product end-of-life disassembly instructionsh22235.€¦ · hp 470 g7 notebook pc purpose: the...

EL-MF877-00 Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.]

HP 470 G7 Notebook PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact. 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes

Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm (MB, RAM, TP BD, Pick BD, USB BD)

5

Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button style batteries

0

Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all that apply with an “x” inside the “[ ]”): [ X ] screws [ ] snaps [ ] adhesive [ ] other. Explain NOTE: Add detailed removal procedures including required tools in the sections 3.1 and 3.2.

1

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps (17.3’’)

1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

0

External electrical cables and cords DC Cable for External Power Supply 1

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs

0

http://standards.int.hp.com/elclass/AMF87701.htm


mailto:Sustainability%20and%20Compliance%20Center%20%[email protected]%3e

mailto:Sustainability%20and%20Compliance%20Center%20%[email protected]%3e

EL-MF877-00 Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description Notes

Quantity of items included in product

already listed as a separate item above)

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

0

Components and waste containing asbestos 0

Components, parts and materials containing refractory ceramic fibers

0

Components, parts and materials containing radioactive substances

0

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if

applicable)

Electric screwdriver (Cross) #1, Cross

ODD BRKT support fixture

Support fixture

3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:

1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first 3. Use correct screwdriver and torque value before unlock the screw.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).


MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL ASSEMBLY MODEL : Harry Potter 17” Standard

Tabulator：Chang Nevil Auditor：Lee Chung-Sheng

Standard Operation Procedure

Document No. : Harry Potter 17” (Snape / Dumbledor) LCM SOP Station :

Name : Ver. : Date :

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty

Step：

Notes : If finding anything uncommon, notice foreman or assistant at once.

Tabulator： Department： Lee Chung-Sheng NPSU-PIE Auditor ： Chang Nevil

Disassemble hinge Cover

1. Disassemble hinge Cover

1(1/1)

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Hinge Cover

DF Jet Black 6051B1241801

Snow White 6051B1241802

FF

Smoky Grey 6051B1241803

Sapphire Blue 6051B1241804

Velvet Burgundy 6051B1241805

Serenity Mint 6051B1241806

FF+

Natural Silver 6051B1241807

Pale Gold 6051B1241808

Scarlet Red 6051B1241809





Step：



Disassemble bezel

1. Disassemble bezel in the order 1→2→3 (Fig.1)

2(1/1)

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Hook Hook

1

2 2

1

3 3





Step：



1. Loosen screw M2*3(6052A0035101)*4,

Fig.1

Electric screwdriver #1 1

Lossen LCD screw

2

1

4

3

3（1/1）

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Step：



Disassemble Touch/B

4(1/1)

Only Touch SKU動作 :

1. Disconnect Touch/B FPC(Fig.2)

2. Disassemble Touch/B於A cover (Fig.1)

Fig.1

Fig.2

hook

Do not press

1.00 2018/3/20

Push

here for

remove

touch/B





Step：



1.Disassemble eDP Cable from A cover (Fig.1)

Disassemble edp cable

5(1/1)

Fig.1

1.00 2018/3/20





Step：



1. Take out the LCD from A case, disconnect

EDP cable from LCD.

Fig.1

Disconnect eDP Cable from LCD

6(1/1)

Fig.2

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出





Step：



1. Loosen screws M2.5*2.5 (6052B0096201)*6

Fig.1


Loossen Hinge screws

2

1

3

7(1/1)

Fig.2

1

2 3

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預留

預留





Step：



1. Disassemble hinge in the order of picture.

First remove hinge from the hook, and then

disassemble hinge from the rib along the Z

axis.(Fig.2)

Fig.1

Disassemble Hinge

8(1/1)

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LH連鋐

6055B0056901 Hinge-L

6055B0056902 Hinge-R

SNR鑫禾

6055B0057001 Hinge-L

6055B0057002 Hinge-R

hook

Rib

Fig.2





Step：



1. Disassemble hinge in the order of picture.

First remove hinge from the hook, and then

disassemble hinge from the rib along the Z

axis.(Fig.2)

Fig.1

Disassemble Hinge

9(1/1)

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LH連鋐

6055B0056901 Hinge-L

6055B0056902 Hinge-R

SNR鑫禾

6055B0057001 Hinge-L

6055B0057002 Hinge-R

hook

Rib

Fig.2





Step：



1. Tear off the aluminum foil ，

2. Disassemble eDP Cable from A cover

Disassemble eDP & Antenna cable

10(1/1)

