positive-bias temperature instability (pbti) of ganmosfets slides.pdf · massachusetts institute of...
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Positive-Bias Temperature Instability (PBTI) of GaN MOSFETs
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Alex Guo and Jesús A. del Alamo
Microsystems Technology Laboratories (MTL)Massachusetts Institute of Technology (MIT)
Cambridge, MA, USA
Sponsor: United States National Defense Science & Engineering Graduate Fellowship (NDSEG)
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Purpose
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To understand the physics of and to mitigate PBTI in GaN n-MOSFETs.
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Outline
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1. Introduction
2. Experimental setup
3. PBTI results
4. Discussion and modeling
5. Conclusions
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• GaN promising for power electronics• Positive-Bias Temperature Instability (PBTI) is a
concern:• Operational instability• Long-term reliability issue
• Challenge: mechanisms responsible for PBTI?
1. Introduction
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Favored structure: GaN MIS-HEMT
P. Lagger, TED 2014
• Many layers and interfaces complicate PBTI picture• Many possible sites for trapping
• MIS-HEMT: Metal-Insulator-Semiconductor High Electron Mobility Transistor
• Why GaN MIS-HEMT: Large gate swing, low gate leakage
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2. Experimental setup• Simpler GaN MOSFET structure
• One interface: oxide/GaN interface • Studied devices with two different gate dielectrics
with same EOT: • SiO2• SiO2/Al2O3 composite
metal
oxideGaN channel
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Device screening and initialization
PBTI experiment flow
I/V sweep during recovery
Repeat 75 times
Stress
• VT : VGS value when ID = 1 µA/mm• S : Extracted at ID = 0.1 µA/mm• gm_max: Extracted on ramp down• All at VDS = 0.1 V
• First sample: ~ 1-2 s after removal of stress
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Thermal detrapping
I/V sweep (confirm device restoration)
Increase stress voltage or temperature
V
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Ramp down
Ramp down
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• tstress ↑ ΔVT ↑ • VGS_stress ↑ ΔVT ↑ • Minimal ΔS for 5 and 10 V stress, clear increase for 15 V stress• After 15 V stress, partial VT recovery, no S recovery
• ΔVT , ΔS at trecovery = 1 s
E field ~ 1, 2, 3 MV/cm
3. PBTI resultsVoltage dependence of ∆VT and ∆S at RT
SiO2
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Temperature dependence of ∆VT and ∆SStress conditions: • VGS_Stress = 15 V, T = -40°C, RT, 75°C, tstress= 10 – 10,000 sec
• T ↑ ΔVT ↑• T ↑ ΔS ↑ • Partial VT recovery, no S recovery
SiO2
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Stress time and voltage evolution of ∆gm,max• Different set of experiments, same stress conditions, RT
• tstress ↑ |∆gm,max| ↑ • VGS_stress ↑ |∆gm,max| ↑ • gm completely recovers after thermal detrapping
SiO2
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• Positive ∆VT increases with stress voltage, time and temperature
• ∆VT recoverable under benign stress (VGS_stress ≤ 10 V, T ≤ RT )
• ∆VT partially recoverable under harsh stress• ∆S non-recoverable under harsh stress
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SiO2 devices summary
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SiO2/Al2O3 vs. SiO2 devices: ΔVT
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SiO2/Al2O3 vs. SiO2: • Weaker T dependence• Larger ΔVT for T ≤ RT
• ΔVT at trecovery = 1s, T = -40°C, RT, 75°C, tStress= 10 – 10,000 sec
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SiO2/Al2O3 vs. SiO2: • Minimal ΔS for all stress
voltages and T’s
• ΔS at trecovery = 1s, RT
SiO2/Al2O3 vs. SiO2 devices: ΔS
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SiO2/Al2O3 vs. SiO2: • Partial recovery of gm
• ∆gm,max after stress during ramp down, RT
SiO2/Al2O3 vs. SiO2 devices: Δgm,max
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SiO2 devices vs. SiO2/Al2O3 devices
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Summary
Similarities:• Positive ∆VT increases with stress voltage, time and
temperature• ∆VT recoverable under benign stress• ∆VT partially recoverable under harsh stress
Differences:• SiO2/Al2O3 devices show larger ∆VT at T ≤ RT• SiO2/Al2O3 devices show weaker T dependence• Both show non-recoverable ∆VT under harsh stress, but
• SiO2 shows non-recoverable ∆S• SiO2/Al2O3 shows non-recoverable ∆gm,max
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For both dielectrics:• Recoverable ∆VT_rec + Non-recoverable ∆VT_perm
Mechanisms behind ∆VT
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SiO2 SiO2/Al2O3
∆𝑽𝑽𝑻𝑻_rec
∆𝑽𝑽𝑻𝑻_rec
∆𝑽𝑽𝑻𝑻_perm∆𝑽𝑽𝑻𝑻_perm
4. Discussion and modeling
VGS_stress = 15 V at RT
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• VGS_stress ≤ 10 V, T ≤ RT • Power law dependence with stress time• Also observed in other MOS systems
Recoverable ∆VT under benign stress
Si InGaAs
S. Zafar, TDMR 2005 S. Deora, et al., IPRS 2014
• Consistent with electron trapping in pre-existing oxide traps
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Oxide trapping model
SiO2: 𝜷𝜷 = 0.25 ; 𝝉𝝉𝟎𝟎= 150 sSiO2/Al2O3: 𝜷𝜷 = 0.22-0.25 ; 𝝉𝝉𝟎𝟎 = 200 s
Channel Oxide 𝜷𝜷
Si Al2O3 0.32
InGaAs Al2O3, ZrO2/Al2O3
0.26-0.29
GaN SiO2 , SiO2/Al2O3
0.22-0.25
∆𝑽𝑽𝑻𝑻_ox = ∆𝑽𝑽𝒎𝒎𝒎𝒎𝒎𝒎 � 𝟏𝟏 − 𝐞𝐞𝐞𝐞𝐞𝐞(− 𝒕𝒕𝝉𝝉𝟎𝟎
𝜷𝜷)
• t: stress time• ∆𝑽𝑽𝒎𝒎𝒎𝒎𝒎𝒎 is function of trap density
and trapped charge centroid• 𝜷𝜷 describes trap distribution• 𝝉𝝉𝟎𝟎 is time constant of traps
This work
S. Zafar, TDMR 2005
SiO2 SiO2/Al2O3
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• VGS_stress = 15 V
Interface charges
Non-recoverable ∆VT under harsher stressSiO2 devices
• Non-recoverable ∆VT correlates with non-recoverable ∆S generation of interface states
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• VGS_stress = 15 V, RT
Oxide charges
Non-recoverable ∆VT under harsher stressSiO2/Al2O3devices
• Non-recoverable ∆VT correlates with non-recoverable ∆gm,maxgeneration of oxide traps near Al2O3/GaN interface
• Also observed in Al2O3/InGaAs MOSFETs (S. Deora, IRPS 2014)
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5. Conclusions
• Under benign stress (VGS_stress ≤ 10 V, T ≤ RT):• ΔVT due to electron trapping in pre-existing oxide traps• ΔVT mostly recoverable
• Under harsher stress (VGS_stress = 15 V), additional non-recoverable ΔVT: • SiO2 generation of interface states• SiO2/Al2O3 generation of oxide traps near oxide/GaN
interface
• Oxide trapping model shows excellent agreement with experimental data at all T
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Questions?
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Thank you