 ff268181121, 54

102436267, 141111, 143529, 417, 31, 32, 33, 39, 4031, 424297968813, 14, 26

9, 209, 2043 ff102114187, 14141414181616162061313, 144553337, 297, 14117, 1436, 386, 277, 2025431313, 38747435454, 95410, 117, 28

43248263813431396, 27 ff30, 4112122535, 381413,183618261245534743

61Index


www.lpkf.com Your LPKF-Distributor

Germany (Headquarters)LPKF Laser & Electronics AGOsteriede 730827 GarbsenGERMANYPhone +49-5131-7095-0Fax +49-5131-7095-90e-mail [email protected] info www.lpkf.com

FrankreichLPKF France S.A.R.L.Z.A. de l’Églantier21 Rue des Cerisiers(C.E. 1514 Lisses)91015 Evry CedexFRANCEPhone +33-1-60862691Fax +33-1-60869622e-mail [email protected]

SlowenienLPKF Laser & Elektronika d.o.o.Planina 34000 KranjSLOVENIAPhone +386-4-2013800Fax +386-4-2013820e-mail [email protected] info www.lpkf.si

SpainLPKF Laser & Electronics Spain, S.L.Apartado Nr. 128791 Soto del Real (Madrid)Madrid/SPAINPhone +34-91-8475505Fax +34-91-8475522e-mail [email protected] info www.lpkfspain.com

UK/IrelandLPKF Laser & Electronics Ltd.Coppid Beech Lane, WokinghamBerkshire-RG40 1PDGREAT BRITAINPhone +44-1344-455046Fax +44-1344-860547e-mail [email protected] info www.lpkf.co.uk

North AmericaLPKF Laser & Electronics28220 SW Boberg Rd.P.O. Box 3858Wilsonville, OR 97070USAPhone +1-503-454-4200Fax +1-503-682-7151e-mail [email protected] info www.lpkfusa.com

LPKF distribution network

LPKF Headquarters

LPKF Distribution and

production facilities

LPKF Distributors

Cata

log n

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ber

111

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OM

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ChinaLPKF Tianjin Co., Ltd.No. 1 Building, Xing Nan Cun,Ke Yan Xi Road, Nan Kai District,Tianjin, 300192PEOPLE'S REPUBLIC OF CHINAPhone +86-22-23005700Fax +86-22-23006965e-mail [email protected]

JapanLPKF Japan Co., Ltd.Yoyogi 5-8-5-304Shibuya-kuTokyo 151000JAPANPhone +81-3-34657105Fax +81-3-34676159e-mail [email protected] info www.lpkf.co.jp

LP

KF

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BP

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PIN

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T C

ATA

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2/0

3

PRODUCT CATALOG 02/03

RAPID PCB PROTOTYPING


Slovenia +386-4-2013804Spain +34-91-8475505UK/Ireland +44-1344-455046North America +1-503-454-4229

(8 am - 5 pm PST)


rapid pcb prototyping - tabe.rutabe.ru/pdf/lpkf_catalog.pdf · milling bit minicontac ......

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