1.00 2018/3/20

Fig.1

Fig.2

Fig.3





Step：



Disassemble eDP cable

1. Disassemble Camera Cable frome A cover

Do not over-pull when disassemble the line

Fig.1

11(1/1)

1.00 2018/3/20

Fig.2

rib

rib

hook

Fig.3 Fig.4





Step：



Disassembe Camera

1. Disconnect Webcam Cable，and disassemble Camera

Fig.1

12(1/1)

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Fig.2 rib rib

Fig.3





Step：



1. Remove antenna cable from A cover along

the arrow of fig.

Disassemble Antenna cable

13(1/1)

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Fig.1





Step：



Disassemble Main Antenna Cable

14(1/1)

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Fig.1

WNC 6036B0214401 Main

6036B0214301 Aux

ACON 6036B0214201 Main

6036B0214101 Aux

INPAQ 6036B0214001 Main

6036B0213901 Aux

YAGEO 6036B0213801 Main

6036B0213701 Aux

1. Disassemble WLAN Antenna (Main） 2. Tear off the aluminum foil

Fig.2





Step：



1. Disassemble WLAN Antenna (AUX） 2. Tear off the aluminum foil

Disassemble AUX Antenna Cable

15(1/1)

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Fig.1

WNC 6036B0214401 Main

6036B0214301 Aux

ACON 6036B0214201 Main

6036B0214101 Aux

INPAQ 6036B0214001 Main

6036B0213901 Aux

YAGEO 6036B0213801 Main

6036B0213701 Aux

Fig.1

Aux Main

Fig.2

Fig.3

MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL ASSEMBLY MODEL : Harry Potter 17”

Tabulator：Chang Nevil Auditor：Lee Chung-Sheng


Document No. : Harry Potter 17” (Snape / Dumbledor) FA SOP Station :


Step：

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard Qty



1. Loosen screws M2.5x6 *4

Loosen screws 1.00 2018/3/20

2

1 4

3

1(1/1)





Step：




Remove Rubber

1. Remove Rubber

Rear

Front

下殼腳墊選用配置

D cover Front rubber Rear rubber

DF Jet Black 6054B2049301 6054B2049401

Snow White 6054B2049302 6054B2049402

FF

Smoky Grey 6054B2049303 6054B2049403

Sapphire Blue 6054B2049304 6054B2049404

Velvet Burgundy 6054B2049305 6054B2049405

Serenity Mint 6054B2049306 6054B2049406

FF+

Natural Silver 6054B2049307 6054B2049407

Pale Gold 6054B2049308 6054B2049408

Scarlet Red 6054B2049309 6054B2049409

1.00 2018/3/20

2(1/1)




Step：




1. Loosen screws M2.5x6 *6 。

Loosen screws

1 5

2

4 3

6

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3(1/1)





Step：




1. Disassemble ODD(Fig2) 2. Loosen screws M2x2*2 (Fig.1) 3. Disassemble ODD Bezel

Disassemble ODD

Fig1

1

2

Fig2

1.01 2018/3/8

4(1/1)





Step：




1. Put ODD on the support fixture (Fig1/Fig2)。

2. Loosen M2x2.5* 1 , and disassemble ODD BRKT

(Fig1/Fig2)。

Disassemble ODD BRKT


ODD BRKT support fixture 1

Fig1

Fig2

螺絲拆解孔鐵件定位孔

1.00 2018/3/20

5(1/1)




Step：




1. Disassemble D cover

Disassemble D cover

Fig1

1

2 2

3 3

1.00 2018/3/20

6(1/1)




Step：




Loosen battery screws

1. Loosen batteryscrews M2x3*4 (Fig1)

Fig1

1 4

3 2

1.00 2018/3/20

7(1/1)





Step：




1. Disassemble DDR(Fig1) 2. Disassemble battery(Fig2)

Disassemble DDR & BATT

Fig1

DIM

M1

DDR

Fig2

1.00 2018/3/20

8(1/1)




Step：




1. Disconnect WLAN Antenna cable

terminal (Fig1)

Disconnect Antenna cable

Fig1

1.00 2018/3/20

9(1/1)




Step：




1. Remove Antenna Cable (Fig1)

Remove Antenna cable

Fig1 Fig2

1.00 2018/3/20

10(1/1)




