pulsed laser ablation opens up new borders for the ... · pulsed laser ablation opens up new...
TRANSCRIPT
Pulsed laser ablation opens up new borders for the manufacturing of solid PCD tools
Aerospace Innovation Forum, Bordeaux, 15.10.2015
Maximilian Warhanek, ETH ZurichPaul Butler-Smith, University of NottinghamClaus Dold, EWAG AGJean-Francois Bucourt, Diamoutils
Agenda
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Pulsed Laser Ablation (PLA)
DIPLAT project
Tangential laser processing
PLA-produced solid PCD tools
Tool performance benchmarking
PLA drill production
Ultrashort Pulsed Laser Ablation
Extremely high laser peak power
Short laser-material interaction time
Negligible thermal impact on workpiece
EWAG Laser Line 5-axes machine centre 50 Watt ps laser source Fully automated
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EWAG Laser Line ULTRA
Source: Semrock.com
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Ultrashort Pulsed Laser Ablation
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DIPLAT - Enabling advanced functionalities of Diamond and other ultra-hard materials by Integrated Pulsed Laser Ablation Technologies
EU 7 Framework Project, 8 partners, 6 countries Development and industrialization of diamond tool
processing technologies by PLA
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Polishing Grinding/Dressing Drilling/Milling15 October 2015 © DIPLAT
Laser Processing Kinematics on Rotary Tools
Radial Efficiency Geometrical flexibility
Tangential Precision / Repeatability Surface quality
Axial Influence of beam caustic
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Radial Laser Processing: 2.5D Volume Ablation
Material removal in layers Orthogonal beam incidence
+ Geometrical flexibility+ Laser power efficiency
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Source: CAM service
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Tangential Laser Processing
Material removal orthogonalto beam directionDefined geometrical limits
Final contour is defined only by the relative motion between laser and workpiecePrecisionRepeatability
[Timmer 2001]: True profiling
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Focus
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Tangential Laser Processing: Advantages
Surface quality No discretization errorLess trade-off between surface
quality and process time
Polishing effect[Tokarev et al. 1994]Composite materialsRoughing
Ra < 35nm on carbide
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Tangential Laser Processing Kinematics
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5 CNC axesX’,Y,Z’,B’,C’PrecisionFlexibility
3 Laser axesU,V,WDynamics
EWAG Laser Line machine kinematics
Tangential Laser Processing before DIPLAT
PCD Cutting inserts
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Source: EWAG AG Source: Claus Dold, 2013, Dissertation
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Tangential Laser Processing - DIPLAT
Solid PCD tools with complex geometries
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2mm drill M2.2 thread mill 2mm mill 2mm mill15 October 2015 © DIPLAT
Tool Benchmarking
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Comparison: Drilling tools by Pulsed Laser Ablation Electro Discharge Grinding CVD-D coating
Criteria Roughness Edge radii Wear behavior
EDG
CVD
PLA
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Tool Benchmarking: Surface Roughness
Roughness: Ra (λc=80 µm)) PLA EDG CVD Clearance face: 146 nm 219nm 217 nm Helix: 152 nm 242nm 249 nm Chisel edge: 166 nm - 280 nm Secondary edge: 138 nm - 208 nm
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500µm
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Tool Benchmarking: Edge Radii
Cutting edges Primary PLA: 9.1 µm (3.5 µm) EDG: 4.7 µm CVD: 18.7 µm
Primary at chisel edge PLA: 5.9 µm EDG: 4.4 µm CVD: 19.1 µm
Secondary PLA: 5.7 µm EDG: 4.6 µm CVD: 16.8 µm
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PLA
CVD
EDG
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Tool Benchmarking: Drilling Test
Material: Zirconium Oxide (1200HV) Feed: 4 mm/min, 3 mm/bore Spindle: 3500 rpm
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Tool Benchmarking: Drilling Chips
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Left:Coated toolBrittle chips
Right:PLA-toolDuctile chips
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Tool Benchmarking : Wear
Tool wear after 15 bores in Zirconia Oxide (1200HV)
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PLA-processed PCD tool CVD-D coated carbide tool15 October 2015 © DIPLAT
Tool Benchmarking: Drilling Test
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Material: CFRP Feed: 480 mm/min, 4 mm/bore Spindle: 8000 rpm
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Tool Benchmarking: Wear
Tool wear after 1000 bores in CFRP
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PLA-processed PCD tool EDG-processed PCD tool
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Tool Benchmarking: Drilling Test
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Material: CMC Feed: 480 mm/min, 3.2 mm/bore Spindle: 8000 rpm
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Tool Benchmarking: Wear
Tool wear after 300 bores in CMC
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PLA-processed PCD tool EDG-processed PCD tool
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Thank you for your kind attention!
Maximilian WarhanekInstitute of Machine Tools and ManufacturingETH Zurich, PFA H43Technoparkstrasse 1CH – 8005 ZürichPhone: +41 44 633 78 [email protected]
Jean-Francois BucourtDiamoutils SAS
Parc Altaïs -32, rue AdrastéeF 74650 Chavanod
Phone: :+33 4 50 67 41 [email protected]://www.diamoutils.com