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Probe Card System for DHP Chip Testing
VXD Workshop, Wetzlar, February 4-6, 2013
H. Krüger, Bonn University
Motivation
• PXD modules are sensitive to single-point-of-failure of the DHP
• Up to know very little statistics of the DHP yield (+ flip chip mounting to wirebond adapters with low yield only)
• Need to qualify ICs before flip-chip mounting
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn 2
DHP
To/from DCD (86 CMOS/HSTL)
To/from DHH (9x LVDS)
To Switcher (4x LVDS)
4 x LVDS
Gb
it T
X
4x
LVD
S
4x
JTA
G
18
x C
MO
S
64
x H
STL
4x
JTA
G
DHP Chip Probing Prerequisites
• What is needed:
– Needle card for solder bump probing
– Test bench for DHP environment
• IO signals from test system (DHH like)
• DCD input/output emulation
– Test procedure to provide full coverage
– Definition of cut parameters for chip classification
• Design is based on DHP 0.2
• DHPT 1.x will be pin compatible to DHP 0.2
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn 3
Probe Station
DHP Chip Probe Test System
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn
DHP test system
(XUPV5 FPGA Board)
Needle Card PCB
Probe Needles
FPGA
DCD emulation
Sequencer r/b
Power Supply
DHP
DA
C
Infiniband
Eth
GPIB or USB
JTAG
4
• 159 bumps need to be connected
• Material: lead free, LTS
• Pitch: 200µm (y), 180µm (x)
• ~110µm diameter
• Connections: – JTAG (4x LVDS)
– Timing (4x LVDS)
– Data Link (1x CML)
– Aux clock (2x LVDS)
– SWITCHER (4x LVDS)
– DCD out (8x 8 HSTL)
– DCD in (8x 2 CMOS)
– DCD timing (2x CMOS)
– DCD JTAG
– DCD_ref (analog)
– Power (8x VSS, 4x VDD, 2x VDD_CML)
– PLLxx2Fast
– FrameSync
– ResetB (CMOS)
– Analog IO test signals
20
0µ
m
180µm
36
85
µm
3685µm
bumps to connect: 159 out of 296
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn -4
-3
-2
-1
0
0 1 2 3
Tho
usa
nd
s
Thousands
5
DHP test system
FPGA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
1 A no bump 180
0
540 0
900
0
1260 0
1620
0
1980 0
2340
0
2700 0
2 B 0
100
360 100
720 100
1080 100
1440 100
1800 100
2160 100
2520 100
3 C 180 200
540 200
900 200
1260 200
1620 200
1980 200
2340 200
2700 200
4 D 0
300
360 300
720 300
1080 300
1440 300
1800 300
2160 300
2520 300
5 E 180 400
540 400
900 400
1260 400
1620 400
1980 400
2340 400
2700 400
6 F 0
500
360 500
720 500
1080 500
1440 500
1800 500
2160 500
2520 500
7 G 180 600
540 600
900 600
1260 600
1620 600
1980 600
2340 600
2700 600
8 H 0
700
360 700
720 700
1080 700
1440 700
1800 700
2160 700
2520 700
9 J 180 800
540 800
900 800
1260 800
1620 800
1980 800
2340 800
2700 800
10 K 0
900
360 900
720 900
1080 900
1440 900
1800 900
2160 900
2520 900
11 L 180
1000
540 1000
900
1000
1260 1000
1620 1000
1980 1000
2340 1000
2700 1000
12 M 0
1100
360 1100
720
1100
1080 1100
1440 1100
1800 1100
2160 1100
2520 1100
13 N 180
1200
540 1200
900
1200
1260 1200
1620 1200
1980 1200
2340 1200
2700 1200
14 O 0
1300
360 1300
720
1300
1080 1300
1440 1300
1800 1300
2160 1300
2520 1300
15 P 180
1400
540 1400
900
1400
1260 1400
1620 1400
1980 1400
2340 1400
2700 1400
16 Q 0
1500
360 1500
720
1500
1080 1500
1440 1500
1800 1500
2160 1500
2520 1500
17 R 180
1600
540 1600
900
1600
1260 1600
1620 1600
1980 1600
2340 1600
2700 1600
18 S 0
1700
360 1700
720
1700
1080 1700
1440 1700
1800 1700
2160 1700
2520 1700
19 T 180
1800
540 1800
900
1800
1260 1800
1620 1800
1980 1800
2340 1800
2700 1800
20 U 0
1900
360 1900
720
1900
1080 1900
1440 1900
1800 1900
2160 1900
2520 1900
21 V 180
2000
540 2000
900
2000
1260 2000
1620 2000
1980 2000
2340 2000
2700 2000
22 W 0
2100
360 2100
720
2100
1080 2100
1440 2100
1800 2100
2160 2100
2520 2100
23 X 180
2200
540 2200
900
2200
1260 2200
1620 2200
1980 2200
2340 2200
2700 2200
24 Y 0
2300
360 2300
720
2300
1080 2300
1440 2300
1800 2300
2160 2300
2520 2300
25 Z 180
2400
540 2400
900
2400
1260 2400
1620 2400
1980 2400
2340 2400