Step：




1. Loosen SSD, WLAN Module screws M2x3 *2(Fig1 ~3)

2. Disassemble SSD & WLAN Module

Loosen SSD、WLAN Module screws


Fig1

Fig2

Fig3

1.00 2018/3/20

11(1/1)




Step：




Disassemble SSD/B

SSD bracket 1. Disconnect SSD/B FFC CNTR from M/B

(Fig1)

2. Loosen screws M2x3*2(Fig2) 3. Disassemble SSD/B & SSD BRKT

、

Fig1


Fig2 2

1

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12(1/1)




Step：




HDD

1. Disconnect HDD FFC CNTR from M/B(Fig2) 2. Disassemble HDD from C Cover, (Fig1) 3. Disassemble HDD Bumper(6051B1243301)

Disassemble HDD

Fig1

OK NG NG

Fig2

Fig3

1.00 2018/3/20

13(1/1)




Step：




1. Disconnect eDP Cable CNTR from M/B (Fig1)

2. Remove eDP cable(Fig1) 3. Disconnect ODD/B FFC CNTR

Disconnect EDP & ODD/B FFC CNTR

Fig1

Fig2

Fig3

1.00 2018/3/20

14(1/1)




Step：




1. Open the machine to 135degrees and place it on the fixture

2. Loosen Hinge screws M2.5x6*4 in the order 1 2 3 4

Disassemble Hinge hp

Fig2

Fig1

Support fixture 1


Fig3

Fig4

1

2

3

4

1.00 2018/3/20

15(1/1)




Step：




1. Disconnect FFC & Pick Button CNTR，(Fig1)

Disconnect pick button FFC CNTR

Fig1

1.00 2018/3/20

16(1/1)




Step：




1. Disconnect TP PCB CNTR，(Fig1) 2. Disconnect KB BL FPC CNTR only for BL

SKU(Fig1)

Disconnect TP & KB backlight FFC

Fig2

Fig1

1.00 2018/3/20

17(1/1)




Step：




1. Disconnect USB FFC CNTR， (Fig1) 2. Disconnect KB membrane CNTR上(Fig2)

Disconnect USB FFC&KB CNTR

Fig1

背膠

背膠

Fig2

1.00 2018/3/20

18(1/1)




Step：




1. Loosen FAN screw M2x3*2(Fig1) 2. Loosen MB screw M2x3*1(Fig2) 3. Loosen Hook screw M2x3*1(Fig.3)


Loosen FAN /Hook screws

Fig1

Fig2

1

2

3

4

Fig3

1.00 2018/3/20

19(1/1)




Step：




1. Disconnect Speaker Cable CNTR(Fig1) 2. Tear off the tape 3. Disconnect FAN CNTR(Fig2) 4. Disassemble Fan

Disconnect Speaker & FAN CNTR

Fig1

Fig2

1.00 2018/3/20

20(1/1)




Step：




1. Loosen Thermal Module screws (Fig1/2) M2*3(6052A0035101)*4 (UMA) M2*3(6052A0035101)*6 (Discrete) M2*3(6052A0035101)*4 (Fan-less) 2. Disassemble Thermal Module or Fan-

less BRKT (Fig2/Fig1)


Loosen screws

Fig1

1

2

3

4

6

5

Fig2

1

2

3

4

1.00 2018/3/20

22(1/1)




Step：




1. Loosen M/B screws M2x3*4(Fig1)

Loosen MB screws

Fig1

1

2

4

3


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23(1/1)




Step：




1. Fan-less SKU Tear off the Mylar(6054B2058101)(Fig1)

2. Disassemble DC-In Jack and M/B

Fig1

Fig1

缺口對齊

Disassemble MB 1.00 2018/3/20

24(1/1)




Step：




1. Disconnect USB/B FFC (Fig1)

2. Disconnect DC-in Cable

Disconnect USB/B FFC & DC-in cable

Fig1

6035B0184001 Cvilux

6035B0186001 玖東

Fig2

DC-in Cable FOXCONN(富士康) 6017B0738701

Singatron(信音) 6017B0738801

實盈 6017B0738901

TE(泰科) 6017B0739001

1.00 2018/3/20

25(1/1)

product end-of-life disassembly instructionsh22235.€¦ · hp 470 g7 notebook pc purpose: the...

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