Powering the Next Mobile Generation – An overview of UFS

Samsung Semiconductor, Inc

Memory Marketing

Panelists

• Kathy Choe Thomas | Sr. Product Marketing Manager, Samsung

• John Geldman | Director, Industry Standards, Micron Semiconductor

• Zachi Friedman | Director of Product Marketing, Arasan Chip Systems

• Perry Keller | Application and Standards Program Lead, Agilent Technologies, Inc.

• Moderator: Janine Love, UBM Tech

Source: Cisco VNI Global Forecast, 2011–2016 Joel Goergen

UFS

Propelling the Mobile Revolution

Kathy Choe Thomas

Samsung Semiconductor, Inc.

Sr. Product Mktg Mgr, NAND Flash Products

UFSA Board of Director, Marketing Committee Charirman

2012: Mobile connected devices exceeded the world's population

Units, M

1

10

100

1,000

10,000

100,000

1960 2020 1970 1980 1990 2000 2010

Mainframe

Minicomputer

PC

Wired Internet (Billion Devices)

Mobile Internet (10 Billion Devices)

Source: Morgan Stanley

10X Computing Growth Drivers Over Time

Shift in User Environment: PC Mobile + Cloud

IoE

Mobile Data Traffic Growth

2G 3G

4G

More Connections

Faster Speeds

More Users

More Video

>10B Devices 134EB

5EB: The total data created between the dawn of civilization and 2003

Smartphone Adoption Continues to Grow

> 80% of world’s population has a mobile phone

But only ~1/4th of the world’s population has a smartphone

Smartphone adoption still has huge upside for global penetration

Tablet Growth Faster Than Smartphones

Tablet shipments surpassed DT/NB PC’s in Q4-12

< 3 Yrs from Intro!

Large Screen Computing Device Demand is strong

Mix favors Tablets, not PCs

Sources: KPCB, Morgan Stanley Research, Gartner

Mobile Era Continues Evolving: IoE

Devices

Internet

Internet of

Things

Social Networking

Crowd Sourcing

Internet of

People

P2P

P2M

M2M

Internet of

Everything

2010: # Connected Devices Surpassed # of people in the world

2012: # Mobile Devices Surpassed # of people in the world

2020: 50+ Billion things will be connected & will talk to each other Sources: Cisco VNI

99% of things in the physical world still not yet connected . . .

Mobile Device Evolution: The New PC

The New Personal

Computer

Input

Comm

Connectivity

AOAC

Cross Platforms

IoE

Security

Reliability

Camera

Content

Apps

Computing

Productivity

HD Video Editing/Rendering

Productivity/Creation

True Multitasking

3D Graphics PC/Console-like Gaming

13MP, Burst Mode Photo Editing

4K Content

Voice/Face Recog

Apps for Everything

BYOE

Mobile Shopping

Multiple Sensors

Smarter, faster, & more powerful devices Require Smarter & faster memory

Performance Improves But Power Still An Issue

Smartphone performance exploding

Cellular

Wi-Fi (B/W)

Display (Resolution)

x20 2~5Mbps

150~300Mbps

720p

50~100Mbps

7Gbps

4,000p

x30

x17

x34

2010 2020

Source : ARM

720p H.264 4Kp H.265 Video (Resolution)

(vs. 2010)

Battery x2.2 5.76W/h 13W/h

Battery capacity not keeping up

Key Mobile Memory Requirements Faster Performance & More Capability While Maintaining Low Power Consumption

Mobile Storage – What’s Needed?

