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PRESENTATION ON Scaling Of MOS Submitted by : Raviraj Kour

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Page 1: Presentation on Scaling

PRESENTATIONON

Scaling Of MOS

Submitted by :Raviraj Kour

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Contents Moore’s LawWhy Scaling?Types of ScalingShort channel EffectsNarrow Width EffectsQueries

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Moore’s Law[1]

No. of transistors on a chip doubled every 18 to 24 months.Semiconductor technology will double its effectiveness every 18 months.

Fig. 1 : No. of transistors with years

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Fig. 2 : End of Moore’s LawThapar University , PatialaTuesday, May 2, 2023 4

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Fig. 3 : Technology Evolution (1997 data)

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Why Scaling?[2]

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Design of high density chips in MOS VLSI technology requires: High packing density of MOSFETS Small transistor size

This reduction of size is k/a Scaling.

S>1 has been introduced leading to reduction of area by a factor S².

Disadvantage : Electric fields within the Gate Oxide grow larger.

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Statistics[3]

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Fig. 4 : Data showing no. of transistors on processors of Intel Corporation with Years

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Let’s Start

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Fig. 5 : MOSFET Scaling by a factor S

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Types of Scaling1. Constant field scaling or full scaling :

Magnitude of internal electric fields is kept constant. Only lateral dimensions are changed. Threshold voltage is also effected.

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Fig. 6: Full – Scaling of MOSFET

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Consequences of Constant Field Scaling :

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Fig. 7 : Change in parameters due to full scaling

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Most significant reduction : Power dissipation is reduced by a factor of S² as P´= P/S²

Power density remains unchanged.

Gate oxide capacitance is scaled down as Cg´ = Cg/S

Overall performance improvement.

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2. Constant Voltage Scaling : More preferred. All dimensions are scaled down except power supply and terminal voltages.

Fig. 8 : Parameters effected due to Constant Voltage ScalingThapar University , PatialaTuesday, May 2, 2023 12

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Cons of Constant Voltage Scaling :

Increase in drain current density and power density by a factor of S³ adversely effecting device reliability.

Causes problems like : Electro Migration Hot Carrier Degradation Gate Oxide Breakdown Electrical Over-stress

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When channel length Leff approx. equals source and junction depth xj.

Why Short Channel MOS , even if it has degraded performance ?

Threshold voltage is less. Why ?

Effects : Drain- Induced Barrier Lowering Surface Scattering Velocity Saturation Impact Ionization Hot Carrier Effect

Short Channel Effects[4]

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Fig. 9: Simplified geometry of MOSFET channel region

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Potential barrier is controlled by both VGS and VDS.

If drain voltage increases , barrier in the channel decreases , leading to DIBL.

Allows electron flow between S and D even at VGS < VTO .

A. Drain- Induced Barrier Lowering (DIBL)[5]

Fig. 10 : As channel length decreases, the barrier φB to be surmounted by an electron, from the source on its way to the drain reduces.

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B. Surface Scattering Due to SCE , electric field increases and mobility becomes field dependent. Surface scattering occurs. Average surface mobility decreases.

Fig. 11: Pictorial representation of Surface Scattering[6]

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C. Velocity Saturation

Velocity of charge carries Vs Electric Field.

Three regions.

Reduces current in Short Channel MOSFET.

Formula :

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Fig. 14 : Drift Velocity Vs Electric Field

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D. Impact Ionisation[7]

Due to high electric field which causes high velocity of electrons. Generates Electron - Hole pairs.

Fig. 15 : Impact Ionization

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E. Hot Carrier Effects

When electrons or holes gain sufficiently large energies to overcome barrier and get trapped in oxide layer.

Permanently changes MOSFET switching characteristics. Adversely effects reliability.

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Fig. 16 : Hot Electron Currents

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Narrow Channel Effects[8]

MOS having channel widths (W) approx. equals depletion region thickness (xdm) is known as Narrow – Channel MOS.

Here , Vto (narrow channel) = Vto + ΔVto (most significant)

Overlapping of Gate Oxide and FOX.

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Fig. 17 : Cross – sectional view of a narrow channel MOSFET

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References[1] lect15-scaling.ppt[2] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , pg. no. 115 , TATA MCGRAW – HILL EDITION[3] www.intel.com/research/silicon/mooreslaw.htm[4] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , pg. no. 119 , TATA MCGRAW – HILL EDITION[5] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , pg. no. 127 , TATA MCGRAW – HILL EDITION[6] EE327 Lec 30a - Surface scattering[7] Introduction to VLSI design (EECS 467) Project Short-Channel Effects in MOSFETs December 11th, 2000 Fabio D’Agostino Daniele Quercia pdf , pg. no. 3.[8] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , page no. 125 , TATA MCGRAW – HILL EDITION