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Product Change Notification

Integration of Supertex Products into Microchip Technology

ADDENDUM TO SUPERTEX PCN-1403 (ISSUED APRIL 1, 2014)

Summary of Changes

Ordering Part NumberPart AgingLot TraceabilityStandardized LabelingStandardized BQM (Base Quantity Multiple)Combination RulesProduct Packing MethodsShipping Boxes

Updated

Updated

Updated

Ordering Part Number

What is Changing? Reason for ChangeWe will replace any spaces in theordering part number with a dash

Consistency and compatibility with Microchip’s existing ordering part number format

Pre:

HV9210NG-G M901

Post:

HV9210NG-G-M901

For a complete list of all affected ordering part numbers, please reference the attachment “PCN1403addendum_OrderingPartNumber.pdf”

Updated List Available

Part Aging

What is Changing? Reason for ChangeMicrochip can ship parts up to 4 years old without requiring a waiver from the customer. Parts older than 2 years old will be recertified prior to shipment.

Material sets used to manufacture integrated circuits have shown no degradation in solderability, moisture sensitivity or reliability of products after 4 years.

For more information related to Microchip’s part aging strategy, please visit the following link on our website:

http://ww1.microchip.com/downloads/en/Market_Communication/Microchip%20part%20age%20policy%20final_2_15_14.pdf

Lot Traceability

What is Changing? Reason for ChangeConvert Supertex lot number format to Microchip Lot Number format. Change the Topside Mark to replace Supertex Lot Number with Microchip Tracecode, Standardize to JEDEC marking for “Green” packages

Improves Microchip capability to provide traceability of products through manufacturing processes and to customers.

PRE CHANGE POST CHANGE


Lot Traceability


For a general guideline/matrix referencing pre- and post- part marking changes, please reference the attachment

“PCN1403addendum_PartMarkingGuideline.pdf”

Additional Info

For a complete list of all affected ordering part numbers, please reference the attachment

“PCN1403addendum_OrderingPartNumberReferenceforPartMarkingChart.pdf”

Example

Example

Standardize Labeling

What is Changing? Reason for ChangeConvert to the Microchip MSLCaution labels (MSL-1, MSL-2, MSL-3)Convert to Microchip labels for Reels, Bags, Inner boxes and Outer cartons

Improve operational efficiencies and cycle times by reducing process variation.

MSL Caution label(MSL-3)


24

168

3

MSL Caution label(MSL-6)


No ChangeWill keep existing MSL-6

Caution Label from Supertex

INNER BOX / REEL / BAG LABELS


Dimension: 100mm. x 60mm.

OUTER LABEL

PRE CHANGE POST CHANGEDimension: 152 mm. x 102 mm.

152 mm.

102

mm

.

No Attention label, preprint on Carton

Standardize BQM

What is Changing? Reason for ChangeStandardize the Base Quantity Multiple (BQM) to Microchip standards for tape and reel quantities (other packing media types are unaffected).

Improve operational efficiencies and cycle times by reducing process variation.

Package Lead count Body size PRE CHANGE POST CHANGEDFN 6 3x3x0.8mm 3000 3300DFN 8 3x3x0.8mm 3000 3300DFN 10 3x3x0.8mm 3000 3300QFN 16 3x3x0.9mm 3000 3300DFN 10 3x4x1.0mm 3000 3300QFN 16 4x4x0.9mm 3000 3300DFN 8 4x4x1.0mm 3000 3300DFN 10 4x4x0.8mm 3000 3300DFN 12 4x4x1.0mm 3000 3300QFN 12 4x4x0.9mm 3000 5000QFN 16 4x4x1.0mm 3000 3300QFN 24 4x4x0.9mm 3000 3300DFN 8 5x5x1.0mm 2500 3300DFN 18 5x5x1.0mm 2500 3300QFN 32 5x5x1.0mm 2500 3300QFN 32 5x5x0.8mm 2500 3300QFN 40 5x5x0.8mm 2500 3300QFN 33 6x6x1.0mm 2000 3000QFN 44 7x7x0.8mm 2000 3000QFN 48 7x7x1.0mm 2000 3000QFN 56 8x8x1.0mm 2000 3000

Tape and ReelBQM Changes

Updated Slide

Package Lead count Body size PRE CHANGE POST CHANGESOT-23 5 -- 2500 3000

SOT-223 3 -- 2500 4000SOIC 8 150mils 2500 3300SOIC 14 150mils 2500 2600SOIC 16 150mils 2500 2600SOIC 20 300mils 1000 1600SOIC 28 300mils 1000 1600SSOP 20 -- 1500 1600PLCC 28 11.5x11.5x4.3 500 750

Tape and ReelBQM Changes

Updated Slide

For a complete list of all affected ordering part numbers, please reference the attachment

“PCN1403addendum_BQMOrderingPartNumber.pdf”

Combination Rules

What is Changing? Reason for ChangeStandardize to Microchip methodsfor combining production lots, trace codes and date codes into tubes, trays, and reel media.

Microchip follows the combination rules defined by JEDEC for immediate packaging (tubes, trays, reels).

