performance of a next generation high speed, high precision, probe card analyzer · 2017. 3....
TRANSCRIPT
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Performance of aNext Generation High Speed,
High Precision, Probe Card Analyzer
Jeffrey S. GreenbergRaymond Kraft, Ph.D.Applied Precision, LLC
South West Test Workshop4 June 2003Long Beach, CA USA
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Presentation Agenda
• Motivation for next generation PCA• Problems with conventional PCAs• probeWoRx – next generation PCA• probeWoRx Benefits• probeWoRx Results
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Motivation• Ever increasing need to test more devices
simultaneously• Probe card pin counts and loads increasing
– Advanced Technology Cards with > 10,000 probes• Test Time
– Need to keep test times acceptable– Minutes, not hours
• Accuracy– Increased loads cause structural deflection and
degrade accuracy– Tighter probe pitch and smaller pads require higher
accuracy
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Conventional Probe Card Analyzers
• Electrical Planarity: Non-Bussed Probes– FAST– Scan checkplate in Z– Continuity measurement at each Z step– Accuracy based on stage position
Probe Card
z2
Checkplate
z1
z0
Overtravel
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Conventional Probe Card Analyzers
• Electrical Planarity: Bussed Probes– SLOW!!– Isolated contact driven individually to each probe– Scan contact in Z – Continuity measurement at each Z step– Accuracy based on stage position– Isolated contact will wear and accumulate dirt/debris
Isolated Contact
XY moveProbe
Bussed
Z Scan
Probe
Bussed
Z Scan
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Conventional Probe Card Analyzers
• Optical Alignment– SLOW!!– Each probe set driven individually to optical window – Measure XY position at zero and nominal overtravel– Accuracy based on stage position– Optical window will wear and accumulate dirt/debris
Probe Set 1 Probe Set 2
Z retract Z overtravel
XY Start XY move XY Stop
Optical window (field of view)
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Conventional Probe Card Analyzers
• Drawbacks to Conventional Planarity and Alignment Measurements– SLOW!!– Measurement results directly related to stage
accuracy and repeatability– Measurement results degraded by dirt/debris
accumulation at isolated contact/window– Measurement accuracy is also sensitive to
• Abbe Error• Deflection under load• Temperature changes
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probeWoRx
Next Generation Probe Card Analyzer (beta system)
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probeWoRx Capabilities
• NEW Optical Planarity and Alignment• Electrical Planarity• Leakage• Contact Resistance• Capacitance• Electrical Components (capacitors, resistors)• Wirechecker• Probe Force• Cleaning• Rework
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probeWoRx New Metrology Technique
• 3D Optical Comparative Metrology (3D-OCM)– Compute both planarity and alignment from
optical measurements– Measure probe locations relative to NIST
traceable measurement standard• Extremely flat measurement standard (< ¼ wave)• Extremely accurate photolithographically-defined
fiducial grid (< 0.5um)– Measurement standard and probes are co-located– Multiple patents pending
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3D-OCM: Measurement Concept
Measurement Standard• Conductive• Transparent• Rigid• Temperature-Stable
Proprietary Optical Measurement System
Fiducial
Probe
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3D-OCM: Measurement System
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3D-OCM: Example Probe Images
MicroSpringTM Vertical
BladeCantilever
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3D-OCM: Continuous Scan• Continuous One-Touch Scan
– Up to 300mm diameter probe array
No Overtravel Overtravel
Probe Array
Continuous Scan Pattern
Planarity & Alignment of All Probes
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3D-OCM: BenefitsHIGH SPEED • Fast continuous motion scan of ALL probes
– Measurement times not slowed down by relays or capacitors
– Same measurement for bussed & non-bussed probes• Scan probes at available image capture rates
Example: Capture/process images at 10 frames/second– 100um pitch linear array (4 probes/capture)
• 2,000 probes in < 2 minutes• 10,000 probes in < 10 minutes
• Electrical measurements can be made in parallel with planarity and alignment measurements
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3D-OCM: BenefitsACCURACY & REPEATABILITY• Accuracy dependent on NIST traceable mask• Measurement INDEPENDENT of stage accuracy
– Eliminates time-consuming stage calibrations• Measurement standard and probes are co-located• Directly measure and compensate for system
deflection• Distributed measurement surface – less sensitive
to wear and dirt/debris• Improved Gage R&R results – reproducibility
approaching repeatability
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probeWoRx ResultsPlanarity and Alignment Test Times
71:2264111 x 454480Cantilever
224:1819498 x 916720Microspring
61:436442 x 612596Vertical
probeWoRx Test Times (minutes)
PR Test Times (hours)
TotalDUTs
Array Size (mm)
Total Probes
Probe Tip Technology
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probeWoRx Results
0
0.5
1
1.5
2
2.5
X Y Z
Rep
eata
bilit
y (u
m) undisturbed
disturbed
Undisturbed and Disturbed Repeatability (3 sigma)Cantilever Probe Card
Production Planarity Spec
Production Alignment Spec
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probeWoRx Results
Undisturbed and Disturbed Repeatability (3 sigma)MicrospringTM Probe Card
0
0.5
1
1.5
2
2.5
X Y Z
Rep
eata
bilit
y (u
m) undisturbed
disturbed
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probeWoRx Results
X Error Repeatability, Undisturbed
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
1
Probe ID
X Er
ror F
rom
Mea
n (u
m) Run1
Run2Run3Run4Run5
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probeWoRx Results
Y Error Repeatability, Undisturbed
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
1
Probe ID
Y Er
ror F
rom
Mea
n (u
m) Run1
Run2Run3Run4Run5
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probeWoRx Results
Planarity Repeatability, Undisturbed
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
1
Probe ID
Plan
arity
from
Mea
n (u
m)
Run1Run2Run3Run4Run5
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New Measurement CapabilitiesPlanarity with no load
z1 z2 z3
Probe Card
3D-OCM
z0
z1
z2
Probe Card
Electrical Planarity
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New Measurement CapabilitiesProbe card/fixture deflection measurement
∆zAt Overtravel Deflection
High Probe
∆zNo Overtravel
High Probe
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New Measurement CapabilitiesLoaded Optical Planarity
-10
-5
0
5
10
15
20
25
Probe ID (sorted by ascending Z values)
Z (u
m)
Optical PlanarityElectrical PlanarityDeflectionLoaded Optical Planarity
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New Measurement CapabilitiesMeasurement of Cobra probe tip planarity infree-hanging position for prober correlation
1 2 3
z1 z2 z3
3D-OCM
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New Measurement Capabilities• Measurement of Cobra probe tip “float”
z1
3D-OCM
Electrical planarity
∆stage1
Float1 = ∆stage1 – z1
1
Float1
Electrical Contact
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Summary
• Wafer test roadmap demands faster, more accurate metrology
• probeWoRx 3D Optical Comparative Metrology offers significant advantages over current metrology techniques– >1 order of magnitude improvement in speed– Greater accuracy– Higher degree of repeatability and reproducibility– Improved machine-to-machine correlation– New measurement capabilities