Instant ON Instant Play

Quad/Octa-Core CPU

Multi-tasking

Larger screens

AOAC

High Capacity in Small Form Factor

Small & Slim Pkg: Z-height is Key New Security Challenges Robust Memory

Enterprise/BYOD

Mobile Shopping

High Performance

Efficiency/Responsiveness

Low Power

Longer Battery Life

Small Package

Thinner is Better Security

Reliability

Multi-tasking

Multi-Processing

Productivity Apps

PC-like Gaming

Fast App Loading/

App Swapping

High Capacity

More Memory

More Apps, Richer Apps

HD Video, High Res Photos

3D Graphics/4K Content

eMMC4.41 eMMC4.5,5.0 UFS2.0

Booting

Partitioning

Security

Data integrity

Expandability/Scalability

Serial interface, Multi-lane

Higher Random IOPS

Low Latency, High Efficiency

UFS = Evolutionary progression of JEDEC standards for Mobile Storage

Mobile-centric Storage: eMMC UFS

Interface

Improvement

Performance

Enhancement

JEDEC Defined Storage Solutions Optimized for Mobile Devices eMMC: Open Mobile Storage w/ Low Power (Mature, Not Scalable) UFS : Scalable, Higher Performance while maintaining Low Power

End Products 2010 2012 2013 2014

100MBps 200MBps 400MBps 600MBps x 2 Lane I/F Speed

What is UFS . . .

Universal Flash Storage

In a nutshell: Tiny SSD for Mobile Devices & Beyond

UFS Advantage: The Fastest Interface

UFS 2.0 exceeds current SSD interface of SATA 3.0 (6Gbps).

• Supports up to Gear 3 at 600MBps per lane with multi-lane support

(Up to 1200MBps w/ 2 Lane)

300

MB/s

2lane

1200

MB/s

2lane 2400

MB/s

UFS 1.1

eMMC 4.51

UFS 2.0

UFS 3.0

1200

MB/s

600

MB/s

300

MB/s 200

MB/s

If 2 lanes used.

SATA 3.0

600

MB/s

eMMC 5.0

400

MB/s

UFS Advantage: Selectable & Scalable Speed

• UFS supports multiple interface speeds – Host can adjust interface based on its needs in real time

PWM G1 PWM G2

PWM G3

PWM G4

HS G2

HS G1

3~9Mb/s 6~18Mb/s 12~36Mb/s 1.25~1.5Gb/s 24~72Mb/s 2.5~3Gb/s

More Performance Less Power consumption

HS G3

6 Gb/s

eMMC vs. UFS: Interface Race

Congested Parallel Interface

Simpler & Faster Serial Interface

eMMC

• High Speed Serial Interface • Future expandability/Scalability built-in • Multi-Lane Support

Which do you prefer for your next mobile device?

UFS Advantage: Queuing & Asynch I/O

Inefficiencies of eMMC = Traffic Jam & back-up • Multiple Commands/Tasks, Multi-processing Demands

UFS Solution: • Async I/O, Command Queuing & Reordering • Higher Efficiency, Faster Completion

UFS Advantage: Higher Performance = Better UX

Source : Samsung Internal Research

Seq Read, 28%

Ran Read, 42%

Seq Write, 12%

Ran Write, 18%

Mobile OS Storage Pattern Analysis

Random Write

x1

x3

eMMC UFS

Source: Samsung

Better End User Experience!

UFS Advantage: Battery Life Improvement

eStorage is the slowest device in system Performance Bottleneck

UFS faster while consuming less system power

Seq. Write 12%

Rnd. Write 18%

Samsung User Daily Workload Analysis

eMMC

UFS UFS

DRAM

AP

eMMC

DRAM

AP

Total System Power Savings Sequential Read 3x

Random Read 2x

Ran Write 3x

Seq. Read 28%

Rnd. Read 42%

Active Standby

Active Standby

UFS: Accelerated Migration for Mobile Evolution

UFS: SSD’s for Mobile Higher Performance & Efficiency with lower total power in small BGA pkg

Legacy Memory Card Based Sync Protocol

eMMC4.3

2015~16

UFS 3.0 (tentative)

2013 2014

UFS 2.0 UFS 2.x

(tentative)

eMMC4.4 eMMC4.41

eMMC4.5

eMMC5.0

2009 2010 2011 2012

eMMC5.1 (tentative)

SCSI Based Async Protocol

400 MB/s

1.2GB/s

2.4 GB/s

Good, sufficient performance, fuel-efficient

Better, faster, scalable for future Higher efficiency

UFS In Summary . . .