Change to Shipping Combination Rules

Packing Media Combination Pre Change Combination Post Change

Tube

1 Date Code 1 Date Code1 Lot Number No limit to the number of production lot

numbers – follow date code combination rule.

Bag

1 Date Code 3 Date codes 1 Lot Number No limit to the number of production lot


Tray

1 Date Code 3 Date codes 1 Lot Number No limit to the number of production lot


Tape and Reel

2 Date Codes 3 Date codes 2 Lot Numbers No limit to the number of production lot


1 Country of Origin – multiple assemblers if they located at the same country.

1 Assembly site

Multiple test site. 1 Test site

Product Packing

What is Changing? Reason for ChangeStandardize to Microchip systems and processes for packing materials.

Reduce the environmental footprint for Microchip and customers by removing unnecessary packing materials.

Packing Methods

Change Packing MethodsRemove Inner Box for listed MSL-1 devicesChange Dry Pack for Tray Change Non-Dry Pack for 7” Tape and ReelChange Non-Dry Pack for 13” Tape and ReelChange Dry Pack for 13” Tape and Reel Change Dry Pack for Tape and Reel of QFP Packages

Updated Slide

Change Packing MethodDry Pack for Trays


Trays pack (5 full packs + 1 cover tray)

Desiccants (x2)

10% 20% 60%

Antistatic PP Straps (x3)HIC Card (x1)

Moisture barrier Bag 280 x 560

Moisture Barrier Bag (Sealed)

Production Label

Green/ESD Label

MSL Label

P2 Label

Antistatic PP Straps (x4)


Change Packing Method non-Dry Packfor 7” Tape and Reel for all packages

Green/ESD LabelUser Direction of Feed(

P2 Label

Production Label

P2 Label

Green/ESD Label

Pink Poly Bag

Blue color reel

Reel label on opposite sprocket holes side

Bag label

Static shielding bag

Protective band at outmost layer


Change Packing Method non-Dry Packfor 13” Tape and Reel for all packages


P2 Label

Production Label

P2 Label

Green/ESD Label

Pink Poly Bag

Blue color reel

Reel label on opposite sprocket holes side

Bag label

Protective band at outmost layer

Static shielding bag


Change Packing Method Dry Pack for 13” Tape and Reel for all packages

Moisture barrier bag 400 x 440 mm.

2 units of desiccant

Blue color reel

3-dot HIC centered


P2 Label

Production Label

Green/ESD Label

P2 Label

MSL Label

Moisture Barrier Bag

Production Label

Desiccants (x2)

HIC Card (x1)

Production Label


Change Packing Method Dry Pack for Tape and Reel of QFP

Add cushion to protect part in tape and reel dry pack

Add Bubble Sheet

Pizza Box

Green/ESD Label

P2 Label

Green/ESD Label

P2 Label

MSL Label

Moisture Barrier Bag

Production Label

Desiccants (x2)

HIC Card (x1)

Shipping Boxes

What is Changing? Reason for Change

Standardize to Microchip systems and processes for shipping boxes.

Reduce the environmental footprint for Microchip and customers by removing unnecessary packing materials. Improve operational efficiencies and cycle times by reducing process variation.

7 Inch Reel Inner Boxfor dry pack

PRE CHANGEDimension: 184.2 x 235 x 25.4 mm.

POST CHANGEDimension: 204 x 220 x 35 mm.

25.4

184.2235

PRE CHANGEDimension (W x L x H) mm

POST CHANGEDimension (W x L x H)

7 Inch Reel Outer Cartonfor dry pack

Length Width Height254 254 254412 412 110410 410 200406 406 305406 406 406597 406 406572 381 279

Length Width Height220 220 120205 460 228

PRE CHANGEDimension: 368.3 x 368.3 x 38.1 mm

POST CHANGEDimension: 342 x 365 x 50 mm

13 Inch Reel Inner Box-smallfor dry pack

PRE CHANGEDimension: 368.3 x 381 x 54 mm

POST CHANGEDimension: 353 x 370 x 78 mm

13 Inch Reel Inner Box-largefor dry pack

PRE CHANGE

Dimension: (W x L x H) mm

POST CHANGEDimension: (W x L x H)mm

13 Inch Reel Outer Cartonfor dry pack

Length Width Height412 412 110410 410 200406 406 305406 406 406597 406 406572 381 279

Length Width Height380 380 380286 375 362405 660 385360 390 385365 384 220380 380 160400 380 80400 380 50400 380 30

Tube Inner box for dry pack

PRE CHANGEDimension: 120.7x184.2x63.5mm

POST CHANGE

Dimension: 129 x 565 x 80 mm

Tubes Outer Cartonfor dry pack

PRE CHANGEDimension:(W x L x H) mm

POST CHANGEDimension:(W x L x H) mm

Length Width Height609 203 203609 254 203597 40.6 406572 381 279

Length Width Height430 657 187.5330 580 230330 580 160160 580 130160 580 90

Tray Inner box for dry pack

PRE CHANGE POST CHANGEDimension: 158.8 x 368.3 x 85.7 mm Dimension: 166 x 371.5 x 88 mm

