solving integration challenges for flexible hybrid … integration challenges for flexible hybrid...
TRANSCRIPT
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Solving Integration Challenges for Flexible Hybrid ElectronicsHigh performance flexible electronics
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Wearable Sensor System Configurations2
Comm User DisplayDataProcessing
Sensor Signal Processing
Wearable Hybrid System
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Integrators are needed (suppliers)
Wearable Hybrid Commercial Electronics Manufacturing3
FHE Assembly
(2014)
2015 Product
Development
2015?? Products in
Market
IC Design
Silicon IC Fabrication
SoP
Printed Circuits & Sensor Design
Printed Electronics Requires
suppliersRequires Mfg Capacity. Not yet available.
Hybrid
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IC’s for wearable hybrid systems4
FleX™ commercial SoP CMOS process.
FleX: 200mm CMOS 180nm Wafer
SOI Substrate
CircuitryPolymer & Bond Pads
CircuitryPolymer & Bond Pads
Permanent Backside Polymer
Permanent Backside Polymer
CircuitryPolymer & Bond Pads
SOI Substrate
CircuitryPolymer & Bond Pads
Standard CMOS Wafer Handle Silicon Removed Polymer Substrate Applied SoP Wafer
Silicon-on-Polymer (SoP) converts
single crystalline semiconductors
into flexible semiconductors.
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“Rainbow™” FHS Assembly Test & Reliability Tools
Rainbow Strip Test Coupon:
» Flexible circuit board compatible with: MEC die, FleX SoP Die, Std Die
» Rcurve Test Platform
» Mechanical or Environmental testing
Rainbow Demonstrator:
» Development tool
» Electrical verification of assembly methods
» Functional test board
5
Purpose: Assembly Technology Development Rainbow Strip (fcb)
Die (IC)
Demonstrator test board (pcb)
Tests and Standards in Development
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Signal processing - The foundation for sensor integration 6
Needs to be done near to sensor. Solution for low
power and SNR.
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FleX-ADC™ Flexible Analog-to-Digital Converter
Operating Voltage 2.5V
Analog Input Channels 8
Resolution 8 bits
Operating Frequency 1MHz
Internal Oscillator Yes; 1MHz
Conversion rate 100ksps
Communication 2-wire I2C™
Conversion Modes Single, Continuous, ScanChannel Select User Configurable
7
8-b
it A
nal
og
Mu
x
A[0]A[1]A[2]A[3]A[4]A[5]A[6]A[7]
8-bitSAR ADC
I2CInterface
Control and Data Registers
Internal Oscillator
I2CCK
I2CDA
Power-OnReset Controller
Features
Die Size 2.4mm X 2.4mmPin Count 24Pad Opening 160um X 160umPad Pitch 300umThickness 24-60um; based on polymerFlexible YesConformal YesMass 0.23mg
Technology TowerJazz 180nm PD-SOI Interconnect 4-level AluminumFlexibility FleX Silicon-on-Polymer
Process Details
Physical Specifications
Source: http://www.americansemi.com/FleX-ADC_Datasheet_rev140404.pdf
Signal processing solution for wearable
hybrid systems
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AS_ADC1002 8-Bit ADC Conventional vs Flexible8
0
50
100
150
200
250
300
0 0.5 1 1.5 2 2.5
AD
C R
ead
ing
Voltage
Voltage vs ADC Reading
AS_ADC1002.fxd (FleX die)
AS_ADC1002.pkg (Conventional Packaged Die)
VS
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Hybrid Manufacturing Infrastructure
Commercial hybrid manufacturing capacity starting summer 2015 Boise, Idaho
Doug Hackler 8/22/2016 9
New 9,000 s.f. Manufacturing Facility
Groundbreaking Jan 26, 2015
• Hybrid Assembly
• IC Design• SoP• Integration• Test• FA• R&D
Goal: Establish an integrator that can provide capacity
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Enabler for Wearable Sensor Product: FleXform-ADC™ Development Kit
Support for this work has been provided by AFRL FA8650-14-C-5010
Platform for new product developers and printed researchers
Integrate flexible sensors with electronics
Enable concept demonstrations and low volume initial production
FHS with SoP ADC
Demonstration Board
FleXform-ADC™
Users can fabricate/mount user’s technology on a hybrid electronic substrate with on
board flexible ADC capability for development and demonstrations of the user’s ideas.
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Doug Hackler 8/22/2016 11
8 ½” (215.9mm)
5 ½” (139.7mm)
FleXform-ADC: User printable FHS• User Printable FHS
• 6 Sensor Areas»Labeled According to
ADC Channel»Each supplied with
2.5V and GND»A1 => OPAMP0»A2 => OPAMP1
• Practice FCB
• Integrates novel sensors with flexible electronics.
• Cut to form after sensor printing
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12FleXform-ADC™ Development Kit
Kit Availability:• Limited initial release 2/23/15• Now accepting pre-orders for March deliveries.
FleXform Kits provide:
• “Out-of-the-box” proof of FHE feasibility
• User printable FHE with on-board FleX-ADC
• Integration Board and Software
• Enables printed device demonstrations
• Fully supported by ASI flexible technology integration team for design and manufacturing.