PIXAPP Advanced Training Programme

PIXAPP, Europe’s Photonic Integrated Circuit (PIC) Packaging Pilot Line, is pleased to announce roll-out of its advanced PIC design, fabrication and packaging training programme. This unique industry training programme provides attendees with access to state-of-the-art facilities and equipment, and a comprehensive set of dedicated lectures and technical mentoring. The programme is delivered by international experts coming from PIXAPP European Consortium (industrial and research), ensuring attendees gain a deep understanding of PIC technologies and critical PIC packaging manufacturing processes.

Training Programme Topics

1. PIC Device & Package Design (lectures and design software training) 2. PIC Fabrication (lectures and lab-based training) 3. PIC Assembly and Packaging (lectures and lab-based training) 4. PIC Testing, Product Reliability and Failure Analysis (lecture and lab-based demonstration) 5. PIC Application Case Studies (using selected examples)

Target Audience

1. Industry developing PIC products and using PIC technologies 2. Industry planning to establish in-house PIC packaging manufacturing facilities 3. Industry planning to outsource PIC packaging manufacturing and design 4. New industry entrants to PIC packaging technologies, including non-photonic experts

Technology and Application Experts: The programme provides attendees with training in PIC design and fabrication in state-of-the-art semiconductor cleanrooms delivered by experts.

Advanced Facilities: Attendees receive hands-on training in a state-of-the-art PIC packaging facility. The essential aspects of PIC packaging will be addressed.

Further Information

See PIXAPP website (www.pixapp.eu) for attendee’s testimonials or contact the PIXAPP Gateway at info@pixapp.eu

Details of Training Programme Topics (5 Days Duration) 1. Access to State-of-the-Art Facilities (Days 1-5): Attendees will receive hands-on training to

understand fundamentals on the reliability tests, assembly and packaging equipment of Photonic Integrated Circuits (PIC).

2. General Introduction and PIC Application Case Studies (Day 1): This section of the training programme provides attendees with an overview of application case studies, highlighting critical PIC device, packaging, assembly and test protocols. The overview will cover the fundamentals of materials, technologies and processes required to package photonic devices. Applications will be selected from the communication, medical device and sensor sectors.

3. PIC Assembly and Packaging (Days 1-3): This section of the training programme provides

attendees with hands-on training of essential PIC assembly and packaging processes. These processes are applicable for a wide range of applications, including high speed communications, medical devices and sensors. Attendees will receive hands-on training using state-of-the-art assembly and packaging equipment, including; optical alignment, fiber coupling, micro optic assembly, flip-chip integration of optical and electronic devices, solder bump and wire-bonding electrical interconnect, mechanical and thermal packaging. Attendees will participate in running these processes, and will package a semiconductor laser fabricated during the PIC fabrication training.

4. PIC Device & Package Design (Day 3): Photonic device assembly and packaging can account for over 50% of the product manufacturing cost. Therefore, it is critical PIC devices are designed for cost-effective packaging. This section of the programme provides attendees with training on device and package design, including implementation of key optical and electrical design rules using standard PIC layout software tools. Additional training will be given in mechanical and thermal design, mainly through worked-examples, providing attendees with an understanding of key aspects of design for PIC assembly and packaging.

5. PIC Testing, Product Reliability and Failure Analysis (Day 4): Packaging can affect the long-

term reliability of PIC products. This section of the training programme provides attendees with hands-on training with functional testing of packaged PIC devices, an overview of critical reliability tests and failure analysis techniques to inspect and identify device failure root cause. This includes demonstration of advanced PIC reliability test systems including; thermal and humidity stress, thermal and mechanical shock, die shear and wire-pull testing, x-ray and ultra-sonic microscopy, life testing, and thermal imaging using infra-red imaging microscopy.

6. PIC Fabrication and Foundry Services (Days 4-5): Attendees will receive hands-on training in

a state-of-the-art semiconductor cleanroom to understand the key process steps to fabricate PIC devices. Attendees will receive training in critical process steps including; metal and insulator deposition, wet and dry semiconductor etching, device cleaving and device preparation for packaging. Attendees will participate in running these process, producing a semiconductor laser, which will be packaged during PIC Assembly and Packaging training.

PIXAPP’s next training programme will take place from 7th - 11th of January 2019.

Further Information See PIXAPP website (www.pixapp.eu) for attendee’s testimonials

or contact the PIXAPP Gateway at info@pixapp.eu