PRE CHANGEDimension:(W x L x H) mm

POST CHANGEDimension:(W x L x H) mm

Tray Outer Cartonfor dry pack



Reel diameterPRE CHANGE

W x L x H (cm)POST CHANGE

W x L x H (cm)

7” N/A

21x21x5.5

21x21x8

16x21.5x21

21x31x21

32x63x15.5

13” N/A

36.5x38x39.5

35.5x35.5x4

35.5x35.5x6

35.5x35.5x16.5

Outer carton for non dry pack T/R (no inner)

Outer carton for non dry pack Tube (no inner)

PRE CHANGEW x L x H (cm)

POST CHANGEW x L x H (cm)

N/A

15x71.5x5

17x65x8

15.5x62x14

22.5x63x16.5

32x63x15.5

36x63x16.5

15x64x5.5

15x64x10

15x64x14

28x63x11

28x63x15.5

28x63x20

MEDIA PRE CHANGEW x L x H (cm)

POST CHANGEW x L x H (cm)

BAG N/A18x37.5x4.4

18x37.5x7

TRAY N/A

18x37.5x4.4

18x37.5x7

18x37x16

35.5x35.5x16.5

36.5x38x39.5

Outer carton for non dry pack Bag and Tray (no inner)

OrderiWhat isthe spac Reasonpart num

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P/N PRE‐CHAupertex Orde

2N6660 H2N6660 H2N6661 H2N7000‐G DAT9932TS‐GCL2N3‐G DCL2N3‐G DCL2N3‐G P

CL8800K63‐GCL8801K63‐GDN2535N3‐GDN2535N3‐GDN2540N3‐GDN3545N8‐GDN3545ND DN3545ND

HV20220FG‐GHV20220FG‐GHV20220PJ‐GHV20220PJ‐GHV20822FG‐GHV214FG‐G HV2201FG‐GHV2201PJ‐G HV2301FG‐GHV230GA‐G HV2601BD MHV2701BD MHV2701FG‐GHV2809K6‐G HV509K6‐G HV518P‐G SHV518PJ‐G M

Number C: Microchipash (-).

ge: consistet.

ANGE ring P/N 043 365 029 D596 G S372 D591 D602 P002 G M935 G M935 G P003 G P013 G P003 G D561 D560 D561 G M931 SM270

G M904 G S323 G M931 S337 M931 M904 M931 M918 M936 M936 M931 M937 M932 S313 M903

Change p will remov

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PNEW

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HHH

H

H

H

HH

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ompatibility

P/N POST‐CHMicrochip Or2N6660‐H02N6660‐H32N6661‐H02N7000‐G‐DAT9932TS‐GCL2N3‐G‐DCL2N3‐G‐DCL2N3‐G‐P

CL8800K63‐GCL8801K63‐GDN2535N3‐GDN2535N3‐GDN2540N3‐GDN3545N8‐GDN3545ND‐DN3545ND‐

HV20220FG‐GV20220FG‐G‐HV20220PJ‐GHV20220PJ‐GHV20822FG‐GHV214FG‐G‐HV2201FG‐G‐HV2201PJ‐G‐HV2301FG‐G‐HV230GA‐G‐HV2601BD‐MHV2701BD‐MHV2701FG‐G‐HV2809K6‐G‐HV509K6‐G‐HV518P‐G‐SHV518PJ‐G‐M

ces with the

with Micro

HANGE rdering P/N043 365 029 D596 ‐S372 D591 D602 P002 ‐M935 ‐M935 G‐P003 G‐P013 G‐P003 G‐D561 D560 D561 G‐M931 ‐SM270 ‐M904 G‐S323 G‐M931 ‐S337 ‐M931 ‐M904 ‐M931 ‐M918 M936 M936 ‐M931 ‐M937 M932 S313 M903

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CN1403_addendum_J

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HHHH

H

HHHHHHH

HHHHH

H

P/N PRE‐CHAupertex OrdeHV5308DJ‐B

HV5308PG‐B‐GHV5308PJ‐B‐GHV5522K7‐GHV5523K7‐G HV5622K7‐GHV5623K7‐G HV57009PG‐GHV5812PJ‐G HV7350K6‐G HV850MG‐GHV850X S3

HV9110NG‐G HV9120NG‐GHV9123NG‐GHV9123NG‐GHV9803BLG‐GHV9803LG‐GHV9901NG‐GHV9910BLG‐GHV9910BLG‐GHV9910BNG‐GHV9910BNG‐GHV9910CNG‐GHV9911NG‐GHV9911NG‐GHV9912NG‐GHV9912NG‐GHV9931LG‐GHV9961NG‐GHV9961NG‐GHV9963NG‐GHV9963NG‐GHV9963NG‐G HV9980WG‐GHV9982K6‐G HV9982K6‐G HV9989K6‐G LND150N3‐G

ANGE ring P/N M903 G M919 G M903 G S344 M933

G S343 M933 G S236 M904 M937

G S329 329 SM267

G M901 G M901 G M934 G S376 G S374 G M901 G S363 G S373 G M901 G M934 G M934 G M901 G M934 G M901 G M934 G S350 G M901 G M934 G M901 G M934 SM359 G S345 M935 SM370 M935

