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2017 IEEE InternationalElectron Devices Meeting

December 2nd – 6th, 2017

Hilton San Francisco Union SquareSan Francisco, California

Focused Call for Papers

IEDM is pleased to announce increasedtechnical focus in the area of:

Process & ManufacturingTechnology

Topics

Papers are solicited on technical innovations relating all processes and manufacturing technologies, covering:

FEOL and MOL, including technologies of substrates and isolation, channel materials, lithography, self‐ assembly, deposition, etching, high-k and metal gate, shallow junctions, silicides and contacts

BEOL, including conductor, barrier metal, low-k dielectric, plug and via, planarization, MIM capacitors, and 3D/2.5D packaging

3D integration, additive manufacturing for photonics‐ electronics integration, and reduction of variations and defects

Streamlined Paper Submission

Submission deadline: August 2ndSingle submission of final, four-page paper

9-CFP-iedm17-PMT-v1.ai 1 5/11/2017 4:17:34 AM