• Mobile Industry evolving quickly along with its flash needs

– Seeking higher performance and improved capabilities

– Enable next generation of smart & powerful mobile devices

• UFS succeeding eMMC as the next generation of mobile flash

– Less Total Power Consumption

– Less Latency

– Less time to complete tasks

– Suitable for multi-processing and multi-processor environments

SSD for Mobile

UFS In Summary . . .

The UFS Advantage is clear . . .

– Less Total Power Consumption More Performance

– Less Latency More Efficiency

– Less time to complete tasks More Features

UFS enables the next generation of smart &

powerful devices for mobile & beyond . . .

John Geldman

Director, Industry Standards Micron Technology

What exactly is “SSD for Mobile”?

January 30, 2014

Mobile & SSD heritage

January 30, 2014

Low

Power

High Bandwidth

SSD/SAS

e· MMC

M-PHY® UFS

M-PHY® is trademark of MIPI

Low

Latency

Size is

Right

26

MIPI’s MPHY a high bandwidth enabler

• UFS 2.0 supports multiple High Speed GEARS

– (see the M-PHY from www.mipi.org)

• UFS supports one or two ‘lanes’ (for 2x bandwidth)

• UFS supports performance ranges

– from 125 MB/s (one lane of HS-G1)

– to 1.2 GB/s (two lanes of HS-G3)

January 30, 2014

Gear HS-G1 HS-G2 HS-G3

Transitions per second 1.25 to 1.45 Gtps 2.5 to 2.9 Gtps 5 to 5.8 Gtps

27

The SCSI queuing architecture a low latency enabler

• A single threaded command sequence • Note: processing the write holds off starting the next command

▶ A multiple threaded in-order command sequence • Note: Command 1 is completed before Payload 2

• A multiple threaded out-of-order command sequence • Note: the bus is used at maximum performance

January 30, 2014

Command 1 (write)

Payload 1 Status 1 Command 2

(read) Payload 2 Status 2

Command 1 (write)

Payload 1 Status 1 Command 2

(read) Payload 2 Status 2 Command 3

Command 1 (write)

Payload 1 Status 2 Command 2

(read) Payload 2 Status 1 Command 3

28

Low power mobile needs MPHY & SCSI • Limit power draw of an idle interface

– M-PHY’s Hibern8te state

• Control logical device power

– SCSI: START STOP UNIT command

• Low interface power on active transfers

– The differential voltage swing is 200 mV (terminated)

– CMOS power is proportion to C * V2 * F

Note: NAND array performance is proportional to array power: All UFS can do is minimize interface power

January 30, 2014

29

Size matters for mobile

• BGA is the initial UFS form factor – Does 12mm x 16mm work for you?

• A micro card is in scope of UFS, but is only in discussions

January 30, 2014

Device Types X (mm) Y (mm) Area (mm2)

CompactFlash 42.8 36.4 1558

NAND package inside

mSATA 24.2 48 1161

SD (standard) 24 32 768

M2 26 30 780

UFS 14 18 252 NAND

die inside

UFS 12 16 192

microSD 11 15 165

UFS 11.5 13 150

January 30, 2014

Thank you!

Low

Power

High Bandwidth

Low

Latency

Size is

Right

Creating a UFS Implementation

Zachi Friedman Director of Product Marketing

Arasan Chip Systems

Agenda

• UFS Architecture

• Implementation Challenges Complexity Challenge

Physical Challenge

• Validating the Design

UFS-SCSI Command Set Layer (UCS)

UFS Transport Protocol Layer

(UTP)

UFS Inter-Connect Layer

(UIC)

L4 = Transport

L3 = Network

L2 = Data Link

L1.5 = Phy adapt

L1 = M-PHY

UFS Controller

Host / Device (Digital)

Application SW & Stacks

UFS Layered Architecture

PHY (Analog)

UniPro

M-PHY

UFS Host & Device – Block Diagram

UFS Host IP

SoC / Application Processor

UFS

Registers

Device

Management

Entity

System Bus Interface Unit (BIU)

UFS Host Controller Interface (HCI)

UFS Transport Protocol Layer (UTP)

UniPro

Transport Layer (L4)

Network Layer (L3)

System

Bus

Data Link Layer (L2)

PHY Adapter Layer (L 1.5)

M-PHY (L1)

UFS Device IP

UFS Device Controller

System Bus Interface Unit (BIU)

UFS Device Controller Interface

UFS Transport Protocol Layer (UTP)

UniPro

Transport Layer (L4)

Network Layer (L3)

System

Bus

Data Link Layer (L2)

PHY Adapter Layer (L 1.5)

M-PHY (L1)

UFS

Registers

Device

Management

Entity

The Complexity Challenge

• A lot to implement – M-PHY

– UniPro

– UFS Protocol

• Glue everything together

• Arasan’s most complex IP to date!