G P002

PNEW

HH

H

HH

H

HHHHH

HHHHHHHHHH

HHHHHHHHH

P/N POST‐CHMicrochip OrHV5308DJ‐B‐V5308PG‐B‐GHV5308PJ‐B‐GHV5522K7‐GHV5523K7‐G‐HV5622K7‐GHV5623K7‐G‐HV57009PG‐GHV5812PJ‐G‐HV7350K6‐G‐HV850MG‐GHV850X‐S3

HV9110NG‐G‐HV9120NG‐GHV9123NG‐GHV9123NG‐GHV9803BLG‐GHV9803LG‐GHV9901NG‐GHV9910BLG‐GHV9910BLG‐GHV9910BNG‐GHV9910BNG‐GHV9910CNG‐GHV9911NG‐GHV9911NG‐GHV9912NG‐GHV9912NG‐GHV9931LG‐GHV9961NG‐GHV9961NG‐GHV9963NG‐GHV9963NG‐GHV9963NG‐G‐HV9980WG‐GHV9982K6‐G‐HV9982K6‐G‐SHV9989K6‐G‐LND150N3‐G

HANGE rdering P/N‐M903 G‐M919 G‐M903 G‐S344 ‐M933 G‐S343 ‐M933 G‐S236 ‐M904 ‐M937 G‐S329 329 ‐SM267 ‐M901 ‐M901 ‐M934 G‐S376 G‐S374 ‐M901 G‐S363 G‐S373 G‐M901 G‐M934 G‐M934 ‐M901 ‐M934 ‐M901 ‐M934

G‐S350 ‐M901 ‐M934 ‐M901 ‐M934 ‐SM359 G‐S345 ‐M935 SM370 ‐M935 G‐P002

PCCN1403_addendum_J

June2014

Su

MMMM

P/N PRE‐CHAupertex OrdeLND150N3‐GLND150N3‐GLND150N3‐GLR645N3‐G LR645N3‐G LR745N3‐G LR745N3‐G LR8N3‐G P

MD0105K6‐GMD1711FG‐GMD1711K6‐GMD1715K6‐GPS10NG‐G MTC6320K6‐GTC6320TG‐GTC6320TG‐GTC8020K6‐G TD9944TG‐GTN0104N3‐GTN0104N3‐GTN0106N3‐GTN0106N3‐GTN0110N3‐GTN0604N3‐GTN0604N3‐GTN0610N3‐GTN0610N3‐GTN0620N3‐GTN0620N3‐GTN0620N3‐GTN1504ND TN2124K1‐GTN2510N8‐GTN2540N3‐GTN5325N3‐GTN5335K1‐GTP0606N3‐GTP0606N3‐GTP2104N3‐G

ANGE ring P/N G P003 G P013 G P014 P003 P013 P003 P013

P003 G M932 G M931 G M933 G M935 M905 D626

G D607 G D626 M937

G D590 G P003 G P014 G P003 G P013 G P002 G P005 G P013 G P003 G P013 G D163 G P002 G P014 D562 G D545 G D592 G P002 G P002 G D589 G P002 G P003 G P003

PNEW

MMMM

T

T

T

P/N POST‐CHMicrochip OrLND150N3‐GLND150N3‐GLND150N3‐GLR645N3‐G‐LR645N3‐G‐LR745N3‐G‐LR745N3‐G‐LR8N3‐G‐P

MD0105K6‐GMD1711FG‐GMD1711K6‐GMD1715K6‐GPS10NG‐G‐MTC6320K6‐G‐TC6320TG‐G‐TC6320TG‐G‐TC8020K6‐G‐TD9944TG‐GTN0104N3‐GTN0104N3‐GTN0106N3‐GTN0106N3‐GTN0110N3‐GTN0604N3‐GTN0604N3‐GTN0610N3‐GTN0610N3‐GTN0620N3‐GTN0620N3‐GTN0620N3‐GTN1504ND‐TN2124K1‐G‐TN2510N8‐GTN2540N3‐GTN5325N3‐GTN5335K1‐G‐TP0606N3‐GTP0606N3‐GTP2104N3‐G

HANGE rdering P/NG‐P003 G‐P013 G‐P014 ‐P003 ‐P013 ‐P003 ‐P013 P003 ‐M932

G‐M931 ‐M933 ‐M935 M905 ‐D626 ‐D607 ‐D626 ‐M937 ‐D590

G‐P003 G‐P014 G‐P003 G‐P013 G‐P002 G‐P005 G‐P013 G‐P003 G‐P013 ‐D163

G‐P002 G‐P014 D562 ‐D545 ‐D592

G‐P002 G‐P002 ‐D589 ‐P002 ‐P003 ‐P003

PCCN1403_addendum_J

June2014

Su

P/N PRE‐CHAupertex OrdeTP2540N3‐GTP5335K1‐GVN0104N3‐GVN0106N3‐GVN0300L‐G VN0335NW VN0550N3‐GVN0606L‐G VN10KN3‐G VN10KN3‐G VN10KN3‐G VN10KN3‐G VN1206L‐G VN1210N2 VN1210ND VN2106ND VN2106NW VN2110ND VN2110NW VN2222LL‐GVN2222LL‐GVN2410L‐G VN2410L‐G VN2450ND VN2460N3‐GVN2460N3‐GVN3205N3‐GVN3205N8‐GVP0335NW VP0550N3‐GVP0550N3‐GVP1210ND VP2110K1‐GVP2206N3‐GVP2206ND VP2450ND