2700 2400
26 AA 0
2500
360 2500
720
2500
1080 2500
1440 2500
1800 2500
2160 2500
2520 2500
27 AB 180
2600
540 2600
900
2600
1260 2600
1620 2600
1980 2600
2340 2600
2700 2600
28 AC 0
2700
360 2700
720
2700
1080 2700
1440 2700
1800 2700
2160 2700
2520 2700
29 AD 180
2800
540 2800
900
2800
1260 2800
1620 2800
1980 2800
2340 2800
2700 2800
30 AE 0
2900
360 2900
720
2900
1080 2900
1440 2900
1800 2900
2160 2900
2520 2900
31 AF 180
3000
540 3000
900
3000
1260 3000
1620 3000
1980 3000
2340 3000
2700 3000
32 AG 0
3100
360 3100
720
3100
1080 3100
1440 3100
1800 3100
2160 3100
2520 3100
33 AH 180
3200
540 3200
900
3200
1260 3200
1620 3200
1980 3200
2340 3200
2700 3200
34 AJ 0
3300
360 3300
720
3300
1080 3300
1440 3300
1800 3300
2160 3300
2520 3300
35 AK 180
3400
540 3400
900
3400
1260 3400
1620 3400
1980 3400
2340 3400
2700 3400
36 AL 0
3500
360 3500
720
3500
1080 3500
1440 3500
1800 3500
2160 3500
2520 3500
37 AM 180
3600
540 3600
900
3600
1260 3600
1620 3600
1980 3600
2340 3600
2700 3600
• Bump coordinates in µm
• Origin in upper left corner
• No bump at location (0,0)
• Bumps with no needle connection shown in gray
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn 6
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn
DHP 0.2 Layout Examples from vendor
8
Debug Probe Card
• PCB with active components, will need some debugging
• Very sensitive with needles attached
Dedicated debug “Probe” Card
• (almost) same netlist as needle card PCB
• replace needle footprint with DHP 0.2 wire bond adapter
Debug PCB is ready and tested
• DHP communication
• FPGA programming (DCD emulation, Switcher sequencer read-back)
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn
Debug Probe Card
9
Needle Card PCB
Specs
• 6 layer PCB
• 3mm thick mechanical stiffness
Status
– PCB Design & Production
– Component mounting
– Testing
– Needle mounting
• needs ~4 weeks (@ HTT)
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn
Needle Probe Card (w/o needles)
10
Probe Station Setup
• Needle card fixture
• We have diced chips only
– put single chips on chuck (Ok for now)
– “chess board” fixture with array of cavities for production testing tbd
• External components:
– Power supply
– DHP test system (FPGA board via Infiniband cables)
– extra JTAG for on board FPGA programming/readback , optional: can use JTAG from Infiniband connection
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn 11
Probe Card System Status
• Hardware components of the needle card test system
– Debug probe card for HW verification and debugging
– Needle probe card: components mounted and tested, shipped for needle mounting end of January (takes ~4 weeks)
– Mechanical fixture for probe station
• Software
– based on DHP test system from Mikhail ()
– needs further extensions (for basic testing ok)
• (more) systematic sequencer and DHP DAC output read-back
• automation of test sequences
• coverage…
• definition of cut parameters
• …
• Planning
– Start commissioning of the needle card system by end of Feb
– First (rudimentary) tested DHP chips supposed to be available in March
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn 12
DHP Chip Availability
• Only small number of DHP 0.2 chips left (~15)
• Next chip version (DHPT 1.0) available by mid 2013
• Need certain number of tested chips for E-MCM and PXD6 large matrix assemblies
Possible scenarios:
a) DHP has high yield, enough Ok tested die for E-MCM + PXD6 (very optimistic)
no action needed
b) DHP yield not sufficient, need more chips (more likely)
i) Buy remaining MPW chips from MOSIS (rather expensive)
ii) Wait for DHPT 1.0 to become available (maybe too late)
iii) Recover unsuccessful DHP 0.2 flip chip assemblies (quite a few)
Recovery procedure
• De-solder and clean DHP chips (Valencia ?)
• Place new bumps (Heidelberg ?)
VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn 13