price circuits-2015
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Price Circuits LLC A Division of Circuitronics LLC
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Price Circuits was started in 2000 offering, advanced technology, dependable quality, and responsive service, to our customers which was unheard of before in the Chicago area. In 2007 Price Circuits was acquired by Circuitronics LLC and is now a division of Circuitronics. We invite all of our customers to inspect our facility and discuss how we can help you succeed.
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We are a certified minority owned business.
We are a self certified small business.
We are a self certified small disadvantage business.
We are ISO 9001:2008 certified.
We are UL certified to a variety of materials.
We are ITAR certified M23491.
We were awarded best PCB manufacturer in Illinois
2009, 2010 & 2013.
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• Wheaton & Elgin, IL USA
– ISO 9001:2008, UL, & ITAR Certifications
– Prototype thru Medium Volume Production
– IPC Class 3 , HDI, Flex up to 12 layers, Rigid flex up to 18 layers, Rigid boards up to 34 layers.
– RoHS Compliant, All surface finishes, All types of materials, Blind & buried vias, Impedance Control.
• Bangalore, India
– ISO 9001:2008, TS16949 & UL Certifications
– Single and double sided boards, Medium to High volume production, Punch & Die facility
• Taipei, Taiwan
– ISO 9001:2008, ISO-14001, QS-9000 & UL Certifications
– Medium to high volume production, Vast capabilities, Up to 30 layers, Blind & buried vias, HDI, Controlled Impedance, RoHS
• Shenzhen, China
– ISO 9001:2008 & UL Certifications
– Medium to High Volume Manufacturing, Vast Capabilities, Up to 8 layers, RoHS.
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• Build-up Technology – blind/buried vias and laser vias
• Rigid up to 34 Layers – impedance control
• Teflon and High Performance Materials
• Hybrid – FR4 with Rogers, PTFE, Polyimide, and BT
• Flex up to 12 Layers & Rigid Flex up to 18 Layers
• Berquist materials with aluminum or copper backing.
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• With UV/YAG laser drill technology, we can produce
micro vias down to sub lamination three. Providing the
highest degree of density and allowing for greater flexibility
in routing dense circuitry.
• Blind and buried vias created using build-up technology.
In combination with laser drilled micro-vias, we can
provide your engineers with the most complex high density
circuits.
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• Electrolytic Nickel Hard Gold selective or full body
• Electrolytic Nickel Soft Gold full body wire-bondable gold
• ENIG (electroless nickel and immersion gold) – selective or full body
• Immersion Silver
• Immersion White Tin
• HASL
• Lead Free HASL
• Entek HT OSP
• Carbon Ink
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Criteria 2015 2016
Line/Space Min. .002” < .002”
Mech. Drill Size Min. .005” .004”
Laser Drill Size Min. .002” < .002”
Max. Aspect Ratio (Mech.) 15:1 17:1
Plating from hole to surface +/- .0002 +/- .0001
Plated Hole Tolerance +/- .002 +/- .001
Max. Board Thickness .310” .325”
Min. Dielectric Thickness .0015” .001”
Max. Layer Count 34 36
Solder Mask Registration +/- .002” +/- .0015”
Max. Copper Thickness 6oz planes/4oz signals 7oz planes/6oz signal
Min. Copper Thickness (Outers) 5 micron 3 micron
Min. Copper Thickness (Inners) 1/8 oz. 3 micron
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Process Capability
2014 2015 2016
Material
FR 4 Tg135 ~ Tg200
Halogen Free FR-4
Aluminum/Copper
FR 4 Tg135 ~ Tg200
Halogen Free FR-4
Aluminum/Copper
FR 4 Tg135 ~ Tg200
Halogen Free FR-4
Aluminum/Copper
Min. Dielectric Thickness 2 mil 2 mil 2 mil
Max. Layer Count 38 40 42
Max. Board Size 22“x29” 22“x29” 22“x29”
Max. Board Thickness .250“ .250“ .250“
Min. Board Thickness .016“(6L) .007”(2L)
.016“(6L)
.006”(2L) .016“(6L) .006”(2L)
Min. Line/Space
I/L 2.4/2.4 Mil 2.0/2.4 Mil 2.0/2.0 Mil
O/L 3.0/3.0 Mil 2.4/3.0 Mil 2.4/2.4 Mil
Warp .005“/in. .005“/in. .005“/in.
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Process
Capability
2014 2015 2016
Min. SMD Width 8 mil 6 mil 6 mil
Layer to Layer Registration 4 mil 4 mil 4 mil
Min.
FHS
Mechanical Drill .005“ .004“ .004“
LASER Drill .003“ .003“ .003“
True Hole Position +/-.002“ +/-.002“ +/-.002“
Finish Hole Size Tolerance
PTH +/-.002“ +/-.002“ +/-.002“
Non-PTH +/-.001 +/-.001 +/-.001
Aspect Ratio (Board Tks /FHS) 16 17 18
Heavy Copper
Inner Layer 12 OZ 12 OZ 12 OZ
Outer Layer 6 OZ 7 OZ 8 OZ
Off Shore Process Capability
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Process Capability
2014 2015 2016
Buried/Blind Via 3+N+3
VIP-C & VIP-N
Stacked via
3+N+3
VIP-C & VIP-N
Stacked via
3+N+3
VIP-C & VIP-N
Stacked via
Back Drill Capability Yes Yes Yes
Outline Tolerance +/-.004“ +/-.004“ +/-.004“
Surface Finish HASL
ENIG
ENEPIG
Immersion Silver
OSP
Carbon
Immersion Tin
Electro Tin
Selective Gold
Full Body Gold
Peelable S/M
HASL
ENIG
ENEPIG
Immersion Silver
OSP
Carbon
Immersion Tin
Electro Tin
Selective Gold
Full Body Gold
Peelable S/M
HASL
ENIG
ENEPIG
Immersion Silver
OSP
Carbon
Immersion Tin
Electro Tin
Selective Gold
Full Body Gold
Peelable S/M
Controlled Impedance +/-10% +/-10% +/-8%
Off Shore Process Capability
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• Quality – AOI, Inspection, and Test
• ISO Certified 9001:2008 Certificate # A2424US
• ITAR Certified #23491
• UL Certified #E58645
• 100% AOI Inner & Outer Layers– Camtek Orion
• 100% Electrical Test –3 Hioki 1116 Flying Probe
• X-ray fluorescence
• Automated Analysis – Wet Processes
• Smart Drill and X-ray Verification Provides for the highest
degree of accuracy in registration of build-up technologies.
• IPC Class I, II, III Compliant
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X-Ray Florescence System
Hioki Flying Probe Tester
Camtek AOI
.
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ESI UV/YAG Laser Drill Class 10K clean room OEM Press Systems press
Automatic Vertical Plating Lines ESI 6 spindle drilling machine
• Wayne Price Phone: (815) 861-6301 E-mail: [email protected]
• Valerie Bly Phone: (630) 415-5830 E-mail: [email protected]
• Shelley Lara Phone: (630) 429-4126 E-mail: [email protected]
• Send all requests to: [email protected]
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