ANGE ring P/N G P002 D588 G P013 G P003 P002 D301

G P013 P003 P002 P003 P013 P014 P002 H212 D623 D595 D619 D491 D614

G P003 G P013 P013 P014 D621 G P003 G P014 G P002 G D576 D300

G D559 G P013 D624 D537

G P003 D613 D622

PNEW

V

P/N POST‐CHMicrochip OrTP2540N3‐GTP5335K1‐G‐VN0104N3‐GVN0106N3‐GVN0300L‐G‐VN0335NW‐VN0550N3‐GVN0606L‐G‐VN10KN3‐G‐VN10KN3‐G‐VN10KN3‐G‐VN10KN3‐G‐VN1206L‐G‐VN1210N2‐HVN1210ND‐VN2106ND‐VN2106NW‐VN2110ND‐VN2110NW‐VN2222LL‐G‐VN2222LL‐G‐VN2410L‐G‐VN2410L‐G‐VN2450ND‐VN2460N3‐GVN2460N3‐GVN3205N3‐GVN3205N8‐GVP0335NW‐VP0550N3‐GVP0550N3‐GVP1210ND‐DVP2110K1‐G‐VP2206N3‐GVP2206ND‐DVP2450ND‐D

HANGE rdering P/N‐P002 ‐D588 G‐P013 G‐P003 ‐P002 ‐D301 G‐P013 ‐P003 ‐P002 ‐P003 ‐P013 ‐P014 ‐P002 H212 D623 D595 ‐D619 D491 ‐D614 ‐P003 ‐P013 ‐P013 ‐P014 D621 G‐P003 G‐P014 G‐P002 G‐D576 ‐D300 ‐D559

G‐P013 D624 ‐D537

G‐P003 D613 D622

PCCN1403_addendum_J

June2014

PART MARKING GUIDELINE [Suppliment to PCN-1403 ADDENDUM]This chart is to be used as a general guideline only and does not include custom marking. It does not contain actual part marking on any specific product.

Supertex Package Code

(P/N Suffix)

Lead/Pin/Bump Count Package Description Pre-Change_Marking Diagram [Supertex] Pre-Change_Marking Guidelines

[Supertex] Post-Change_Marking Diagram [Microchip] Pre-Change_Marking Guidelines [Microchip]

B1 26 BCC (6x6)

P = Product CodeL = Lot NumberYY = Year SealedWW = Week Sealed___________ = RoHS Compliant● = Pin 1 Indicator

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.

BD 42 Bumped DieL = Lot NumberYYWW = Date CodeP = Product Code● = Pin 1 Indicator


DJ 44 Quad Cerpac Chip Carrier

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID* May be part of ejector pin or included as part of Top Marking* May be part of Top marketing (i.e. adjacent to the 1st row - YYWW)

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: Marking is rotated 90° CCW from original Supertex specification.Note: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.



(P/N Suffix)



48 LQFP (7x7, 1.4mm)

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking* May be part of Top marketing (i.e. adjacent to the 1st row - YYWW)


100 MQFP (14x20)

YY = Year SealedWW = Week SealedP = Product CodeL = Lot NumberC = Country of OriginA = Assembler ID______ = RoHS Compliant


G1 26 LLGA (6x6)



GA 25 / 26 FPBGA



FG



(P/N Suffix)



HF 128 TQFP (w/Heat Slug)

P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedC = Country of OriginA = Assembler ID___________ = RoHS Compliant


3X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code

5X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code

K4 3 DPAK (TO-252)

P = Product CodeL = Lot NumberYY = Year SealedWW = Week Sealed___________ = RoHS Compliant

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.

K5 3 SOT-23

P = Product CodeL = Lot NumberY = Last Digit of Year SealedWW = Week Sealed___________ = RoHS CompliantNote: SPACING in between "YWW" and "LLLL" could be omitted due to space constraint


P = Product CodeY = Last Digit of Year SealedW = Code for Week Sealed___________ = RoHS Compliant

K1 / T SOT-23 (TO-236AB)



(P/N Suffix)



K6 8 VDFN (4x4)

P = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator


K6 8 VDFN (5x5)

P = Product CodeL = Lot NumberYY = Year SealedWW = Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator


K6 10 VDFN (3x4)



K6 12 VDFN (4x4)



K6 18 VDFN (5x5)



K6 12 VQFN (4x4)





(P/N Suffix)



K6 16 VQFN (3x3)



K6 16 VQFN (4x4)



K6 24 VQFN (4x5)

P = Product CodeL = Lot NumberY = Code for Year SealedW = Code for Week SealedA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator


K6 32 VQFN (5x5)



K6 33 VQFN (6x6)



K6 40 VQFN (6x6)





(P/N Suffix)



K6 48 VQFN (7x7)



K6 56 VQFN (8x8)



K6 64 VQFN (9x9)



K6 80 VQFN (11x11)



K7 8 WDFN (3x3)


X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.

