presentation on scaling
TRANSCRIPT
PRESENTATIONON
Scaling Of MOS
Submitted by :Raviraj Kour
Contents Moore’s LawWhy Scaling?Types of ScalingShort channel EffectsNarrow Width EffectsQueries
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Moore’s Law[1]
No. of transistors on a chip doubled every 18 to 24 months.Semiconductor technology will double its effectiveness every 18 months.
Fig. 1 : No. of transistors with years
Fig. 2 : End of Moore’s LawThapar University , PatialaTuesday, May 2, 2023 4
Fig. 3 : Technology Evolution (1997 data)
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Why Scaling?[2]
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Design of high density chips in MOS VLSI technology requires: High packing density of MOSFETS Small transistor size
This reduction of size is k/a Scaling.
S>1 has been introduced leading to reduction of area by a factor S².
Disadvantage : Electric fields within the Gate Oxide grow larger.
Statistics[3]
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Fig. 4 : Data showing no. of transistors on processors of Intel Corporation with Years
Let’s Start
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Fig. 5 : MOSFET Scaling by a factor S
Types of Scaling1. Constant field scaling or full scaling :
Magnitude of internal electric fields is kept constant. Only lateral dimensions are changed. Threshold voltage is also effected.
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Fig. 6: Full – Scaling of MOSFET
Consequences of Constant Field Scaling :
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Fig. 7 : Change in parameters due to full scaling
Most significant reduction : Power dissipation is reduced by a factor of S² as P´= P/S²
Power density remains unchanged.
Gate oxide capacitance is scaled down as Cg´ = Cg/S
Overall performance improvement.
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2. Constant Voltage Scaling : More preferred. All dimensions are scaled down except power supply and terminal voltages.
Fig. 8 : Parameters effected due to Constant Voltage ScalingThapar University , PatialaTuesday, May 2, 2023 12
Cons of Constant Voltage Scaling :
Increase in drain current density and power density by a factor of S³ adversely effecting device reliability.
Causes problems like : Electro Migration Hot Carrier Degradation Gate Oxide Breakdown Electrical Over-stress
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When channel length Leff approx. equals source and junction depth xj.
Why Short Channel MOS , even if it has degraded performance ?
Threshold voltage is less. Why ?
Effects : Drain- Induced Barrier Lowering Surface Scattering Velocity Saturation Impact Ionization Hot Carrier Effect
Short Channel Effects[4]
Fig. 9: Simplified geometry of MOSFET channel region
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Potential barrier is controlled by both VGS and VDS.
If drain voltage increases , barrier in the channel decreases , leading to DIBL.
Allows electron flow between S and D even at VGS < VTO .
A. Drain- Induced Barrier Lowering (DIBL)[5]
Fig. 10 : As channel length decreases, the barrier φB to be surmounted by an electron, from the source on its way to the drain reduces.
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B. Surface Scattering Due to SCE , electric field increases and mobility becomes field dependent. Surface scattering occurs. Average surface mobility decreases.
Fig. 11: Pictorial representation of Surface Scattering[6]
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C. Velocity Saturation
Velocity of charge carries Vs Electric Field.
Three regions.
Reduces current in Short Channel MOSFET.
Formula :
Fig. 14 : Drift Velocity Vs Electric Field
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D. Impact Ionisation[7]
Due to high electric field which causes high velocity of electrons. Generates Electron - Hole pairs.
Fig. 15 : Impact Ionization
E. Hot Carrier Effects
When electrons or holes gain sufficiently large energies to overcome barrier and get trapped in oxide layer.
Permanently changes MOSFET switching characteristics. Adversely effects reliability.
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Fig. 16 : Hot Electron Currents
Narrow Channel Effects[8]
MOS having channel widths (W) approx. equals depletion region thickness (xdm) is known as Narrow – Channel MOS.
Here , Vto (narrow channel) = Vto + ΔVto (most significant)
Overlapping of Gate Oxide and FOX.
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Fig. 17 : Cross – sectional view of a narrow channel MOSFET
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References[1] lect15-scaling.ppt[2] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , pg. no. 115 , TATA MCGRAW – HILL EDITION[3] www.intel.com/research/silicon/mooreslaw.htm[4] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , pg. no. 119 , TATA MCGRAW – HILL EDITION[5] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , pg. no. 127 , TATA MCGRAW – HILL EDITION[6] EE327 Lec 30a - Surface scattering[7] Introduction to VLSI design (EECS 467) Project Short-Channel Effects in MOSFETs December 11th, 2000 Fabio D’Agostino Daniele Quercia pdf , pg. no. 3.[8] Cmos Digital Integrated Circuits - Sung-Mo Kang and Yusuf Leblebici.pdf , page no. 125 , TATA MCGRAW – HILL EDITION