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2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

Power Electronic Packaging, Co-Design and Reliability

Yong Liu, Corporate R & DMay 29, 2018

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

Outline

I. Power Electronics Packaging II. Current State of Art Co-Design in Power

Electronics Packaging III. Challenges in Co-Design and ReliabilityIV. What is the Next?V. Summary

I. Power Electronic Packaging: Driven Capability

Central PV*

String PV*

pile

GaN

SiC

SiliconRemains Mainstream Technology

10M

1M

100k

10k

1k

1k 10k 100k 1M 10M

* PV = photovolta ic inverter; ** OB C = onboard charger

fsw [Hz]

Pout [W]

SJ

OBC**

Silicon : 12V – 1700V-Best FOM, Packaging Options

Superjunction: 650V – 900V-Optimized HV solution

SiC: 900V – above 1700 V-High power density performance

GaN: 650V- High frequency performance

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

4

I. Power Electronic Packaging: GaN & SiC Applications

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

I. Power Electronic Packaging: Evolution

10

1001k

10k100k

1M

100

1 k

10k

100k

1M

10M

10M

Operation Frequency (Hz)

SCRModule

Triac

GTO

TransistorModule

IGBTModule

MOSFETModule

IGBTModule

IPMMOSFET

• Air Conditioner• Refrigerator• Washing Machine

• UPS• Welder

• Inverter• Motor Control

• Automotive

• TV (Display)

Cap

acity

(VA

)

Pkg Transition (Discrete to Intelligent Package)

Discrete Package Intelligent Power Module

Courtesy ofFormer FairchildCTO Dan Kinzer

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

I. Power Electronic Packaging: Core Technology

L

Microchannel DBC

S o u r c e :

O R T H O D Y N E

LF DBC/DBA/IMS Double DBC/spacer

Al wire bonding Ribbon Bonding Clip /LF bondingEmbedded die bonding

Soldering Ag/Cu sintering

US welding

Substrate less

Vacuum soldering

Gel EMC Potting Epoxy MUF

Interconnect

Substrate

Die Attach

Encapsulation

Ag attach

Infineon

UC Irving

M itsub ish i

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

II. Current State of Art Co-Design in Power Electronic Packaging• To Provide Differentiating & Cost Effective Co-design Infrastructure for Power Electronics

• Current Co-Design Platform Includes:

Explore/Design + Simulation + Design Verification + Methodology + Development/Share

Simulation Tools DesignMethodology

Design PlatformDesign

VerificationDevelopment/Share

Weakness: Case by CaseNot strong in design sensitivity, optimization and probabilityNot Yet Ready for virtual prototyping

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

III. Challenges in Co-Design and Reliability

Multi-Scale and Multi-Physics in Co-Design/Reliability:Reliability from Die design to system

Assembly Reliability:Multi-Step Process/Variation/Probability

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

9

IV. What is the next: Co-Design Ecosystem for a Efficient Virtual Prototype

The system will target:

• Multi-scale and Multi-physics in Design• Sensitivity/Optimization/Probabilistic Analysis

in Design, Assembly Process and Reliability

Co-design ecosystem

Various design and simulation

software for co-design

Co-design vault and

environment

Mat Lab for various mat

properties test

Test Lab for e lectrical,

therm al and m echanical

perform ance

Current Co-Design

Platform

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018

V. Summary Virtual Prototyping• Current state of art Co-Design includes Explore/Design +

Simulation + Design Verification + Methodology + Development/Sharing

• Key Challenges in Co-Design/Reliability include Multi-Scale and Multi-Physics, Multi-Step Process/Variation Probability

• Co-Design Ecosystem & Virtual Prototyping will happen soon in Power Electronics Industry

2018 IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, 2018