K7 10 WDFN (3x3)





(P/N Suffix)



K7 10 WDFN (4x4)



K7 19 WDFN (7x5)



K7 12 WQFN (3x3)



K7 16 WQFN (3X3)



K7 32 WQFN (5x5)



K7 32 WQFN (6x6)





(P/N Suffix)



K7 40 WQFN (5x5)



K7 44 WQFN (7x7)



L / LL 3 TO-92P = Product CodeYY = Year SealedWW = Week Sealed___________ = RoHS Compliant

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code

6 LFGA (3x3)



22 LFGA (5x7)



64 LFGA (7x7)



LA



(P/N Suffix)



64 LFGA (7x7)



78 LFGA (9x9)



LG 8 SOIC (Narrow Body)

Y = Code for Year Sealed orYY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator

Y = Code for Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant

X = Product CodeY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.

8

X = Product CodeY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 Indicator

10

X = Product CodeY = Year SealedWW = Week SealedNNN = Traceability Code● = Pin 1 Indicator

MG MSOP

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator

LB

OR



(P/N Suffix)



N2 3 TO-39 (Metal Can)P = Product CodeYY = Year SealedWW = Week Sealed


N3 3 TO-92

P = Product CodeYY = Year SealedWW = Week Sealed___________ = RoHS Compliant

For LR SeriesP = Product CodeY = Last Digit of Year SealedW = Code for Week SealedL = Lot Number___________ = RoHS Compliant


N5 3 TO-220P = Product CodeYY = Year SealedWW = Week Sealed___________ = RoHS Compliant


N8 3 SOT 89 (TO-243AA)P = Product CodeY = Last Digit of Year SealedW = Code for Week Sealed___________ = RoHS Compliant

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Code

OR

For LR Series

Or



(P/N Suffix)



14


16


16


28


40


NG SOIC (Narrow Body)

P = Product CodeY = Last Digit of Year SealedWW = Week SealedL = Lot NumberA = Assembler IDC = Country of Origin___________ = RoHS Compliant● = Pin 1 Indicator

P PDIP

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking



(P/N Suffix)



44

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking* May be part of Top Marking

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec Symbol● = Pin 1 IndicatorNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.Note: Marking is rotated 90° CW from original Supertex specification

64


80


100


YY = Year SealedWW = Week SealedP = Product CodeL = Lot NumberC = Country of OriginA = Assembler ID______ = RoHS Compliant

PG PQFP



(P/N Suffix)



28

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.Note: Marking is rotated 90° CCW from original Supertex specification

44

X = Product CodeYY = Year SealedWW = Week SealedNNN = Traceability Codee# = Jedec SymbolNote: Marking is rotated 90° CCW from original Supertex specificationNote: The JEDEC environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code.

QP 44 QSOP

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of OriginA = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking


SG 8 SOIC (Narrow Body) with Heat Slug

Y = Code for Year Sealed orYY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator

Y = Code for Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant


PJ PLCC

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of Origin**A = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking** "Space" in between Date Code & Assembler ID can be dropped in case of space limitation.Note: Bottom marking may be presented in either a horizonal or circular direction.

OR



(P/N Suffix)



TG 8 SOIC (Narrow Body) with Dual Die

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number___________ = RoHS Compliant● = Pin 1 Indicator


TS 24 TSSOP

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of OriginA = Assembler ID______ = RoHS Compliant* May be part of ejector pin


16


20


24


28


Wide Body SOIC (SOW) WG

YY = Year SealedWW = Week SealedP = Product CodeL = Lot Number*C = Country of OriginA = Assembler ID______ = RoHS Compliant* May be part of ejector pin or included as part of Top Marking

Orderi[Supplim What isstandard Reasonprocess

Ordering

AT9919KAT9933LCL320SGCL325SGCL330SGCL7SG‐GCL8800KCL8801KDN1509KHT0440KHT0440LHT0740LHT18LG‐HT19LG‐HV100K5HV101K5HV20220HV2201PHV2809KHV300LGHV310LGHV311LGHV430WHV508LGHV509K6HV5523KHV5623KHV5812PHV5812WHV6810WHV7350K

ng Part Nment to PC

changingds for tape

n for changvariation.

g Part Numbe

K7‐G LG‐G G‐G G‐G G‐G K63‐G‐M935 K63‐G‐M935 K1‐G K6‐G LG‐G LG‐G ‐G ‐G 5‐G 5‐G 0PJ‐G‐M904 PJ‐G‐M904 K6‐G‐M937 G‐G G‐G G‐G WG‐G G‐G 6‐G‐M932 K7‐G‐M933 K7‐G‐M933 PJ‐G‐M904 WG‐G WG‐G K6‐G‐M937

Number DCN-1403 AD

: Standardiand reel qu

ge: Improve

er PKG SUFFIX K7‐G LG‐G SG‐G SG‐G SG‐G SG‐G K6‐G K6‐G K1‐G K6‐G LG‐G LG‐G LG‐G LG‐G K5‐G K5‐G PJ‐G PJ‐G K6‐G LG‐G LG‐G LG‐G WG‐G LG‐G K6‐G K7‐G K7‐G PJ‐G WG‐G WG‐G K6‐G

