présentation powerpoint

© 2009

Copyrights © Yole Développement SARL. All rights reserved.

Nokia

Memory Applications:Packaging & Integration Trends

– 2009 Report –

How 3-D integration will challenge

and reshape the memory industry

Infineon

© 2009 • 2Copyrights © Yole Développement SARL. All rights reserved.

Macro Industry Trends

• Wireless is everywhere, growing and enabling new market segments (smart-

phones, net books, pocket computing devices)

– CONNECTIVIY and INTEGRATION are the main drivers

• Demands for data is increasing as well:

– Faster pipes, more pipes (WAN, LAN, PAN), performance, concurrency

– HD multimedia is coming

• Complexity and concurrency require improved power consumption and are

stressing current architectures:

– Need for more efficient interconnect methods for pin count relief and low power

consumption

• As a results, everything is pointing to more and more “local” memory/storage

at the device level

– More and more quantity and get memory closer to logic for higher performance

– Cloud computing could remove the need for increasing “memory storage” content at

the device level. However, this will not happen before many years from now (> 2015)


Memory BOM growth forecast in Mobile Handsets

• Memory content grows even while other Semiconductor content falls

– Driven by growing Density requirements

• Memory revenue CAGR 2007-2011 ~ 5.1%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

2006 2007 2008 2009 2010 2011

Worldwide Mobile Phone Semiconductor Revenue Share by Type of Content

Image processor

Apps processors and coprocessors

Onboard Memory (Flash/PSRAM/MDRAM)

Radio/connectivity

Baseband (Digital + Analog)

Source: IDC 2007

22%

28%


Memory Applications / Markets

TODAY:

• RAM memories are historically driven by computing applications (desktop computers, server engines…)

• NOR Flash is mostly used to store and have fast reading access to OS data (applications of operating

systems) used in most of today‟s consumer devices (cell-phone, DSCs, portable media players, printers…)

• NAND Flash has emerged recently for storage based applications in most consumer applications

TOMOROW:

• New generation memories (PRAM, FeRAM, MRAM..) are being developed and introduced on the market for

potential replacement of NOR Flash & SRAM into embedded memory applications

• “Solid State” memory is the next killer application for adoption of NAND Flash in volume:

– SSDs to replace HDD (hard disk magnetic drives) mainly in:

• Personal computing markets (notebooks, net book, MIDs …)

• Enterprise / Data server markets

– General memory content also growing in Multimedia / Gaming / Micro-Cards applications

– New package technologies are needed to adapt to tighter footprint requirements (e.g. 3D TSV)

• RAM (SRAM / DRAM) memory integration is driven by computing / wireless Logic application:

– DDR3 / DDR4 DRAM: TSV soon require to answer to density versus bandwidth limitation

– Wireless Logic Trend is to combine into one single package all memory content in order to control:

• Multi-mode cellular communication devices (related to GSM / 3G / LTE: Analog & digital baseband chips)

• Multimedia and computing devices (related to Application processor and graphic accelerator chips)

• Wireless connectivity devices (related to Bluetooth, WLAN, GPS, NFC chips)

– Computing Logic Trend to stack high capacities of DRAM cache memories for next generation computing perf.

• CPU/GPU graphic engines applications

• HPC, Server, FPGAs…


Overall memory wafer shipment forecasts (12’’ wspy eq.)


Impact on Memory Packaging & Integration

• Memory ASPs will continue to decrease and will reach their “cost versus density” limits with latest

advancements of lithography technology (45nm, 32nm to 22nm node?)

• On the other hand, memory packaging and integration is becoming more and more challenging for

different reasons:

– NAND Flash memory quantity is increasing fast in data storage applications especially (SSDs, Micro-SD cards,

MCP/SiP/PoP packages): stringent density and form factor requirements to stack more silicon in ever less space

– NOR Flash will be progressively replaced by NAND+SRAM combination and New generation memories (e.g. PC-RAM)

– RAM based memories:

• Memory integration of RAM memories (on-chip, in-package…) is growing fast: DRAM product usage is mostly

doubling Year to Year, especially in mobile / nomadic devices

• Interfacing Logic to external DRAM is more and more difficult due to increasing requirements on bandwidth,

performance, power consumption and pin-counts accessibility:

– Possibility for Fan-out WLP integration in some portion of the low-end DRAM market

– Integration of DRAM in stacked memories SiP packages (FC-BGAs, POP…): new package & interconnect

technologies are needed to adapt to tighter footprint requirements (e.g. 3-D TSV interconnects)

– Embedded RAM:

o Embedded DRAM is already available today, but still “emerging”

Driven by performance motivations („CPU + memory‟ or „Baseband + memory‟ that are stacked in a

face to face manner)

eDRAM with TSVs are coming soon (> 2010) and will enable higher performance and bandwidth first

and will provide later on direct access / interfacing to the external “cache memory” SiP package

o Managing internal SRAM memory in Wireless Logic SOC applications is still possible but die sizes

are expanding with time: cost impact is becoming more and more critical

Efficient re-partioning of memory content will be needed at some point:

• Embedded memories holds promising future by stacking both eDRAM and eFlash on top of 3D-

SOCs for Cost driven motivations

• Not yet area/cost effective but coming soon!