The Physical Challenge

• 5.8 GHz channel

• Manage skew between 2 lanes

• Clock & Data Recovery (CDR) within short bursts

• M-PHY is a very complex PHY

The Validation Challenge

• Complex high speed protocols involved

Validation equipment cannot be an after-thought

• Reference Validation equipment – the need for “Golden” model

Golden Host – for validating device implementation

Golden Device – for validating host implementation

Host Device

Bootstrapping the UFS Ecosystem

Perry Keller Digital Applications and Standards Program Lead

Memory Program Manager

Member - Jedec and UFSA Board of Directors Chairman – Jedec UFS (JC64.5) and UFSA Compliance Committees

UFS is Unique

– Developed in a truly open fashion • Over 50 companies and a dozen separate committees across

Jedec, MIPI Alliance and UFSA participated

• Everyone has equal opportunity to contribute and vote

• “Big Boys” don’t always get their way

– Freedom from legacy support enables UFS to use “Best of Class” practices across the board

• Implements lessons learned from dozens of existing standards

• Applies to UFS technology AND entire enabling ecosystem

40

Bootstrapping the UFS Ecosystem

DesignCon UFS Panel 2014

Too

ls

UFS Ecosystem

T10

Technical Standards

Test and Measurement

Equipment Providers

Test Procedures

Technical Seminars

Marketing Collateral

Logo Management

Compliance Validation Process

UFS IP, Silicon, OS and System Developers

Authorized Test Centers

Too

ls

Workshops Plugfests

BoD: Samsung, Micron, SK Hynix, Agilent, Phison, Silicon Motion

Compliance Test Reports

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Logo

Li

cen

se

Primary Missions:

UFS technology promotion & infrastructure enablement

Product compliance and UFS logo certification management

Technical input into JEDEC for future specifications

www.universalflash.org

Current Board Members:

Samsung, Micron, SK Hynix, Agilent, Phison & Silicon Motion

The Universal Flash Storage Association (UFSA) was founded in 2010 as an open Trade Association to promote widespread industry adoption and acceptance of the UFS standard.

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2H 1H

2012

2H 1H

Jedec

UFS Workshops & Plugfests

CTS 0.59

Industry

UFSA

UFS Prototype DUT

2013

UFS 1.1

UFS Enablement Milestones

HCI 1.1

UFS roadmap informative only and no guarantee on schedules

MIPI Unipro 1.41

M-PHY 2.0

Compliance Committee

Unipro 1.61

M-PHY 3.0

2014

1H

UFS 2.0

M-Phy Test 1.0 Unipro Test 1.0

UFS Test 1.0

UFS Test 2.0

CTS 1.0

ATC Certification

Marketing Committee

Website Logo Registration FAQ, Briefing slides Whitepapers Promotional/planning tours

Board of Directors

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Accredited

Labs

JC 64.5

UFS Test Spec

M-Phy/Unipro Test Spec

MIPI M-Phy &

Unipro Test WGs

Compliance Committee

Compliance

Test Spec

Logo

Committee

Compliance

Certificate

Logo

License

Adopter Member Products

What & How to Measure

Success Criteria

UTP Test Spec

44

UFS Logo Certification Process

Certified Product

UFSA Compliance Test Events

• UFS Workshop – By invitation only

– Test the Test Specification

– Potential early certification

• UFS Plugfest – Open to UFSA members

– Pre-compliance test

– Potential Certification

• Certification Test

– Service provides by Authorized Test Centers

– Anyone can request testing

– Logo application requires UFSA membership AND compliance certification

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