Detail for DDENDUM

ize the Basuantitys (oth

e operationa

PKG DESCR

8L (3x3) DF8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N33L (6x6) Q33L (6x6) Q5L SOT‐2310L (3x4) D8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N3L SOT‐2233L SOT‐22328L PLCC 28L PLCC 56L (8x8) Q8L SOIC (N8L SOIC (N8L SOIC (N20L SOIC (W8L SOIC (N32L (5x5) Q44L (7x7) Q44L (7x7) Q28L PLCC 28L SOIC (W20L SOIC (W56L (8x8) Q

Tape & RM]

se Quantity her packing

al efficienci

RIPTION

FN arrow Body)arrow Body) arrow Body) arrow Body) arrow Body) QFN QFN

DFN arrow Body)arrow Body)arrow Body)arrow Body)3 3

QFN arrow Body)arrow Body)arrow Body)Wide Body) arrow Body)QFN QFN QFN

Wide Body) Wide Body) QFN

Reel BQM

Multiple (Bg media typ

es and cyc

w/Heat Slugw/Heat Slugw/Heat Slugw/Heat Slug

PC

M Change

BQM) to Micpes are una

cle times by

BQM PRCHANG3000 2500 2500 2500 2500 2500 2000 2000 2500 3000 2500 2500 2500 2500 2500 2500 500 500 2000 2500 2500 2500 1000 2500 2500 2000 2000 500 1000 1000 2000

CN1403_addendum_J

es

crochip affected).

y reducing

RE E

BQM PCHAN330330330330330330300300300330330330330330400400750750300330330330160330330300300750160160300

June2014

POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0 0 00 00 00 00 00 00 00 00 00 0 00 00 00

Ordering

HV7800KHV7801KHV809LGHV809SGHV816K6HV823LGHV825LGHV830LGHV852K7HV853K7HV857K7HV857LKHV859K7HV892K7HV9110NHV9120NHV9123NHV9123NHV9150KHV9801AHV9803BHV9803BHV9803LHV9803LHV9861AHV9901NHV9910BHV9910BHV9910BHV9910BHV9910BHV9910CHV9910CHV9910CHV9911NHV9911NHV9912NHV9912NHV9918KHV9919B

g Part Numbe

K1‐G K1‐G G‐G G‐G 6‐G G‐G G‐G G‐G 7‐G 7‐G 7‐G K7‐G 7‐G 7‐G NG‐G‐SM267 NG‐G‐M901 NG‐G‐M901 NG‐G‐M934 K6‐G ALG‐G BLG‐G BLG‐G‐S376 LG‐G LG‐G‐S374 ALG‐G NG‐G‐M901 BLG‐G BLG‐G‐S363 BLG‐G‐S373 BNG‐G‐M901BNG‐G‐M934CLG‐G CNG‐G‐M934CSG‐G NG‐G‐M901 NG‐G‐M934 NG‐G‐M901 NG‐G‐M934 K7‐G BK7‐G

er PKG SUFFIX K1‐G K1‐G LG‐G SG‐G K6‐G LG‐G LG‐G LG‐G K7‐G K7‐G K7‐G K7‐G K7‐G K7‐G NG‐G NG‐G NG‐G NG‐G K6‐G LG‐G LG‐G LG‐G LG‐G LG‐G LG‐G NG‐G LG‐G LG‐G LG‐G

NG‐G NG‐G

LG‐G NG‐G

SG‐G NG‐G NG‐G NG‐G NG‐G K7‐G K7‐G

PKG DESCR

5L SOT‐235L SOT‐238L SOIC (N8L SOIC (N16L (4x4) Q8L SOIC (N8L SOIC (N8L SOIC (N10L (3x3) D10L (3x3) D8L (3x3) DF8L (3x3) DF8L (3x3) DF10L (4x4) D14L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L (3x3) Q8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N16L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N16L SOIC (N16L SOIC (N8L SOIC (N16L SOIC (N8L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N8L (3x3) DF8L (3x3) DF

RIPTION

arrow Body)arrow Body) QFN arrow Body)arrow Body)arrow Body)DFN DFN FN FN FN DFN Narrow BodyNarrow BodyNarrow BodyNarrow BodyQFN arrow Body)arrow Body)arrow Body)arrow Body)arrow Body)arrow Body)Narrow Bodyarrow Body)arrow Body)arrow Body)Narrow BodyNarrow Bodyarrow Body)Narrow Bodyarrow Body) Narrow BodyNarrow BodyNarrow BodyNarrow BodyFN FN

w/Heat Slug

y) y) y) y)

y)

y) y)

y) w/Heat Slugy) y) y) y)

PC

BQM PRCHANG2500 2500 2500 2500 3000 2500 2500 2500 3000 3000 3000 3000 3000 3000 2500 1000 1000 2500 3000 2500 2500 2500 2500 2500 2500 1000 2500 2500 2500 1000 2500 2500 2500 2500 1000 2500 1000 2500 3000 3000

CN1403_addendum_J

RE E

BQM PCHAN300300330330330330330330330330330330330330260260260260330330330330330330330260330330330260260330260330260260260260330330