3-D integration of memories with TSV

Example of 3-D integrated construction (Image courtesy of DuPont Electronics)

PCB


3D TSV memory wafer shipments per Industry:

2013 forecast


Report - Table of Content (1/2)

• Introduction to memory technologies …. Page 1

– DRAM / SRAM / NOR Flash / NAND Flash

• Overall memory shipment market (in Units)

• Overall memory market revenues (in $B)

– Trends for next generation Non-Volatile memory

technologies:

• M-RAM / PC-RAM: status of industrialization and

near-term opportunities

• Memory Applications & Markets …...……. Page 18

– Current & future applications driving DRAM / SRAM /

NAND / NOR Flash memory demand

• Per industry:

– Market forecasts in Munits shipment and in

300mm wafers equivalent

– Breakdown for Telecom / Computing /

Consumer / Servers / Automotive / Industrial

& Medical markets

• Per product / application:

– 2008-2015 market forecasts in Munits

shipment and in 300mm wafers equivalent

– Breakdown for Desktop PCs / Notebooks /

Net books / MID / Regular & Blade Servers /

Data storage servers / Portable media

players / Portable game stations / Memory

Cards / USB Stick / Cell-phones / Game

stations / Set-Top Box / HD camcorders /

DSC / SLR / Automotive / Base stations /

Portable navigation Sys – GPS / Digital TV /

Workstations / Memory Upgrades / HDD /

Printer / Analog TV / DVD Player / HPC / ATE

systems

• Memory Packaging & Integration Trends …. Page 33

– Architectures and memory die quantity analysis in current

product‟s generation:

• Focus on Cell-phones, SSDs, DSCs, servers, Portable

media players and game stations

– Single Die versus Stacked packaging:

• Key market metrics and packaging trends for memory

integration using TSOP / FBGA / PoP / PiP / WLP Fan-in /

Fan-out WLP packages

• Impact of 3-D integration technologies on the

memory market ………..…………………………..……. Page 55

– Applications and market drivers for 3D integration with

memories

– “Embedded 3D-SOC memories” Versus “3-D Stacked

memories in SiP”:

• Definitions, players and roadmaps

• 2008-2015 market forecasts in Munits shipment and in


– „‟3D Chip Stacking‟‟ Vs. „‟Circuit Transfer 3D‟‟ Vs.

„‟Monolithic 3D‟‟ integration


• 2008-2015 market forecasts in Munits shipment and in



Report - Table of Content (2/2)

• … (continued from previous slide) Impact of 3-D

integration technologies on the memory

market:

– MLC versus SLC Flash memory architectures: impact

on adoption of 3-D TSV integrated memories


• 2008-2015 market forecasts in Munits shipment

and in 300mm wafers equivalent

– Silicon interposers for 3D TSV memories:


• 2008-2015 market forecasts in Munits shipment

and in 300mm wafers equivalent

– TSV manufacturing cost challenge:

• What is the process and cost of TSV in

memories today?

• What is the targeted cost for a broad adoption

of 3-D TSV into low cost memory markets?

– Overall Roadmap for 3-D integration with Memories

(2008 – 2015)

– Impact of 3-D integration with TSV on DRAM / SRAM

/ NAND / NOR Flash memory markets

• 2008-2015 market forecasts in Munits shipment and

in 300mm wafers equivalent

• Breakdown per mount technology: forecast for

Single die / Wire Bond stacked / 3-D TSV memory

• Breakdown per application:

– Opportunities of 3-D integrated memory in

DDR3 / DDR4 / Wireless Application

processors / Wireless Baseband - DSP /

SSDs / Graphic memory / Micro-Cards /

Embedded & Cache CPU-GPU / FPGAs

• Player‟s strategy for 3-D integration with

memories ……………….…………………………………... Page 85

– Supply chain analysis: Memory fabs / CMOS

foundries / IDMs / OSATs/ Fab-less / Integrator

player activities

– Infrastructure & pre-competitive alliances in 3-D IC

system integration

• Perspectives & Conclusions ……………….……. Page 98

• Annexes ….…………………………………………………. 4


Extracted slides from the report (sample)


Key features & Benefits

• Companies cited in the report :

– AMD, Amkor, Chartered Semiconductor, Dai Nippon Printing, Dongbu HiTek, Ibiden,

IBM, IMFlash, Intel, Elpida, Excico, Freescale, Fujitsu, Hynix, Micron, Nanya, NEC,

Numonyx, Qualcomm, Renesas, TSMC, Texas Instruments, Samsung, SanDisk, Seagate,

Shinko, SOITEC / Tracit, Sony, StatsChipPac, STMicroelectronics, Spansion, SPIL,

Swissbit, Tezzaron, Toshiba, UMC, Xilinx, Ziptronix and more …

• Who should buy this report ?

– Strategy & Marketing executives from the equipment, materials or chip manufacturing

semiconductor industries who need to position rapidly about the impact of 3-D

integration on the complex, high volume and fast moving memory market.

• Key features:

– Up-to-date Key metrics of the memory market:

• Per application (more than 30 products screened)

• Per type of memory (DRAM / SRAM / NOR / NAND Flash)

• In Munits shipment and in 300mm wafer equivalent

– Impact of 3-D integration on the memory market and applications

– Key players strategy for 3D integration with memories

– Cost analysis & challenges for TSV manufacturing:

• How to make TSV interconnects happen in high volume / low cost memory markets?


Contact us!

• For more information on this report, please contact David Jourdan at:

– [email protected]

– + 33 472 83 01 80

• For more information on our activity & services:

www.yole.fr www.i-micronews.com/3DIC.asp

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