June2014

POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

Ordering

HV9925SHV9930LHV9931LHV9931LHV9961LHV9961NHV9961NHV9963NHV9963NHV9963NHV9967BHV9971LHV9972LHV9973LLND01K1LP0701LLP1030DLR12LG‐GLR645LGMD0100MD0105MD0107MD1210MD1211MD1213MD1711MD1810MD1811MD1812MD1813MD1820MD1821MD1822MD1823PS10NG‐SR036SGSR037SGSR086SGSR087SGSR10LG‐G

g Part Numbe

SG‐G LG‐G LG‐G LG‐G‐S350 LG‐G NG‐G‐M901 NG‐G‐M934 NG‐G‐M901 NG‐G‐M934 NG‐G‐SM359 BK7‐G LG‐G LG‐G LG‐G 1‐G G‐G DK1‐G G G‐G 0DK6‐G 5K6‐G‐M932 7K6‐G 0K6‐G 1LG‐G 3K6‐G 1K6‐G‐M933 0K6‐G 1K6‐G 2K6‐G 3K6‐G 0K6‐G 1K6‐G 2K6‐G 3K6‐G ‐G‐M905 G‐G G‐G G‐G G‐G G

er PKG SUFFIX SG‐G LG‐G LG‐G LG‐G LG‐G NG‐G NG‐G NG‐G NG‐G NG‐G K7‐G LG‐G LG‐G LG‐G K1‐G LG‐G K1‐G LG‐G LG‐G K6‐G K6‐G K6‐G K6‐G LG‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G K6‐G NG‐G SG‐G SG‐G SG‐G SG‐G LG‐G

PKG DESCR

8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N16L SOIC (N8L (3x3) DF8L SOIC (N8L SOIC (N8L SOIC (N5L SOT‐238L SOIC (N5L SOT‐238L SOIC (N8L SOIC (N8L (4x4) DF18L (5x5) D12L (4x4) D12L (4x4) Q8L SOIC (N12L (4x4) Q48L (7x7) Q16L (4x4) Q16L (4x4) Q16L (4x4) Q16L (4x4) Q16L (3x3) Q16L (3x3) Q16L (3x3) Q16L (3x3) Q14L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N

RIPTION

arrow Body) arrow Body)arrow Body)arrow Body)arrow Body)Narrow BodyNarrow BodyNarrow BodyNarrow BodyNarrow BodyFN arrow Body)arrow Body)arrow Body)

arrow Body)

arrow Body)arrow Body)FN (Dual Pad)DFN DFN QFN arrow Body)QFN QFN QFN QFN QFN QFN QFN QFN QFN QFN Narrow Bodyarrow Body) arrow Body) arrow Body) arrow Body) arrow Body)

w/Heat Slug

y) y) y) y) y)

)

y) w/Heat Slugw/Heat Slugw/Heat Slugw/Heat Slug

PC

BQM PRCHANG2500 2500 2500 2500 2500 1000 2500 1000 2500 2500 3000 2500 2500 2500 2500 2500 2500 2500 2500 3000 2500 3000 3000 2500 3000 2000 3000 3000 3000 3000 3000 3000 3000 3000 2500 2500 2500 2500 2500 2500

CN1403_addendum_J

RE E

BQM PCHAN330330330330330260260260260260330330330330300330300330330330330330330330330300330330330330330330330330260330330330330330

June2014

POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

Ordering

TC1550TTC2320TTC6215TTC6320KTC6320KTC6320TTC6320TTC6320TTC7920KTC8020KTC8220KTD9944TTD9944TTN2640LTP2640L

g Part Numbe

TG‐G TG‐G TG‐G K6‐G K6‐G‐D626 TG‐G TG‐G‐D607 TG‐G‐D626 K6‐G K6‐G‐M937 K6‐G TG‐G TG‐G‐D590 LG‐G LG‐G

er PKG SUFFIX TG‐G TG‐G TG‐G K6‐G K6‐G TG‐G TG‐G TG‐G K6‐G K6‐G K6‐G TG‐G TG‐G LG‐G LG‐G

PKG DESCR

8L SOIC (N8L SOIC (N8L SOIC (N8L (4x4) DF8L (4x4) DF8L SOIC (N8L SOIC (N8L SOIC (N12L (4x4) D56L (8x8) Q12L (4x4) D8L SOIC (N8L SOIC (N8L SOIC (N8L SOIC (N

RIPTION

arrow Body) arrow Body) arrow Body) FN (Dual Pad)FN (Dual Pad)arrow Body) arrow Body) arrow Body) DFN QFN DFN arrow Body) arrow Body) arrow Body)arrow Body)

(Dual) (Dual) (Dual) ) ) (Dual) (Dual) (Dual)

(Dual) (Dual)

PC

BQM PRCHANG2000 2000 2000 3000 3000 2000 2000 2000 3000 2000 3000 2000 2000 2500 2500

CN1403_addendum_J

RE E

BQM PCHAN330330330330330330330330330300330330330330330

June2014

POST NGE 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

product change notification - anglia.com adde… · product change notification ... plcc 28...

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